TWI639057B - 曝光裝置及曝光方法、以及元件製造方法 - Google Patents
曝光裝置及曝光方法、以及元件製造方法 Download PDFInfo
- Publication number
- TWI639057B TWI639057B TW101150758A TW101150758A TWI639057B TW I639057 B TWI639057 B TW I639057B TW 101150758 A TW101150758 A TW 101150758A TW 101150758 A TW101150758 A TW 101150758A TW I639057 B TWI639057 B TW I639057B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- measurement
- substrate
- stage
- exposure
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 65
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 238000005259 measurement Methods 0.000 claims abstract description 575
- 230000033001 locomotion Effects 0.000 claims description 344
- 230000003287 optical effect Effects 0.000 claims description 133
- 238000001514 detection method Methods 0.000 claims description 129
- 239000000758 substrate Substances 0.000 claims description 95
- 238000012546 transfer Methods 0.000 claims description 34
- 238000005452 bending Methods 0.000 claims description 14
- 238000012937 correction Methods 0.000 claims description 12
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 1156
- 210000003128 head Anatomy 0.000 description 376
- 239000007788 liquid Substances 0.000 description 132
- 238000012545 processing Methods 0.000 description 101
- 238000011068 loading method Methods 0.000 description 54
- 238000007654 immersion Methods 0.000 description 49
- 238000005286 illumination Methods 0.000 description 48
- 239000005871 repellent Substances 0.000 description 29
- 238000013507 mapping Methods 0.000 description 28
- 238000001179 sorption measurement Methods 0.000 description 26
- 238000011084 recovery Methods 0.000 description 21
- 238000010586 diagram Methods 0.000 description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 20
- 230000006870 function Effects 0.000 description 17
- 230000008569 process Effects 0.000 description 16
- 238000001816 cooling Methods 0.000 description 15
- 238000005070 sampling Methods 0.000 description 13
- 238000013459 approach Methods 0.000 description 12
- 230000001133 acceleration Effects 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 11
- 230000004075 alteration Effects 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- 238000003384 imaging method Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 238000007689 inspection Methods 0.000 description 9
- 230000009471 action Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000012530 fluid Substances 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 8
- 230000036961 partial effect Effects 0.000 description 8
- 238000005111 flow chemistry technique Methods 0.000 description 7
- 230000000737 periodic effect Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 238000004441 surface measurement Methods 0.000 description 7
- 239000000969 carrier Substances 0.000 description 6
- 230000001276 controlling effect Effects 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 238000004364 calculation method Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000007774 longterm Effects 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- 229910052727 yttrium Inorganic materials 0.000 description 4
- 238000012935 Averaging Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 3
- 229910052769 Ytterbium Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000036316 preload Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000002940 repellent Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 210000000887 face Anatomy 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000012925 reference material Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000013316 zoning Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49764—Method of mechanical manufacture with testing or indicating
