TWI644781B - Mold device, compression molding device, and compression molding method - Google Patents

Abstract

Provided are a mold device, a compression molding device, and a compression molding method capable of suppressing variations in clamping force.

The mold device has an elbow link mechanism, and the elbow link mechanism is provided below the sliding plate, and transmits the clamping force of the mold clamping mechanism to the sliding plate. The elbow link mechanism includes a first link member that moves the sliding plate, and a second link member that has a first end rotatably connected to the lower fixed plate and is rotatably connected to the first link member. A second end; and a third link member that connects the second link member and the mold clamping mechanism; at least three elbow link mechanisms are arranged below the sliding plate.

Description

Mold device, compression molding device, and compression molding method

The present invention relates to a mold device, a compression molding device, and a compression molding method.

For example, as described in Patent Documents 1 and 2 below, a clamping force transmission mechanism in a compression molding apparatus has conventionally used an elbow link mechanism. For example, in the compression molding apparatus shown in Patent Document 2, the clamping force of the servo motor is transmitted to the movable platen through a pair of toggle link mechanisms.

[Advanced technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2006-168271

[Patent Document 2] Japanese Patent Application Publication No. 2012-136000

[Patent Document 3] Japanese Patent Laid-Open No. 2001-1358

[Patent Document 4] Japanese Patent Laid-Open No. 2003-224156

In the compression molding apparatus described in Patent Document 2, when a pair of elbow link mechanisms are used to transfer the clamping force to the movable platen, the movement of the movable platen is guided by a tie rod. However, there is a gap in the guide of the tie rod. When the movable platen moves up and down, the movable platen is inclined. This tilt becomes the cause of the uneven clamping force. However, a certain amount of clearance of the guide portion must be ensured.

With the increase in the size of resin-molded packages, uniform mold clamping The demand for power is increasing. While ensuring the durability and reliability of a compression molding device, while suppressing an excessive increase in cost, it is an issue to suppress variations in the clamping force caused by the inclination of the molding die.

An object of the present invention is to provide a mold device, a compression molding device, and a compression molding method that can suppress variations in clamping force.

The mold device of the present invention is used for compression-molding an insert member with a resin material, and is characterized in that it includes a forming mold having an upper mold and a lower mold; an upper fixed disk for fixing the upper mold; The lower part; the slide plate is provided in a state where the lower mold is fixed, and the upper fixed plate and the lower fixed plate are provided so as to be movable up and down; and an elbow link mechanism is provided for sliding Below the plate, the clamping force of the clamping mechanism is transmitted to the sliding plate. The elbow link mechanism includes a first link member that moves the sliding plate, and a second link member that has a first end rotatably connected to the lower fixed plate and is rotatably connected to the first link member. A second end; and a third link member that connects the second link member and the mold clamping mechanism; at least three elbow link mechanisms are arranged below the sliding plate.

In the above mold apparatus of one embodiment, at least three elbow link mechanisms include a plurality of elbow link mechanisms in which the directions of the rotation axes intersect each other.

In the above-mentioned mold apparatus of one embodiment, the Below, four elbow link mechanisms are arranged, and the four elbow link mechanisms are arranged at positions symmetrical about two axes orthogonal to each other.

In the mold apparatus according to one embodiment, a plurality of load cells for measuring the distribution of the clamping force are further provided between the lower mold and the sliding plate.

The compression molding apparatus of the present invention includes: a molding unit including the mold device described above; an internal loader unit including an internal loader; the internal loader is a molding die for supplying an insert member to the molding unit; : An external loader, which takes out a molded product from a molding die of a molding unit; and a storage section that stores the molded product.

The compression molding method of the present invention is a compression molding method for compression-molding an insert member with a resin material, and is characterized in that it includes a supply step of supplying the insert member to a forming mold having an upper mold and a lower mold; The connecting rod mechanism transmits the clamping force of the mold clamping mechanism to the sliding plate for fixing the lower mold, so that the sliding plate and the lower mold are moved to the upper mold to become the mold clamping state. The mold clamping process involves transmitting the clamping force to the slide plate through at least three toggle link mechanisms arranged below the slide plate.

In the above compression molding method of one embodiment, at least three elbow link mechanisms include a plurality of elbow link mechanisms in which the directions of the rotation axes intersect each other.

