TWI646151B - 樹脂組成物、硬化膜及其製造方法、以及電子零件 - Google Patents

樹脂組成物、硬化膜及其製造方法、以及電子零件 Download PDF

Info

Publication number
TWI646151B
TWI646151B TW103125024A TW103125024A TWI646151B TW I646151 B TWI646151 B TW I646151B TW 103125024 A TW103125024 A TW 103125024A TW 103125024 A TW103125024 A TW 103125024A TW I646151 B TWI646151 B TW I646151B
Authority
TW
Taiwan
Prior art keywords
group
formula
carbon atoms
resin composition
mass
Prior art date
Application number
TW103125024A
Other languages
English (en)
Chinese (zh)
Other versions
TW201510082A (zh
Inventor
小野敬司
榎本哲也
大江匡之
鈴木桂子
副島和也
鈴木越晴
Original Assignee
日立化成杜邦微系統股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成杜邦微系統股份有限公司 filed Critical 日立化成杜邦微系統股份有限公司
Publication of TW201510082A publication Critical patent/TW201510082A/zh
Application granted granted Critical
Publication of TWI646151B publication Critical patent/TWI646151B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)
TW103125024A 2013-07-23 2014-07-22 樹脂組成物、硬化膜及其製造方法、以及電子零件 TWI646151B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013152759 2013-07-23
JP2013-152759 2013-07-23

Publications (2)

Publication Number Publication Date
TW201510082A TW201510082A (zh) 2015-03-16
TWI646151B true TWI646151B (zh) 2019-01-01

Family

ID=52392958

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103125024A TWI646151B (zh) 2013-07-23 2014-07-22 樹脂組成物、硬化膜及其製造方法、以及電子零件

Country Status (3)

Country Link
JP (1) JP6414060B2 (ja)
TW (1) TWI646151B (ja)
WO (1) WO2015011893A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115185157A (zh) * 2016-03-31 2022-10-14 旭化成株式会社 感光性树脂组合物、固化浮雕图案的制造方法和半导体装置
WO2018043262A1 (ja) * 2016-08-31 2018-03-08 富士フイルム株式会社 パターン形成方法、積層体の製造方法および電子デバイスの製造方法
WO2018181182A1 (ja) * 2017-03-29 2018-10-04 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法および半導体デバイス
JP7078744B2 (ja) * 2018-10-19 2022-05-31 富士フイルム株式会社 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、および半導体デバイス
CN109946925A (zh) * 2019-04-08 2019-06-28 深圳先进技术研究院 一种化合物在促进聚酰亚胺低温固化中的应用、聚酰亚胺前体组合物及其用途
JP7431696B2 (ja) 2020-08-04 2024-02-15 信越化学工業株式会社 ポジ型感光性樹脂組成物、ポジ型感光性ドライフィルム、ポジ型感光性ドライフィルムの製造方法、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品
JP7335217B2 (ja) 2020-09-24 2023-08-29 信越化学工業株式会社 感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003255535A (ja) * 2002-03-06 2003-09-10 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、パターン製造法及びこれを用いた電子部品
JP2010090386A (ja) * 1999-03-30 2010-04-22 Asahi Kasei E-Materials Corp 感光性樹脂組成物
TW201129867A (en) * 2009-12-04 2011-09-01 Toray Industries Photosensitive resin composition, laminate using the same and solid-state image pick-up device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4592999B2 (ja) * 2001-04-26 2010-12-08 新日鐵化学株式会社 新規な末端修飾したポリアミック酸及びそれを含む感光性樹脂組成物
JP2003345012A (ja) * 2002-05-28 2003-12-03 Hitachi Chemical Dupont Microsystems Ltd 感光性組成物、及びこれを用いた電子部品
WO2004111726A2 (en) * 2003-06-06 2004-12-23 Fujifilm Electronic Materials U.S.A., Inc. Novel photosensitive resin compositions
JP5747437B2 (ja) * 2009-04-14 2015-07-15 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物及びこれを用いた回路形成用基板
JP2011123219A (ja) * 2009-12-09 2011-06-23 Asahi Kasei E-Materials Corp 感光性ポリアミド樹脂組成物、硬化レリーフパターンの形成方法及び半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010090386A (ja) * 1999-03-30 2010-04-22 Asahi Kasei E-Materials Corp 感光性樹脂組成物
JP2003255535A (ja) * 2002-03-06 2003-09-10 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、パターン製造法及びこれを用いた電子部品
TW201129867A (en) * 2009-12-04 2011-09-01 Toray Industries Photosensitive resin composition, laminate using the same and solid-state image pick-up device

Also Published As

Publication number Publication date
TW201510082A (zh) 2015-03-16
WO2015011893A1 (ja) 2015-01-29
JP6414060B2 (ja) 2018-10-31
JPWO2015011893A1 (ja) 2017-03-02

Similar Documents

Publication Publication Date Title
TWI646151B (zh) 樹脂組成物、硬化膜及其製造方法、以及電子零件
JP6610643B2 (ja) ポリイミド前駆体樹脂組成物
TWI658063B (zh) 感光性樹脂組成物、使用其的圖案硬化膜的製造方法、圖案硬化膜及半導體裝置
CN112799281A (zh) 感光性树脂组合物、聚酰亚胺的制造方法及半导体装置
KR102276251B1 (ko) 폴리이미드 전구체를 포함하는 수지 조성물, 및 그것을 사용한 경화막의 제조 방법
TW201533159A (zh) 樹脂組成物、由其形成的硬化膜及圖案硬化膜、它們的製造方法以及電子零件
JP6888660B2 (ja) ポリイミド前駆体を含む樹脂組成物、硬化膜の製造方法及び電子部品
JP6146005B2 (ja) ポリイミド前駆体組成物、該組成物を用いた硬化膜
JP6390165B2 (ja) ポリイミド前駆体、該ポリイミド前駆体を含む感光性樹脂組成物、それを用いたパターン硬化膜の製造方法及び半導体装置
JP6244871B2 (ja) ポリイミド前駆体樹脂組成物
KR102215890B1 (ko) 감광성 수지 조성물, 그것을 사용한 패턴 경화막의 제조 방법 및 반도체 장치
JP2014201696A (ja) ポリイミド前駆体、該ポリイミド前駆体を含む感光性樹脂組成物、及びそれを用いたパターン硬化膜の製造方法
JPH1192660A (ja) 感光性樹脂組成物
JP2011053679A (ja) ポジ型感光性組成物
TW201841984A (zh) 感光性樹脂組成物、硬化圖案的製造方法、硬化物、層間絕緣膜、覆蓋塗層、表面保護膜及電子零件
TWI846881B (zh) 感光性聚醯亞胺樹脂組成物
TWI839243B (zh) 樹脂組合物、聚醯亞胺之製造方法、硬化浮凸圖案之製造方法、及半導體裝置
JP2014122280A (ja) ポリイミド前駆体樹脂組成物
TW202432646A (zh) 樹脂組合物、硬化浮凸圖案之製造方法、及半導體裝置
TW202132919A (zh) 負型感光性樹脂組合物、以及使用其之聚醯亞胺及硬化浮凸圖案之製造方法