TWI632639B - Substrate holding device, deposition apparatus and substrate holding method - Google Patents

Abstract

The invention provides a substrate holding device, which can ensure the adhesion between the mask and the substrate.

The substrate holding device (30) includes a shield plate (311), an intermediate plate (32), a holding plate (33), and a pressing mechanism (34). The shield plate (311) is made of magnetic material. The intermediate plate (32) has a first surface facing the mask plate (311) and a second surface opposite to the first surface, and the first surface is configured to be arranged on the mask plate The substrate (W) on (311) contacts. The holding plate (33) supports the intermediate plate (32) so as to be relatively movable in the axial direction orthogonal to the shield plate (311), and has a structure capable of being magnetically attracted through the intermediate plate (32) and the substrate (W) The magnet (331) of the shield plate (311). The pressing mechanism (34) is arranged to face the second face, and is configured to be able to press at least a part of the second face along the axial direction.

Description

Substrate holding device, film forming device and substrate holding method

The present invention relates to a substrate holding device that uses a magnet to hold a film forming mask and a substrate, a film forming device provided with the substrate holding device, and a substrate holding method.

As a technique for forming a thin film in a predetermined area of a substrate, a method of using a mask for film formation is known. For example, in Patent Document 1, an inline type film forming apparatus has been described in which a substrate having a plate-like mask disposed on a film forming surface is transferred to a film forming chamber while being deposited The vapor of the vapor deposition material generated by the source is vapor deposited on the film-forming surface.

In such a film forming apparatus, in order to prevent the vapor of the vapor deposition material from entering the gap between the mask and the substrate, it is necessary to ensure the adhesion between the mask and the substrate. For this reason, there is known a method of sandwiching a substrate and a substrate holder that holds the substrate flat between a mask and a magnet plate that magnetically attracts the mask (for example, refer to Patent Document 2) ).

On the other hand, with the recent enlargement of the substrate, the thickness of the substrate holder required to obtain flatness has increased. As a result, there is a possibility that the magnetic force of the magnet plate to the mask may be reduced, and the substrate and the There is a risk of reduced adhesion. In order to eliminate this problem, Patent Document 2 has already described the following: on the evaporation source side of the mask, a mask pressing mechanism that presses the mask against the substrate is provided to closely contact the mask to the substrate.

[Prior Technical Literature]

[Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 2010-118157.

Patent Document 2: Japanese Patent Application Publication No. 2013-247040.

However, in the structure described in Patent Document 2, since the mechanism portion constituting the mask pressing mechanism is provided on the evaporation source side of the mask, there is a fear that the mechanism portion may be coated and thus may cause malfunction. In addition, in the case where the aperture ratio of the mask is large or the interval between the openings is narrow, it is difficult to arrange the above-mentioned mechanism portion without shielding the opening.

In view of the above circumstances, an object of the present invention is to provide a substrate holding apparatus, a film forming apparatus, and a substrate holding method that can ensure the adhesion between the mask and the substrate without providing a mechanism portion on the evaporation source side of the mask.

In order to achieve the above object, a substrate holding device according to an aspect of the present invention includes a mask plate, an intermediate plate, a holding plate, and a pressing mechanism.

The mask plate is made of magnetic material.

The intermediate plate has a first surface facing the mask plate and a second surface opposite to the first surface, and the first surface is configured to be able to be arranged on the mask plate. Substrate contact.

The holding plate supports the intermediate plate so as to be relatively movable in the axial direction orthogonal to the shield plate. The holding plate has a magnet configured to magnetically attract the shield plate through the intermediate plate and the substrate.

The pressing mechanism is disposed facing the second face. The pressing mechanism is configured to be able to press at least a part of the second surface along the axial direction.

