TWI656102B - 脆性基板之分斷方法 - Google Patents

脆性基板之分斷方法 Download PDF

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Publication number
TWI656102B
TWI656102B TW104128694A TW104128694A TWI656102B TW I656102 B TWI656102 B TW I656102B TW 104128694 A TW104128694 A TW 104128694A TW 104128694 A TW104128694 A TW 104128694A TW I656102 B TWI656102 B TW I656102B
Authority
TW
Taiwan
Prior art keywords
line
crack
substrate
forming
trench
Prior art date
Application number
TW104128694A
Other languages
English (en)
Chinese (zh)
Other versions
TW201615579A (zh
Inventor
曾山浩
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201615579A publication Critical patent/TW201615579A/zh
Application granted granted Critical
Publication of TWI656102B publication Critical patent/TWI656102B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
TW104128694A 2014-10-29 2015-08-31 脆性基板之分斷方法 TWI656102B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014219929 2014-10-29
JP2014-219929 2014-10-29

Publications (2)

Publication Number Publication Date
TW201615579A TW201615579A (zh) 2016-05-01
TWI656102B true TWI656102B (zh) 2019-04-11

Family

ID=55857074

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104128694A TWI656102B (zh) 2014-10-29 2015-08-31 脆性基板之分斷方法

Country Status (5)

Country Link
JP (1) JP6288293B2 (ja)
KR (1) KR101866824B1 (ja)
CN (1) CN107108322B (ja)
TW (1) TWI656102B (ja)
WO (1) WO2016067728A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018131179A1 (de) 2018-12-06 2020-06-10 Schott Ag Glaselement mit geschnittener Kante und Verfahren zu dessen Herstellung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008201629A (ja) * 2007-02-21 2008-09-04 Epson Imaging Devices Corp 電気光学装置の製造方法、基板の分断方法、及び、基板分断装置
TW201204658A (en) * 2010-06-14 2012-02-01 Mitsuboshi Diamond Ind Co Ltd Scribing method for brittle material substrate
TW201417156A (zh) * 2012-10-26 2014-05-01 Mitsuboshi Diamond Ind Co Ltd 脆性材料基板之分斷方法與分斷裝置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100549099B1 (ko) 2001-06-14 2006-02-02 미쓰보시 다이야몬도 고교 가부시키가이샤 유기이엘 디스플레이 제조장치 및 유기이엘 디스플레이의제조방법
TWI226877B (en) 2001-07-12 2005-01-21 Mitsuboshi Diamond Ind Co Ltd Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates
WO2004048058A1 (ja) * 2002-11-22 2004-06-10 Mitsuboshi Diamond Industrial Co.,Ltd. 基板分断方法およびその方法を用いたパネル製造方法
WO2004067243A1 (ja) * 2003-01-29 2004-08-12 Mitsuboshi Diamond Industrial Co., Ltd. 基板分断装置および基板分断方法
EP1941981A4 (en) * 2005-10-28 2014-01-01 Mitsuboshi Diamond Ind Co Ltd METHOD FOR FORMING A WRITING PURSE ON A SUBSTRATE OF SPROUED MATERIAL AND DEVICE FOR FORMING A WRITING TRACK
JP2007160811A (ja) * 2005-12-15 2007-06-28 Pioneer Electronic Corp 平面表示パネルの製造方法およびガラス板の分割方法
JP2007331983A (ja) * 2006-06-15 2007-12-27 Sony Corp ガラスのスクライブ方法
JP4885675B2 (ja) * 2006-09-27 2012-02-29 株式会社Ｎｓｃ 貼合せガラス板の切断分離方法
WO2009050938A1 (ja) * 2007-10-16 2009-04-23 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板のｕ字状溝加工方法およびこれを用いた除去加工方法およびくり抜き加工方法および面取り方法
JP5450964B2 (ja) * 2008-02-29 2014-03-26 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
JP5210356B2 (ja) * 2010-06-14 2013-06-12 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
JP2013010644A (ja) * 2011-06-28 2013-01-17 Mitsuboshi Diamond Industrial Co Ltd ガラス基板のスクライブ方法
JP5688782B2 (ja) * 2012-04-24 2015-03-25 株式会社東京精密 ダイシングブレード

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008201629A (ja) * 2007-02-21 2008-09-04 Epson Imaging Devices Corp 電気光学装置の製造方法、基板の分断方法、及び、基板分断装置
TW201204658A (en) * 2010-06-14 2012-02-01 Mitsuboshi Diamond Ind Co Ltd Scribing method for brittle material substrate
TW201417156A (zh) * 2012-10-26 2014-05-01 Mitsuboshi Diamond Ind Co Ltd 脆性材料基板之分斷方法與分斷裝置

Also Published As

Publication number Publication date
TW201615579A (zh) 2016-05-01
KR20170067805A (ko) 2017-06-16
CN107108322B (zh) 2020-01-14
KR101866824B1 (ko) 2018-07-17
WO2016067728A1 (ja) 2016-05-06
JPWO2016067728A1 (ja) 2017-07-06
JP6288293B2 (ja) 2018-03-07
CN107108322A (zh) 2017-08-29

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