In the above compression molding method according to one embodiment, the mold clamping process includes transmitting the clamping force to the slide plate through four elbow link mechanisms arranged under the slide plate, and the four elbow link mechanisms. The system is arranged at positions symmetrical about two axes orthogonal to each other.

The above compression molding method according to an embodiment further includes borrowing A process of measuring the distribution of clamping force by a plurality of load cells placed between the lower mold and the sliding plate.

When according to the present invention, if at least three elbow link mechanisms are arranged, the slide plate can be stabilized and the tilt of the slide plate when it is moved up and down is suppressed. As a result, the clamping force used in the mold apparatus for compression molding can be more evenly distributed.

10‧‧‧ elbow link mechanism

10A ~ 10C‧‧‧ connecting rod member

10D‧‧‧Slider

10E‧‧‧Ball Screw

11‧‧‧Forming mold

11A‧‧‧Mould

11B‧‧‧Die

12‧‧‧ Upper fixed plate

13‧‧‧ Lower fixed plate

14‧‧‧ sliding board

15‧‧‧ base

16‧‧‧ load cell

17‧‧‧ Trolley

20‧‧‧ Internal Loader

30‧‧‧outside loader

1000‧‧‧Mould device

A‧‧‧forming unit

B‧‧‧ Internal Loader Unit

C‧‧‧Outside loader unit

FIG. 1 is a plan view showing the overall configuration of a compression molding apparatus including the mold apparatus of the present invention.

Fig. 2 is a diagram showing a state after adding a forming unit in the compression forming apparatus shown in Fig. 1.

Fig. 3 is a front view of the mold device (mold open state) of the present invention.

Fig. 4 is a front view of the mold device (clamping state) of the present invention.

Fig. 5 is an enlarged view showing the structure (molded state) of an elbow link mechanism in a mold device.

Fig. 6 is an enlarged view showing the structure (clamped state) of the elbow link mechanism in the mold device.

Fig. 7 is a drawing showing the structure of a joint of a link member.

FIG. 8 is a diagram showing an example of the arrangement of the load cells.

Fig. 9 is a diagram showing an example of the arrangement of an elbow link mechanism.

Hereinafter, embodiments of the present invention will be described. In addition, the same or equivalent parts are given the same reference numerals, and descriptions thereof may not be repeated.

Furthermore, in the embodiments described below, the number and In the case of an amount, etc., unless otherwise stated, the scope of the present invention is not necessarily limited to the number and amount. In addition, in the following embodiments, each constituent element is not an indispensable item for the present invention except in the case where it is specifically described.

FIG. 1 shows a compression molding apparatus including a mold device according to the present invention. The top view of the overall structure of the device. As shown in FIG. 1, the compression molding apparatus includes a molding unit A including a mold apparatus 1000 for compressively molding a resin material (resin sealing molding) on a substrate (insertion member) mounted on, for example, a semiconductor wafer; The loader unit B includes an inner loader 20 for supplying the insert member to the forming mold of the forming unit A; and the outer loader unit C includes an outer loader 30 and a storage portion, and the outer loader 30 is taken out from the forming mold of the forming unit A For the molded product, the storage section stores the molded product. The inner loader 20 and the outer loader 30 are moved up and down in the first figure.

Forming unit A, inner loader unit B and outer loader unit C, It is detachably connected to each other through a connecting mechanism such as a bolt and a pin body. In the example of FIG. 1, although there are two forming units A, this number can be adjusted to increase or decrease according to the production volume. There may be one forming unit A, as shown in FIG. 2, or it may be increased to four, for example.

Moreover, in the example of Fig. 1 and Fig. 2, the forming unit A, the inner Although the loader unit B and the outer loader unit C are arranged in this order, it may be, for example, a mother machine in which the forming unit A, the inner loader unit B, and the outer loader unit C are integrated into one unit, and the One or more slaves of one forming unit A are juxtaposed to constitute a compression forming apparatus.

Furthermore, in the examples shown in Figs. 1 and 2, it is also possible to use The insert member and the resin material are manually supplied to the molding unit A, and the molded product after the molding is taken out.

Next, the structure of the mold apparatus 1000 is demonstrated using FIG.3 and FIG.4. 3 and 4 are front views showing a mold opening state and a mold clamping state of the mold device 1000, respectively.

