TWI643683B - Fluid providing device - Google Patents

Abstract

A fluid supply device is used to process a substrate. The substrate includes a non-planar area. The fluid supply device includes a fluid supply unit and a gas supply unit. The fluid supply unit is configured to output a fluid toward the substrate. The gas supply unit is located outside the fluid supply unit. The gas supply unit includes a gas output portion, and the gas output portion is configured to output a first gas toward the substrate. When the fluid supply unit outputs fluid to the substrate, a wet process is formed on the non-planar area; when the gas output portion outputs the first gas toward the substrate, and the first gas flows along a horizontal direction opposite to the substrate, the first The gas will form a removal process on the non-planar area to remove the fluid.

Description

Fluid supply device

The invention relates to a fluid supply device, in particular to a fluid supply device for effectively treating the surface of a substrate.

In the substrate manufacturing process, the substrate surface is often cleaned to remove impurities on the substrate surface. When cleaning the surface of the substrate, the principle of high-speed flow of compressed air is usually used to allow the conventional nozzle to provide a flowing liquid toward the wafer surface, or the liquid is formed into a high-pressure vapor through a steam generator, and then the high-pressure vapor is provided to the substrate. surface. In this way, the surface of the substrate can be cleaned by flowing liquid or high-pressure steam.

However, the nozzle supplies liquid or gas to the substrate surface with a high-speed liquid flushing system. When the substrate to be processed has deep grooves, impurities may still remain in the grooves. In addition, high-pressure steam is generated by a high-temperature and high-pressure steam engine, and the supply process requires precise control of pressure to avoid the danger of explosion due to excessive pressure. Therefore, the danger of the production of high-pressure steam is relatively increased, and additional high temperature must be purchased High-pressure steam engines relatively increase process costs.

Therefore, it is necessary to provide a fluid nozzle that can effectively treat the substrate surface and the grooves of the substrate.

The main object of the present invention is to provide a fluid supply device capable of effectively treating the surface of a substrate.

To achieve the above object, the fluid supply device of the present invention is used to process a substrate, and the substrate includes a non-planar area. The fluid supply device includes a fluid supply unit and a gas supply unit. The fluid supply unit is configured to output a fluid toward the substrate. The gas supply unit is located outside the fluid supply unit. The gas supply unit includes a gas output portion, and the gas output portion is configured to output a first gas toward the substrate. When the fluid supply unit outputs fluid to the substrate, a wet process is formed on the non-planar area; when the gas output portion outputs the first gas toward the substrate, and the first gas flows along a horizontal direction opposite to the substrate, the first The gas will form a removal process on the non-planar area to remove the fluid.

According to an embodiment of the present invention, the gas supply unit further includes an outer ring body, the outer ring body is located outside the body, and there is a first distance between the outer ring body and the body, and the first distance defines the first gas from the gas A gas flow from the supply unit.

According to an embodiment of the present invention, the first gas supplied by the gas supply unit is a ring-shaped gas flow.

According to an embodiment of the present invention, when the fluid supply device executes a continuous process above the substrate, the non-planar area will sequentially receive the ejection process formed by the annular airflow, the wet process formed by the fluid, and the displacement formed by the annular airflow. Division process.

According to an embodiment of the present invention, when the fluid supply device performs a continuous process above the substrate, the annular airflow first removes an air in a non-planar area that has not been contacted by the fluid, and makes the non-planar area a negative Pressure state; then, the fluid supply unit supplies the fluid to the substrate, and the fluid moves to the non-planar region by a negative pressure state to perform a wet process on the non-planar region; then, the annular airflow removes the fluid from the non-planar region .

According to an embodiment of the present invention, the annular airflow removes the air in the non-planar area and removes a part of the impurities in the non-planar area, and the fluid moves to the non-planar area to move the remaining impurities in the non-planar area; then, The annular air flow removes the fluid containing the remaining impurities in the non-planar area.

According to an embodiment of the present invention, the fluid supply unit includes a body, a gas input end, a liquid input end, and a first fluid output part, and the gas input end is connected to the body for inputting a second gas into the body, The liquid input end is connected to the body for inputting a liquid into the body, and the liquid and the second gas are mixed into a fluid. The first fluid output part is used to output the fluid toward the substrate, and the fluid is an atomized liquid.

According to an embodiment of the present invention, the body includes a mixing space, and the second gas and the liquid are mixed in the mixing space to form an atomized liquid, and the atomized liquid is output to the substrate by the first fluid output portion.

