JPS599538U - Resin sealing equipment for semiconductor devices - Google Patents

Resin sealing equipment for semiconductor devices

Info

Publication number
JPS599538U
JPS599538U JP10551582U JP10551582U JPS599538U JP S599538 U JPS599538 U JP S599538U JP 10551582 U JP10551582 U JP 10551582U JP 10551582 U JP10551582 U JP 10551582U JP S599538 U JPS599538 U JP S599538U
Authority
JP
Japan
Prior art keywords
resin sealing
semiconductor devices
sealing equipment
cull
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10551582U
Other languages
Japanese (ja)
Other versions
JPS6225888Y2 (en
Inventor
大塚　忠雄
舟塚　寿
Original Assignee
内外機材株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 内外機材株式会社 filed Critical 内外機材株式会社
Priority to JP10551582U priority Critical patent/JPS599538U/en
Publication of JPS599538U publication Critical patent/JPS599538U/en
Application granted granted Critical
Publication of JPS6225888Y2 publication Critical patent/JPS6225888Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体素子用樹脂封止装置を示す概略図
、第２図は本考案の一実施例を示す半導体素子用樹脂封
止装置の概略図、第３図は第２図の装置のスピンドル作
動機構を示す斜視図である。 ３１・・・基台、′３６・・・固定台、３７・・・作動
台、４２・・・トグル機構、４３．６３・・・ポールス
クリュ、４６・・・第１のＤＣサーボモータ、４９．５
３・・・面発熱体、５０・・・下金型、５４・・・上金
型、５６・・・カル、５７・・・スピンドル作動機構、
６１・・・第２のＤＣサーボモータ、６７・・・スピン
ドル、６８・・・プ　−。 ランジャ。Fig. 1 is a schematic diagram showing a conventional resin sealing device for semiconductor elements, Fig. 2 is a schematic diagram of a resin sealing device for semiconductor elements showing an embodiment of the present invention, and Fig. 3 is the device shown in Fig. 2. FIG. 31... Base, '36... Fixed base, 37... Operating base, 42... Toggle mechanism, 43.63... Pole screw, 46... First DC servo motor, 49 .5
3... Surface heating element, 50... Lower mold, 54... Upper mold, 56... Cal, 57... Spindle operating mechanism,
61...Second DC servo motor, 67...Spindle, 68...P-. Ranja.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 樹脂封止時に半導体素子が収納される互に開閉可能な上
下金型と、型締時、前記上金型のカルに挿入され、同カ
ルから充填された樹脂を溶融した状態で上下金型内に圧
入する先端にプランジャを着脱自在に取付けたスピンド
ルとを具備した半導体素子用樹脂封止装置において、Ｄ
Ｃサーボモータを駆動源として前記スピンドルを上下動
させる構造にしたことを特徴とする半導体素子用樹脂封
止装置。Upper and lower molds that can be opened and closed mutually accommodate the semiconductor element during resin sealing, and are inserted into the cull of the upper mold during mold clamping, and the melted resin filled from the same cull is placed inside the upper and lower molds. D.
1. A resin sealing device for a semiconductor element, characterized in that the spindle is moved up and down using a C servo motor as a driving source.
JP10551582U 1982-07-12 1982-07-12 Resin sealing equipment for semiconductor devices Granted JPS599538U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10551582U JPS599538U (en) 1982-07-12 1982-07-12 Resin sealing equipment for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10551582U JPS599538U (en) 1982-07-12 1982-07-12 Resin sealing equipment for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS599538U true JPS599538U (en) 1984-01-21
JPS6225888Y2 JPS6225888Y2 (en) 1987-07-02

Family

ID=30247291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10551582U Granted JPS599538U (en) 1982-07-12 1982-07-12 Resin sealing equipment for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS599538U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6171164A (en) * 1984-09-13 1986-04-12 Fanuc Ltd Automatic adjusting device for die clamping force
JPS6278835A (en) * 1985-09-30 1987-04-11 Mitsubishi Electric Corp Resin sealing device for semiconductor element
JPH03153324A (en) * 1989-11-10 1991-07-01 Sumitomo Heavy Ind Ltd Resin sealing device
JP2012147673A (en) * 2011-10-13 2012-08-02 Mitsui High Tec Inc Resin seal apparatus of permanent magnets
US8728375B2 (en) 2005-01-24 2014-05-20 Mitsui High-Tec, Inc. Method of resin sealing permanent magnets in laminated rotor core
JP2015214095A (en) * 2014-05-12 2015-12-03 Ｔｏｗａ株式会社 Mold device and apparatus and method for compression molding

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578107A (en) * 1980-06-18 1982-01-16 Toshiba Corp Molding apparatus for resin seal

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578107A (en) * 1980-06-18 1982-01-16 Toshiba Corp Molding apparatus for resin seal

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6171164A (en) * 1984-09-13 1986-04-12 Fanuc Ltd Automatic adjusting device for die clamping force
JPS6278835A (en) * 1985-09-30 1987-04-11 Mitsubishi Electric Corp Resin sealing device for semiconductor element
JPH03153324A (en) * 1989-11-10 1991-07-01 Sumitomo Heavy Ind Ltd Resin sealing device
US8728375B2 (en) 2005-01-24 2014-05-20 Mitsui High-Tec, Inc. Method of resin sealing permanent magnets in laminated rotor core
US10498203B2 (en) 2005-01-24 2019-12-03 Mitsui High-Tec, Inc. Method of resin sealing permanent magnets in laminated rotor core
JP2012147673A (en) * 2011-10-13 2012-08-02 Mitsui High Tec Inc Resin seal apparatus of permanent magnets
JP2015214095A (en) * 2014-05-12 2015-12-03 Ｔｏｗａ株式会社 Mold device and apparatus and method for compression molding

Also Published As

Publication number Publication date
JPS6225888Y2 (en) 1987-07-02

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