CN110087382A - 电路基板 - Google Patents

电路基板 Download PDF

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Publication number
CN110087382A
CN110087382A CN201810205381.5A CN201810205381A CN110087382A CN 110087382 A CN110087382 A CN 110087382A CN 201810205381 A CN201810205381 A CN 201810205381A CN 110087382 A CN110087382 A CN 110087382A
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circular capacitor
capacitor structure
circuit substrate
signal end
circular
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王主力
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Emcom Technology Inc
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Emcom Technology Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6464—Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6467—Means for preventing cross-talk by cross-over of signal conductors
    • H01R13/6469—Means for preventing cross-talk by cross-over of signal conductors on substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
    • H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

本发明提供一种电路基板，包含第一信号端、第二信号端、第一圆形电容结构、第二圆形电容结构。第一圆形电容结构电性连接于第一信号端。第二圆形电容结构电性连接于第二信号端。其中，第一圆形电容结构及第二圆形电容结构位于电路基板的不同平面。

Description

电路基板
技术领域
本发明是关于一种电路基板，具体来说，特别是一种具有圆形电容板的电路基板。
背景技术
一般而言，高频信号通过连接线及连接器传输，其中所产生的信号串音干扰是通过在电路基板上制作电容耦合来降低。
传统上，连接器插座所使用的电路基板制作电容元件大多是利用方形平板电容(例如：US 7658651)来制作。
然而，于制作电路基板的过程中，难免产生偏差，进而导致电容值产生变化。
如图1A～图1C所示，图1A为已知方形电容上下板面积相同(以长42mil，宽32mil，上下板垂直距离0.02mm为例)的正常电容模拟数值。图1B为图1A加入负公差(长41mil，宽31mil)的模拟数值。图1C为图1A加入正公差(长43mil，宽33mil)的模拟数值。
发明内容
有鉴于此，本发明的目的在于提供一种电路基板，利用上下圆形电容板的结构，降低由于工艺误差所导致电容值的变化。
电路基板包含第一信号端、第二信号端、第一圆形电容结构、第二圆形电容结构。第一圆形电容结构电性连接于第一信号端。第二圆形电容结构电性连接于第二信号端。
其中，第一圆形电容结构及第二圆形电容结构位于电路基板的不同平面。
于一实施例中，该第一圆形电容结构及该第二圆形电容结构的面积为相同。
于一实施例中，该第一圆形电容结构及该第二圆形电容结构的面积为不相同。
于一实施例中，更包含：一第三信号端；一第三圆形电容结构，电性连接于该第三信号端；一第四圆形电容结构，电性连接于该第二信号端；其中，该第三圆形电容结构及该第四圆形电容结构位于该电路基板的不同平面。
于一实施例中，该第三圆形电容结构及该第四圆形电容结构的面积为相同。
附图说明
图1A～图1C为已知方形电容的电容值变化曲线图。
图2A为本发明适用于电连接器的电路基板的一实施例立体图。
图2B为图2A的实施例爆炸图。
图3为本发明电路基板的一实施例立体图。
图4A为本发明电路基板的一实施例示意图。
图4B～图4D为图4A的实施例模拟图。
图5A为已知方形电容与本发明电路基板的电容值模拟图。
图5B为已知方形电容加入正负公差的模拟图。
图5C为本发明电路基板加入正负公差的模拟图。
主要元件符号说明：
1 电连接器 11 电路基板
12 配接部 13 电路板
111 第一信号端 113 第二信号端
114 信号端 115 第三信号端
116 信号端 118 信号端
121 金属接点 122 金属接点
123 金属接点 124 金属接点
125 金属接点 126 金属接点
127 金属接点 128 金属接点