According to an embodiment of the present invention, when the fluid supply device performs a wet process, the fluid supply unit supplies fluid to a non-planar area of the substrate, and the gas supply unit temporarily suspends supplying the first gas.

According to an embodiment of the present invention, when the fluid supply device performs a spray process, the gas supply unit flows the first gas in a horizontal direction relative to the substrate to remove an air in the non-planar area, and the fluid The supply unit has temporarily stopped supplying fluid.

According to an embodiment of the present invention, the gas output portion and the substrate have a second distance therebetween, and the second distance is between 3 mm and 6 mm.

According to an embodiment of the present invention, the non-planar area is a flange or a groove.

With the fluid supply device of the present invention, the substrate can be continuously processed in three stages, such as a spray process, a wet process, and a removal process, so as to effectively process the grooves or non-planar areas of the substrate surface and its non-planar areas. Flange in flat area, etc., non-planar structure. In addition, the above three processes can be performed simultaneously or separately according to requirements; for simultaneous operation, when the fluid supply device performs a single stroke on the substrate, three processing effects can be achieved at the same time.

In order to make your reviewing committee better understand the technical content of the present invention, specific preferred embodiments are described below.

In the following, please refer to FIG. 1 to FIG. 7 for a fluid supply device according to a first embodiment of the present invention. FIG. 1 is a schematic diagram of a fluid supply device according to a first embodiment of the present invention; FIG. 2 is a schematic diagram of a fluid supply device when performing a spraying process according to a first embodiment of the present invention; and FIG. 3 is a first embodiment of the present invention Schematic diagram of the fluid supply device when the wet process is performed; FIG. 4 is a schematic diagram of the fluid supply device when the spray process is performed again in the first embodiment of the present invention; FIG. 5 is a continuation of the first embodiment of the present invention Schematic diagram of the fluid supply device in the first step of the spraying process, the wet process, and the removing process; FIG. 6 is a diagram showing the first step of the first embodiment of the present invention when the spraying process, the wet process, and the removing process are successively performed; Schematic diagram of the two-step fluid supply device; FIG. 7 is a schematic diagram of the third step of the fluid supply device in the first embodiment of the present invention following the ejection process, the wet process, and the removal process.

As shown in FIG. 1, a fluid supply device 1 according to a first embodiment of the present invention is used to process a substrate 100. The substrate 100 includes a planar region and a non-planar region 110. The non-planar region 110 is composed of a groove or a flange. In this embodiment, the groove is used as an example. The groove has a plurality of impurities T and T1, such as particles ( Particle). The fluid supply device 1 includes a fluid supply unit 10 and a gas supply unit 20.

As shown in FIG. 1 to FIG. 3, in the first embodiment of the present invention, the fluid supply unit 10 is configured to provide a fluid to the substrate 100 to process the surface of the substrate 100. The fluid in this embodiment is an atomized liquid F As an example. The fluid supply unit 10 uses two fluid nozzles as an example. The fluid supply unit 10 includes a body 11, a gas input end 12, a liquid input end 13, and a first fluid output portion 14. The main body 11 is a bell-shaped structure. The bell-shaped structure of the main body 11 includes a mixing space 111 inside. The gas input terminal 12 is connected to the body 11, and the gas input terminal 12 can be connected to an external pipeline 200. The gas input terminal 12 is used to receive the second gas A supplied by the pipeline 200 to input the second gas A into the mixing space 111 of the main body 11. The liquid input terminal 13 is connected to the body 11 and the liquid input terminal 13 can be connected to an external pipe 200a. The liquid input terminal 13 is used to receive the liquid L supplied by the pipe 200a to input the liquid L into the mixing space 111 of the body 11. ; The second gas A and the liquid L are mixed in the mixing space 111 to form an atomized liquid F. The first fluid output portion 14 is disposed on the bottom of the body 11 and faces the substrate 100, and the first fluid output portion 14 communicates with the mixing space 111. The first fluid output portion 14 is configured to output the atomized liquid F in the mixing space 111 toward the substrate 100 to process the substrate 100.