In the above substrate holding device, the intermediate plate has a function of maintaining the planar state of the substrate by contacting the non-film-forming surface of the substrate facing the mask plate. On the other hand, there is a possibility that the larger the intermediate plate, or the smaller the thickness of the intermediate plate, the flatness of the intermediate plate itself may be caused by insufficient strength of the intermediate plate or heat input during film formation (heat input) The deformation may be lowered. Therefore, the substrate holding device includes a pressing mechanism that presses at least a part of the intermediate plate toward the shield plate side. Thereby, the flatness of the intermediate plate can be improved, and as a result, the flatness of the substrate contacting the intermediate plate can also be maintained, and excellent adhesion with the intermediate plate can be ensured. In addition, since the intermediate plate can be thinned, it is possible to ensure stable adhesion between the mask plate and the substrate regardless of the size of the substrate.

In the above substrate holding device, since the pressing mechanism is arranged facing the second side of the intermediate plate, it is possible to achieve the close contact between the shield plate and the substrate without providing any mechanism portion on the evaporation source side of the shield plate. Therefore, the adhesion effect between the mask plate and the substrate can be stably maintained without depending on the aperture ratio of the mask plate or the arrangement of the mask openings.

The above-mentioned axis is typically an axis parallel to the direction of gravity. In this case, since the pressing mechanism can prevent the flatness from being reduced due to the deflection and deformation of the substrate or the intermediate plate, the desired film forming accuracy can be stably obtained.

The pressing mechanism is typically provided on the holding plate. By disposing the pressing mechanism on the holding plate, the device configuration can be simplified, and the desired position of the intermediate plate can be stably pressed.

The pressing mechanism may include a plurality of pressing units configured to be able to respectively press a plurality of locations on the second surface. By being able to press a plurality of positions on the middle plate in this way, it becomes possible to easily improve the flatness of the middle plate. The pressing position of the intermediate plate is not particularly limited, and typically the central portion and / or the peripheral portion of the intermediate plate (second surface) may be mentioned.

The intermediate plate may be configured to be movable in the axial direction between the contact position and the holding position. The contact position is set to the first At least a part of the surface contacts the substrate and the relative distance from the holding plate is a first distance, the holding position is set to a relative distance from the holding plate at a second distance smaller than the first distance position. In this case, the pressing mechanism presses the second surface along the axial direction during the movement of the intermediate plate from the contact position toward the holding position.

According to the above configuration, in a state where the first surface of the intermediate plate has contacted the substrate, the second surface can be pressed by the pressing mechanism while bringing the magnet close to the second surface of the intermediate plate. Therefore, the positional deviation of the substrate from the mask plate does not occur, and the substrate can be in close contact with the mask plate with high flatness.

The pressing unit includes, for example, a pressing member and an elastic member. The pressing member is arranged to face the second face. The elastic member is disposed between the pressing member and the second surface, and is elastically deformable toward the axial direction.

Thereby, since a desired pressing force can be stably applied to a plurality of positions on the intermediate plate, the intermediate plate and the substrate can be maintained at the intended flatness.

The constituent material of the intermediate plate is not particularly limited, and may be a magnetic material or a non-magnetic material. When the intermediate plate is made of a magnetic material, a magnetic circuit through which the magnetic field from the magnet passes is formed, so that the magnetic attraction force to the shield plate can be improved. On the other hand, in the case where the intermediate plate is composed of a non-magnetic material, the magnetic When the substrate is held by iron, the holding plate is separated from the shield plate with the intermediate plate in contact with the substrate.

A film-forming apparatus according to an aspect of the present invention includes a film-forming chamber, a film-forming source, a shield plate, an intermediate plate, a holding plate, and a pressing mechanism.

The film forming source is arranged in the film forming chamber.

The mask plate is arranged to face the film-forming source, and is made of a magnetic material.

The intermediate plate has a first surface facing the mask plate and a second surface opposite to the first surface, and the first surface is configured to be able to be arranged on the mask plate. Substrate contact.

The holding plate supports the intermediate plate so as to be relatively movable in the axial direction orthogonal to the shield plate. The holding plate has a magnet configured to magnetically attract the shield plate through the intermediate plate and the substrate.

The pressing mechanism is arranged to face the second face, and is configured to be able to press at least a part of the second face along the axial direction.

A substrate holding method according to an aspect of the present invention includes the step of disposing a substrate on a mask plate made of a magnetic material.

