KR102330732B1 - 마스크들을 위한 고밀도 레지스트레이션 맵들을 생성하기 위한 방법, 시스템 및 컴퓨터 프로그램 제품 - Google Patents

마스크들을 위한 고밀도 레지스트레이션 맵들을 생성하기 위한 방법, 시스템 및 컴퓨터 프로그램 제품 Download PDF

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KR102330732B1
KR102330732B1 KR1020167030599A KR20167030599A KR102330732B1 KR 102330732 B1 KR102330732 B1 KR 102330732B1 KR 1020167030599 A KR1020167030599 A KR 1020167030599A KR 20167030599 A KR20167030599 A KR 20167030599A KR 102330732 B1 KR102330732 B1 KR 102330732B1
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South Korea
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registration
mask
points
tool
sample points
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KR20160142354A (ko
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프랑크 래스커
모하매드 엠 다네쉬파냐
프라딥 수브라만얀
야린 시옹
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케이엘에이 코포레이션
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Image Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020167030599A 2014-04-02 2015-04-02 마스크들을 위한 고밀도 레지스트레이션 맵들을 생성하기 위한 방법, 시스템 및 컴퓨터 프로그램 제품 Active KR102330732B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461974001P 2014-04-02 2014-04-02
US61/974,001 2014-04-02
PCT/US2015/024060 WO2015153872A1 (en) 2014-04-02 2015-04-02 A method, system and computer program product for generating high density registration maps for masks

Publications (2)

Publication Number Publication Date
KR20160142354A KR20160142354A (ko) 2016-12-12
KR102330732B1 true KR102330732B1 (ko) 2021-11-23

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KR1020167030599A Active KR102330732B1 (ko) 2014-04-02 2015-04-02 마스크들을 위한 고밀도 레지스트레이션 맵들을 생성하기 위한 방법, 시스템 및 컴퓨터 프로그램 제품

Country Status (6)

Country Link
US (1) US20150310160A1 (enExample)
JP (1) JP6570010B2 (enExample)
KR (1) KR102330732B1 (enExample)
CN (1) CN106165065B (enExample)
TW (1) TWI640843B (enExample)
WO (1) WO2015153872A1 (enExample)

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US10162928B2 (en) * 2015-12-02 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. Method of designing a semiconductor device, system for implementing the method and standard cell
US10120973B2 (en) 2017-03-15 2018-11-06 Applied Materials Israel Ltd. Method of performing metrology operations and system thereof
US10296702B2 (en) 2017-03-15 2019-05-21 Applied Materials Israel Ltd. Method of performing metrology operations and system thereof
DE102017219217B4 (de) 2017-10-26 2021-03-25 Carl Zeiss Smt Gmbh Masken für die Mikrolithographie, Verfahren zur Bestimmung von Kantenpositionen der Bilder der Strukturen einer derartigen Maske und System zur Durchführung eines derartigen Verfahrens
WO2022009392A1 (ja) * 2020-07-09 2022-01-13 株式会社日立ハイテク 欠陥検査装置、欠陥検査方法
CN114373000A (zh) * 2021-11-29 2022-04-19 湖南快乐阳光互动娱乐传媒有限公司 一种问题地图筛查方法和装置

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JP2013064632A (ja) 2011-09-16 2013-04-11 Nuflare Technology Inc 位置ずれマップ作成装置、パターン検査システム、及び位置ずれマップ作成方法
US8624971B2 (en) 2009-01-23 2014-01-07 Kla-Tencor Corporation TDI sensor modules with localized driving and signal processing circuitry for high speed inspection

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JP3730263B2 (ja) * 1992-05-27 2005-12-21 ケーエルエー・インストルメンツ・コーポレーション 荷電粒子ビームを用いた自動基板検査の装置及び方法
US6539106B1 (en) * 1999-01-08 2003-03-25 Applied Materials, Inc. Feature-based defect detection
US9002497B2 (en) * 2003-07-03 2015-04-07 Kla-Tencor Technologies Corp. Methods and systems for inspection of wafers and reticles using designer intent data
US20090136117A1 (en) * 2004-10-26 2009-05-28 May High-Tech Solutions Ltd. Method and apparatus for residue detection on a polished wafer
US7349066B2 (en) * 2005-05-05 2008-03-25 Asml Masktools B.V. Apparatus, method and computer program product for performing a model based optical proximity correction factoring neighbor influence
JP4203498B2 (ja) * 2005-09-22 2009-01-07 アドバンスド・マスク・インスペクション・テクノロジー株式会社 画像補正装置、パターン検査装置、画像補正方法、及び、パターン欠陥検査方法
US7676077B2 (en) * 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
KR100819803B1 (ko) * 2006-04-06 2008-04-07 삼성테크윈 주식회사 솔더 페이스트 검사 방법
US8825051B2 (en) * 2009-05-01 2014-09-02 Qualcomm Incorporated Idle handoff to hybrid femto cell based on system selection database
KR101195263B1 (ko) * 2010-04-13 2012-11-14 에스케이하이닉스 주식회사 포토마스크의 이미지 배치 에러 보정 방법
JP2013045372A (ja) * 2011-08-25 2013-03-04 Dainippon Printing Co Ltd 画像評価方法、描画条件選択方法、画像評価プログラム、描画条件選択プログラム
US9599575B2 (en) * 2012-02-07 2017-03-21 Applied Materials Israel, Ltd. System, a method and a computer program product for CAD-based registration
US8855399B2 (en) * 2012-02-07 2014-10-07 Applied Materials Israel, Ltd. System, a method and a computer program product for CAD-based registration
TWI618050B (zh) * 2013-02-14 2018-03-11 杜比實驗室特許公司 用於音訊處理系統中之訊號去相關的方法及設備
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CN106154768B (zh) * 2016-07-01 2019-04-05 无锡中微掩模电子有限公司 一种基于掩模板的集成电路基板二次曝光方法

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JP2004101654A (ja) 2002-09-05 2004-04-02 Toshiba Corp マスク欠陥検査方法、半導体装置の製造方法、マスク欠陥検査装置、欠陥影響度マップ作成方法およびプログラム
US8624971B2 (en) 2009-01-23 2014-01-07 Kla-Tencor Corporation TDI sensor modules with localized driving and signal processing circuitry for high speed inspection
JP2013064632A (ja) 2011-09-16 2013-04-11 Nuflare Technology Inc 位置ずれマップ作成装置、パターン検査システム、及び位置ずれマップ作成方法

Also Published As

Publication number Publication date
WO2015153872A1 (en) 2015-10-08
TW201543184A (zh) 2015-11-16
CN106165065B (zh) 2019-08-30
TWI640843B (zh) 2018-11-11
JP2017516130A (ja) 2017-06-15
CN106165065A (zh) 2016-11-23
US20150310160A1 (en) 2015-10-29
KR20160142354A (ko) 2016-12-12
JP6570010B2 (ja) 2019-09-04

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