In the first embodiment of the present invention, the gas supply unit 20 is located outside the fluid supply unit 10, and the top end of the gas supply unit 20 can be connected to an external pipe 200b, and the external pipe 200b can face into the gas supply unit 20. The first gas B is transmitted. The gas supply unit 20 includes a gas output portion 21 and an outer ring body 22. The gas output portion 21 is connected to the outer ring body 22. The gas output portion 21 has a ring structure, and the gas output portion 21 surrounds the first fluid output portion 14. The gas output portion 21 is configured to output the first gas B supplied by the pipeline 200 b toward the substrate 100. The first gas B output by the gas output portion 21 of the ring structure is a ring-shaped airflow. The ring-shaped airflow is, for example, an airflow that flows radially around the center of the fluid supply device 1. There is a second distance D between the gas output portion 21 and the substrate 100. The second distance D is between 3 mm and 6 mm. When the first gas B flows over the non-planar area 110, it can be in the groove. A negative pressure state is formed inside, but the size of the second distance D is not limited to this, and it can be changed according to design requirements. The outer ring body 22 is a bell-shaped structure and is located outside the body 11. The bell-shaped structure of the outer ring body 22 surrounds the bell-shaped structure of the body 11. There is a first distance C between the outer ring body 22 and the body 11. The first distance C defines a gas flow rate of the first gas B flowing from the gas supply unit 20.

It should be noted that the pipelines 200, 200a, and 200b of the present invention are connected to external computers (not shown), and each of the pipelines 200, 200a, and 200b can be controlled by the computer to stop supplying gas or Liquid, so that the fluid supply device 1 provides different kinds of processes to the substrate 100. Computer control is not the focus of this case, so I won't go into details.

In the first embodiment of the present invention, when the surface of the substrate 100 is to be processed and the impurities T, T1 stuck in the non-planar area 110 are removed, a continuous process can be performed over the substrate 100 using the fluid supply device 1 so that the non- The planar area 110 sequentially receives a three-stage process such as a spraying process in which a circular air flow is blown, a wet process in which the atomized liquid F is formed, and a removal process in which the circular air flow is formed.

First, as shown in FIG. 1 and FIG. 2, when the fluid supply device 1 is started to perform a continuous process on the substrate 100, the fluid supply device 1 first performs a spray-out process. In the spraying process, only the pipe 200b will transmit the first gas B, and the pipes 200 and 200a will not transmit any gas or liquid. Therefore, the fluid supply unit 10 at this moment will temporarily stop supplying the atomized liquid F, so the atomized liquid F will not touch the substrate 100 and its non-planar area 110 at this moment. The gas supply unit 20 after receiving the first gas B allows the first gas B to flow toward the gas output portion 21 within the outer ring body 22, and causes the first gas B to be output from the gas output portion 21 and along the opposite substrate 100 The horizontal direction S flows. According to Bernoulli's principle, when the first gas B flowing in the horizontal direction S passes around the groove of the non-planar region 110, it will attract the non-planar region 110 due to the pressure difference, rather than the non-planar region 110. The air will be removed from the groove due to the attractive force, and a negative pressure will be formed inside the non-planar region 110. When the attraction caused by the first gas B removes the air in the non-planar region 110, a part of the impurities T in the non-planar region 110 is also removed, that is, the attraction caused by the first gas B can be preliminary A part of the impurities T is sucked away, so that the impurities T leave the non-planar region 110 along the impurity moving direction U. The air removal according to the present invention is to draw the air from the inside of the groove to the outside of the groove through the attractive force of the first gas B.

After the spraying process, a wet process will be performed, as shown in Figures 1 and 3. In the wet process, the pipeline 200b will not transmit the first gas B, and the pipelines 200 and 200a will respectively transmit the second gas. A and liquid L, the second gas A and liquid L are mixed in the mixing space 111 to form an atomized liquid F, and the atomized liquid F is output from the first fluid output portion 14 toward the substrate 100. When the first fluid output portion 14 outputs the atomized liquid F toward the substrate 100, the atomized liquid F moves along the atomized liquid flow direction J on the substrate 100. When the atomized liquid F moves closer to the non-planar region 110, the atomized liquid F also moves into the non-planar region 110 by the negative pressure state in the groove of the non-planar region 110 to move the non-planar region 110. The remaining impurities T1 in the non-planar region 110 are loosened and easily taken away from the non-planar region 110. In this way, the wet process is completed.

After the wet process, the removal process will be performed, as shown in Figures 1 and 4. In the removal process, only the pipeline 200b will transmit the first gas B, and the pipelines 200 and 200a will not transmit any gas or liquid. . The gas supply unit 20 after receiving the first gas B allows the first gas B to flow toward the gas output portion 21 within the outer ring body 22, and causes the first gas B to be output from the gas output portion 21 and along the opposite substrate 100 The horizontal direction S flows. According to the Bernoulli principle, the ring-shaped gas flow of the first gas B flowing in the horizontal direction S will attract the non-planar region 110, and the atomized liquid F in the non-planar region 110 containing the remaining impurities T1 will Under the influence of attraction, it is removed out of the groove. In this way, the substrate 100 can be effectively processed after a continuous process.