The intermediate plate is brought into contact with the above substrate.

At least a part of the intermediate plate is pressed toward the shield plate by the pressing mechanism.

A holding plate having a magnet that magnetically attracts the shield plate is disposed above the intermediate plate, thereby integrally holding the intermediate plate, the substrate, and the top Describe the mask plate.

According to the present invention, the adhesion between the mask and the substrate can be ensured.

10‧‧‧ film-forming room

20‧‧‧Evaporation source

30‧‧‧Substrate holding device

31‧‧‧Mask member

32‧‧‧Middle board

32a‧‧‧Lower surface (first surface)

32b‧‧‧Upper surface (second surface)

33‧‧‧Retaining plate

34‧‧‧Pressing mechanism

35、37‧‧‧Press unit

36‧‧‧Support unit

40‧‧‧Control Department

100‧‧‧film forming device

311‧‧‧Mask

312‧‧‧Frame Department

312a‧‧‧ Avoidance Department

321‧‧‧Shaft

321h‧‧‧Head

331‧‧‧ magnet

332‧‧‧Through hole

351‧‧‧Pressing piece

352‧‧‧bolt member

353‧‧‧Support

354‧‧‧Nut member

355‧‧‧Elastic member

G1, G2, G3 ‧‧‧ distance (gap)

W‧‧‧Substrate

FIG. 1 is a schematic cross-sectional view showing a film forming apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic enlarged view of the substrate holding device in the film forming apparatus, and shows a state before holding the substrate.

FIG. 3 is a schematic enlarged view of the substrate holding device in the above film forming apparatus, and shows a state after holding the substrate.

FIG. 4 is a side view schematically showing the positional relationship of the mask plate, the substrate, the intermediate plate, and the magnet (holding plate) in the substrate holding device.

FIG. 5 is a schematic side view illustrating the holding state of the substrate when the intermediate plate has been deformed.

6 is a schematic side view illustrating the function of the above substrate holding device.

7 is a schematic side cross-sectional view showing one configuration example of a pressing mechanism in the substrate holding device, and shows a non-holding state of the substrate.

FIG. 8 is a schematic side cross-sectional view showing one configuration example of a pressing mechanism in the substrate holding device, and shows a state immediately before holding the substrate.

FIG. 9 is a schematic side cross-sectional view showing a configuration example of a pressing mechanism in the substrate holding device, and shows a state after holding the substrate.

Fig. 10 shows the pressing of the middle plate by the above pressing mechanism A schematic plan view of an example of a part.

Fig. 11 is a schematic plan view of an intermediate plate showing a modification of the pressing mechanism.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic cross-sectional view showing a film forming apparatus 100 according to an embodiment of the present invention. In the figure, the X-axis, Y-axis, and Z-axis systems show three orthogonal directions, the X-axis and Y-axis systems show the horizontal direction, and the Z-axis system shows the height direction (even in the following figures) .

[Overall configuration of film forming apparatus]

The film forming apparatus 100 of this embodiment is configured as a vacuum evaporation apparatus, and includes a film forming chamber 10, an evaporation source 20 (film forming source), and a substrate holding device 30.

The film forming chamber 10 is composed of a vacuum chamber. That is, a vacuum pump (not shown) is connected to the film forming chamber 10 and is configured to allow the inside of the film forming chamber 10 to be exhausted and maintained in a predetermined low-pressure atmosphere.

The film forming apparatus 100 is, for example, a cluster type vacuum film forming apparatus in which a plurality of processing chambers including the film forming chamber 10 are arranged through a gate valve around a transfer chamber. In this case, as shown in FIG. 1, it is possible to pass through a substrate conveying machine (not shown) provided in the conveying chamber The robot transports the substrate W from the transfer chamber toward the film formation chamber 10 or from the film formation chamber 10 toward the transfer chamber.

The evaporation source 20 is used to generate vapor of the evaporation material (or evaporation material), and can use various types of evaporation sources such as resistance heating type, induction heating type, and electron beam heating type. As the vapor deposition material system, metal compound materials such as metal materials, metal oxides or metal sulfides, synthetic resin materials, materials for organic EL (electroluminescence), and the like can be used.