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Toxicology (AREA)
- Atmospheric Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Multimedia (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161581293P | 2011-12-29 | 2011-12-29 | |
| US201161581360P | 2011-12-29 | 2011-12-29 | |
| US61/581,293 | 2011-12-29 | ||
| US61/581,360 | 2011-12-29 | ||
| JPJP2012-248419 | 2012-11-12 | ||
| JP2012248419 | 2012-11-12 | ||
| US13/727,286 US9207549B2 (en) | 2011-12-29 | 2012-12-26 | Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement |
| US13/727,286 | 2012-12-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201341966A TW201341966A (zh) | 2013-10-16 |
| TWI639057B true TWI639057B (zh) | 2018-10-21 |
Family
ID=48697662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101150758A TWI639057B (zh) | 2011-12-29 | 2012-12-28 | 曝光裝置及曝光方法、以及元件製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9207549B2 (OSRAM) |
| JP (1) | JP6016200B2 (OSRAM) |
| KR (1) | KR101698249B1 (OSRAM) |
| TW (1) | TWI639057B (OSRAM) |
| WO (1) | WO2013100202A1 (OSRAM) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8832916B2 (en) * | 2011-07-12 | 2014-09-16 | Lam Research Corporation | Methods of dechucking and system thereof |
| NL2009533A (en) * | 2011-10-27 | 2013-05-07 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
| US8779635B2 (en) * | 2012-04-10 | 2014-07-15 | Kla-Tencor Corporation | Arrangement of reticle positioning device for actinic inspection of EUV reticles |
| US10242903B2 (en) * | 2012-11-30 | 2019-03-26 | Nikon Corporation | Suction device, carry-in method, carrier system and exposure apparatus, and device manufacturing method |
| CN103207529B (zh) * | 2013-03-22 | 2015-04-29 | 京东方科技集团股份有限公司 | 曝光方法及曝光设备 |
| DE102013016065B4 (de) * | 2013-09-27 | 2016-02-18 | Mecatronix Ag | Positioniervorrichtung und Verfahren |
| US9529280B2 (en) | 2013-12-06 | 2016-12-27 | Kla-Tencor Corporation | Stage apparatus for semiconductor inspection and lithography systems |
| IN2014CH00782A (OSRAM) | 2014-02-19 | 2015-08-28 | Kennametal India Ltd | |
| KR101975414B1 (ko) * | 2014-08-15 | 2019-05-07 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치 및 방법 |
| US9694545B2 (en) * | 2014-12-18 | 2017-07-04 | Stratasys, Inc. | Remotely-adjustable purge station for use in additive manufacturing systems |
| HK1246871A1 (en) * | 2015-02-23 | 2018-09-14 | Nikon Corporation | Measurement device, lithography system and exposure device, and management method, superposition measurement method and device manufacturing method |
| EP3264180B1 (en) | 2015-02-23 | 2020-01-08 | Nikon Corporation | Substrate processing system and substrate processing method, and device manufacturing method |
| WO2016136689A1 (ja) | 2015-02-23 | 2016-09-01 | 株式会社ニコン | 計測装置、リソグラフィシステム及び露光装置、並びにデバイス製造方法 |
| CN108139683B (zh) * | 2015-09-30 | 2021-11-05 | 株式会社尼康 | 曝光装置及曝光方法、以及平面显示器制造方法 |
| CN112415863B (zh) * | 2015-09-30 | 2023-05-23 | 株式会社尼康 | 曝光装置、平面显示器的制造方法、组件制造方法、及曝光方法 |
| JP6656728B2 (ja) * | 2015-10-01 | 2020-03-04 | 学校法人 中村産業学園 | 相関顕微鏡 |
| CN205427436U (zh) * | 2016-03-23 | 2016-08-03 | 北京京东方光电科技有限公司 | 显示器件的对位检测设备及曝光工艺系统 |
| KR102181121B1 (ko) * | 2016-09-20 | 2020-11-20 | 주식회사 원익아이피에스 | 기판 이송 장치 및 기판 이송 장치의 제어 방법 |