The above-mentioned spraying process, wet process, and removal process are separately described. When the fluid supply device 1 is in actual operation, the above three processes can be continued at the same time. For example, the annular air flow and the atomizing liquid F are simultaneously supplied to the surface of the substrate 100, and the substrate An example of one of the grooves 100, as shown in FIG. 5, when the fluid supply device 1 performs a single stroke movement, the groove is first formed into a negative pressure state through a circular air flow and a part of the impurities T is removed; As shown in FIG. 6, the fluid supply device 1 continues to move and supplies the atomized liquid F to the groove for processing; finally, as shown in FIG. 7, the fluid supply device 1 continues to move to remove the mist containing the remaining impurities T1 in the groove. With the removal of the chemical liquid F, three processing effects can be achieved simultaneously in a single stroke of the fluid supply device 1.

It is worth mentioning that if the substrate has deeper or narrower grooves, air will occupy most of the space in the groove, making it difficult for atomized liquid to enter the groove; even if atomized liquid enters the groove, Due to the deeper or narrower structure of the groove, the atomized liquid cannot be effectively discharged from the groove. However, the fluid supply device 1 of the present invention can effectively process the substrate 100 through the above-mentioned spraying process, wet process, and removal process, and effectively discharge the atomized liquid from the groove.

In the following, please refer to FIG. 8 for a fluid supply device according to a second embodiment of the present invention. FIG. 8 is a schematic diagram of a fluid supply device according to a second embodiment of the present invention.

As shown in FIG. 8, the difference between the second embodiment and the first embodiment is that in the fluid supply device 1 a of the second embodiment, one of the non-planar areas 110 a of the substrate 100 a is a flange, and there are some impurities T1 Easily caught on the bottom of the flange of the non-planar area 110a. The liquid input end 13a of the second embodiment is directly connected to the first fluid output part 14a, so the second gas A provided by the gas input end 12 will flow directly to the first fluid output part 14a, and the liquid L provided by the liquid input end 13a It also flows directly to the first fluid output portion 14a. The second gas A and the liquid L are mixed with the first fluid output portion 14 a to form an atomized liquid F for output to the substrate 100. The output atomized liquid F can still clean the surface of the substrate 100 and process the grooves of the non-planar area 110 and the flange of the non-planar area 110a to move the impurity T1 at the bottom of the flange of the non-planar area 110a so that the impurity T1 Out of the non-planar area 110a.

With the fluid supply device 1 and 1a of the present invention, the substrate 100 can be processed in three stages, such as a spray process, a wet process, and a removal process, so as to effectively treat the surface of the substrate 100 and the recesses of the non-planar area 110 thereof. The groove or flange of the non-planar area 110a. In addition, the above three processes can be performed simultaneously or separately according to requirements. For the same time, when the fluid supply device 1 and 1a perform a single stroke on the substrate 100, three processing effects can be achieved at the same time without using high pressure steam. The substrate is processed.

The substrate 100 mentioned in the present invention may be a carrier board form, a wafer form, a wafer form, and the like, and may be a round shape, a square shape, and is not limited thereto. And the fluid supply device 1 and 1a of the present invention can be applied to substrate wet processes (cleaning, etching, etc.), for example: single substrate wet process, multi-substrate wet process, single-side wafer metal ball etching, thin wafer support / Peeling, bonding / peeling process, silicon carbide recycled wafers, recycled silicon wafers, etc. are not limited to this.

It should be noted that the above are merely examples, and are not limited to the examples. For example, those who do not depart from the basic structure of the present invention should all be within the scope of the rights claimed by the patent, and the scope of the patent application shall prevail.