In addition, the evaporation source 20 may also include a shutter that can prevent vapor from reaching the substrate W held by the substrate holding device 30. In addition, the evaporation source 20 may be fixed to the bottom of the film forming chamber 10, or may be configured to be relatively movable in the horizontal direction with respect to the bottom of the film forming chamber 10 and the substrate holding device 30.

[Substrate holding device]

The substrate holding device 30 is arranged at a position directly above the evaporation source 20 and is configured to be able to hold the substrate W to be formed in a position facing the evaporation source 20. The substrate holding device 30 includes a cover member 31, an intermediate plate 32, a holding plate 33, and a pressing mechanism 34.

2 and 3 are schematic enlarged views of the substrate holding device 30, wherein FIG. 2 shows the state before holding the substrate W, and FIG. 3 shows the state after holding the substrate W. FIG.

The shield member 31 is arranged to face the evaporation source 20. The mask member 31 is fixed to the inside of the film forming chamber 10 through a fixing portion (not shown).

The mask member 31 includes: a mask plate 311 facing the film formation of the substrate W; and a frame portion 312 supporting the periphery of the mask plate 311.

The mask plate 311 is composed of a thin plate composed of a magnetic material having a prescribed opening pattern. The constituent material of the mask plate 311 is not particularly limited. Typically, Fe (iron), Co (cobalt), Ni (nickel), or alloys thereof having high permeability characteristics (soft magnetic characteristics) can be used. Strong magnetic material. In addition, in order to suppress the thermal deformation of the mask plate 311 caused by the heat input from the film forming source (evaporation source 20) during film formation, iron-nickel alloy (ivar) having a small thermal expansion coefficient or the like may be used. The alloy is used as a constituent material of the shield plate 311. The mask plate 311 has a size that can cover the film forming surface of the substrate W. The size of the substrate W is not particularly limited. In the present embodiment, a rectangular glass substrate (for example, 680 mm to 1200 mm in length and 730 mm to 1300 mm in width) of the fourth to fifth generations (G4 to G5) is used.

The frame portion 312 is fixed to the above-mentioned fixing portion for holding the shield plate 311 in a horizontal posture. Although the frame portion 312 may be composed of a magnetic material in the same manner as the shield plate 311, it is not limited to this, and may be composed of a non-magnetic member.

The intermediate plate 32 is arranged above the mask member 31 and is composed of a rectangular plate material having a predetermined thickness greater than that of the substrate W. In this embodiment, the intermediate plate 32 is made of non-magnetic material such as austenitic stainless steel, aluminum, or copper. The intermediate plate 32 has a lower surface 32a (first surface) facing the mask plate 311; and an upper surface 32b (second surface) on the opposite side. The lower surface 32a of the intermediate plate 32 is configured to be able to contact the back surface (non-evaporated surface) of the substrate W opposed to the mask plate 311 when the substrate is held (FIG. 3).

A circulation channel for cooling water may be formed inside the intermediate plate 32. With this, it is possible to suppress an excessive increase in the temperature of the substrate W during film formation, and it is possible to cool the substrate W to a predetermined temperature or lower.

The holding plate 33 is arranged above the intermediate plate 32 and is supported so as to be able to relatively move the intermediate plate 32 in the axial direction (Z-axis direction) orthogonal to the shield plate 31. The holding plate 33 includes a magnet 331 configured to be able to magnetically attract the shield plate 311 through the intermediate plate 32 and the substrate W. The magnet 331 is composed of a plate-shaped permanent magnet arranged on the lower surface of the holding plate 33 and larger than the substrate W.

The holding plate 33 is configured to be relatively movable in the Z-axis direction by a lifting mechanism (not shown). The holding plate 33 takes a position away from the shield plate 311 (ascending position) as shown in FIG. 2 in the state before holding the substrate W, and takes a position as shown in FIG. 3 when holding the substrate W The position where the mask plate 311 is adjacent (a lowered position). As described later, The intermediate plate 32 is configured such that its lower surface 32a is separated from the mask plate 311 by a predetermined distance in the ascending position, and its lower surface 32a is in contact with the mask plate 311 (or the substrate W) in the descending position.

