TWI652140B - 雙碟式表面磨床中靜壓墊的熱變形預防設備以及雙碟式表面磨床 - Google Patents

雙碟式表面磨床中靜壓墊的熱變形預防設備以及雙碟式表面磨床 Download PDF

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Publication number
TWI652140B
TWI652140B TW102141722A TW102141722A TWI652140B TW I652140 B TWI652140 B TW I652140B TW 102141722 A TW102141722 A TW 102141722A TW 102141722 A TW102141722 A TW 102141722A TW I652140 B TWI652140 B TW I652140B
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TW
Taiwan
Prior art keywords
static pressure
grinding
thermal deformation
workpiece
pressure pad
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TW102141722A
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English (en)
Chinese (zh)
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TW201433409A (zh
Inventor
芝中篤志
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光洋機械工業股份有限公司
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  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
TW102141722A 2012-11-23 2013-11-15 雙碟式表面磨床中靜壓墊的熱變形預防設備以及雙碟式表面磨床 TWI652140B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012256952A JP6033652B2 (ja) 2012-11-23 2012-11-23 両面研削装置における静圧パッドの熱変形防止装置および両面研削装置
JP2012-256952 2012-11-23

Publications (2)

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TW201433409A TW201433409A (zh) 2014-09-01
TWI652140B true TWI652140B (zh) 2019-03-01

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TW102141722A TWI652140B (zh) 2012-11-23 2013-11-15 雙碟式表面磨床中靜壓墊的熱變形預防設備以及雙碟式表面磨床

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JP (1) JP6033652B2 (https=)
TW (1) TWI652140B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6401082B2 (ja) * 2015-03-10 2018-10-03 日本碍子株式会社 セラミック構造体の製法
JP6383700B2 (ja) * 2015-04-07 2018-08-29 光洋機械工業株式会社 薄板状ワークの製造方法及び両頭平面研削装置
CN109352445B (zh) * 2018-12-05 2019-11-12 江苏博克斯科技股份有限公司 一种用于电子产品内部板件的打磨装置及其工作方法
CN111716204B (zh) * 2020-07-01 2021-08-13 中山市国景家具有限公司 一种木材表面精细化处理加工系统
CN115070604B (zh) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201016393A (en) 2008-08-08 2010-05-01 Kuraray Co Polishing pad and the method for manufacturing the polishing pad

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4613665Y1 (https=) * 1967-09-28 1971-05-14
US4262452A (en) * 1978-11-24 1981-04-21 Lopez Francisco R Disc brake grinding apparatus and method
JPS5755000Y2 (https=) * 1979-09-29 1982-11-27
JP2010064214A (ja) * 2008-09-12 2010-03-25 Koyo Mach Ind Co Ltd 両頭平面研削盤及びワークの両面研削方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201016393A (en) 2008-08-08 2010-05-01 Kuraray Co Polishing pad and the method for manufacturing the polishing pad

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TW201433409A (zh) 2014-09-01
JP6033652B2 (ja) 2016-11-30
JP2014104515A (ja) 2014-06-09

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