DE19980801T1 - Plattenförmiges Wärmeableitrohr und Kühlvorrichtung, die dieses verwendet - Google Patents

Plattenförmiges Wärmeableitrohr und Kühlvorrichtung, die dieses verwendet

Info

Publication number
DE19980801T1
DE19980801T1 DE19980801T DE19980801T DE19980801T1 DE 19980801 T1 DE19980801 T1 DE 19980801T1 DE 19980801 T DE19980801 T DE 19980801T DE 19980801 T DE19980801 T DE 19980801T DE 19980801 T1 DE19980801 T1 DE 19980801T1
Authority
DE
Germany
Prior art keywords
plate
same
heat sink
cooling device
shaped heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19980801T
Other languages
English (en)
Inventor
Masami Ikeda
Masaaki Yamamoto
Hitoshi Sho
Tatsuhiko Ueki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of DE19980801T1 publication Critical patent/DE19980801T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE19980801T 1998-04-13 1999-04-06 Plattenförmiges Wärmeableitrohr und Kühlvorrichtung, die dieses verwendet Withdrawn DE19980801T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9978398 1998-04-13
PCT/JP1999/001809 WO1999053255A1 (en) 1998-04-13 1999-04-06 Plate type heat pipe and cooling structure using it

Publications (1)

Publication Number Publication Date
DE19980801T1 true DE19980801T1 (de) 2000-05-31

Family

ID=14256549

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19980801T Withdrawn DE19980801T1 (de) 1998-04-13 1999-04-06 Plattenförmiges Wärmeableitrohr und Kühlvorrichtung, die dieses verwendet

Country Status (6)

