TWI663136B - Plate glass and manufacturing method thereof - Google Patents

Plate glass and manufacturing method thereof Download PDF

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Publication number
TWI663136B
TWI663136B TW105142273A TW105142273A TWI663136B TW I663136 B TWI663136 B TW I663136B TW 105142273 A TW105142273 A TW 105142273A TW 105142273 A TW105142273 A TW 105142273A TW I663136 B TWI663136 B TW I663136B
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Taiwan
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sheet glass
glass
manufacturing
plate glass
notch
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TW105142273A
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Chinese (zh)
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TW201800357A (en
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片山裕貴
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日商日本電氣硝子股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C03C15/02—Surface treatment of glass, not in the form of fibres or filaments, by etching for making a smooth surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02422—Non-crystalline insulating materials, e.g. glass, polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B24B41/053—Grinding heads for working on plane surfaces for grinding or polishing glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

對於將在周緣部(Ga)具有缺口部(Gb)的圓盤狀的板玻璃(G)製造的方法，在缺口部(Gb)施加蝕刻處理者。 In a method for manufacturing a disc-shaped plate glass (G) having a notch (Gb) in a peripheral portion (Ga), an etching treatment is applied to the notch (Gb).

Description

板玻璃及其製造方法 Plate glass and manufacturing method thereof

本發明，是有關於在周緣部具有缺口部的板玻璃及其製造方法。 This invention relates to the sheet glass which has a notch part in the peripheral part, and its manufacturing method.

例如半導體晶圓的製造程序中，對於將半導體晶圓支撐的構件會使用板玻璃。此時，在半導體晶圓中，設有為了將其結晶方位配合於規定的方向的V形缺口的缺口部，對於此缺口部一般是被施加研磨加工。 For example, in the manufacturing process of a semiconductor wafer, plate glass is used for a member supporting a semiconductor wafer. At this time, the semiconductor wafer is provided with a notch portion having a V-shaped notch in order to match its crystal orientation to a predetermined direction. Generally, the notch portion is subjected to polishing processing.

例如在專利文獻1中揭示了，對於半導體晶圓的缺口部施加研磨加工用的方法。此研磨方法，是藉由一邊將由不織布等形成的圓板狀的研磨工具旋轉，一邊與成為研磨對象的半導體晶圓的缺口部抵接，將該缺口部研磨成對應研磨工具的凸狀外周部的形狀者(段落0027、第2圖~第4圖)。 For example, Patent Document 1 discloses a method for applying a polishing process to a notch portion of a semiconductor wafer. In this polishing method, a disc-shaped polishing tool formed of a non-woven fabric or the like is rotated while abutting against a notched portion of a semiconductor wafer to be polished, and the notched portion is polished to a convex outer peripheral portion corresponding to the polishing tool (Paragraph 0027, Figures 2 to 4).

[習知技術文獻] [Xizhi technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2005-118903號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2005-118903

但是在半導體晶圓的支撐用是使用板玻璃的情況，也有必要在板玻璃設置位置對合用的缺口部。玻璃因為一般是脆性，所以在半導體製造步驟使用支撐用板玻璃時，該板玻璃具有從缺口部破損的可能。因此，為了提高此板玻璃的強度，考慮對於板玻璃的缺口部也施加研磨加工。但是，在使用研磨工具的研磨加工中無法將缺口部的表面成為充分地平滑的狀態，使支撐用板玻璃具有無法獲得充分強度的情況。即，在習知的半導體製造步驟使用支撐用板玻璃時，該板玻璃是具有破損的可能。 However, in the case where a sheet glass is used for the support of the semiconductor wafer, it is also necessary to align the notched portion for the sheet glass installation position. Since glass is generally brittle, when a supporting plate glass is used in a semiconductor manufacturing step, the plate glass may be broken from the notch portion. Therefore, in order to improve the strength of this plate glass, it is considered that a grinding process is also applied to the notched portion of the plate glass. However, in the polishing process using a polishing tool, the surface of the notch portion cannot be sufficiently smoothed, and the sheet glass for support may not have sufficient strength. That is, when a supporting plate glass is used in a conventional semiconductor manufacturing process, the plate glass may be damaged.

且在板玻璃的缺口部具有角部的話，因為無論如何皆容易產生破裂，所以也考慮例如將角部作成R面等的平滑的曲面形狀。但是，在此情況下，因為缺口部的三次元形狀會複雜化，在如專利文獻1的形態的研磨工具中將缺口部的表面無遺漏地研磨是困難的。 In addition, if a corner portion is provided in the notch portion of the sheet glass, cracks are liable to occur in any case. For example, it is also considered that the corner portion has a smooth curved surface shape such as an R surface. However, in this case, since the three-dimensional shape of the notch portion is complicated, it is difficult to grind the surface of the notch portion without omission in the polishing tool in the form of Patent Document 1.

本發明，是有鑑於以上的狀況者，其欲解決的技術的課題，是藉由對於被設在板玻璃的缺口部無遺漏且穩定地施加加工使提高板玻璃的強度。 The present invention has been made in view of the above circumstances, and a technical problem to be solved is to increase the strength of the sheet glass by stably applying processing to the notch portion provided in the sheet glass and stably performing the processing.

本發明是為了解決上述的課題者，是將在周緣部具有缺口部的圓盤狀的板玻璃製造的方法，在前述缺 口部施加蝕刻處理。如此，藉由在缺口部施加蝕刻處理，就可以將缺口部的表面整體無遺漏地平滑化。因此，可以提高板玻璃的強度。且，可以將缺口部無遺漏且穩定地施加加工。 The present invention is to solve the above-mentioned problems, and is a method for manufacturing a disc-shaped sheet glass having a notch portion in a peripheral portion. An etching process is applied to the mouth. In this way, by applying an etching treatment to the cutout portion, the entire surface of the cutout portion can be smoothed without omission. Therefore, the strength of the sheet glass can be improved. In addition, it is possible to stably process the notched portion without omission.

