CN108668424B - 气密结构 - Google Patents

气密结构 Download PDF

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CN108668424B
CN108668424B CN201710186984.0A CN201710186984A CN108668424B CN 108668424 B CN108668424 B CN 108668424B CN 201710186984 A CN201710186984 A CN 201710186984A CN 108668424 B CN108668424 B CN 108668424B
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赵晓宇
赖其渊
符猛
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Quan Yi Da Science And Technology (foshan) Co Ltd
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Abstract

一种气密结构，包括第一板体、设置在所述第一板体上的第二板体以及设置于所述第一板体和第二板体之间的毛细结构，所述第二板体中部相对其两侧内凹而形成一凹槽，所述凹槽与所述第一板体之间形成一密封的腔体，所述毛细结构设置于所述腔体内，所述第一板体一端向上凸伸形成一中空的第一延伸部，所述第二板体一端对应所述延伸部而开设形成贯穿其上下表面的通孔，所述第一延伸部穿设所述通孔后，所述通孔的内周缘与所述第一延伸部的外周缘接触。

Description

气密结构
技术领域
本发明涉及一种气密结构，特别涉及一种带有螺丝孔的气密结构。
背景技术
通常地，气密结构设置于电路板上，以对电路板进行散热。
一般地气密结构，通常包括上下两层板体以及设置于两层板体中的毛细结构。所述两层板体上设置有相应的通孔，用于螺丝穿过以将气密结构与电路板固定连接。对于大多数气密结构来说，所述通孔中未攻设有螺纹，所述通孔与电路板之间通常设置有类似柱体的过渡连接部。当所述气密结构与所述电路板连接时，螺丝穿过所述通孔后通过所述过渡连接部与电路板固定连接。然而，如此与电路板连接的气密结构中螺丝在通孔中长时间容易松动，而且气密结构两层板体之间亦容易发生松动，从而导致气密结构与电路板连接的稳定性。
发明内容
有鉴于此，本发明提供一种与电路板配合连接稳定性高的气密结构。
一种气密结构，包括第一板体、设置在所述第一板体上的第二板体以及设置于所述第一板体和第二板体之间的毛细结构，所述第二板体中部相对其两侧内凹而形成一凹槽，所述凹槽与所述第一板体之间形成一密封的腔体，所述毛细结构设置于所述腔体内，所述第一板体一端向上凸伸形成一中空的第一延伸部，所述第二板体一端对应所述第一延伸部而开设形成贯穿其上下表面的通孔，所述第一延伸部穿设所述通孔后，所述通孔的内周缘与所述第一延伸部的外周缘接触，所述第一延伸部的内壁攻设有螺纹，所述第二板体具有一下表面及与所述下表面相对的上表面，所述第二板体与所述通孔相对的另一端形成一第二延伸部，所述第二延伸部为自所述下表面朝向所述上表面方向一体冲压而形成的一中空状的凸起，所述第二延伸部内壁攻设有螺纹。
在本发明所述气密结构中，所述第一板体上设置有中空的第一延伸部，第二板体上设置有中空的第二延伸部，而且所述第一延伸部和第二延伸部均一一体冲压而成，使得所述气密结构中第一板体和第二板体之间稳定性提高，而且所述第一延伸部和第二延伸部内壁均可攻设螺纹，通过螺丝直接与电路板固定，而免去了通过额外的过渡连接部，不但节约成本而且进一步增加了所述气密结构与电路板之间连接的稳定性。
附图说明
图1所示为本发明一实施例中所述气密结构的示意图。
主要元件符号说明
气密结构 100
第一板体 10
第一表面 101
第二表面 102
第二板体 20
第一延伸部 11
第一螺纹 110
第一顶部 111
下表面 201
上表面 202
凹槽 21
通孔 22
第二延伸部 23
第二螺纹 230
第二顶部 231
腔体 120
第一毛细部 31
第二毛细部 32
连接部 33
如下具体实施方式将上述附图进一步说明本发明。
具体实施方式
下面将本发明实施方式中的附图，对本发明实施方式中的技术方案进行清楚、完整地描述，显然，所描述的实施方式仅仅是本发明一部分实施方式，而不是全部的实施方式。基于本发明中的实施方式，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施方式，都属于本发明保护的范围。
本文中所使用的方位词“第一”、“第二”均是以使用时所述第一基板的位置定义，而并不限定。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本发明。
如图1所示，本发明所述气密结构100包括一第一板体10、第二板体20以及设置于所述第一板体10、第二板体20之间的毛细结构30。
所述第一板体10呈一水平的板体且厚度均匀。所述第一板体10具有一第一表面101以及与所述第一表面101相对的第二表面102。所述第一板体10一端自第一表面101朝向第二表面102方向向上凸伸形成第一延伸部11。所述第一延伸部11为自所述第一表面101朝向第二表面102方向一体冲压而成。所述第一延伸部11超出且垂直所述第一板体10的第二表面102。
进一步地，所述第一延伸部11呈中空状柱体，且所述第一延伸部11的内壁攻设有第一螺纹110。
所述第二板体20与所述第一板体厚度相等。所述第二板体20设置于所述第一板体10的第二表面102上。所述第二板体20具有下表面201以及与所述下表面201相对的上表面202。所述第二板体20的中部相对两侧内凹而形成一凹槽21。所述凹槽21的纵截面呈梯形，其口径朝向远离第一板体10的方向逐渐减小。所述凹槽21与所述第一板体10之间形成一密封的腔体120。
进一步地，所述第二板体20一端开设有贯穿其下表面201及上表面202的通孔22。所述通孔22与所述第一板体10的第一延伸部11对应设置，从而供所述第一延伸部11穿入所述通孔22。所述第一延伸部11穿入所述通孔22后，所述通孔22的内周缘与所述第一延伸部11的外周缘接触，且所述第一延伸部11进一步超出所述凹槽21的底部。
进一步地，所述第二板体与所述通孔22相对的另一端形成一第二延伸部23。所述第二延伸部23自所述第二板体20的下表面201朝向上表面202方向冲压而形成的一凸起。所述第二延伸部23具有一第二顶部231，所述第二顶部231与所述第一延伸部11的第一顶部111共面。所述第二延伸部23呈中空的柱状，其内壁形成有第二螺纹230。
所述毛细结构30设置于所述腔体120内。所述毛细结构30包括一贴设所述凹槽21内壁的第一毛细部31、贴设于所述第一板体10的第二表面102的第二毛细部32以及连接所述第一毛细部31及第二毛细部32的多个连接部33。所述连接部33与所述第一毛细部31、第二毛细部32垂直，且所述多个连接部33之间均等间距设置。
所述第一毛细部31和第二毛细部32的厚度相等。所述连接部33的纵截面呈矩形，且所述连接部33的高度和宽度均大于所述第一毛细部31及第二毛细部32的厚度。
在本发明所述气密结构100中，所述第一板体上设置有中空的第一延伸部11，第二板体上设置有中空的第二延伸部23，而且所述第一延伸部11和第二延伸部23均一一体冲压而成，使得所述气密结构100中第一板体10和第二板体20之间稳定性提高，而且所述第一延伸部11和第二延伸部23内壁均可攻设螺纹，通过螺丝直接与电路板固定，而免去了通过额外的过渡连接部，不但节约成本而且进一步增加了所述气密结构100与电路板之间连接的稳定性。
可以理解的是，对于本领域的普通技术人员来说，可以根据本发明的技术构思做出其它各种相应的改变与变形，而所有这些改变与变形都应属于本发明的权利要求的保护范围。

