TWI652120B - 塗布方法 - Google Patents

塗布方法 Download PDF

Info

Publication number
TWI652120B
TWI652120B TW106120181A TW106120181A TWI652120B TW I652120 B TWI652120 B TW I652120B TW 106120181 A TW106120181 A TW 106120181A TW 106120181 A TW106120181 A TW 106120181A TW I652120 B TWI652120 B TW I652120B
Authority
TW
Taiwan
Prior art keywords
liquid
chemical liquid
chemical
substrate
circular substrate
Prior art date
Application number
TW106120181A
Other languages
English (en)
Chinese (zh)
Other versions
TW201803651A (zh
Inventor
吉田省吾
小椋浩之
吉田隆一
髙橋保夫
Original Assignee
斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 斯庫林集團股份有限公司 filed Critical 斯庫林集團股份有限公司
Publication of TW201803651A publication Critical patent/TW201803651A/zh
Application granted granted Critical
Publication of TWI652120B publication Critical patent/TWI652120B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW106120181A 2016-07-05 2017-06-16 塗布方法 TWI652120B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-133479 2016-07-05
JP2016133479A JP6764713B2 (ja) 2016-07-05 2016-07-05 塗布方法

Publications (2)

Publication Number Publication Date
TW201803651A TW201803651A (zh) 2018-02-01
TWI652120B true TWI652120B (zh) 2019-03-01

Family

ID=60912679

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106120181A TWI652120B (zh) 2016-07-05 2017-06-16 塗布方法

Country Status (5)

Country Link
JP (1) JP6764713B2 (ja)
KR (1) KR102237668B1 (ja)
CN (1) CN109414721B (ja)
TW (1) TWI652120B (ja)
WO (1) WO2018008325A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7092508B2 (ja) * 2018-01-26 2022-06-28 株式会社Ｓｃｒｅｅｎホールディングス 塗布方法
JP7095394B2 (ja) * 2018-05-15 2022-07-05 株式会社デンソー 樹脂の塗布方法
JP7149170B2 (ja) * 2018-11-20 2022-10-06 ナガセケムテックス株式会社 流動性材料の塗布方法および塗布装置、ならびにノズルヘッド
CN111905989A (zh) * 2020-08-14 2020-11-10 中国科学院微电子研究所 高粘度光刻胶的涂胶方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010114328A (ja) 2008-11-07 2010-05-20 Mitsumi Electric Co Ltd レジスト塗布方法
JP5931230B1 (ja) 2015-01-15 2016-06-08 東京エレクトロン株式会社 液処理方法、液処理装置、及び記録媒体。

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60217627A (ja) 1984-04-13 1985-10-31 Hitachi Ltd 薄膜形成方法と薄膜形成装置
EP1205258A1 (en) * 1999-07-29 2002-05-15 Chugai Ro Co., Ltd. Circular or annular coating film forming method
KR100948220B1 (ko) * 2002-03-19 2010-03-18 도쿄엘렉트론가부시키가이샤 도포처리방법 및 도포처리장치
JP3970695B2 (ja) 2002-06-10 2007-09-05 株式会社Ｓｏｋｕｄｏ レジスト塗布方法
JP4084167B2 (ja) * 2002-06-10 2008-04-30 株式会社Ｓｏｋｕｄｏ 処理液塗布方法
JP2004164802A (ja) * 2002-11-15 2004-06-10 Tdk Corp 光記録ディスクの製造方法
JP5109373B2 (ja) * 2007-01-19 2012-12-26 富士通セミコンダクター株式会社 塗布液の塗布方法及び半導体装置の製造方法
JP2010042325A (ja) * 2008-08-08 2010-02-25 Sharp Corp 塗布方法および塗布装置
JP5507523B2 (ja) * 2011-11-01 2014-05-28 東京エレクトロン株式会社 塗布処理装置、塗布処理方法、プログラム及びコンピュータ記憶媒体
JP5790622B2 (ja) * 2012-11-01 2015-10-07 東京エレクトロン株式会社 塗布膜形成方法、塗布膜形成装置及び記憶媒体
JP6438748B2 (ja) * 2014-11-28 2018-12-19 株式会社Ｓｃｒｅｅｎホールディングス 塗布方法および塗布装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010114328A (ja) 2008-11-07 2010-05-20 Mitsumi Electric Co Ltd レジスト塗布方法
JP5931230B1 (ja) 2015-01-15 2016-06-08 東京エレクトロン株式会社 液処理方法、液処理装置、及び記録媒体。

Also Published As

Publication number Publication date
TW201803651A (zh) 2018-02-01
CN109414721A (zh) 2019-03-01
CN109414721B (zh) 2021-10-22
JP6764713B2 (ja) 2020-10-07
KR20190013951A (ko) 2019-02-11
WO2018008325A1 (ja) 2018-01-11
JP2018001114A (ja) 2018-01-11
KR102237668B1 (ko) 2021-04-08

Similar Documents

Publication Publication Date Title
TWI652120B (zh) 塗布方法
TWI610724B (zh) 塗佈方法及塗佈裝置
US11033929B2 (en) Application method
JP7212730B2 (ja) 塗布方法
JP6712482B2 (ja) 基板処理方法および基板処理装置
US11862485B2 (en) Nozzle standby device, liquid processing apparatus and operation method of liquid processing apparatus
TWI634397B (zh) 顯影方法
JP7073658B2 (ja) 基板処理方法、基板処理装置、及び記憶媒体
TWI693109B (zh) 塗佈方法
JP6672091B2 (ja) 基板処理方法および基板処理装置
US11773492B2 (en) Substrate processing apparatus, substrate processing method, and storage medium
JP7202960B2 (ja) 塗布膜形成方法及び塗布膜形成装置
JP7051334B2 (ja) 基板処理装置および基板処理方法
JP7136543B2 (ja) 基板処理方法および基板処理装置
TW202106398A (zh) 基板處理方法及基板處理裝置
TWI682452B (zh) 基板處理裝置以及基板處理方法
JP7445021B2 (ja) 塗布処理装置、塗布処理方法及びコンピュータ記憶媒体
JP2017195248A (ja) 塗布方法
JP2022049378A (ja) 塗布装置および塗布方法
KR20210038320A (ko) 기판 처리 장치 및 기판 처리 방법
JPH11219880A (ja) 吐出ノズル及び塗布液塗布装置