在本發明的板玻璃的製造方法中，將前述缺口部的位置對齊地將複數前述板玻璃層疊，在前述缺口部施加蝕刻處理較佳。如此，藉由在將缺口部的位置對齊的狀態下將複數板玻璃層疊，就可以將各缺口部的蝕刻處理連續或是同時進行，成為可將板玻璃效率良好地製造。 In the method for manufacturing a sheet glass of the present invention, it is preferable that a plurality of the sheet glasses are laminated so that the positions of the cutout portions are aligned, and an etching treatment is preferably applied to the cutout portions. In this way, by laminating a plurality of plate glass in a state where the positions of the cutout portions are aligned, the etching treatment of each cutout portion can be performed continuously or simultaneously, and the plate glass can be efficiently manufactured.

在本發明的板玻璃的製造方法中，將前述複數板玻璃中的前述缺口部的位置藉由定位構件對齊較佳。由此，藉由將定位構件與複數缺口部接觸，就成為可將複數板玻璃的缺口部的位置精度佳地對齊。 In the manufacturing method of the sheet glass of this invention, it is preferable to align the position of the said notch part in the said several sheet glass with a positioning member. Accordingly, by contacting the positioning member with the plurality of cutout portions, it is possible to align the position of the cutout portions of the plurality of plate glass with high accuracy.

在本發明的板玻璃的製造方法中，將前述定位構件可裝卸自如或是可移動地安裝在將前述複數板玻璃載置的載置台較佳。如此，定位構件，是藉由被安裝於載置台，就可以在定位置效率良好地進行缺口部的定位。此定位終了的話，定位構件，是藉由從載置台被取下，或是變更其位置，使遠離缺口部。因此，定位構件不會成為阻礙，成為可在缺口部施加良好的蝕刻處理。 In the method for manufacturing a sheet glass of the present invention, it is preferable that the positioning member is detachably or movably mounted on a mounting table on which the plurality of sheet glass is placed. In this way, the positioning member can be efficiently positioned at the fixed position by mounting the positioning member on the mounting table. When this positioning is completed, the positioning member is removed from the mounting table or its position is changed away from the notch. Therefore, the positioning member does not become a hindrance, and it is possible to apply a good etching treatment to the cutout portion.

在本發明的板玻璃的製造方法中，前述載置台，是具有前述板玻璃被載置的支撐面，前述支撐面，是被配置成對於水平方向傾斜狀較佳。如此，藉由將載置台的支撐面配置成傾斜狀，成為容易將板玻璃載置在此支撐 面，成為可效率良好地進行板玻璃對於支撐面的層疊作業。 In the method for manufacturing a sheet glass of the present invention, the mounting table has a supporting surface on which the sheet glass is placed, and the supporting surface is preferably arranged to be inclined in a horizontal direction. In this way, by arranging the support surface of the mounting table in an inclined shape, it becomes easy to mount and support the plate glass there. This makes it possible to efficiently perform the laminating operation of the sheet glass on the support surface.

在本發明的板玻璃的製造方法中，在前述複數板玻璃之間形成保護層較佳。如此藉由在板玻璃之間形成保護層，就可防止板玻璃的表面被蝕刻液浸蝕。 In the manufacturing method of the sheet glass of this invention, it is preferable to form a protective layer between the said several sheet glass. In this way, by forming a protective layer between the plate glass, the surface of the plate glass can be prevented from being etched by the etching solution.

且前述保護層，是由液體所構成較佳。將保護層藉由液體構成的話，保護層的形成可以迅速地進行，且蝕刻處理終了時，被層疊的板玻璃可容易地剝離。 The protective layer is preferably made of a liquid. When the protective layer is formed of a liquid, the formation of the protective layer can be performed quickly, and the laminated glass can be easily peeled off at the end of the etching process.

在本發明的板玻璃的製造方法中，在前述板玻璃的前述缺口部、及除了前述缺口部以外的前述板玻璃的前述周緣部施加蝕刻處理較佳。如此，不只板玻璃的缺口部，藉由也在其周緣部施加蝕刻處理，就可提高板玻璃的整體的強度。 In the manufacturing method of the sheet glass of this invention, it is preferable to apply an etching process to the said notch part of the said sheet glass, and the said peripheral part of the said sheet glass other than the said notch part. In this way, not only the notch portion of the sheet glass but also the peripheral edge portion can be etched to increase the strength of the entire sheet glass.

本發明的板玻璃，是在周緣部具有缺口部的圓盤狀的板玻璃，主表面是由非蝕刻面所構成，缺口部是由蝕刻面所構成。依據這種構成的話，例如，將該板玻璃使用於半導體支撐用途的情況時，可以抑制半導體製造步驟中的破損。 The sheet glass of the present invention is a disc-shaped sheet glass having a notch portion in a peripheral portion, and the main surface is made of a non-etched surface, and the notch portion is made of an etched surface. According to this structure, for example, when this plate glass is used for a semiconductor support application, it is possible to suppress damage in a semiconductor manufacturing process.

依據本發明的話，藉由對於被設在板玻璃的缺口部施加無遺漏且穩定的加工就可提高板玻璃的強度。 According to the present invention, the strength of a sheet glass can be improved by applying a stable and non-missing process to a notch portion provided in the sheet glass.

1‧‧‧保持具 1‧‧‧ holder

2‧‧‧第一構件(載置台) 2‧‧‧First component (mounting table)

3‧‧‧第二構件 3‧‧‧ second component

4‧‧‧本體部 4‧‧‧Body

4a‧‧‧一端部 4a‧‧‧One end

4b‧‧‧另一端部 4b‧‧‧ the other end

5‧‧‧定位銷(定位部) 5‧‧‧ Locating Pin (Positioning Section)

5a‧‧‧第一定位銷(定位構件) 5a‧‧‧First positioning pin (positioning member)

5b‧‧‧第二定位銷 5b‧‧‧Second positioning pin

5c‧‧‧第三定位銷 5c‧‧‧third positioning pin

6‧‧‧連結部 6‧‧‧ Connection Department

6a‧‧‧棒狀構件 6a‧‧‧ rod-shaped member

6b‧‧‧螺帽 6b‧‧‧nut

7‧‧‧支撐面 7‧‧‧ support surface

8‧‧‧孔部 8‧‧‧ Hole

9‧‧‧第一貫通孔 9‧‧‧First through hole

10‧‧‧第二貫通孔 10‧‧‧Second through hole

11‧‧‧把持部 11‧‧‧ holding section

12‧‧‧設置台 12‧‧‧ Setting Table

13‧‧‧隔件 13‧‧‧ spacer

14‧‧‧保護層 14‧‧‧ protective layer

15‧‧‧蝕刻槽 15‧‧‧etching tank

DG‧‧‧假玻璃 DG‧‧‧ fake glass

EL‧‧‧蝕刻液 EL‧‧‧etching solution

G‧‧‧板玻璃 G‧‧‧ Plate glass

Ga‧‧‧周緣部 Ga‧‧‧ Peripheral

Gb‧‧‧缺口部 Gb‧‧‧ Notch

L‧‧‧液體 L‧‧‧Liquid

[第1圖]在板玻璃的製造方法所使用的保持具的分解側面圖。 [FIG. 1] An exploded side view of a holder used in a method for manufacturing a sheet glass.