11a 第一圆形电容结构 11b 第二圆形电容结构
12a 第三圆形电容结构 12b 第四圆形电容结构
S1 信号线 S3 信号线
S5 信号线
具体实施方式
以下将以图式配合文字叙述公开本发明的多个实施方式，为明确说明起见，许多实务上的细节将在以下叙述中一并说明。然而，应了解到，这些实务上的细节不应用以限制本发明。此外，为简化图式起见，一些已知的结构与元件在图式中将以简单示意的方式绘出。
请参阅图2A及图2B，本实施例的电路基板11是适用于电连接器1，例如电连接器、通讯连接器等，并无特定限制。电连接器1包含电路基板11、配接部12以及电路板13。电路基板11与电路板13均与配接部12上的金属接点121～128电性连接。
请参阅图3、图4A～图4D。本实施例的电路基板11是以软性电路板为例，但不以此为限。如图2及图3所示，电路基板11较佳包含信号端111、113、114、115、116及118、第一圆形电容结构11a、第二圆形电容结构11b。信号端111、113、114、115、116及118分别电性连接至配接部12的金属接点121～128。例如，第一信号端111与金属接点121连接、第二信号端113与金属接点123连接，依此类推。
第一圆形电容结构11a位于电路基板11的上层，通过信号线S1与第一信号端111电性连接。第二圆形电容结构11b较佳与第一圆形电容结构11a位于不同层，例如位于底层，通过信号线S3与第二信号端113电性连接。据此设计，可通过上下两圆形电容结构11a、11b储存电场进而产生电容耦合。
于此实施例中，第一圆形电容结构11a及第二圆形电容结构11b是以相同面积为例，但不以此为限。然而，为了便于辨识，图式中的两圆形电容结构仍以不同大小的态样呈现。
请一并参考图4B～图4D，以本实施例而言，第一圆形电容结构11a及第二圆形电容结构11b的半径均为20.684mil(由图1A方形电容面积换算得知)，且两电容板之间的垂直距离亦为0.02mm。以此条件进行模拟，在不同的频率下，其电容值约为2.895E-14F、2.893E-14F、2.892E-14F以及2.891E-14F。
如图4C及图4D所示，为图4B的圆形电容分别加上负、正公差(半径分别为20.184mil及21.184mil)的模拟数据。
于一实施例中，电路基板亦可包含多个圆形电容结构，例如第三圆形电容结构12a及第四圆形电容结构12b。第三信号端115通过信号线S5与第三圆形电容结构12a电性连接。第四圆形电容结构12b共用信号线S3与第二信号端113电性连接，且第四圆形电容结构12b与第三圆形电容结构12a电容耦合。于本实施例中，两圆形电容结构亦以相同面积为例。
综合上述的实施例，并请一并参考图5A～图5C。图5A及图5B为已知正常方形电容值与工艺误差时的模拟电容值统计图表。如图所示，以已知方形电容板来看(面积相等及分别加入正负公差)，于各频率下所得到的电容值的误差约落在4.84％～8.16％之间。
图5A亦包含本发明正常圆形电容值与工艺误差时的模拟电容值统计图表。如图5A及图5C所示，以本发明圆形电容板来看(面积相等及分别加入正负公差)，于各频率下所得到的电容值的误差约落在2.00％～6.40％之间。
综上比较可清楚得知，本发明的圆形电容结构能有效降低因工艺的正负公差而导致电容值的变化量。亦即，圆形平板电容结构具有较好的抗工艺误差的功效。
本发明的电路基板，圆形电容结构的上下板的面积可为相同，或是不同，并无特定限制，特此说明。
本发明的电路基板，亦可为硬式电路板，双层板、多层板，并无特定限制，特此说明。
相较于现有技术，本发明的电路基板利用上下圆形电容板的结构，降低由于工艺误差所导致电容值的变化。

Claims (5)

1.一种电路基板，其特征在于，包含：
一第一信号端；
一第二信号端；
一第一圆形电容结构，电性连接于该第一信号端；
一第二圆形电容结构，电性连接于该第二信号端；以及
其中，该第一圆形电容结构及该第二圆形电容结构位于该电路基板的不同平面。
2.如权利要求1所述的电路基板，其特征在于，该第一圆形电容结构及该第二圆形电容结构的面积为相同。
3.如权利要求1所述的电路基板，其特征在于，该第一圆形电容结构及该第二圆形电容结构的面积为不相同。
4.如权利要求1所述的电路基板，其特征在于，更包含：
一第三信号端；
一第三圆形电容结构，电性连接于该第三信号端；
一第四圆形电容结构，电性连接于该第二信号端；以及
其中，该第三圆形电容结构及该第四圆形电容结构位于该电路基板的不同平面。
5.如权利要求4所述的电路基板，其特征在于，该第三圆形电容结构及该第四圆形电容结构的面积为相同。
CN201810205381.5A 2018-01-25 2018-03-13 电路基板 Pending CN110087382A (zh)

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TW107102733 2018-01-25

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CN205354863U (zh) * 2015-12-22 2016-06-29 昆山万盛电子有限公司 片状电容器

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