As shown in FIGS. 3 and 4, the mold device 1000 includes a forming mold 11. The molding die 11 includes an upper die 11A and a lower die 11B.

The mold device 1000 further includes: an upper fixed plate 12 that fixes the upper mold 11A of the forming mold 11; a lower fixed plate 13 that is disposed below the upper fixed plate 12; a slide plate 14 that is fixed through the base 15 and the load cell 16 The lower die 11B of the forming die 11 and the tie rod 17 connect the upper fixed plate 12 and the lower fixed plate 13.

The slide plate 14 is vertically movable relative to the upper fixed plate 12 and the lower fixed plate 13. The slide plate 14 is driven in the vertical direction by an elbow link mechanism 10 provided below the slide plate 14. Thereby, the mold opening state (FIG. 3) and the mold clamping state (FIG. 4) of the molding die 11 are switched.

The elbow link mechanism 10 includes a link member 10A (a first link member) and a moving sliding plate 14; a link member 10B (a second link member), which is rotatably connected to a lower fixed plate 13 and a connecting member. A lever member 10A; and a link member 10C (third link member), which connects the link member 10B with the slider 10D and the ball screw 10E (mold clamping mechanism). The clamping force of the forming die 11 is transmitted to the slide plate 14 through the link members 10A to 10C.

An end portion of one side of the link member 10B is rotatably connected To the lower fixing plate 13, the other end of the link member 10B is rotatably connected to the link member 10A.

When the mold device 1000 shown in FIGS. 1 to 4 is used to compression-mold an insert member with a resin material, first, the insert member and the resin material are supplied to the mold 11. Next, in a state where the upper mold 11A of the forming mold 11 is fixed, the elbow link mechanism 10 provided below the sliding plate 14 is used to move the sliding plate 14 upward to apply the required clamping force to the forming mold 11. .

5 and 6 are enlarged views showing the structure (clamping state) of the elbow link mechanism 10 in the mold-opening state and the mold-clamping state of the molding die 11, respectively. In the step of applying the clamping force to the forming mold 11, from the mold opening state of the forming mold 11 shown in FIG. 5, the ball screw 10E is operated and the link members 10A to 10C are rotated until the mold clamping shown in FIG. status.

Fig. 7 is a drawing showing the structure of the joints (a part α in Figs. 5 and 6) of the link members 10A to 10C. As shown in FIG. 7, the link members 10B and 10C are fitted into the recessed portions formed on the tip portions of the link member 10A, respectively. The pin system that becomes the rotation axis penetrates the link members 10A to 10C.

As described above, a plurality of load cells 16 for measuring the distribution of the locking force are provided between the lower mold 10B (the base 15) of the forming mold 11 and the sliding plate 14. Based on the measurement results, whether the distribution of the locking force is Based on the evaluation result of the homogenization, feedback such as adjusting the position of the plural elbow link mechanism 10 can be performed.

In addition, although an example of the arrangement of the load cell 16 is shown in FIG. 8, the arrangement of the load cell 16 is not limited to this.

FIG. 9 is a diagram showing an example of the arrangement of the toggle link mechanism 10 surface. In the example of FIG. 9, four of the elbow link mechanisms 10 are arranged below the slide plate 14. The four elbow link mechanisms 10 are arranged at symmetrical positions with respect to two axes (X-axis and Y-axis in FIG. 9) orthogonal to each other. In addition, two of the four elbow link mechanisms 10 are arranged such that their rotation axes are parallel to the X-axis, and the remaining two of the four elbow link mechanisms 10 are arranged such that their rotation axes and The Y axis is parallel. That is, the four elbow link mechanisms 10 include elbow link mechanisms 10 whose rotation axis directions intersect each other.

When the mold device according to this embodiment is shown in FIG. 9, By combining a pair of elbow link mechanisms 10 rotating around the X axis and a pair of elbow link mechanisms 10 rotating around the Y axis, the movement of each elbow link mechanism 10 is restricted, and the slide plate 14 can be stably moved up and down. . As a result, the inclination of the slide plate 14 is suppressed, and the clamping force used in the mold apparatus for compression molding can be more uniformly distributed.

