TWI647824B - 製造被動光學元件的方法及包含該元件的裝置 - Google Patents

製造被動光學元件的方法及包含該元件的裝置 Download PDF

Info

Publication number
TWI647824B
TWI647824B TW106113502A TW106113502A TWI647824B TW I647824 B TWI647824 B TW I647824B TW 106113502 A TW106113502 A TW 106113502A TW 106113502 A TW106113502 A TW 106113502A TW I647824 B TWI647824 B TW I647824B
Authority
TW
Taiwan
Prior art keywords
light
wafer
blocking portion
transmitting
transmitting units
Prior art date
Application number
TW106113502A
Other languages
English (en)
Chinese (zh)
Other versions
TW201742238A (zh
Inventor
Hartmut Rudmann
哈馬特 盧德曼
Susanne Westenhoefer
蘇珊 威斯頓霍夫
Bojan TESANOVIC
博亞恩 泰莎諾維克
Original Assignee
Heptagon Micro Optics Pte. Ltd.
新加坡恒立私人有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte. Ltd., 新加坡恒立私人有限公司 filed Critical Heptagon Micro Optics Pte. Ltd.
Publication of TW201742238A publication Critical patent/TW201742238A/zh
Application granted granted Critical
Publication of TWI647824B publication Critical patent/TWI647824B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00365—Production of microlenses
    • B29D11/00375—Production of microlenses by moulding lenses in holes through a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00932—Combined cutting and grinding thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Optical Integrated Circuits (AREA)
  • Led Device Packages (AREA)
TW106113502A 2011-07-19 2012-07-17 製造被動光學元件的方法及包含該元件的裝置 TWI647824B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161509357P 2011-07-19 2011-07-19
US61/509,357 2011-07-19

Publications (2)

Publication Number Publication Date
TW201742238A TW201742238A (zh) 2017-12-01
TWI647824B true TWI647824B (zh) 2019-01-11

Family

ID=46639253

Family Applications (3)

Application Number Title Priority Date Filing Date
TW106113502A TWI647824B (zh) 2011-07-19 2012-07-17 製造被動光學元件的方法及包含該元件的裝置
TW101125645A TWI635601B (zh) 2011-07-19 2012-07-17 製造被動光學元件的方法及包含該元件的裝置
TW106126425A TWI647825B (zh) 2011-07-19 2012-07-17 製造被動光學元件的方法及包含該元件的裝置

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW101125645A TWI635601B (zh) 2011-07-19 2012-07-17 製造被動光學元件的方法及包含該元件的裝置
TW106126425A TWI647825B (zh) 2011-07-19 2012-07-17 製造被動光學元件的方法及包含該元件的裝置

Country Status (8)

Country Link
US (4) US8767303B2 (enExample)
EP (1) EP2735029B1 (enExample)
JP (2) JP2014521992A (enExample)
KR (1) KR101966478B1 (enExample)
CN (1) CN103975436B (enExample)
SG (1) SG10201605834YA (enExample)
TW (3) TWI647824B (enExample)
WO (1) WO2013010285A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG193151A1 (en) * 2011-07-19 2013-09-30 Heptagon Micro Optics Pte Ltd Opto-electronic modules and methods of manufacturing the same and appliances and devices comprising the same
SG10201606075XA (en) * 2011-08-10 2016-09-29 Heptagon Micro Optics Pte Ltd Opto-electronic module and method for manufacturing the same
TWI593091B (zh) 2012-08-20 2017-07-21 海特根微光學公司 光學晶圓之製造
EP2827368B1 (en) * 2013-07-19 2019-06-05 ams AG Package for an optical sensor, optical sensor arrangement and method of producing a package for an optical sensor
WO2015016772A1 (en) 2013-07-31 2015-02-05 Heptagon Micro Optics Pte. Ltd. Micro-optical orientation sensor and related methods
NL2011843C2 (en) 2013-11-26 2015-05-27 Anteryon Wafer Optics B V A method for manufacturing an optical assembly.
US9711552B2 (en) * 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
US9829614B2 (en) 2015-02-02 2017-11-28 Synaptics Incorporated Optical sensor using collimator
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
JPWO2016208403A1 (ja) * 2015-06-23 2018-04-12 ソニー株式会社 イメージセンサ、および電子機器
JP2017022200A (ja) * 2015-07-08 2017-01-26 ソニーセミコンダクタソリューションズ株式会社 イメージセンサ、および電子機器
KR102439203B1 (ko) * 2015-10-07 2022-09-02 베이징 지오브이 테크놀로지 컴퍼니 리미티드 지문 감지를 위한 이미지 센서 구조체들
KR101738883B1 (ko) * 2016-01-06 2017-05-23 한국과학기술원 초박형 디지털 카메라 및 그 제조 방법
JP6740628B2 (ja) * 2016-02-12 2020-08-19 凸版印刷株式会社 固体撮像素子及びその製造方法
SG11201602031TA (en) * 2016-03-08 2017-10-30 Tnc Optics & Tech Pte Ltd A fabrication method of optical sensor cover having a lens
WO2020176037A1 (en) * 2019-02-25 2020-09-03 Ams Sensors Singapore Pte. Ltd. Manufacture of optical diffusers elements and optical diffuser element
US10734184B1 (en) 2019-06-21 2020-08-04 Elbit Systems Of America, Llc Wafer scale image intensifier