Claims (9)

1.一种气密结构，包括第一板体、设置在所述第一板体上的第二板体以及设置于所述第一板体和第二板体之间的毛细结构，所述第二板体中部相对其两侧内凹而形成一凹槽，所述凹槽与所述第一板体之间形成一密封的腔体，所述毛细结构设置于所述腔体内，其特征在于：所述第一板体一端向上凸伸形成一中空的第一延伸部，所述第二板体一端对应所述第一延伸部而开设形成贯穿其上下表面的通孔，所述第一延伸部穿设所述通孔后，所述通孔的内周缘与所述第一延伸部的外周缘接触，所述第一延伸部的内壁攻设有螺纹，所述第二板体具有一下表面及与所述下表面相对的上表面，所述第二板体与所述通孔相对的另一端形成一第二延伸部，所述第二延伸部为自所述下表面朝向所述上表面方向一体冲压而形成的一中空状的凸起，所述第二延伸部内壁攻设有螺纹。
2.如权利要求1所述气密结构，其特征在于：所述第一板体具有第一表面及与所述第一表面相对的第二表面，所述第一延伸部为自所述第一表面朝向第二表面方向通过一体冲压而成的凸起。
3.如权利要求1所述气密结构，其特征在于：所述第一延伸部具有一第一顶部，所述第一延伸部穿入所述通孔后，所述第一延伸部的第一顶部超出所述第二板体的凹槽的底部。
4.如权利要求1所述气密结构，其特征在于：所述凹槽的纵截面呈梯形，其口径朝向远离第一板体的方向逐渐减小。
5.如权利要求3所述气密结构，其特征在于：所述第二延伸部具有一第二顶部，且所述第二延伸部的第二顶部与所述第一延伸部的第一顶部共面设置。
6.如权利要求1所述气密结构，其特征在于：所述毛细结构包括一贴设于所述凹槽内壁的第一毛细部、贴设于所述第一板体的第二表面的第二毛细部以及连接所述第一毛细部和第二毛细部的多个连接部。
7.如权利要求6所述气密结构，其特征在于：所述连接部的纵截面呈矩形，所述连接部与所述第一毛细部和第二毛细部垂直设置，且所述多个连接部之间均等间隔设置。
8.如权利要求6所述气密结构，其特征在于：所述第一毛细结构和第二毛细结构的厚度相等，所述连接部的高度和宽度均大于所述第一毛细结构和第二毛细结构的厚度。
9.如权利要求1所述气密结构，其特征在于：所述第一板体和第二板体的厚度均匀且相等。
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CN201710186984.0A CN108668424B (zh) 2017-03-27 2017-03-27 气密结构
TW106113425A TWI664888B (zh) 2017-03-27 2017-04-21 氣密結構
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