| JP6787404B2 (ja) * | 2016-09-30 | 2020-11-18 | 株式会社ニコン | 移動体装置、移動方法、露光装置、露光方法、フラットパネルディスプレイの製造方法、並びにデバイス製造方法 |
| JP6981170B2 (ja) * | 2017-10-20 | 2021-12-15 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法 |
| KR102070756B1 (ko) * | 2018-03-15 | 2020-01-29 | 이노6 주식회사 | 다축 구조 스테이지 |
| CN113490884B (zh) * | 2019-02-11 | 2025-02-28 | Asml荷兰有限公司 | 具有热控制系统的光刻设备和方法 |
| US11626305B2 (en) * | 2019-06-25 | 2023-04-11 | Applied Materials, Inc. | Sensor-based correction of robot-held object |
| CN110411381B (zh) * | 2019-08-06 | 2021-07-13 | 许昌学院 | 一种适用电机定子的自动校正平整度多点检测设备 |
| JP7463525B2 (ja) * | 2020-02-06 | 2024-04-08 | エーエスエムエル ネザーランズ ビー．ブイ． | デュアルステージリソグラフィ装置を用いる方法及びリソグラフィ装置 |
| CN112835269B (zh) * | 2021-01-19 | 2024-04-12 | 上海集成电路装备材料产业创新中心有限公司 | 一种光刻装置及曝光方法 |
| JP7589803B2 (ja) * | 2021-04-09 | 2024-11-26 | 株式会社ニコン | 露光装置、デバイス製造方法、フラットパネルディスプレイの製造方法および露光方法 |
| CN118576903A (zh) * | 2024-06-07 | 2024-09-03 | 广州天力能医疗器械有限公司 | 一种仿生红外往复仪及远红外场效应生成方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1442757A (zh) | 2002-03-01 | 2003-09-17 | Asml荷兰有限公司 | 对准方法、对准基底,光刻装置和器件制造方法 |
| CN1782884A (zh) | 2004-11-29 | 2006-06-07 | Asml荷兰有限公司 | 衬底台、测量衬底位置的方法以及光刻装置 |
| TW201137531A (en) | 2009-09-30 | 2011-11-01 | Nikon Corp | Exposure apparatus and exposure method, and device manufacturing method |
Family Cites Families (110)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57117238A (en) | 1981-01-14 | 1982-07-21 | Nippon Kogaku Kk <Nikon> | Exposing and baking device for manufacturing integrated circuit with illuminometer |
| JPS58113706A (ja) | 1981-12-26 | 1983-07-06 | Nippon Kogaku Kk <Nikon> | 水平位置検出装置 |
| US4780617A (en) | 1984-08-09 | 1988-10-25 | Nippon Kogaku K.K. | Method for successive alignment of chip patterns on a substrate |
| DE4033556A1 (de) | 1990-10-22 | 1992-04-23 | Suess Kg Karl | Messanordnung fuer x,y,(phi)-koordinatentische |
| US5196745A (en) | 1991-08-16 | 1993-03-23 | Massachusetts Institute Of Technology | Magnetic positioning device |
| JPH05102287A (ja) * | 1991-10-02 | 1993-04-23 | Hitachi Ltd | 板状物搬送装置 |
| KR100300618B1 (ko) | 1992-12-25 | 2001-11-22 | 오노 시게오 | 노광방법,노광장치,및그장치를사용하는디바이스제조방법 |
| US6624433B2 (en) | 1994-02-22 | 2003-09-23 | Nikon Corporation | Method and apparatus for positioning substrate and the like |
| JPH07270122A (ja) | 1994-03-30 | 1995-10-20 | Canon Inc | 変位検出装置、該変位検出装置を備えた露光装置およびデバイスの製造方法 |
| WO1998024115A1 (en) | 1996-11-28 | 1998-06-04 | Nikon Corporation | Aligner and method for exposure |
| JPH10167470A (ja) * | 1996-12-02 | 1998-06-23 | Kiyoyuki Horii | 非接触保持方法とその装置 |
| USRE40043E1 (en) | 1997-03-10 | 2008-02-05 | Asml Netherlands B.V. | Positioning device having two object holders |
| JPH1116816A (ja) | 1997-06-25 | 1999-01-22 | Nikon Corp | 投影露光装置、該装置を用いた露光方法、及び該装置を用いた回路デバイスの製造方法 |
| KR100841147B1 (ko) | 1998-03-11 | 2008-06-24 | 가부시키가이샤 니콘 | 레이저 장치, 자외광 조사 장치 및 방법, 물체의 패턴 검출장치 및 방법 |
| JP4505989B2 (ja) | 1998-05-19 | 2010-07-21 | 株式会社ニコン | 収差測定装置並びに測定方法及び該装置を備える投影露光装置並びに該方法を用いるデバイス製造方法、露光方法 |
| WO2001035168A1 (en) | 1999-11-10 | 2001-05-17 | Massachusetts Institute Of Technology | Interference lithography utilizing phase-locked scanning beams |
| SG107560A1 (en) | 2000-02-25 | 2004-12-29 | Nikon Corp | Exposure apparatus and exposure method capable of controlling illumination distribution |
| US20020041377A1 (en) | 2000-04-25 | 2002-04-11 | Nikon Corporation | Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method |
| TW527526B (en) | 2000-08-24 | 2003-04-11 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
