TWI657479B - 用以形成半導體積層構造之方法及系統 - Google Patents

用以形成半導體積層構造之方法及系統 Download PDF

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Publication number
TWI657479B
TWI657479B TW103143205A TW103143205A TWI657479B TW I657479 B TWI657479 B TW I657479B TW 103143205 A TW103143205 A TW 103143205A TW 103143205 A TW103143205 A TW 103143205A TW I657479 B TWI657479 B TW I657479B
Authority
TW
Taiwan
Prior art keywords
sub
component
semiconductor
direct
laminate structure
Prior art date
Application number
TW103143205A
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English (en)
Chinese (zh)
Other versions
TW201543535A (zh
Inventor
約翰Ｆ 斯圖姆夫
Original Assignee
美商蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商蘭姆研究公司 filed Critical 美商蘭姆研究公司
Publication of TW201543535A publication Critical patent/TW201543535A/zh
Application granted granted Critical
Publication of TWI657479B publication Critical patent/TWI657479B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
    • H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laser Beam Processing (AREA)
TW103143205A 2013-12-13 2014-12-11 用以形成半導體積層構造之方法及系統 TWI657479B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/105,566 US9070745B1 (en) 2013-12-13 2013-12-13 Methods and systems for forming semiconductor laminate structures
US14/105,566 2013-12-13

Publications (2)

Publication Number Publication Date
TW201543535A TW201543535A (zh) 2015-11-16
TWI657479B true TWI657479B (zh) 2019-04-21

Family

ID=53369386

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103143205A TWI657479B (zh) 2013-12-13 2014-12-11 用以形成半導體積層構造之方法及系統

Country Status (6)

Country Link
US (1) US9070745B1 (https=)
JP (1) JP6465633B2 (https=)
KR (1) KR20150069548A (https=)
CN (1) CN104716021B (https=)
SG (1) SG10201407521YA (https=)
TW (1) TWI657479B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9937589B2 (en) * 2015-03-27 2018-04-10 Advanced Research For Manufacturing Systems, Llc Object manufacturing from a work piece made of separate components
WO2020082232A1 (en) * 2018-10-23 2020-04-30 Yangtze Memory Technologies Co., Ltd. Semiconductor device flipping apparatus
US10903050B2 (en) 2018-12-10 2021-01-26 Lam Research Corporation Endpoint sensor based control including adjustment of an edge ring parameter for each substrate processed to maintain etch rate uniformity
CN114043074B (zh) * 2021-11-25 2024-05-03 哈尔滨工业大学 一种具有柔性加工能力的小型水导激光加工系统及方法
CN114346474B (zh) * 2022-01-17 2023-05-16 博捷芯(深圳)半导体有限公司 一种全自动激光晶圆切割装置及切割方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020115263A1 (en) * 2001-02-16 2002-08-22 Worth Thomas Michael Method and related apparatus of processing a substrate
US20040058476A1 (en) * 2002-09-25 2004-03-25 Ziptronix Wafer bonding hermetic encapsulation
US20050099467A1 (en) * 2003-10-10 2005-05-12 Andreas Bibl Print head with thin membrane
US20110151644A1 (en) * 2009-12-23 2011-06-23 Alexandre Vaufredaz Process for fabricating a heterostructure with minimized stress

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003257807A (ja) * 2002-03-07 2003-09-12 Shin Etsu Chem Co Ltd シリコン加工品の製造方法およびシリコン加工品
JP4128843B2 (ja) * 2002-10-16 2008-07-30 古河電気工業株式会社 半導体チップ製造方法
JP4417028B2 (ja) * 2003-05-22 2010-02-17 株式会社タカトリ ダイシングフレームへのダイシングテープの貼り付け装置
JP2006332378A (ja) * 2005-05-26 2006-12-07 Sharp Corp 物品の位置決め方法および位置決め装置、並びに半導体装置の製造方法および半導体装置の製造装置
EP1894662A2 (en) * 2006-08-29 2008-03-05 Nitto Denko Corporation Adhesive sheet for water jet laser dicing
JP2008153349A (ja) * 2006-12-15 2008-07-03 Disco Abrasive Syst Ltd ウェーハの分割方法
JP2010519763A (ja) * 2007-02-22 2010-06-03 ハナ シリコン アイエヌシー プラズマ処理装置用シリコン素材の製造方法
JP2009212173A (ja) * 2008-03-03 2009-09-17 Csun Mfg Ltd ウエハフィルム裁断装置
JP2011088799A (ja) * 2009-10-26 2011-05-06 Mitsubishi Electric Corp 半導体装置の製造方法およびレーザー加工装置
JP5578911B2 (ja) * 2010-03-31 2014-08-27 古河電気工業株式会社 ウエハ加工用テープ
CN102373017A (zh) * 2010-08-19 2012-03-14 古河电气工业株式会社 晶片加工用胶带
JP5952550B2 (ja) * 2011-11-28 2016-07-13 株式会社半導体エネルギー研究所 貼り合わせ装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020115263A1 (en) * 2001-02-16 2002-08-22 Worth Thomas Michael Method and related apparatus of processing a substrate
US20040058476A1 (en) * 2002-09-25 2004-03-25 Ziptronix Wafer bonding hermetic encapsulation
US20050099467A1 (en) * 2003-10-10 2005-05-12 Andreas Bibl Print head with thin membrane
US20110151644A1 (en) * 2009-12-23 2011-06-23 Alexandre Vaufredaz Process for fabricating a heterostructure with minimized stress

Also Published As

Publication number Publication date
JP2015122490A (ja) 2015-07-02
US9070745B1 (en) 2015-06-30
CN104716021A (zh) 2015-06-17
CN104716021B (zh) 2019-04-09
SG10201407521YA (en) 2015-07-30
TW201543535A (zh) 2015-11-16
US20150170958A1 (en) 2015-06-18
KR20150069548A (ko) 2015-06-23
JP6465633B2 (ja) 2019-02-06

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