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4952026A (en) * 1988-10-14 1990-08-28 Corning Incorporated Integral optical element and method
US20020196563A1 (en) * 2001-04-20 2002-12-26 Nobuki Itoh Method of manufacturing microlens array and microlens array
WO2007063856A1 (ja) * 2005-11-30 2007-06-07 Hitachi Maxell, Ltd. バックライト用光学シート、バックライト及び表示装置

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3532038A (en) * 1967-06-05 1970-10-06 Ibm Multi-lens devices for the fabrication of semiconductor devices
JPS5590909A (en) * 1978-12-28 1980-07-10 Canon Inc Production of compound eye lens device
KR987001092A (ko) * 1994-12-23 1998-04-30 엘. 린그렌 클린턴 반도체 감마 선 카메라 및 의학 화상 시스템(Semiconductor Gamma-Ray Camera and Medical Imaging System)
JP2003004909A (ja) * 2001-04-20 2003-01-08 Matsushita Electric Ind Co Ltd マイクロレンズアレイの製造方法及びマイクロレンズアレイ
TW200506418A (en) * 2003-07-01 2005-02-16 Nippon Sheet Glass Co Ltd Lens plate, its manufacturing method, and image transmitting apparatus
JP2005072662A (ja) * 2003-08-25 2005-03-17 Sharp Corp 透光板および透光板の製造方法、並びに透光板を用いた画像入力装置
EP1569276A1 (en) 2004-02-27 2005-08-31 Heptagon OY Micro-optics on optoelectronics
US7399421B2 (en) * 2005-08-02 2008-07-15 International Business Machines Corporation Injection molded microoptics
KR100802199B1 (ko) * 2006-05-25 2008-03-17 정경희 광모듈 및 그 제조방법
EP1870936A1 (fr) * 2006-06-19 2007-12-26 STMicroelectronics (Rousset) SAS Procédé de fabrication de lentilles, notamment pour imageur intégré
US8013289B2 (en) * 2006-11-15 2011-09-06 Ether Precision, Inc. Lens array block for image capturing unit and methods of fabrication
US20080290435A1 (en) * 2007-05-21 2008-11-27 Micron Technology, Inc. Wafer level lens arrays for image sensor packages and the like, image sensor packages, and related methods
JP5580207B2 (ja) * 2007-11-27 2014-08-27 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッド ウェハ・スケール・パッケージおよびその製作方法、ならびに光学デバイスおよびその製作方法
TWI478808B (zh) * 2007-12-19 2015-04-01 Heptagon Micro Optics Pte Ltd 製造光學元件的方法
TWI505703B (zh) 2007-12-19 2015-10-21 新加坡恒立私人有限公司 光學模組，晶圓等級的封裝及其製造方法
US7920328B2 (en) * 2008-02-28 2011-04-05 Visera Technologies Company Limited Lens module and a method for fabricating the same
JP5030828B2 (ja) * 2008-03-18 2012-09-19 株式会社沖データ レンズアレイ並びにそれを有するｌｅｄヘッド、露光装置、画像形成装置及び読取装置
CN102016653B (zh) * 2008-04-28 2013-07-10 柯尼卡美能达精密光学株式会社 晶圆透镜聚合体的制造方法及晶圆透镜的制造方法
JP4906798B2 (ja) * 2008-07-01 2012-03-28 株式会社沖データ レンズアレイ、ｌｅｄヘッド、露光装置、画像形成装置及び読取装置
JP4966931B2 (ja) * 2008-08-26 2012-07-04 シャープ株式会社 電子素子ウエハモジュールおよびその製造方法、電子素子モジュールおよびその製造方法、電子情報機器
WO2010055801A1 (ja) 2008-11-17 2010-05-20 コニカミノルタオプト株式会社 光学素子の製造方法及び光学素子
JP2010204635A (ja) * 2009-02-06 2010-09-16 Fujifilm Corp レンズアレイ
JP2010204632A (ja) 2009-02-06 2010-09-16 Fujifilm Corp ウェハレベルレンズアレイの製造方法、ウェハレンズアレイ、レンズモジュール及び撮像ユニット
JP2012529069A (ja) * 2009-06-02 2012-11-15 フラウンホーファー−ゲゼルシャフト・ツール・フェルデルング・デル・アンゲヴァンテン・フォルシュング・アインゲトラーゲネル・フェライン レンズ及びその製造方法
CN102023330A (zh) * 2009-09-15 2011-04-20 鸿富锦精密工业（深圳）有限公司 遮光元件阵列、遮光元件阵列制造方法及镜头模组阵列
JP2011097294A (ja) 2009-10-28 2011-05-12 Olympus Corp 撮像装置および撮像装置の製造方法
CN102667568A (zh) * 2009-11-05 2012-09-12 柯尼卡美能达先进多层薄膜株式会社 摄像装置以及该摄像装置的制造方法
JP2011104811A (ja) 2009-11-13 2011-06-02 Fujifilm Corp マスタ型、マスタの作成方法及びマスタ
CN102652284B (zh) * 2009-12-11 2014-10-08 富士胶片株式会社 黑色可固化组合物、遮光彩色滤光片、遮光膜及其制备方法，晶片级透镜，以及固态成像器件
CN102130138B (zh) * 2010-01-12 2013-01-02 中芯国际集成电路制造(上海)有限公司 图像传感器及其形成方法
US7974023B1 (en) * 2010-03-11 2011-07-05 Himax Semiconductor, Inc. Wafer level optical lens substrate, wafer level optical lens module and fabrication method thereof
TWM399313U (en) * 2010-07-30 2011-03-01 Sigurd Microelectronics Corp Proximity sensor package structure
SG10201602612PA (en) * 2011-10-06 2016-05-30 Heptagon Micro Optics Pte Ltd Method for wafer-level manufacturing of objects and corresponding semi-finished products
JP2014190988A (ja) * 2013-03-26 2014-10-06 Fuji Xerox Co Ltd レンズアレイ及びレンズアレイ製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4952026A (en) * 1988-10-14 1990-08-28 Corning Incorporated Integral optical element and method
US20020196563A1 (en) * 2001-04-20 2002-12-26 Nobuki Itoh Method of manufacturing microlens array and microlens array
WO2007063856A1 (ja) * 2005-11-30 2007-06-07 Hitachi Maxell, Ltd. バックライト用光学シート、バックライト及び表示装置