1.1a‧‧‧fluid supply device

10‧‧‧ Fluid Supply Unit

11‧‧‧ Ontology

111‧‧‧ mixed space

12‧‧‧gas input

13, 13a‧‧‧Liquid input terminal

14, 14a‧‧‧First fluid output

20‧‧‧Gas supply unit

21‧‧‧Gas output department

22‧‧‧ outer ring

100, 100a‧‧‧ substrate

110, 110a‧‧‧ non-planar area

200, 200a, 200b ‧‧‧ pipeline

A‧‧‧Second gas

B‧‧‧First Gas

D‧‧‧First pitch C Second pitch

F‧‧‧Atomized liquid

J‧‧‧Atomizing liquid flow direction

L‧‧‧Liquid

S‧‧‧Horizontal

T, T1‧‧‧ impurities

U‧‧‧ Impurity moving direction

FIG. 1 is a schematic diagram of a fluid supply device according to a first embodiment of the present invention. FIG. 2 is a schematic diagram of a fluid supply device during a spray-out process according to the first embodiment of the present invention. FIG. 3 is a schematic diagram of a fluid supply device during a wet process according to the first embodiment of the present invention. FIG. 4 is a schematic diagram of a fluid supply device when the spraying process is performed again according to the first embodiment of the present invention. FIG. 5 is a schematic diagram of a fluid supply device in the first step of the spraying process, the wet process, and the removing process in the first embodiment of the present invention. FIG. 6 is a schematic diagram of a fluid supply device in the second step of the first embodiment of the present invention, which successively performs a spraying process, a wet process, and a removing process. FIG. 7 is a schematic diagram of a fluid supply device in the third step of the spraying process, the wet process, and the removing process in the first embodiment of the present invention. FIG. 8 is a schematic diagram of a fluid supply device according to a second embodiment of the present invention.

Claims (12)

A fluid supply device for processing a substrate. The substrate includes a non-planar area. The fluid supply device includes: a fluid supply unit for outputting a fluid toward the substrate; and a gas supply unit located in the fluid supply unit. Outside, the gas supply unit includes a gas output portion for outputting a first gas toward the substrate; wherein when the fluid supply unit outputs the fluid toward the substrate, a non-planar area is formed. Wet process; when the gas output section outputs the first gas toward the substrate, and the first gas flows in a horizontal direction relative to the substrate, the first gas forms a removal process on the non-planar area To remove the fluid. The fluid supply device according to item 1 of the scope of patent application, wherein the gas supply unit further includes an outer ring body, the fluid supply unit further includes a body, the outer ring body is located outside the body, and the outer ring body There is a first distance from the body, and the first distance defines a gas flow rate of the first gas flowing from the gas supply unit. The fluid supply device according to item 2 of the scope of patent application, wherein the first gas supplied by the gas supply unit is a ring-shaped gas flow. The fluid supply device according to item 3 of the scope of patent application, wherein when the fluid supply device performs a continuous process above the substrate, the non-planar area will sequentially receive a jetting process formed by the annular air flow, and the fluid formation The wet process, and the removal process formed by the annular airflow. The fluid supply device according to item 3 of the scope of patent application, wherein when the fluid supply device performs a continuous process above the substrate, the annular airflow first moves an air in the non-planar area that has not been contacted by the fluid. And removing the non-planar region into a negative pressure state; then, the fluid supply unit supplies the fluid to the substrate, and the fluid moves to the non-planar region by the negative pressure state to perform the wet operation on the non-planar region. Process; then, the annular gas stream removes the fluid from the non-planar area. The fluid supply device according to item 5 of the patent application scope, wherein the annular airflow removes the air in the non-planar area and removes a part of impurities in the non-planar area, and the fluid moves to the non-planar area to move the non-planar area The remaining impurities in the planar region; then, the annular gas stream removes the fluid containing the remaining impurities in the non-planar region. The fluid supply device according to item 1 of the scope of patent application, wherein the fluid supply unit includes a body, a gas input end, a liquid input end, and a first fluid output part, and the gas input end is connected to the body for A second gas is input into the body, and the liquid input end is connected to the body for inputting a liquid into the body. The liquid and the second gas are mixed to form the fluid, and the first fluid output portion is used to face the body. The substrate outputs the fluid, which is an atomized liquid. The fluid supply device according to item 7 of the patent application scope, wherein the body includes a mixing space, the second gas and the liquid are mixed in the mixing space to form the atomized liquid, and the atomized liquid is output by the first fluid Output to this substrate. The fluid supply device according to item 1 of the patent application scope, wherein when the fluid supply device performs the wet process, the fluid supply unit supplies the fluid to the non-planar area of the substrate, and the gas supply unit suspends supply Should be the first gas. The fluid supply device according to item 1 of the scope of the patent application, wherein when the fluid supply device performs a spraying process, the gas supply unit flows the first gas in the horizontal direction relative to the substrate, so that the non- An air in the flat area is removed, and the fluid supply unit suspends the supply of the fluid. The fluid supply device according to item 1 of the scope of patent application, wherein the gas output portion and the substrate have a second distance therebetween, and the second distance is between 3 mm and 6 mm. The fluid supply device according to item 1 of the patent application scope, wherein the non-planar area is a flange or a groove.