[第2圖]顯示保持具的第一構件的俯視圖。 [FIG. 2] A plan view showing a first member of a holder.

[第3圖]顯示保持具的第二構件的俯視圖。 [Fig. 3] A plan view showing a second member of the holder.

[第4圖]顯示板玻璃的製造方法的一步驟的側面圖。 [Fig. 4] A side view showing one step of a method for manufacturing a plate glass.

[第5圖]顯示板玻璃的製造方法的一步驟的側面圖。 [FIG. 5] A side view showing one step of a method for manufacturing a plate glass.

[第6圖]顯示板玻璃的製造方法的一步驟的側面圖。 [FIG. 6] A side view showing one step of the method for manufacturing a plate glass.

[第7圖A]顯示板玻璃的製造方法的一步驟的側面圖。 [FIG. 7A] A side view showing one step of the method for manufacturing a plate glass.

[第7圖B]顯示板玻璃的製造方法的一步驟的側面圖。 [FIG. 7B] A side view showing one step of the method for manufacturing a plate glass.

[第7圖C]顯示板玻璃的製造方法的一步驟的側面圖。 [FIG. 7C] A side view showing one step of the method for manufacturing a plate glass.

[第8圖]顯示板玻璃的製造方法的一步驟的側面圖。 [Fig. 8] A side view showing one step of a method for manufacturing a plate glass.

[第9圖]顯示板玻璃的製造方法的一步驟的側面圖。 [FIG. 9] A side view showing one step of the method for manufacturing a plate glass.

[第10圖]顯示板玻璃的製造方法的一步驟的側面圖。 [Fig. 10] A side view showing one step of the method for manufacturing a plate glass.

[第11圖]顯示板玻璃的製造方法的一步驟的側面圖。 [FIG. 11] A side view showing one step of the method for manufacturing a plate glass.

[第12圖]顯示板玻璃的製造方法的一步驟的側面圖。 [Fig. 12] A side view showing one step of the method for manufacturing a plate glass.

[第13圖]顯示板玻璃的製造方法的一步驟的側面圖。 [Fig. 13] A side view showing one step of a method for manufacturing a plate glass.

以下，對於實施本發明用的形態一邊參照圖面一邊說明。第1圖至第13圖，是顯示本發明的板玻璃的製造方法的一實施例。 Hereinafter, the form for implementing this invention is demonstrated, referring drawings. 1 to 13 are diagrams showing an embodiment of a method for manufacturing a sheet glass of the present invention.

第1圖，是顯示為了實施本方法所使用的板玻璃的保持具。保持具1，是具備：複數板玻璃G被載置的第一構件2、及與複數板玻璃G被載置的第一構件2重疊的第二構件3。又，板玻璃G，是如第2圖所示，構成圓盤狀，並且在其周緣部Ga的一部分形成有V形缺口的缺口部Gb者。 FIG. 1 shows a holder for sheet glass used for carrying out the method. The holder 1 includes a first member 2 on which a plurality of sheet glass G is placed, and a second member 3 which overlaps with the first member 2 on which a plurality of sheet glass G is placed. In addition, as shown in FIG. 2, the sheet glass G has a disc shape, and a notch portion Gb having a V-shaped notch is formed in a part of the peripheral edge portion Ga.

如第1圖及第2圖所示，第一構件2，是具備：板玻璃G被載置的本體部4、及對於被載置在本體部4的板玻璃G進行定位的定位部5、及將第一構件2及第二構件3連結用的連結部6。 As shown in FIGS. 1 and 2, the first member 2 includes a body portion 4 on which the plate glass G is placed, and a positioning portion 5 that positions the plate glass G placed on the body portion 4. And a connecting portion 6 for connecting the first member 2 and the second member 3.

本體部4，是藉由長方形狀的板構件構成。本體部4，是具有被積載板玻璃G的支撐面7。支撐面7，是將板玻璃G由2列層疊地支撐的方式構成長方形狀。且，支撐面7，是具有將定位部5可裝卸自如地支撐的複數(在本例中為三個)的孔部8。 The main body portion 4 is configured by a rectangular plate member. The main body portion 4 is a support surface 7 having a plate glass G to be stacked. The support surface 7 is formed in a rectangular shape so that the sheet glass G is supported by being stacked in two rows. In addition, the support surface 7 is provided with a plurality of hole portions 8 (three in this example) for detachably supporting the positioning portion 5.

定位部5，是包含可裝卸自如地被安裝於本體部4的支撐面7的複數定位銷5a~5c。在本實施例中，對於支撐面7，將三根定位銷5a~5c作為一組，被配置有合計二組的定位銷5a~5c。一組的定位銷5a~5c，是包 含：進行板玻璃G的缺口部Gb的定位的第一定位銷5a、進行板玻璃G的周緣部Ga的定位的第二定位銷5b及第三定位銷5c。如第1圖所示，各定位銷5a~5c，其一端部是被插入支撐面7的孔部8成為立位狀態。 The positioning portion 5 includes a plurality of positioning pins 5 a to 5 c including a support surface 7 detachably attached to the main body portion 4. In this embodiment, as for the support surface 7, three positioning pins 5a to 5c are used as a group, and a total of two groups of positioning pins 5a to 5c are arranged. A set of positioning pins 5a ~ 5c is a package It includes a first positioning pin 5a for positioning the notch portion Gb of the sheet glass G, a second positioning pin 5b and a third positioning pin 5c for positioning the peripheral edge portion Ga of the sheet glass G. As shown in FIG. 1, one end of each of the positioning pins 5 a to 5 c is a hole portion 8 that is inserted into the support surface 7 and becomes a standing state.