| US7561270B2 (en) | 2000-08-24 | 2009-07-14 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufactured thereby |
| US7289212B2 (en) | 2000-08-24 | 2007-10-30 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufacturing thereby |
| US6611316B2 (en) | 2001-02-27 | 2003-08-26 | Asml Holding N.V. | Method and system for dual reticle image exposure |
| TW529172B (en) | 2001-07-24 | 2003-04-21 | Asml Netherlands Bv | Imaging apparatus |
| KR100927560B1 (ko) | 2002-01-29 | 2009-11-23 | 가부시키가이샤 니콘 | 이미지 형성 상태 조정 시스템, 노광 방법 및 노광 장치, 그리고 프로그램 및 정보 기록 매체 |
| JP2004083180A (ja) * | 2002-08-26 | 2004-03-18 | Sharp Corp | シート状基板の搬送装置及び搬送方法 |
| JP2004101362A (ja) | 2002-09-10 | 2004-04-02 | Canon Inc | ステージ位置計測および位置決め装置 |
| JP2004140058A (ja) * | 2002-10-16 | 2004-05-13 | Hitachi Electronics Eng Co Ltd | ウエハ搬送装置およびウエハ処理装置 |
| SG10201603067VA (en) | 2003-04-11 | 2016-05-30 | Nikon Corp | Apparatus having an immersion fluid system configured to maintain immersion fluid in a gap adjacent an optical assembly |
| US7025498B2 (en) | 2003-05-30 | 2006-04-11 | Asml Holding N.V. | System and method of measuring thermal expansion |
| TWI433212B (zh) | 2003-06-19 | 2014-04-01 | 尼康股份有限公司 | An exposure apparatus, an exposure method, and an element manufacturing method |
| TWI295408B (en) | 2003-10-22 | 2008-04-01 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method, and measurement system |
| US7589822B2 (en) | 2004-02-02 | 2009-09-15 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
| US7102729B2 (en) | 2004-02-03 | 2006-09-05 | Asml Netherlands B.V. | Lithographic apparatus, measurement system, and device manufacturing method |
| US7256871B2 (en) | 2004-07-27 | 2007-08-14 | Asml Netherlands B.V. | Lithographic apparatus and method for calibrating the same |
| JP4656448B2 (ja) | 2004-09-30 | 2011-03-23 | 株式会社ニコン | 投影光学装置及び露光装置 |
| US7528931B2 (en) | 2004-12-20 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US20060139595A1 (en) | 2004-12-27 | 2006-06-29 | Asml Netherlands B.V. | Lithographic apparatus and method for determining Z position errors/variations and substrate table flatness |
| US7515281B2 (en) | 2005-04-08 | 2009-04-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7161659B2 (en) | 2005-04-08 | 2007-01-09 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
| US7405811B2 (en) | 2005-04-20 | 2008-07-29 | Asml Netherlands B.V. | Lithographic apparatus and positioning apparatus |
| US7349069B2 (en) | 2005-04-20 | 2008-03-25 | Asml Netherlands B.V. | Lithographic apparatus and positioning apparatus |
| US7348574B2 (en) | 2005-09-02 | 2008-03-25 | Asml Netherlands, B.V. | Position measurement system and lithographic apparatus |
| US7362446B2 (en) | 2005-09-15 | 2008-04-22 | Asml Netherlands B.V. | Position measurement unit, measurement system and lithographic apparatus comprising such position measurement unit |
| US7978339B2 (en) | 2005-10-04 | 2011-07-12 | Asml Netherlands B.V. | Lithographic apparatus temperature compensation |
| EP2857902B1 (en) | 2006-01-19 | 2016-04-20 | Nikon Corporation | Immersion exposure apparatus, immersion exposure method, and device fabricating method |
| CN101385120B (zh) | 2006-02-21 | 2012-09-05 | 株式会社尼康 | 测定装置及方法、处理装置及方法、图案形成装置及方法、曝光装置及方法、以及元件制造方法 |
| KR20130057496A (ko) | 2006-02-21 | 2013-05-31 | 가부시키가이샤 니콘 | 패턴 형성 장치, 마크 검출 장치, 노광 장치, 패턴 형성 방법, 노광 방법 및 디바이스 제조 방법 |
| SG170012A1 (en) | 2006-02-21 | 2011-04-29 | Nikon Corp | Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method |