Also Published As

Publication number Publication date
TW201310626A (zh) 2013-03-01
US20160031169A1 (en) 2016-02-04
TW201820597A (zh) 2018-06-01
TWI647825B (zh) 2019-01-11
JP2017167533A (ja) 2017-09-21
US8767303B2 (en) 2014-07-01
US10527762B2 (en) 2020-01-07
TW201742238A (zh) 2017-12-01
EP2735029A1 (en) 2014-05-28
EP2735029B1 (en) 2022-12-21
CN103975436A (zh) 2014-08-06
KR20140054081A (ko) 2014-05-08
TWI635601B (zh) 2018-09-11
US9193120B2 (en) 2015-11-24
SG10201605834YA (en) 2016-09-29
JP2014521992A (ja) 2014-08-28
US20140347747A1 (en) 2014-11-27
KR101966478B1 (ko) 2019-04-05
US9610743B2 (en) 2017-04-04
JP6763807B2 (ja) 2020-09-30
US20170235026A1 (en) 2017-08-17
CN103975436B (zh) 2019-05-10
WO2013010285A1 (en) 2013-01-24
US20130033767A1 (en) 2013-02-07

Similar Documents

Publication Publication Date Title
TWI647824B (zh) 製造被動光學元件的方法及包含該元件的裝置
US11005001B2 (en) Opto-electronic modules and methods of manufacturing the same and appliances and devices comprising the same
JP6151354B2 (ja) ウエハスタックの組立
TWI624040B (zh) 光學晶圓之製造
CN104937445A (zh) 光学元件制造以及并入有所述光学元件的模块