如第1圖所示，連結部6，是具有從本體部4的支撐面7突出的複數棒狀構件6a。此棒狀構件6a，是由螺栓構件所構成，橫跨其全長具有公螺紋部。且，連結部6，是具有讓此棒狀構件6a的公螺紋部嵌入的螺帽6b。 As shown in FIG. 1, the connecting portion 6 is a plurality of rod-shaped members 6 a having protrusions from the support surface 7 of the main body portion 4. This rod-shaped member 6a is composed of a bolt member and has a male screw portion across its entire length. The connection portion 6 is a nut 6b having a male screw portion of the rod-shaped member 6a fitted therein.

如第2圖所示，構成連結部6的複數棒狀構件6a，是將被載置在本體部4的支撐面7的板玻璃G包圍的方式，被配置成環狀。具體而言，連結部6，是對應被2列層疊的板玻璃G，被環狀配置在本體部4的支撐面7的二處。由棒狀構件6a所構成的環的直徑(與棒狀構件6a內接的圓的直徑)，是設定成比板玻璃G的直徑更大。由此，板玻璃G被積載在第一構件2時，各棒狀構件6a，是遠離板玻璃G的周緣部Ga位置，後述的蝕刻處理時，不會與此周緣部Ga接觸。 As shown in FIG. 2, the plurality of rod-shaped members 6 a constituting the connection portion 6 are arranged in a ring shape so as to surround the plate glass G placed on the support surface 7 of the main body portion 4. Specifically, the connection portion 6 is a sheet glass G that is stacked in two rows, and is arranged at two positions on the support surface 7 of the main body portion 4 in a ring shape. The diameter of the ring formed by the rod-shaped member 6a (the diameter of a circle inscribed with the rod-shaped member 6a) is set larger than the diameter of the plate glass G. Accordingly, when the sheet glass G is stored on the first member 2, each rod-shaped member 6 a is located away from the peripheral edge portion Ga of the sheet glass G, and does not come into contact with the peripheral edge portion Ga during the etching process described later.

如第3圖所示，第二構件3，是與第一構件2同樣地藉由長方形狀的板構件所構成。第二構件3，是具有：可將定位部5的各定位銷5a~5c插通的第一貫通孔9、及可將連結部6的棒狀構件6a插通的第二貫通孔10。且，第二構件3，是具有將保持具1操作用的把持部11。 As shown in FIG. 3, the second member 3 is configured by a rectangular plate member similarly to the first member 2. The second member 3 includes a first through hole 9 through which the positioning pins 5 a to 5 c of the positioning portion 5 can be inserted, and a second through hole 10 through which the rod-shaped member 6 a of the connection portion 6 can be inserted. The second member 3 includes a grip portion 11 for operating the holder 1.

以下說明，利用上述構成的保持具1將板玻璃G製造的方法。 Hereinafter, a method of manufacturing the sheet glass G by using the holder 1 having the above-described configuration will be described.

板玻璃G，是例如，藉由從母材玻璃切削加工、磨削加工而形成具有周緣部Ga的圓形玻璃之後，藉由在此周緣部Ga的一部分，施加切削加工、磨削加工而形成缺口部Gb。又，板玻璃G的表面、周緣部Ga、及缺口部Gb，是在以下說明的蝕刻處理之前，使用研磨砥石和研磨膠帶等的研磨工具被研磨加工也可以。 The plate glass G is formed, for example, by forming a circular glass having a peripheral edge portion Ga by cutting and grinding processing from a base glass, and then forming a portion of the peripheral edge portion Ga by cutting and grinding. Notch Gb. In addition, the surface, peripheral edge Ga, and notch Gb of the sheet glass G may be polished by using a polishing tool such as abrasive vermiculite or abrasive tape before the etching process described below.

其後，板玻璃G，是被載置在第一構件2的支撐面7。在本實施例中，第一構件2，是作為將板玻璃G層疊用的載置台被使用。 Thereafter, the sheet glass G is placed on the support surface 7 of the first member 2. In this embodiment, the first member 2 is used as a mounting table for laminating the sheet glass G.

在最初的板玻璃G被載置於支撐面7之前，假玻璃DG是被載置在支撐面7(第4圖參照)。假玻璃DG，是具有與板玻璃G幾乎相同形狀較佳。即，假玻璃DG，是在其周緣部具有缺口部Gb者。假玻璃DG被載置在支撐面7的話，如第5圖乃至第7圖A~第7圖C所示，複數板玻璃G是依序層疊在假玻璃DG上。 Before the first sheet glass G is placed on the support surface 7, the dummy glass DG is placed on the support surface 7 (see FIG. 4). It is preferable that the dummy glass DG has almost the same shape as the sheet glass G. That is, the dummy glass DG has a notch portion Gb in its peripheral portion. When the dummy glass DG is placed on the support surface 7, as shown in FIGS. 5 to 7A to 7C, the plurality of plate glasses G are sequentially stacked on the dummy glass DG.

第一構件2，是如第5圖所示，被載置在規定的設置台12。在設置台12及第一構件2之間，配置有隔件13。此隔件13，是將第一構件2的本體部4中的寬度方向的一端部4a的下面支撐。由此，第一構件2的本體部4中的支撐面7，是寬度方向中的一端部4a的位置較高，另一端部4b的位置較低的方式傾斜。對於由此所產生的支撐面7的水平方向的傾斜角度，是成為45°以下較 佳。 The first member 2 is placed on a predetermined setting table 12 as shown in FIG. 5. A spacer 13 is arranged between the installation base 12 and the first member 2. This spacer 13 supports the lower surface of one end portion 4 a in the width direction of the main body portion 4 of the first member 2. As a result, the support surface 7 in the main body portion 4 of the first member 2 is inclined such that the position of one end portion 4a is higher in the width direction and the position of the other end portion 4b is lower. The horizontal inclination angle of the supporting surface 7 thus generated is 45 ° or less. good.