Also, for example, when compared with the case of using a pair of elbow link mechanisms Below, by using the elbow link mechanism 10 which is used more (four in the example in FIG. 9), a small elbow link mechanism 10 can be applied to the same degree of clamping force. As a result, for example, the elbow link mechanism 10 can be arranged close to the center of the slide plate 14, the degree of freedom in the arrangement of the elbow link mechanism 10 is improved, and the effect of suppressing variations in the clamping force can be improved.

The above-mentioned effects made by the mold device of this embodiment are to be advanced. It becomes more significant when the size of the resin molding package is increased. The mold device according to this embodiment can also be applied to, for example, a resin molded product having a size (planar shape) of 660 mm × 515 mm or larger.

Moreover, the arrangement of the toggle link mechanism 10 is not limited to FIG. 9 As shown, as long as the elbow link mechanism 10 is disposed below the slide plate 14 In three cases, the effect of suppressing the inclination of the slide plate 14 can be obtained.

Although the embodiments of the present invention have been described above, It should be considered as the implementation form disclosed this time, and it is not intended to exemplify all points, nor to limit the present inventor. The scope of the present invention is expressed by the scope of patent application, which includes the meaning equivalent to the scope of patent application, and all changes within the scope.

Claims (5)

A mold device for compression-molding an insert member with a resin material, comprising: a forming mold having an upper mold and a lower mold; an upper fixing plate for fixing the upper mold; a lower fixing plate provided on the upper fixing plate; Bottom; The sliding plate is installed in a state where the lower mold is fixed, and it is provided to be movable up and down with respect to the upper fixed plate and the lower fixed plate; a clamping mechanism is provided to lock the required A mold force to the forming mold; and an elbow link mechanism provided below the slide plate to transmit the clamping force of the mold clamping mechanism to the slide plate, the elbow link mechanism includes a first link member Moving the sliding plate; a second link member having a first end rotatably connected to the lower fixed plate and a second end rotatably connected to the first link member; and a third link A lever member connects the second link member and the mold clamping mechanism, and the elbow link mechanism is provided with four under the slide plate; the four elbow link mechanisms are provided with Placed in a symmetrical position with respect to two axes perpendicular to each other; the rotation axis of two of the aforementioned four elbow link mechanisms is arranged parallel to one of the two axes perpendicular to each other; the aforementioned four elbow link mechanisms The two remaining ones have their rotation axes arranged in parallel with the other axis; the two elbow link mechanisms of the aforementioned four elbow link mechanisms are relative to the common one connecting the two elbow link mechanisms. A ball screw disposed below a central portion of the slide plate supports the slide plate at a symmetrical position. The mold device according to item 1 of the scope of patent application, further comprising a plurality of load cells for measuring the distribution of the clamping force between the lower mold and the sliding plate. A compression forming device includes: a forming unit including the mold device described in item 1 of the scope of patent application; an internal loader unit including an internal loader, wherein the internal loader supplies the insertion mold to the forming mold of the forming unit; And the external loader unit includes: an external loader that takes out a molded product from the molding die of the molding unit; and a storage section that stores the molded product. A compression molding method for compression-molding an insert member with a resin material, comprising: a supplying step for supplying the insert member to a forming mold having an upper mold and a lower mold; and a mold clamping step for transmitting the mold clamping through an elbow link mechanism. The clamping force of the mechanism is to fix the sliding plate of the lower mold, move the sliding plate and the lower mold to the upper mold, and enter a clamping state. The clamping process includes disposing under the sliding plate. The four elbow link mechanisms transmit the clamping force to the slide plate; the four elbow link mechanisms are arranged at symmetrical positions about two axes orthogonal to each other; the four elbow joints The rotation axis of two of the lever mechanisms is configured to be parallel to one of the two axes that are perpendicular to each other; the remaining two of the four elbow link mechanisms are configured to be parallel to the other axis; Two elbow link mechanisms among the elbow link mechanisms are opposed to a ball screw provided in common to connect the two elbow link mechanisms, and are disposed below the central portion of the sliding plate. Supporting said ball screw slide plate in symmetrical positions. The compression molding method according to item 4 of the scope of patent application, further comprising a step of measuring the distribution of the clamping force by a plurality of load cells arranged between the lower mold and the sliding plate.