The pressing mechanism 34 has a plurality of pressing units 35 configured to press at least a part of the upper surface 32b of the intermediate plate 32 in the Z-axis direction. As will be described later, the plurality of pressing units 35 are respectively arranged on the holding plate 33 so as to face the upper surface 32b of the intermediate plate 32.

The pressing mechanism 34 is used to prevent the gap between the base plate W and the intermediate plate 32 due to the deflection or deformation of the intermediate plate 32, and has the following function: when the holding plate 33 has reached the lowered position, the specified pressure is used to By pressing the upper surface of the intermediate plate 32 that has been in contact with the non-evaporated surface of the substrate W, the shape of the intermediate plate 32 is corrected to be flat.

4 is a side view schematically showing the positional relationship of the mask plate 311, the substrate W, the intermediate plate 32, and the magnet 331 (holding plate 33). When holding the substrate W, the holding plate 33 moves toward the lowered position to make the intermediate plate 32 contact the non-evaporated surface of the substrate W, and the magnet 331 magnetically attracts the mask plate 311 and the intermediate plate 32 and the mask plate The substrate W is sandwiched between 311.

At this time, as shown in FIG. 5, when a gap is generated between the substrate W and the intermediate plate 32 due to the deformation of the intermediate plate 32, even when the holding plate 33 has moved to the lowered position, that is, the substrate is held In the state, the mask plate 311 The distance between the magnet 331 and the magnet 331 will still increase, and it will attract the situation that the magnetic force of the magnet 331 required for the shield plate 311 to be in close contact with the substrate W is insufficient. Therefore, in this embodiment, as shown in FIG. 6, the holding plate 33 has been moved to the lowered position, and at least a part of the upper surface 32 b of the intermediate plate 32 is directed toward the substrate W (mask plate 311 ) Side press, thereby reducing the amount of deformation of the intermediate plate 32, and thereby maintaining the flatness of the intermediate plate 32.

The plurality of pressing units 35 are configured to be able to locally press the upper surface of the intermediate plate 32, respectively. Since the pressing mechanism 34 includes a plurality of pressing units 35, the flatness of the intermediate plate 32 can be easily improved. The pressing position of the intermediate plate 32 (the position where the pressing unit 35 is arranged) is not particularly limited, and typically the central portion, the peripheral portion, or both of the intermediate plate 32 may be mentioned.

The plurality of pressing units 35 typically have the same structure. 7 to 9 are schematic side sectional views showing the structure of the pressing mechanism 35, wherein FIG. 7 shows the state before holding the substrate W, FIG. 8 shows the state before holding the substrate W, and then FIG. 9 shows the holding substrate W after status.

Here, FIG. 7 shows a state in which the substrate W and the holding plate 33 start to descend from the rising position of the holding plate 33 shown in FIG. 2, and the substrate W has been placed on the upper surface of the mask plate 311, and the intermediate plate is not The state of contact with the substrate W.

In addition, in order to easily understand the function of the pressing unit 35, in FIGS. 7 and 8, the intermediate plate 32 is depicted in a slightly deformed state (a state in which deflection has occurred), and the substrate shown in FIG. 9 W's hold state The state where the deflection of the intermediate plate 32 has been corrected (planar state) is depicted.

The upper surface 32b of the intermediate plate 32 is provided with a plurality of shaft portions 321 extending in the Z-axis direction, and the holding plate 33 and the magnet 331 are provided with a plurality of through holes 332 corresponding to the positions of the shaft portions 321. The plurality of shaft portions 321 respectively pass through the plurality of through holes 332, and a head portion 321h that can abut on the periphery of the opening of the through hole 332 on the side of the holding plate 33 side is provided at the upper end thereof.