其後，如第7圖A所示，在假玻璃DG的表面被塗抹規定的液體L(例如水)，其後，如第7圖B所示，最初的板玻璃G是被重疊在假玻璃DG上。由此，如第7圖C所示，在假玻璃DG及板玻璃G之間，形成有由液體L所產生的膜。由此液體L所產生的膜，在後述的蝕刻處理時，防止蝕刻液侵入假玻璃DG及板玻璃G之間，作為保護板玻璃G的表面的層(保護層14)的功能。 Thereafter, as shown in FIG. 7A, a predetermined liquid L (for example, water) is applied to the surface of the dummy glass DG. Thereafter, as shown in FIG. 7B, the first sheet glass G is superimposed on the dummy glass. On DG. Accordingly, as shown in FIG. 7C, a film generated by the liquid L is formed between the dummy glass DG and the sheet glass G. The film produced by the liquid L prevents the etchant from entering between the dummy glass DG and the sheet glass G during the etching process described later, and functions as a layer (protective layer 14) for protecting the surface of the sheet glass G.

將板玻璃G層疊時，各板玻璃G之間也形成有由此液體L所產生的保護層14。如第8圖所示，規定數(在圖例中為五枚)的板玻璃G被層疊的話，假玻璃DG是被層疊在位於最上部的板玻璃G上。在此假玻璃DG及位於最上部的板玻璃G之間也形成有保護層14。 When the sheet glass G is laminated, a protective layer 14 caused by the liquid L is also formed between the sheet glass G. As shown in FIG. 8, when a predetermined number (five pieces in the illustration) of sheet glass G is laminated, the dummy glass DG is laminated on the top sheet glass G. A protective layer 14 is also formed between the dummy glass DG and the uppermost plate glass G.

將板玻璃G層疊時，對於本體部4的支撐面7被配置成環狀的連結部6的棒狀構件6a是成為標記，作業者，是藉由朝向此連結部6中的環的內側將板玻璃G移動，就可以容易地進行其設置。且，將板玻璃G載置在支撐面7時，將板玻璃G與連結部6接觸，將板玻璃G作為導件朝設置位置導引也可以。 When the sheet glass G is laminated, the rod-shaped member 6 a of the linking portion 6 arranged on the supporting surface 7 of the main body portion 4 is a mark, and the operator faces the inside of the ring in the linking portion 6 The plate glass G is moved, and its setting can be easily performed. When the plate glass G is placed on the support surface 7, the plate glass G is brought into contact with the connection portion 6, and the plate glass G may be guided as a guide toward the installation position.

作業者，是將板玻璃G一邊與第一定位銷5a、第二定位銷5b、及第三定位銷5c抵接，一邊將板玻璃G層疊於第一構件2的支撐面7上。具體而言，作業者，是將板玻璃G的缺口部Gb與第一定位銷5a接觸，將第二定位銷5b及第三定位銷5c與板玻璃G的周緣部 Ga接觸。由此被層疊於第一構件2的支撐面7上的複數板玻璃G，是在各缺口部Gb的位置對齊的狀態下被定位。由此，被層疊的板玻璃G，因為不會產生缺口部Gb的位置偏離，所以其表面不會露出。又，第一定位銷5a是對應缺口部Gb的形狀，由與缺口部Gb卡合的形狀構成較佳。在本實施例中，缺口部Gb因為是從俯視看形成圓凹形狀，所以第一定位銷5a是構成對應缺口部Gb的尺寸的徑的圓柱狀。 The operator laminates the sheet glass G on the support surface 7 of the first member 2 while abutting the sheet glass G with the first positioning pin 5a, the second positioning pin 5b, and the third positioning pin 5c. Specifically, the operator contacts the notch portion Gb of the sheet glass G with the first positioning pin 5a, and brings the second positioning pin 5b and the third positioning pin 5c with the peripheral portion of the sheet glass G. Ga contact. As a result, the plurality of plate glasses G laminated on the support surface 7 of the first member 2 are positioned in a state where the positions of the respective cutout portions Gb are aligned. As a result, the laminated glass plate G does not have its surface exposed because the positional deviation of the notch portion Gb does not occur. The first positioning pin 5a has a shape corresponding to the cutout portion Gb, and is preferably formed in a shape engaging with the cutout portion Gb. In this embodiment, the cutout portion Gb is formed into a concave shape in a plan view, so the first positioning pin 5a has a cylindrical shape having a diameter corresponding to the size of the cutout portion Gb.

藉由被設在設置台12的隔件13，第一構件2的支撐面7，因為是被配置成傾斜狀(第5圖參照)，所以成為容易將板玻璃G載置的姿勢。即，例如作業者是從第一構件2的寬度方向中的另一端部4b側將板玻璃G載置在支撐面7的情況，因為支撐面7，是接近作業者的方式傾斜配置，所以可以將朝板玻璃G的支撐面7的層疊作業容易地進行。 Since the spacer 13 provided on the installation table 12 and the support surface 7 of the first member 2 are arranged in an inclined shape (refer to FIG. 5), the plate glass G can be easily placed. In other words, for example, when the operator places the sheet glass G on the support surface 7 from the other end portion 4b side in the width direction of the first member 2, the support surface 7 can be arranged obliquely so as to approach the operator. The laminating operation toward the support surface 7 of the sheet glass G is easily performed.

且被支撐於此支撐面7的各定位銷5a~5c，是對應支撐面7的傾斜的方式傾斜。此情況，作業者是從第一構件2的寬度方向中的另一端部4b側將板玻璃G載置在支撐面7時，各定位銷5a~5c，其先端部是朝向作業者的方式傾斜。因此，作業者，是將板玻璃G載置在支撐面7時，可以將板玻璃G容易與各定位銷5a~5c接觸，可以將板玻璃G的層疊作業更容易地進行。 The positioning pins 5 a to 5 c supported on the support surface 7 are inclined in a manner corresponding to the inclination of the support surface 7. In this case, when the operator places the plate glass G on the support surface 7 from the other end portion 4b side in the width direction of the first member 2, the tip ends of the positioning pins 5a to 5c are inclined toward the operator. . Therefore, when the operator places the sheet glass G on the support surface 7, the sheet glass G can be easily brought into contact with the positioning pins 5a to 5c, and the sheet glass G can be laminated more easily.