| US7602489B2 (en) | 2006-02-22 | 2009-10-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7253875B1 (en) | 2006-03-03 | 2007-08-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7636165B2 (en) | 2006-03-21 | 2009-12-22 | Asml Netherlands B.V. | Displacement measurement systems lithographic apparatus and device manufacturing method |
| JP4642787B2 (ja) * | 2006-05-09 | 2011-03-02 | 東京エレクトロン株式会社 | 基板搬送装置及び縦型熱処理装置 |
| US7483120B2 (en) | 2006-05-09 | 2009-01-27 | Asml Netherlands B.V. | Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method |
| EP2071611B1 (en) | 2006-08-31 | 2019-05-01 | Nikon Corporation | Mobile body drive system and mobile body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision method |
| TWI597585B (zh) | 2006-08-31 | 2017-09-01 | Nippon Kogaku Kk | Exposure method and exposure apparatus, and device manufacturing method |
| SG10201407395SA (en) | 2006-08-31 | 2014-12-30 | Nikon Corp | Movable Body Drive Method And Movable Body Drive System, Pattern Formation Method And Apparatus, Exposure Method And Apparatus, And Device Manufacturing Method |
| SG10201407218XA (en) | 2006-09-01 | 2015-01-29 | Nippon Kogaku Kk | Movable Body Drive Method And Movable Body Drive System, Pattern Formation Method And Apparatus, Exposure Method And Apparatus, And Device Manufacturing Method |
| KR101770082B1 (ko) | 2006-09-01 | 2017-08-21 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 디바이스 제조 방법, 그리고 캘리브레이션 방법 |
| KR101360507B1 (ko) | 2006-09-29 | 2014-02-07 | 가부시키가이샤 니콘 | 이동체 시스템, 패턴 형성 장치, 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법 |
| JP4925281B2 (ja) | 2006-10-13 | 2012-04-25 | オリンパスイメージング株式会社 | 電子撮像装置 |
| US7619207B2 (en) | 2006-11-08 | 2009-11-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| WO2008056735A1 (en) | 2006-11-09 | 2008-05-15 | Nikon Corporation | Holding unit, position detecting system and exposure system, moving method, position detecting method, exposure method, adjusting method of detection system, and device producing method |
| JP4607910B2 (ja) * | 2007-01-16 | 2011-01-05 | 東京エレクトロン株式会社 | 基板搬送装置及び縦型熱処理装置 |
| US7561280B2 (en) | 2007-03-15 | 2009-07-14 | Agilent Technologies, Inc. | Displacement measurement sensor head and system having measurement sub-beams comprising zeroth order and first order diffraction components |
| KR20080088843A (ko) | 2007-03-30 | 2008-10-06 | 주식회사 신라공업 | 자동차용 벨트풀리의 제조방법 |
| US7710540B2 (en) | 2007-04-05 | 2010-05-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US8098362B2 (en) | 2007-05-30 | 2012-01-17 | Nikon Corporation | Detection device, movable body apparatus, pattern formation apparatus and pattern formation method, exposure apparatus and exposure method, and device manufacturing method |
| EP2184768B1 (en) | 2007-07-24 | 2015-09-09 | Nikon Corporation | Mobile object driving method, mobile object driving system, pattern forming method and apparatus, exposure method and apparatus and device manufacturing method |
| WO2009013905A1 (ja) | 2007-07-24 | 2009-01-29 | Nikon Corporation | 位置計測システム、露光装置、位置計測方法、露光方法及びデバイス製造方法、並びに工具及び計測方法 |
| US8194232B2 (en) | 2007-07-24 | 2012-06-05 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, position control method and position control system, and device manufacturing method |
| US8547527B2 (en) | 2007-07-24 | 2013-10-01 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and pattern formation apparatus, and device manufacturing method |
| US8867022B2 (en) | 2007-08-24 | 2014-10-21 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, and device manufacturing method |