Each shaft portion 321 is composed of the same length, and when suspended by the weight of the intermediate plate 32 (for example, when the holding plate 33 is in the raised position), the upper surface 32b of the intermediate plate 32 and the magnet are set The length of the distance G1 is formed between the lower surfaces of 331. Thereby, the intermediate plate 32 can be relatively moved so as to support the holding plate 33 in the Z-axis direction up to the longest distance G1.

In this embodiment, the head portion 321h of the shaft portion 321 is formed in an inverted conical trapezoid shape. Thereby, in the suspended state of the intermediate plate 32 shown in FIG. 7, since the axis of each shaft portion 321 and the axis of each through hole 332 can be aligned, the intermediate plate 32 and the holding plate 33 can be stably maintained Hanging posture. In addition, in order to further improve the above-mentioned efficiency, the opening portion of each through hole 332 on the holding plate 33 side may be formed into a conical conical shape (mortar shape) corresponding to the shape of the head portion 321h as shown.

On the other hand, the plurality of pressing units 35 are provided on the holding plate 33 and are respectively arranged at the penetration positions of the plurality of shaft portions 321. Each pressing unit 35 includes a pressing member 351 arranged at a position directly above the head 321h of the shaft portion 321, and an elastic member 355 arranged between the pressing member 351 and the upper surface 32b of the intermediate plate 32.

The pressing member 351 is arranged on the head portion 321h of the shaft portion 321 so as to face the Z-axis direction. The pressing member 351 is made of, for example, a circular plate material, and a bolt member 352 extending in the Z-axis direction is fixed to the center portion thereof. The bolt member 352 penetrates the top of the support portion 353 provided on the upper surface of the holding plate 33 so as to surround the head 321h of the shaft portion 321, and is screwed to the nut member 354 fixed on the upper surface of the support portion 353 . Therefore, by rotating the bolt member 352 and the nut member 354 around the axis, the relative distance between the pressing member 351 and the head 321h of the shaft portion 321 can be adjusted.

The elastic member 355 is elastically deformable in the Z-axis direction, and is provided on the upper surface of the head portion 321h of the shaft portion 321. Although the elastic member 355 is typically constituted by a coil spring, it is not limited to this, and may be constituted by an elastic material such as rubber or elastomer. In this embodiment, when the holding plate 33 is located at the first position, a distance G2 is formed between the upper surface of the elastic member 355 and the lower surface of the pressing member 351. The distance G2 is set to a smaller value than the distance G1. The value of the distance G2 can also be zero. In addition, the elastic member 355 may be provided not on the upper surface of the head 321h of the shaft portion 321 but on the pressing member 351 Under the surface.

In this embodiment, the intermediate plate 32 has, with respect to the holding plate 33 (magnet 331), a first position shown in FIG. 7; a second position (contact position) shown in FIG. 8; and a first position shown in FIG. Three positions (hold position). The intermediate plate 32 is configured to be movable between the first position and the third position along the Z-axis direction via the second position.

In the above-mentioned first position, the intermediate plate 32 is suspended by the holding plate 33, the lower surface 32a of the intermediate plate 32 does not contact the substrate W, and the upper surface 32b of the intermediate plate 32 is held at a relative distance from the gap G1 The plate 33 (magnet 331) is opposed.

In the above-mentioned second position, the lower surface 32a of the intermediate plate 32 contacts the substrate W, the holding plate 33 is lowered until the pressing member 351 contacts the upper surface of the elastic member 355, and the upper surface 32b of the intermediate plate 32 is separated by a gap (G1 -G2) opposite to the holding plate 33 (magnet 331) at a relative distance (first distance).

In the above-mentioned third position, at least a part of the lower surface 32a of the intermediate plate 32 contacts the substrate W, the holding plate 33 causes the elastic member 355 to compress and deform while further lowering by a specified amount, and the upper surface 32b of the intermediate plate 32 is separated The relative distance (second distance) of the gap G3, which is smaller than the gap (G1-G2), faces the holding plate 33 (magnet 331).

Since the pressing unit 35 is configured as described above, the pressing mechanism 34 can move from the second position (contact position) toward the third position on the intermediate plate 32 (Holding position) While moving, the upper surface 32b of the intermediate plate 32 is pressed along the Z-axis direction.