其後，如第9圖、第10圖所示，第二構件3是被重疊在第一構件2。第二構件3，是與位於被層疊的 板玻璃G的最上部的假玻璃DG接觸。且，第一構件2的定位銷5a~5c的先端，是插通第二構件3的第一貫通孔9，連結部6的棒狀構件6a的先端部，是插通第二構件3的第二貫通孔10(第10圖參照)。 Thereafter, as shown in FIGS. 9 and 10, the second member 3 is superposed on the first member 2. The second member 3 is stacked The uppermost dummy glass DG of the sheet glass G is in contact. The leading ends of the positioning pins 5a to 5c of the first member 2 are first through holes 9 through which the second member 3 is inserted, and the leading ends of the rod-shaped members 6a of the connecting portion 6 are the first through holes of the second member 3. Two through holes 10 (refer to FIG. 10).

第二構件3被設置的話，如第10圖所示，定位部5的先端部及連結部6的棒狀構件6a的先端部，是成為從第二構件3的各貫通孔9、10突出的狀態。在此狀態下，如第11圖所示，棒狀構件6a的先端部是嵌入螺帽6b。 When the second member 3 is provided, as shown in FIG. 10, the leading end portion of the positioning portion 5 and the leading end portion of the rod-shaped member 6 a of the connecting portion 6 protrude from the through holes 9 and 10 of the second member 3. status. In this state, as shown in FIG. 11, the tip end portion of the rod-shaped member 6a is the fitting nut 6b.

藉由將螺帽6b充分地旋緊，第二構件3，是在將被層疊的板玻璃G由適切的力按壓的狀態下，與第一構件2連結。如第12圖所示，第一構件2及第二構件3的連結完成的話，第一定位銷5a、第二定位銷5b及第三定位銷5c，是從保持具1被取下。此情況，各定位銷5a~5c，因為其一端部是從第二構件3的第一貫通孔9突出，所以藉由將其一端部捏住地拔取，就可以從保持具1容易地取下。 By fully tightening the nut 6b, the second member 3 is connected to the first member 2 in a state where the laminated sheet glass G is pressed by an appropriate force. As shown in FIG. 12, when the first member 2 and the second member 3 are connected, the first positioning pin 5 a, the second positioning pin 5 b, and the third positioning pin 5 c are removed from the holder 1. In this case, since each of the positioning pins 5 a to 5 c protrudes from the first through hole 9 of the second member 3, the pin 1 can be easily removed from the holder 1 by pinching and pulling out one end.

其後，作業者，是將手放在把持部11將保持具1舉升，並且將保持具1浸漬在蝕刻液EL被貯留的蝕刻槽15(第13圖參照)。蝕刻液EL，雖是使用例如包含氫氟酸及鹽酸的混酸，但是不限定於此。藉由保持具1被層疊的狀態下被保持的各板玻璃G，是在蝕刻槽15內，在其周緣部Ga及缺口部Gb被施加蝕刻處理。 After that, the operator raises the holder 1 by placing his hand on the holding portion 11 and immerses the holder 1 in the etching tank 15 in which the etching solution EL is stored (refer to FIG. 13). Although the etchant EL is a mixed acid containing, for example, hydrofluoric acid and hydrochloric acid, it is not limited thereto. Each plate glass G held by the holders 1 in a laminated state is etched in the etching groove 15 at its peripheral edge portion Ga and the notch portion Gb.

規定時間的蝕刻處理之後，保持具1，是從蝕 刻槽15被拉起。被保持在保持具1的複數板玻璃G，是從保持具1被取出之後，在其表面施加精加工的研磨加工。其後，經過洗淨步驟，完成在缺口部Gb被施加過蝕刻處理的板玻璃G。完成的板玻璃G，其主表面是成為非蝕刻面，在缺口部Gb、及除了此缺口部Gb以外的周緣部G形成蝕刻面。 After the etching process for a predetermined time, the holder 1 is removed from the etching The notch 15 is pulled up. The plurality of plate glass G held by the holder 1 is polished after the surface is removed after being taken out of the holder 1. After that, the plate glass G having been subjected to the etching treatment in the notched portion Gb is completed through a washing step. The main surface of the finished plate glass G is a non-etched surface, and an etched surface is formed in the notched portion Gb and a peripheral edge portion G other than the notched portion Gb.

依據以上說明的本發明的板玻璃G的製造方法的話，藉由在缺口部Gb施加蝕刻處理，藉由在缺口部Gb的全域施加無遺漏且穩定的加工，就可以提高板玻璃G的強度。因此，可以大幅地提高板玻璃G(缺口部Gb)的耐久性、壽命。進一步，因為在將複數板玻璃G層疊由保持具1保持的狀態下，進行蝕刻處理，所以可以將該處理效率良好地進行。 According to the manufacturing method of the sheet glass G of the present invention described above, the strength of the sheet glass G can be increased by applying an etching process to the notched portion Gb and applying a stable and non-missing process to the entire area of the notched portion Gb. Therefore, the durability and life of the sheet glass G (notch Gb) can be significantly improved. Furthermore, since the etching process is performed in a state where the plurality of plate glass G is laminated and held by the holder 1, this process can be performed efficiently.

藉由第一定位銷5a，而藉由將被層疊的複數板玻璃G的各缺口部Gb在相同位置對齊，各板玻璃G，是成為其表面不會露出地層疊，蝕刻處理時板玻璃G的表面也不會與蝕刻液EL接觸。且，藉由在板玻璃G之間形成保護層14，板玻璃G，其表面不需要被浸蝕在蝕刻液EL，只有包含缺口部Gb的周緣部Ga被蝕刻處理。 With the first positioning pins 5a, the notch portions Gb of the laminated plurality of plate glass G are aligned at the same position. Each plate glass G is laminated so that its surface is not exposed. The plate glass G is etched during the etching process. The surface will not be in contact with the etching solution EL. In addition, by forming the protective layer 14 between the plate glass G, the surface of the plate glass G does not need to be etched in the etching solution EL, and only the peripheral portion Ga including the notch portion Gb is etched.