| US8237919B2 (en) | 2007-08-24 | 2012-08-07 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method for continuous position measurement of movable body before and after switching between sensor heads |
| US8218129B2 (en) | 2007-08-24 | 2012-07-10 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, measuring method, and position measurement system |
| US8023106B2 (en) | 2007-08-24 | 2011-09-20 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
| US9304412B2 (en) | 2007-08-24 | 2016-04-05 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method |
| US20090051895A1 (en) | 2007-08-24 | 2009-02-26 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, device manufacturing method, and processing system |
| KR20100057758A (ko) | 2007-08-24 | 2010-06-01 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 그리고 패턴 형성 방법 및 패턴 형성 장치 |
| US9013681B2 (en) | 2007-11-06 | 2015-04-21 | Nikon Corporation | Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method |
| KR101470671B1 (ko) | 2007-11-07 | 2014-12-08 | 가부시키가이샤 니콘 | 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법 |
| US9256140B2 (en) | 2007-11-07 | 2016-02-09 | Nikon Corporation | Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method with measurement device to measure movable body in Z direction |
| US8665455B2 (en) | 2007-11-08 | 2014-03-04 | Nikon Corporation | Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method |
| US8422015B2 (en) | 2007-11-09 | 2013-04-16 | Nikon Corporation | Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method |
| US8711327B2 (en) | 2007-12-14 | 2014-04-29 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| US8115906B2 (en) | 2007-12-14 | 2012-02-14 | Nikon Corporation | Movable body system, pattern formation apparatus, exposure apparatus and measurement device, and device manufacturing method |
| US8237916B2 (en) | 2007-12-28 | 2012-08-07 | Nikon Corporation | Movable body drive system, pattern formation apparatus, exposure apparatus and exposure method, and device manufacturing method |
| US8274639B2 (en) | 2008-04-30 | 2012-09-25 | Nikon Corporation | Stage device, pattern formation apparatus, exposure apparatus, stage drive method, exposure method, and device manufacturing method |
| US8817236B2 (en) | 2008-05-13 | 2014-08-26 | Nikon Corporation | Movable body system, movable body drive method, pattern formation apparatus, pattern formation method, exposure apparatus, exposure method, and device manufacturing method |
| US8786829B2 (en) | 2008-05-13 | 2014-07-22 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| US8228482B2 (en) | 2008-05-13 | 2012-07-24 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| US8994923B2 (en) | 2008-09-22 | 2015-03-31 | Nikon Corporation | Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method |
| US8325325B2 (en) | 2008-09-22 | 2012-12-04 | Nikon Corporation | Movable body apparatus, movable body drive method, exposure apparatus, exposure method, and device manufacturing method |
| US8508735B2 (en) | 2008-09-22 | 2013-08-13 | Nikon Corporation | Movable body apparatus, movable body drive method, exposure apparatus, exposure method, and device manufacturing method |
| US8599359B2 (en) | 2008-12-19 | 2013-12-03 | Nikon Corporation | Exposure apparatus, exposure method, device manufacturing method, and carrier method |
| US8902402B2 (en) * | 2008-12-19 | 2014-12-02 | Nikon Corporation | Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method |
