TWI644979B - 熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法及半導體元件 - Google Patents

熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法及半導體元件 Download PDF

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Publication number
TWI644979B
TWI644979B TW104118221A TW104118221A TWI644979B TW I644979 B TWI644979 B TW I644979B TW 104118221 A TW104118221 A TW 104118221A TW 104118221 A TW104118221 A TW 104118221A TW I644979 B TWI644979 B TW I644979B
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TW
Taiwan
Prior art keywords
thermosetting resin
group
resin composition
general formula
compound
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TW104118221A
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English (en)
Chinese (zh)
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TW201600564A (zh
Inventor
小山一郎
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日商富士軟片股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW104118221A 2014-06-27 2015-06-05 熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法及半導體元件 TWI644979B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-132157 2014-06-27
JP2014132157 2014-06-27

Publications (2)

Publication Number Publication Date
TW201600564A TW201600564A (zh) 2016-01-01
TWI644979B true TWI644979B (zh) 2018-12-21

Family

ID=54938297

Family Applications (1)

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TW104118221A TWI644979B (zh) 2014-06-27 2015-06-05 熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法及半導體元件

Country Status (3)

Country Link
JP (1) JPWO2015199220A1 (ja)
TW (1) TWI644979B (ja)
WO (1) WO2015199220A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108473679B (zh) * 2016-01-15 2020-12-11 东丽株式会社 固化膜及其制造方法
KR102104806B1 (ko) * 2016-01-29 2020-04-27 후지필름 가부시키가이샤 감광성 수지 조성물, 경화막, 적층체, 경화막의 제조 방법, 적층체의 제조 방법, 및 반도체 디바이스
CN109716235B (zh) * 2016-09-20 2022-11-18 太阳控股株式会社 正型感光性树脂组合物、干膜、固化物、印刷电路板及半导体元件
TWI808143B (zh) 2018-03-29 2023-07-11 日商富士軟片股份有限公司 感光性樹脂組成物、硬化膜、積層體及它們的製造方法、半導體器件及用於該等之熱鹼產生劑
JP7133027B2 (ja) * 2018-09-27 2022-09-07 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス
KR102571972B1 (ko) 2018-09-28 2023-08-29 후지필름 가부시키가이샤 감광성 수지 조성물, 경화막, 적층체, 경화막의 제조 방법, 및 반도체 디바이스

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007056196A (ja) * 2005-08-26 2007-03-08 Tokyo Institute Of Technology ポリイミド前駆体組成物、ポリイミド膜の製造方法及び半導体装置
US20080038663A1 (en) * 2006-08-11 2008-02-14 Fujifilm Corporation Laser-decomposable resin composition and pattern-forming material using the same
US20090246700A1 (en) * 2008-03-26 2009-10-01 Koji Sonokawa Plate-making method of lithographic printing plate precursor
CN102604156A (zh) * 2011-12-29 2012-07-25 长兴化学工业股份有限公司 碱产生剂
JP2013152381A (ja) * 2012-01-26 2013-08-08 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜、半導体装置、および表示体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008081720A (ja) * 2006-08-30 2008-04-10 Fujifilm Corp 分解性樹脂組成物及びそれを用いるパターン形成材料
JP5768348B2 (ja) * 2009-09-17 2015-08-26 大日本印刷株式会社 熱塩基発生剤、高分子前駆体組成物、当該組成物を用いた物品
JP2011222788A (ja) * 2010-04-09 2011-11-04 Dainippon Printing Co Ltd 薄膜トランジスタ基板
TWI671343B (zh) * 2014-06-27 2019-09-11 日商富士軟片股份有限公司 熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法以及半導體裝置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007056196A (ja) * 2005-08-26 2007-03-08 Tokyo Institute Of Technology ポリイミド前駆体組成物、ポリイミド膜の製造方法及び半導体装置
US20080038663A1 (en) * 2006-08-11 2008-02-14 Fujifilm Corporation Laser-decomposable resin composition and pattern-forming material using the same
US20090246700A1 (en) * 2008-03-26 2009-10-01 Koji Sonokawa Plate-making method of lithographic printing plate precursor
CN102604156A (zh) * 2011-12-29 2012-07-25 长兴化学工业股份有限公司 碱产生剂
JP2013152381A (ja) * 2012-01-26 2013-08-08 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜、半導体装置、および表示体装置

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JPWO2015199220A1 (ja) 2017-04-27
WO2015199220A1 (ja) 2015-12-30
TW201600564A (zh) 2016-01-01

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