被配置在第一構件2的連結部6的複數棒狀構件6a，因為是將被層疊的板玻璃G的周圍包圍的方式被配置成環狀，所以藉由連結部6(棒狀構件6a、螺帽6b)將第二構件3與第一構件2連結時，可以將適度的按壓力均一地賦予於被層疊配置的複數板玻璃G。由此，各 板玻璃G，是將各定位銷5a~5c取下之後，其位置也不會偏離地被保持於保持具1。 The plurality of rod-shaped members 6a arranged in the connection portion 6 of the first member 2 are arranged in a ring shape so as to surround the periphery of the laminated sheet glass G. Therefore, the connection portion 6 (the rod-shaped members 6a, When the nut 6b) connects the second member 3 and the first member 2, a moderate pressing force can be uniformly applied to the plurality of plate glass G stacked. From this, each The sheet glass G is held on the holder 1 without being deviated from the position of each positioning pin 5a to 5c after being removed.

[實施例] [Example]

本發明人，是為了確認本發明的效果而進行了試驗。在此試驗中，使用鑽石工具將缺口部研磨的板玻璃作為比較例1，將缺口部由研磨膠帶研磨的板玻璃作為比較例2，在缺口部施加了蝕刻處理的板玻璃作為實施例。對於比較例1、比較例2及實施例實施四點彎曲強度試驗，比較了其強度。 The inventors conducted tests to confirm the effects of the present invention. In this test, a plate glass having a notched portion polished using a diamond tool was used as Comparative Example 1, a plate glass having a notched portion polished with a polishing tape was used as Comparative Example 2, and a plate glass having an etching treatment applied to the notched portion was used as an example. The four-point bending strength test was performed for Comparative Example 1, Comparative Example 2, and Examples, and the strengths were compared.

板玻璃，是使用直徑300mm、厚度1.0mm者，將載物點的間隔作成100mm、將支點的間隔作成200mm、將十字頭的速度作成5.0mm/min，實施了試驗。在此試驗中，在各例中，測量了彎曲強度的平均值(平均強度)、最大值(最大強度)、最小值(最小強度)進行了比較。試驗體的數量(試驗點數)，是比較例1為41、比較例2為45、且實施例為46。將試驗結果如表1所示。 The sheet glass was tested using a diameter of 300 mm and a thickness of 1.0 mm. The distance between the load points was 100 mm, the distance between the fulcrum points was 200 mm, and the speed of the crosshead was 5.0 mm / min. In this test, the average value (average strength), maximum value (maximum strength), and minimum value (minimum strength) of the bending strength were measured and compared in each case. The number of test bodies (the number of test points) was 41 in Comparative Example 1, 45 in Comparative Example 2, and 46 in Example. The test results are shown in Table 1.

如表1所示，實施例，是在彎曲強度的平均值、最大值、最小值的其中任一，皆成為超過比較例1及比較例2的試驗結果。 As shown in Table 1, in the examples, the average, maximum, and minimum values of the flexural strength exceeded the test results of Comparative Examples 1 and 2.

又，本發明，不限定於上述實施例的構成，也不限定於上述的作用效果。本發明，在不脫離本發明的實質範圍內可進行各種變更。 In addition, the present invention is not limited to the configuration of the above-mentioned embodiment, nor is it limited to the aforementioned effects. The present invention can be modified in various ways without departing from the scope of the invention.

在上述的實施例中，雖顯示藉由形成於第一構件2的支撐面7的孔部8而將各定位銷5a~5c支撐的例，但是不限定於此。切換成此孔部8，將定位銷5a~5c沿著支撐面7可移動(可上下滑動)地被支撐的溝部是形成於支撐面7也可以。 In the embodiment described above, the example in which the positioning pins 5 a to 5 c are supported by the hole portion 8 formed in the support surface 7 of the first member 2 is shown, but it is not limited to this. Switching to this hole portion 8 may be a groove portion that supports the positioning pins 5 a to 5 c along the support surface 7 so as to be movable (slidable up and down).

此溝部，可將定位銷5a~5c，朝：進行板玻璃G的定位的第一位置、及從此第一位置退避的第二位置，位置變更。由此，在第一位置進行了由定位銷5a~5c所產生的板玻璃G的定位之後，藉由將各定位銷5a~5c朝第二位置移動，使各定位銷5a~5c不會與板玻璃G接觸，可以在板玻璃G施加良好的蝕刻處理。 In this groove portion, the positioning pins 5 a to 5 c can be changed in position toward a first position where the glass plate G is positioned and a second position retracted from the first position. Therefore, after positioning the plate glass G generated by the positioning pins 5a to 5c at the first position, the positioning pins 5a to 5c are moved to the second position so that the positioning pins 5a to 5c do not interact with each other. The plate glass G is in contact, and a good etching process can be applied to the plate glass G.

且不需要形成孔部8和溝部，將規定數的板玻璃G積載於第一構件2的支撐面7之後，作業者由手將定位構件(定位銷5a)與板玻璃G的缺口部Gb抵接，將缺口部Gb對齊也可以。 Moreover, it is not necessary to form the hole portion 8 and the groove portion. After a predetermined number of plate glass G is stored on the support surface 7 of the first member 2, the operator manually touches the positioning member (the positioning pin 5a) with the notch portion Gb of the plate glass G Then, the notch portion Gb may be aligned.

在上述的實施例中，定位部5，雖例示了定位銷5a~5c，但是不限定於此。定位部5，是對應板玻璃G和缺口部Gb的大小，包含板構件等其他的定位構件。 In the embodiment described above, the positioning portions 5 are exemplified by the positioning pins 5a to 5c, but are not limited thereto. The positioning portion 5 corresponds to the size of the plate glass G and the notch portion Gb, and includes other positioning members such as a plate member.

在上述的實施例中，雖顯示了在板玻璃G之間形成有由液體L所產生的保護層14的例，但是不限定於此，保護層14，是由具有黏性的密封劑和黏著劑，或是假玻璃DG等其他的固體所構成也可以。且，對應板玻璃G的尺寸、形狀、強度等，不需要形成保護層14就可以將板玻璃G層疊，在缺口部Gb施加蝕刻處理。 In the above-mentioned embodiment, although the example in which the protective layer 14 by the liquid L was formed between the plate glass G was shown, it is not limited to this. The protective layer 14 is made of a tacky sealant and adhesive It can also be composed of other solids such as false glass DG. In addition, according to the size, shape, strength, and the like of the sheet glass G, the sheet glass G can be laminated without forming the protective layer 14, and an etching process can be applied to the notch portion Gb.

