TWI655885B - 電路基板 - Google Patents

電路基板 Download PDF

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TWI655885B
TWI655885B TW107102733A TW107102733A TWI655885B TW I655885 B TWI655885 B TW I655885B TW 107102733 A TW107102733 A TW 107102733A TW 107102733 A TW107102733 A TW 107102733A TW I655885 B TWI655885 B TW I655885B
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capacitor structure
circular capacitor
circuit substrate
signal terminal
circular
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TW107102733A
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TW201933952A (zh
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王主力
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好慶科技企業股份有限公司
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Priority to TW107102733A priority Critical patent/TWI655885B/zh
Priority to CN201810205381.5A priority patent/CN110087382A/zh
Priority to DE102018211274.6A priority patent/DE102018211274A1/de
Priority to US16/257,812 priority patent/US10763620B2/en
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Publication of TW201933952A publication Critical patent/TW201933952A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6464—Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6467—Means for preventing cross-talk by cross-over of signal conductors
    • H01R13/6469—Means for preventing cross-talk by cross-over of signal conductors on substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
    • H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

本發明揭示一種電路基板，包含第一訊號端、第二訊號端、第一圓形電容結構、第二圓形電容結構。第一圓形電容結構電性連接於第一訊號端。第二圓形電容結構電性連接於第二訊號端。其中，第一圓形電容結構及第二圓形電容結構位於電路基板之不同平面。

Description

電路基板
本發明係關於一種電路基板，具體來說，特別是一種具有圓形電容板的電路基板。
一般而言，高頻訊號藉由連接線及連接器傳輸，其中所產生的訊號串音干擾係藉由在電路基板上製作電容耦合來降低。
傳統上，連接器插座所使用之電路基板製作電容元件大多是利用方形平板電容(例如：US 7658651)來製作。
然而，於製作電路基板的過程中，難免產生偏差，進而導致電容值產生變化。
如圖1A~圖1C所示，圖1A係為習知方形電容上下板面積相同(以長42mil，寬32mil，上下板垂直距離0.02mm為例)的正常電容模擬數值。圖1B係為圖1A加入負公差(長41mil，寬31mil)之模擬數值。圖1C係為圖1A加入正公差(長43mil，寬33mil)之模擬數值。
有鑑於此，本發明之目的在於提供一種電路基板，利用上下圓形電容板之結構，降低藉由製程誤差所導致電容值之變化。
電路基板包含第一訊號端、第二訊號端、第一圓形電容結構、第二圓形電容結構。第一圓形電容結構電性連接於第一訊號端。第二 圓形電容結構電性連接於第二訊號端。
其中，第一圓形電容結構及第二圓形電容結構位於電路基板之不同平面。
1‧‧‧電連接器
11‧‧‧電路基板
12‧‧‧配接部
13‧‧‧電路板
111‧‧‧第一訊號端
113‧‧‧第二訊號端
114‧‧‧訊號端
115‧‧‧第三訊號端
116‧‧‧訊號端
118‧‧‧訊號端
121‧‧‧金屬接點
122‧‧‧金屬接點
123‧‧‧金屬接點
124‧‧‧金屬接點
125‧‧‧金屬接點
126‧‧‧金屬接點
127‧‧‧金屬接點
128‧‧‧金屬接點
11a‧‧‧第一圓形電容結構
11b‧‧‧第二圓形電容結構
12a‧‧‧第三圓形電容結構
12b‧‧‧第四圓形電容結構
S1‧‧‧訊號線
S3‧‧‧訊號線
S5‧‧‧訊號線
圖1A~圖1C係為習知方形電容之電容值變化曲線圖。
圖2A係為本發明適用於電連接器之電路基板之一實施例立體圖。
圖2B係為圖2A之實施例爆炸圖。
圖3係為本發明電路基板之一實施例立體圖。
圖4A係為本發明電路基板之一實施例示意圖。
圖4B~圖4D係為圖4A之實施例模擬圖。
圖5A係為習知方形電容與本發明電路基板之電容值模擬圖。
圖5B係為習知方形電容加入正負公差之模擬圖。
圖5C係為本發明電路基板加入正負公差之模擬圖。
以下將以圖式配合文字敘述揭露本發明的複數個實施方式，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本發明。此外，為簡化圖式起見，一些習知的結構與元件在圖式中將以簡單示意的方式繪出。
請參閱圖2A及圖2B，本實施例之電路基板11係適用於電連接器1，例如電連接器、通訊連接器等，並無特定限制。電連接器1包含電路基板11、配接部12以及電路板13。電路基板11與電路板13均與配接部12 上的金屬接點121~128電性連接。
請參閱圖3、圖4A~圖4D。本實施例之電路基板11係以軟性電路板為例，但不以此為限。如圖2及圖3所示，電路基板11較佳包含訊號端111、113、114、115、116及118、第一圓形電容結構11a、第二圓形電容結構11b。訊號端111、113、114、115、116及118分別電性連接至配接部12的金屬接點121~128。例如，第一訊號端111與金屬接點121連接、第二訊號端113與金屬接點123連接，依此類推。
第一圓形電容結構11a位於電路基板11之上層，透過訊號線S1與第一訊號端111電性連接。第二圓形電容結構11b較佳與第一圓形電容結構11a位於不同層，例如位於底層，透過訊號線S3與第二訊號端113電性連接。據此設計，可透過上下兩圓形電容結構11a、11b儲存電場進而產生電容耦合。
於此實施例中，第一圓形電容結構11a及第二圓形電容結構11b係以相同面積為例，但不以此為限。然而，為了便於辨識，圖式中的兩圓形電容結構仍以不同大小的態樣呈現。
請一併參考圖4B~圖4D，以本實施例而言，第一圓形電容結構11a及第二圓形電容結構11b之半徑均為20.684mil(由圖1A方形電容面積換算得知)，且兩電容板之間的垂直距離亦為0.02mm。以此條件進行模擬，在不同的頻率下，其電容值約為2.895E-14F、2.893E-14F、2.892E-14F以及2.891E-14F。
如圖4C及圖4D所示，係為圖4B之圓形電容分別加上負、正公差(半徑分別為20.184mil及21.184mil)之模擬數據。
於一實施例中，電路基板亦可包含多個圓形電容結構，例如第三圓形電容結構12a及第四圓形電容結構12b。第三訊號端115透過訊號線S5與第三圓形電容結構12a電性連接。第四圓形電容結構12b共用訊號線S3與第二訊號端113電性連接，且第四圓形電容結構12b與第三圓形電容結構12a電容耦合。於本實施例中，兩圓形電容結構亦以相同面積為例。
綜合上述之實施例，並請一併參考圖5A~圖5C。圖5A及圖5B係為習知正常方形電容值與製程誤差時的模擬電容值統計圖表。如圖所示，以習知方形電容板來看(面積相等及分別加入正負公差)，於各頻率下所得到的電容值之誤差約落在4.84%~8.16%之間。
圖5A亦包含本發明正常圓形電容值與製程誤差時的模擬電容值統計圖表。如圖5A及圖5C所示，以本發明圓形電容板來看(面積相等及分別加入正負公差)，於各頻率下所得到的電容值之誤差約落在2.00%~6.40%之間。
綜上比較可清楚得知，本發明之圓形電容結構能有效降低因製程的正負公差而導致電容值之變化量。亦即，圓形平板電容結構具有較好的抗製程誤差之功效。
本發明之電路基板，圓形電容結構之上下板之面積可為相同，或是不同，並無特定限制，特此說明。
本發明之電路基板，亦可為硬式電路板，雙層板、多層板，並無特定限制，特此說明。
相較於先前技術，本發明之電路基板利用上下圓形電容板之結構，降低藉由製程誤差所導致電容值之變化。

