TWI639896B - Exposure device, component manufacturing system, and component manufacturing method - Google Patents

Exposure device, component manufacturing system, and component manufacturing method Download PDF

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Publication number
TWI639896B
TWI639896B TW106123484A TW106123484A TWI639896B TW I639896 B TWI639896 B TW I639896B TW 106123484 A TW106123484 A TW 106123484A TW 106123484 A TW106123484 A TW 106123484A TW I639896 B TWI639896 B TW I639896B
Authority
TW
Taiwan
Prior art keywords
projection
substrate
light
optical system
illumination
Prior art date
Application number
TW106123484A
Other languages
English (en)
Chinese (zh)
Other versions
TW201740218A (zh
Inventor
加藤正紀
Original Assignee
日商尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商尼康股份有限公司 filed Critical 日商尼康股份有限公司
Publication of TW201740218A publication Critical patent/TW201740218A/zh
Application granted granted Critical
Publication of TWI639896B publication Critical patent/TWI639896B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/7015—Details of optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lenses (AREA)
  • Microscoopes, Condenser (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
TW106123484A 2012-12-18 2013-12-06 Exposure device, component manufacturing system, and component manufacturing method TWI639896B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012276139 2012-12-18
JPJP2012-276139 2012-12-18

Publications (2)

Publication Number Publication Date
TW201740218A TW201740218A (zh) 2017-11-16
TWI639896B true TWI639896B (zh) 2018-11-01

Family

ID=50978197

Family Applications (3)

Application Number Title Priority Date Filing Date
TW102144736A TWI596438B (zh) 2012-12-18 2013-12-06 Substrate processing apparatus, component manufacturing system and component manufacturing method
TW106123484A TWI639896B (zh) 2012-12-18 2013-12-06 Exposure device, component manufacturing system, and component manufacturing method
TW107133825A TWI687779B (zh) 2012-12-18 2013-12-06 投影光學裝置、掃描曝光裝置、及元件製造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW102144736A TWI596438B (zh) 2012-12-18 2013-12-06 Substrate processing apparatus, component manufacturing system and component manufacturing method

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW107133825A TWI687779B (zh) 2012-12-18 2013-12-06 投影光學裝置、掃描曝光裝置、及元件製造方法

Country Status (6)

Country Link
JP (4) JP6217651B2 (ko)
KR (6) KR102075325B1 (ko)
CN (2) CN104871091B (ko)
HK (1) HK1208915A1 (ko)
TW (3) TWI596438B (ko)
WO (1) WO2014097859A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101961605B1 (ko) * 2011-12-20 2019-03-22 가부시키가이샤 니콘 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법
WO2021193360A1 (ja) 2020-03-24 2021-09-30 株式会社カネカ 膵臓α細胞への分化誘導方法
CN114070971A (zh) * 2020-07-27 2022-02-18 奥林巴斯株式会社 观察装置、光偏转单元、像形成方法
CN117031720B (zh) * 2023-09-28 2023-12-29 微纳动力(北京)科技有限责任公司 一种自动化集成光学装置及系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864501A (ja) * 1994-08-25 1996-03-08 Nikon Corp 投影光学系及びそれを備えた露光装置
TW200714374A (en) * 2005-06-28 2007-04-16 Eastman Kodak Co UV cure equipment with combined light path
TW200736662A (en) * 2006-03-20 2007-10-01 Nikon Corp Reflection/refraction projection optical system, reflection/refraction optical device, scanning exposure device and production method of micro-device
JP2011221538A (ja) * 2010-04-13 2011-11-04 Nikon Corp マスクケース、マスクユニット、露光装置、基板処理装置及びデバイス製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002258489A (ja) * 2000-04-20 2002-09-11 Nikon Corp 露光装置および露光方法
KR101590743B1 (ko) * 2005-06-02 2016-02-01 칼 짜이스 에스엠티 게엠베하 마이크로리소그래피 투영 대물 렌즈
DE102005030839A1 (de) 2005-07-01 2007-01-11 Carl Zeiss Smt Ag Projektionsbelichtungsanlage mit einer Mehrzahl von Projektionsobjektiven
JP4984631B2 (ja) 2006-04-28 2012-07-25 株式会社ニコン 露光装置及び方法、露光用マスク、並びにデバイス製造方法
JP4880511B2 (ja) * 2007-03-28 2012-02-22 株式会社オーク製作所 露光描画装置
US8379187B2 (en) * 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
JP2009231311A (ja) * 2008-03-19 2009-10-08 Nikon Corp 照明装置、露光装置、露光方法及びデバイス製造方法
DE102009037077B3 (de) * 2009-08-13 2011-02-17 Carl Zeiss Smt Ag Katadioptrisches Projektionsobjektiv
JP2012004564A (ja) 2010-06-11 2012-01-05 Nikon Corp 露光方法、露光装置、デバイス製造方法
WO2013035661A1 (ja) * 2011-09-07 2013-03-14 株式会社ニコン 基板処理装置
KR101961605B1 (ko) * 2011-12-20 2019-03-22 가부시키가이샤 니콘 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864501A (ja) * 1994-08-25 1996-03-08 Nikon Corp 投影光学系及びそれを備えた露光装置
TW200714374A (en) * 2005-06-28 2007-04-16 Eastman Kodak Co UV cure equipment with combined light path
TW200736662A (en) * 2006-03-20 2007-10-01 Nikon Corp Reflection/refraction projection optical system, reflection/refraction optical device, scanning exposure device and production method of micro-device
JP2011221538A (ja) * 2010-04-13 2011-11-04 Nikon Corp マスクケース、マスクユニット、露光装置、基板処理装置及びデバイス製造方法

Also Published As

Publication number Publication date
JP6217651B2 (ja) 2017-10-25
KR101903941B1 (ko) 2018-10-02
KR101988820B1 (ko) 2019-06-12
KR101934228B1 (ko) 2018-12-31
CN107247388A (zh) 2017-10-13
KR20190067258A (ko) 2019-06-14
JP6635167B2 (ja) 2020-01-22
KR102075325B1 (ko) 2020-02-07
JP2017227916A (ja) 2017-12-28
CN104871091A (zh) 2015-08-26
WO2014097859A1 (ja) 2014-06-26
TWI596438B (zh) 2017-08-21
KR20190000398A (ko) 2019-01-02
TW201426202A (zh) 2014-07-01
KR20190093699A (ko) 2019-08-09
KR20180040730A (ko) 2018-04-20
KR102009138B1 (ko) 2019-08-08
JP2019049723A (ja) 2019-03-28
HK1208915A1 (en) 2016-03-18
JP2020052420A (ja) 2020-04-02
KR101861905B1 (ko) 2018-05-28
TW201740218A (zh) 2017-11-16
JP6414303B2 (ja) 2018-10-31
JPWO2014097859A1 (ja) 2017-01-12
TW201905603A (zh) 2019-02-01
TWI687779B (zh) 2020-03-11
KR20170127053A (ko) 2017-11-20
CN107247388B (zh) 2018-09-18
KR20150097514A (ko) 2015-08-26
CN104871091B (zh) 2017-06-30

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