在上述的實施例中，缺口部Gb雖例示了V形缺口，但是不限定於此，定向平面的直線狀的缺口部Gb是形成於半導體晶圓的情況時，對應此將直線狀的缺口部Gb形成於板玻璃G也可以。 In the above-mentioned embodiment, although the notch portion Gb illustrates a V-shaped notch, it is not limited to this. When the linear notch portion Gb in the orientation plane is formed on a semiconductor wafer, the linear notch portion is corresponding to this. Gb may be formed in the plate glass G.

在上述的實施例中，雖顯示了將第一構件2的支撐面7配置成傾斜狀，將板玻璃G積載在此支撐面7的例，但是不限定於此。支撐面7，是在被配置成水平狀的狀態下將板玻璃G支撐也可以。且，將支撐面7沿著垂直方向配置，並且藉由相面對配置的第二構件3，將複數板玻璃G挾持也可以。 In the above-mentioned embodiment, although the example which arrange | positioned the support surface 7 of the 1st member 2 in an inclined shape, and the plate glass G is stored in this support surface 7, the example is shown, However, It is not limited to this. The support surface 7 may support the plate glass G in the state arrange | positioned horizontally. In addition, the support surface 7 may be arranged in the vertical direction, and the plurality of plate glass G may be held by the second members 3 arranged facing each other.

在上述的實施例中，雖顯示了將被層疊配置的板玻璃G保持在保持具1，將此保持具1浸漬在蝕刻槽15的例，但是不限定於此。不需要使用保持具1，就可在規定位置將複數板玻璃G層疊配置，並且藉由將蝕刻液塗抹或是吹附在缺口部Gb，只有在缺口部Gb施加蝕刻處理也可以。此情況，不需要將板玻璃G層疊，每次一枚地進行蝕刻處理也可以。且，此情況時，不只缺口部Gb，在周緣部Ga也施加蝕刻處理也可以。 Although the example in which the laminated glass plates G are held in the holder 1 and the holder 1 is immersed in the etching tank 15 is shown in the above-mentioned embodiment, it is not limited to this. The plurality of plate glass G can be stacked and arranged at a predetermined position without using the holder 1, and the etching process can be applied to the notched portion Gb by applying or blowing the etchant to the notched portion Gb. In this case, it is not necessary to laminate the sheet glass G, and the etching process may be performed one at a time. In this case, an etching process may be applied to not only the notch portion Gb but also the peripheral edge portion Ga.

在上述的實施例中，雖顯示了將：朝第一構件2的板玻璃G的載置(層疊)、板玻璃G之間的保護層14的形成、第二構件3對於第一構件2的重疊、棒狀構件6a對於連結部6的螺帽6b的旋緊、保持具1朝蝕刻槽15的浸漬的各步驟，藉由作業者的手動作業進行的例，但是不限定於此。將這些的步驟自動化地製造板玻璃G也可以。 In the above-mentioned embodiment, it is shown that: the placing (lamination) of the sheet glass G toward the first member 2; the formation of the protective layer 14 between the sheet glass G; The steps of overlapping and tightening the rod-shaped member 6a with respect to the nut 6b of the connecting portion 6 and immersion of the holder 1 into the etching tank 15 are examples of manual operations performed by an operator, but the invention is not limited thereto. These steps may be automated to produce sheet glass G.

Claims (8)

一種板玻璃的製造方法，是將在周緣部具有缺口部的圓盤狀的板玻璃製造的方法，其特徵為：將前述缺口部的位置對齊地將複數前述板玻璃層疊，在前述缺口部施加蝕刻處理。A method for manufacturing sheet glass is a method for manufacturing a disc-shaped sheet glass having a notch portion in a peripheral portion, characterized in that a plurality of the sheet glasses are laminated in alignment with the position of the notch portion, and applied to the notch portion. Etching. 如申請專利範圍第1項的板玻璃的製造方法，其中，將前述複數板玻璃中的前述缺口部的位置藉由定位構件對齊。The method for manufacturing sheet glass according to the first item of the patent application, wherein the positions of the cutout portions in the plurality of sheet glass are aligned by a positioning member. 如申請專利範圍第2項的板玻璃的製造方法，其中，將前述定位構件可裝卸自如或是可移動地安裝在將前述複數板玻璃載置的載置台。For example, the method for manufacturing a sheet glass according to the second item of the patent application, wherein the positioning member is detachably or movably mounted on a mounting table on which the plurality of sheet glass is placed. 如申請專利範圍第3項的板玻璃的製造方法，其中，前述載置台，是具有前述板玻璃被載置的支撐面，前述支撐面，是被配置成對於水平方向傾斜狀。According to the method for manufacturing sheet glass according to item 3 of the scope of patent application, the mounting table has a support surface on which the sheet glass is mounted, and the support surface is arranged to be inclined with respect to a horizontal direction. 如申請專利範圍第1至4項中任一項的板玻璃的製造方法，其中，在前述複數板玻璃之間形成保護層。The method for manufacturing a sheet glass according to any one of claims 1 to 4, wherein a protective layer is formed between the aforementioned plurality of sheet glasses. 如申請專利範圍第5項的板玻璃的製造方法，其中，前述保護層，是由液體所構成。For example, the method for manufacturing a sheet glass according to item 5 of the patent application, wherein the protective layer is made of a liquid. 如申請專利範圍第1至4項中任一項的板玻璃的製造方法，其中，在前述板玻璃的前述缺口部、及除了前述缺口部以外的前述板玻璃的前述周緣部施加蝕刻處理。The manufacturing method of the sheet glass according to any one of claims 1 to 4, wherein an etching treatment is applied to the notch portion of the sheet glass and the peripheral portion of the sheet glass other than the notch portion. 一種板玻璃，是在周緣部具有缺口部的圓盤狀的板玻璃，其特徵為：主表面是只由非蝕刻面所構成，前述缺口部及周緣部是只由蝕刻面所構成。A plate glass is a disc-shaped plate glass having a notch portion in a peripheral portion, and is characterized in that the main surface is composed of only a non-etched surface, and the notch portion and the peripheral portion are composed of only an etched surface.
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