Country Link
US (1) US6263959B1 (de)
CN (1) CN1179187C (de)
DE (1) DE19980801T1 (de)
GB (1) GB2341230B (de)
TW (1) TW406180B (de)
WO (1) WO1999053255A1 (de)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6896039B2 (en) * 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6639799B2 (en) 2000-12-22 2003-10-28 Intel Corporation Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
US20020084061A1 (en) * 2001-01-03 2002-07-04 Rosenfeld John H. Chemically compatible, lightweight heat pipe
US7411337B2 (en) * 2001-11-16 2008-08-12 Intel Corporation Electrical energy-generating system and devices and methods related thereto
US6574963B1 (en) 2001-11-16 2003-06-10 Intel Corporation Electrical energy-generating heat sink system and method of using same to recharge an energy storage device
US6626233B1 (en) * 2002-01-03 2003-09-30 Thermal Corp. Bi-level heat sink
US6819561B2 (en) * 2002-02-22 2004-11-16 Satcon Technology Corporation Finned-tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same
US20040011509A1 (en) * 2002-05-15 2004-01-22 Wing Ming Siu Vapor augmented heatsink with multi-wick structure
TW551612U (en) * 2002-07-26 2003-09-01 Tai Sol Electronics Co Ltd Piercing type IC heat dissipating device
JP3851875B2 (ja) * 2003-01-27 2006-11-29 株式会社東芝 冷却装置及び電子機器
TWI235817B (en) * 2004-03-26 2005-07-11 Delta Electronics Inc Heat-dissipating module
US20050270741A1 (en) * 2004-06-02 2005-12-08 Wang Chin W Large-area planar heat dissipation structure
US7149087B2 (en) * 2004-09-08 2006-12-12 Thermal Corp. Liquid cooled heat sink with cold plate retention mechanism
US7677299B2 (en) * 2004-11-10 2010-03-16 Wen-Chun Zheng Nearly isothermal heat pipe heat sink
TWI284190B (en) * 2004-11-11 2007-07-21 Taiwan Microloops Corp Bendable heat spreader with metallic screens based micro-structure and method for fabricating same
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
US20080216994A1 (en) * 2007-03-08 2008-09-11 Convergence Technologies Limited Vapor-Augmented Heat Spreader Device
US8146756B2 (en) * 2007-04-18 2012-04-03 Jonathan Manufacturing Corporation Universal toolless rack mount bracket
US7800905B1 (en) * 2007-10-16 2010-09-21 Nvidia Corporation Flat vapor chamber apparatus and method for transferring heat between integrated circuits
TWM339197U (en) * 2007-12-13 2008-08-21 Asia Vital Components Co Ltd Heat dissipating unit
JP4638923B2 (ja) * 2008-03-31 2011-02-23 日立オートモティブシステムズ株式会社 制御装置
CN101754655B (zh) * 2008-12-10 2013-03-06 富瑞精密组件（昆山）有限公司 散热模组
CN101852564A (zh) * 2009-03-30 2010-10-06 富准精密工业(深圳)有限公司 散热装置
US20100294475A1 (en) * 2009-05-22 2010-11-25 General Electric Company High performance heat transfer device, methods of manufacture thereof and articles comprising the same
US20100294467A1 (en) * 2009-05-22 2010-11-25 General Electric Company High performance heat transfer device, methods of manufacture thereof and articles comprising the same
US20110315351A1 (en) * 2010-06-23 2011-12-29 Celsia Technologies Taiwan, I Vapor chamber having composite supporting structure
US9307674B2 (en) 2011-05-06 2016-04-05 International Business Machines Corporation Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component
US8493738B2 (en) 2011-05-06 2013-07-23 International Business Machines Corporation Cooled electronic system with thermal spreaders coupling electronics cards to cold rails
US9027360B2 (en) 2011-05-06 2015-05-12 International Business Machines Corporation Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system
CN103096678B (zh) * 2011-10-27 2017-09-15 全亿大科技（佛山）有限公司 散热装置
US8687364B2 (en) 2011-10-28 2014-04-01 International Business Machines Corporation Directly connected heat exchanger tube section and coolant-cooled structure
US9043035B2 (en) 2011-11-29 2015-05-26 International Business Machines Corporation Dynamically limiting energy consumed by cooling apparatus
US9273906B2 (en) 2012-06-14 2016-03-01 International Business Machines Corporation Modular pumping unit(s) facilitating cooling of electronic system(s)
US9110476B2 (en) 2012-06-20 2015-08-18 International Business Machines Corporation Controlled cooling of an electronic system based on projected conditions
US8913384B2 (en) 2012-06-20 2014-12-16 International Business Machines Corporation Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)
US9879926B2 (en) 2012-06-20 2018-01-30 International Business Machines Corporation Controlled cooling of an electronic system for reduced energy consumption
US9313930B2 (en) 2013-01-21 2016-04-12 International Business Machines Corporation Multi-level redundant cooling system for continuous cooling of an electronic system(s)
JP5654186B1 (ja) * 2013-01-25 2015-01-14 古河電気工業株式会社 ヒートパイプ
TW201437591A (zh) * 2013-03-26 2014-10-01 Asustek Comp Inc 熱管結構
JP6548032B2 (ja) * 2015-03-19 2019-07-24 株式会社オートネットワーク技術研究所 冷却部材、及び蓄電モジュール
CN204707386U (zh) * 2015-04-30 2015-10-14 讯凯国际股份有限公司 散热组件、水冷式散热组件及散热系统
KR102546241B1 (ko) * 2016-10-05 2023-06-22 삼성전자주식회사 반도체 패키지
CN108668424B (zh) * 2017-03-27 2019-12-10 全亿大科技（佛山）有限公司 气密结构
JP6905678B2 (ja) * 2017-03-27 2021-07-21 大日本印刷株式会社 ベーパーチャンバ、ベーパーチャンバ搭載基板およびベーパーチャンバ用金属シート
JP2019032134A (ja) * 2017-08-09 2019-02-28 レノボ・シンガポール・プライベート・リミテッド プレート型熱輸送装置及び電子機器
US10458718B2 (en) * 2017-11-29 2019-10-29 Asia Vital Components Co., Ltd. Airtight penetration structure for heat dissipation device
CN111212547B (zh) * 2018-11-22 2022-04-19 宏达国际电子股份有限公司 散热模块的制造方法、散热模块以及电子装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07208884A (ja) * 1994-01-19 1995-08-11 Fujikura Ltd 平板型ヒートパイプ
US6082443A (en) * 1997-02-13 2000-07-04 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
JP3403307B2 (ja) * 1997-02-13 2003-05-06 古河電気工業株式会社 ヒートスプレッダとそれを用いた冷却器
JP3106429B2 (ja) * 1997-04-11 2000-11-06 古河電気工業株式会社 板型ヒートパイプとそれを用いた冷却構造

Also Published As

Publication number Publication date
GB2341230A (en) 2000-03-08
WO1999053255A1 (en) 1999-10-21
GB9928395D0 (en) 2000-01-26
US6263959B1 (en) 2001-07-24
CN1179187C (zh) 2004-12-08
TW406180B (en) 2000-09-21
GB2341230B (en) 2002-01-09
CN1263591A (zh) 2000-08-16

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Legal Events

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OP8 Request for examination as to paragraph 44 patent law
8130 Withdrawal