| US8773635B2 (en) * | 2008-12-19 | 2014-07-08 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| US8760629B2 (en) | 2008-12-19 | 2014-06-24 | Nikon Corporation | Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body |
| KR101056795B1 (ko) | 2008-12-23 | 2011-08-12 | 하지성 | 한지(韓紙)를 이용한 장례용 관(棺)의 제조방법 |
| KR101052544B1 (ko) | 2008-12-23 | 2011-07-29 | 삼성중공업 주식회사 | 영상 필링 방법 및 그 영상 변환 장치 |
| US8553204B2 (en) | 2009-05-20 | 2013-10-08 | Nikon Corporation | Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method |
| US8970820B2 (en) * | 2009-05-20 | 2015-03-03 | Nikon Corporation | Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method |
| US8792084B2 (en) | 2009-05-20 | 2014-07-29 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| NL2005013A (en) * | 2009-07-31 | 2011-02-02 | Asml Netherlands Bv | Positioning system, lithographic apparatus and method. |
| US8488109B2 (en) | 2009-08-25 | 2013-07-16 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
| US8514395B2 (en) | 2009-08-25 | 2013-08-20 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
| US8493547B2 (en) | 2009-08-25 | 2013-07-23 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| JP5507392B2 (ja) * | 2009-09-11 | 2014-05-28 | エーエスエムエル ネザーランズ ビー．ブイ． | シャッター部材、リソグラフィ装置及びデバイス製造方法 |
| US20110085150A1 (en) * | 2009-09-30 | 2011-04-14 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| US8488106B2 (en) | 2009-12-28 | 2013-07-16 | Nikon Corporation | Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method |
| NL2006118A (en) | 2010-03-03 | 2011-09-06 | Asml Netherlands Bv | Lithographic apparatus and method for measuring a position. |
-
2012
- 2012-12-26 US US13/727,286 patent/US9207549B2/en active Active
- 2012-12-28 WO PCT/JP2012/084310 patent/WO2013100202A1/en not_active Ceased
- 2012-12-28 JP JP2014520850A patent/JP6016200B2/ja active Active
- 2012-12-28 KR KR1020147011607A patent/KR101698249B1/ko active Active
- 2012-12-28 TW TW101150758A patent/TWI639057B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1442757A (zh) | 2002-03-01 | 2003-09-17 | Asml荷兰有限公司 | 对准方法、对准基底,光刻装置和器件制造方法 |
| CN1782884A (zh) | 2004-11-29 | 2006-06-07 | Asml荷兰有限公司 | 衬底台、测量衬底位置的方法以及光刻装置 |
| TW201137531A (en) | 2009-09-30 | 2011-11-01 | Nikon Corp | Exposure apparatus and exposure method, and device manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140107186A (ko) | 2014-09-04 |
| TW201341966A (zh) | 2013-10-16 |
| JP2015505154A (ja) | 2015-02-16 |
| US9207549B2 (en) | 2015-12-08 |
| US20130183623A1 (en) | 2013-07-18 |
| WO2013100202A1 (en) | 2013-07-04 |
| KR101698249B1 (ko) | 2017-02-01 |
| JP6016200B2 (ja) | 2016-10-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI639057B (zh) | 曝光裝置及曝光方法、以及元件製造方法 | |
| TWI592764B (zh) | 搬入方法、曝光方法、搬送系統及曝光裝置、以及元件製造方法 | |
| TWI624734B (zh) | 曝光裝置及曝光方法、以及元件製造方法 | |
| TWI590005B (zh) | Exposure method and exposure apparatus, and device manufacturing method | |
| TWI609252B (zh) | Moving body driving system and moving body driving method, pattern forming apparatus and method, exposure apparatus and method, element manufacturing method, and determination method | |
| HK1234167A1 (en) | Carrier method, exposure method, exposure apparatus, and device manufacturing method | |
| HK1234163A1 (en) | Exposure method, exposure apparatus, and device manufacturing method | |
| HK1196165B (en) | Apparatus for loading a flexible substrate and a lithography apparatus | |
| HK1196165A (en) | Apparatus for loading a flexible substrate and a lithography apparatus | |
| HK1234163B (zh) | 曝光方法、曝光装置、及元件制造方法 |