Claims (4)

  1. 一種電路基板，包含：一第一訊號端；一第二訊號端；一第三訊號端；一第一圓形電容結構，電性連接於該第一訊號端；一第二圓形電容結構，電性連接於該第二訊號端；一第三圓形電容結構，電性連接於該第三訊號端；以及一第四圓形電容結構，電性連接於該第二訊號端；其中，該第一圓形電容結構及該第二圓形電容結構位於該電路基板之不同平面，該第三圓形電容結構及該第四圓形電容結構位於該電路基板之不同平面。
  2. 如請求項1所述之電路基板，其中該第一圓形電容結構及該第二圓形電容結構之面積為相同。
  3. 如請求項1所述之電路基板，其中該第一圓形電容結構及該第二圓形電容結構之面積為不相同。
  4. 如請求項1所述之電路基板，其中該第三圓形電容結構及該第四圓形電容結構之面積為相同。
TW107102733A 2018-01-25 2018-01-25 電路基板 TWI655885B (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW107102733A TWI655885B (zh) 2018-01-25 2018-01-25 電路基板
CN201810205381.5A CN110087382A (zh) 2018-01-25 2018-03-13 电路基板
DE102018211274.6A DE102018211274A1 (de) 2018-01-25 2018-07-09 Schaltungssubstrat
US16/257,812 US10763620B2 (en) 2018-01-25 2019-01-25 Circuit substrate

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TW107102733A TWI655885B (zh) 2018-01-25 2018-01-25 電路基板

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TW201933952A TW201933952A (zh) 2019-08-16

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Publication number Priority date Publication date Assignee Title
TWI655885B (zh) * 2018-01-25 2019-04-01 好慶科技企業股份有限公司 電路基板
TWI743581B (zh) * 2019-10-30 2021-10-21 好慶科技企業股份有限公司 訊號通訊插座
USD941786S1 (en) * 2019-11-22 2022-01-25 T-Worx Holdings, LLC Circuit board

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