TWI640843B - 用於產生遮罩之高密度對位映圖的方法、系統及電腦程式產品 - Google Patents

用於產生遮罩之高密度對位映圖的方法、系統及電腦程式產品 Download PDF

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Publication number
TWI640843B
TWI640843B TW104111017A TW104111017A TWI640843B TW I640843 B TWI640843 B TW I640843B TW 104111017 A TW104111017 A TW 104111017A TW 104111017 A TW104111017 A TW 104111017A TW I640843 B TWI640843 B TW I640843B
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TW
Taiwan
Prior art keywords
mask
points
alignment
data
tool
Prior art date
Application number
TW104111017A
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English (en)
Chinese (zh)
Other versions
TW201543184A (zh
Inventor
法蘭克 雷斯基
穆罕默德 丹尼斯帕納
布拉迪普 沙布拉曼雁
熊亞霖
Original Assignee
美商克萊譚克公司
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Publication date
Application filed by 美商克萊譚克公司 filed Critical 美商克萊譚克公司
Publication of TW201543184A publication Critical patent/TW201543184A/zh
Application granted granted Critical
Publication of TWI640843B publication Critical patent/TWI640843B/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Image Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW104111017A 2014-04-02 2015-04-02 用於產生遮罩之高密度對位映圖的方法、系統及電腦程式產品 TWI640843B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461974001P 2014-04-02 2014-04-02
US61/974,001 2014-04-02

Publications (2)

Publication Number Publication Date
TW201543184A TW201543184A (zh) 2015-11-16
TWI640843B true TWI640843B (zh) 2018-11-11

Family

ID=54241286

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104111017A TWI640843B (zh) 2014-04-02 2015-04-02 用於產生遮罩之高密度對位映圖的方法、系統及電腦程式產品

Country Status (6)

Country Link
US (1) US20150310160A1 (enExample)
JP (1) JP6570010B2 (enExample)
KR (1) KR102330732B1 (enExample)
CN (1) CN106165065B (enExample)
TW (1) TWI640843B (enExample)
WO (1) WO2015153872A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10162928B2 (en) * 2015-12-02 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. Method of designing a semiconductor device, system for implementing the method and standard cell
US10296702B2 (en) 2017-03-15 2019-05-21 Applied Materials Israel Ltd. Method of performing metrology operations and system thereof
US10120973B2 (en) * 2017-03-15 2018-11-06 Applied Materials Israel Ltd. Method of performing metrology operations and system thereof
DE102017219217B4 (de) * 2017-10-26 2021-03-25 Carl Zeiss Smt Gmbh Masken für die Mikrolithographie, Verfahren zur Bestimmung von Kantenpositionen der Bilder der Strukturen einer derartigen Maske und System zur Durchführung eines derartigen Verfahrens
WO2022009392A1 (ja) * 2020-07-09 2022-01-13 株式会社日立ハイテク 欠陥検査装置、欠陥検査方法
CN114373000A (zh) * 2021-11-29 2022-04-19 湖南快乐阳光互动娱乐传媒有限公司 一种问题地图筛查方法和装置

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US7676077B2 (en) * 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
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TW201443877A (zh) * 2013-02-14 2014-11-16 Dolby Lab Licensing Corp 音訊處理系統中之訊號去相關

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US6539106B1 (en) * 1999-01-08 2003-03-25 Applied Materials, Inc. Feature-based defect detection
JP3808817B2 (ja) * 2002-09-05 2006-08-16 株式会社東芝 マスク欠陥検査方法、半導体装置の製造方法、マスク欠陥検査装置、欠陥影響度マップ作成方法およびプログラム
US9002497B2 (en) * 2003-07-03 2015-04-07 Kla-Tencor Technologies Corp. Methods and systems for inspection of wafers and reticles using designer intent data
WO2006046236A1 (en) * 2004-10-26 2006-05-04 May High-Tech Solutions, Ltd. Method and apparatus for residue detection on a polished wafer
US7349066B2 (en) * 2005-05-05 2008-03-25 Asml Masktools B.V. Apparatus, method and computer program product for performing a model based optical proximity correction factoring neighbor influence
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US20070064995A1 (en) * 2005-09-22 2007-03-22 Junji Oaki Image density-adapted automatic mode switchable pattern correction scheme for workpiece inspection
US7676077B2 (en) * 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
TW201127119A (en) * 2009-05-01 2011-08-01 Qualcomm Inc Idle handoff to hybrid femto cell based on system selection database
TW201443877A (zh) * 2013-02-14 2014-11-16 Dolby Lab Licensing Corp 音訊處理系統中之訊號去相關

Also Published As

Publication number Publication date
JP6570010B2 (ja) 2019-09-04
CN106165065B (zh) 2019-08-30
US20150310160A1 (en) 2015-10-29
KR20160142354A (ko) 2016-12-12
WO2015153872A1 (en) 2015-10-08
CN106165065A (zh) 2016-11-23
JP2017516130A (ja) 2017-06-15
TW201543184A (zh) 2015-11-16
KR102330732B1 (ko) 2021-11-23

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