The lowering position of the holding plate 33 is set at a position away from the mask plate 311 by a specified height. In this case, the pressing force of the intermediate plate 32 by the pressing mechanism 34 (pressing unit 35) can be set by the distance G2. Therefore, the aforementioned pressing force can be easily adjusted by changing the distance G2.

As shown in FIGS. 2 and 3, the substrate holding device 30 further includes a support unit 36 for supporting the substrate W transported into the film forming chamber 10 between the mask plate 311 and the intermediate plate 32. The supporting unit 36 includes, for example, a plurality of hooks for supporting the peripheral portion of the lower surface of the substrate W. The support unit 36 is configured to be able to move up and down between a substrate receiving position (FIG. 2) of a substrate transfer device (not shown) and a substrate mounting position (FIG. 3) where the substrate is placed on the shield plate 311. In addition, the support unit 36 is configured to be movable in the horizontal direction so that the substrate W can be aligned with the mask plate 311.

The film forming apparatus 100 further includes: an evaporation source 20; a substrate holding device 30; and a control unit 40 that controls operations of the support unit 36 and the like. The control unit 40 is typically constituted by a computer, and controls the operation of each unit by executing a specified program.

[Operation of film forming apparatus]

Next, a typical operation of the film forming apparatus 100 of this embodiment configured as described above will be described.

The substrate W transported to the film forming chamber 10 through a gate valve (not shown) has the film forming surface facing downward, and is supported by the support unit 36 that has been waiting at the substrate receiving position. At this time, the holding plate 33 is moved to the raised position as shown in FIG. 2, and the intermediate plate 32 is suspended from the holding plate 33 by its own weight. The substrate W is arranged between the intermediate plate 32 and the shield plate 311 by the support unit 36. After that, the alignment of the substrate W to the mask plate 311 in the horizontal direction is performed.

After the alignment of the substrate W, the support unit 36 is lowered toward the substrate mounting position, and the substrate W is mounted on the upper surface of the shield plate 311. In addition, a plurality of escape portions (recesses) 312a are provided on the upper surface of the frame portion 312 of the mask member 31 to avoid collision with the support unit 36 descending toward the substrate placement position.

After that, the holding plate 33 moves from the raised position shown in FIG. 2 toward the lowered position shown in FIG. 3. Thereby, the lower surface 32a of the intermediate plate 32 will contact the non-evaporated surface (non-film-forming surface) of the substrate W, and by the relative movement of the holding plate 33 to the intermediate plate 22, the magnet 331 will be adjacent to the intermediate plate 32 Upper surface 32b. At this time, the magnet 331 stops with a slight gap (G3) to the upper surface 32b of the intermediate plate.

On the other hand, the plural portions of the upper surface 32b of the intermediate plate 32 are partially pressed from the pressing units 35 toward the substrate W and the shield plate 311 in the Z-axis direction until the first The position moves to the third position (holding position) shown in FIG. 9 via the second position (contact position) shown in FIG. 8. In the present embodiment, the intermediate plate 32 is pressed toward the mask plate 311 by each pressing unit 35 with a pressing amount corresponding to a distance of (G1-G2-G3). At this time, when the intermediate plate 32 has been flexed or deformed, the deflection or deformation is corrected to be flat, so the flatness of the intermediate plate 32 can be improved (FIG. 9). Thereby, since the contact area between the lower surface 32a of the intermediate plate 32 and the substrate W can be increased, the relative distance between the magnet 331 and the shield plate 311 also becomes shorter, and the shield plate 311 caused by the magnet 331 can be increased As a result of the magnetic attraction force, the adhesion between the substrate W and the mask plate 311 can be improved.

As described above, the intermediate plate 32, the substrate W, and the shield plate 311 can be kept integrated. After that, the film formation process of the substrate W can be performed. According to the present embodiment, since the substrate holding device 30 can ensure the adhesion between the substrate W and the mask plate 311, the gap between the substrate W and the mask plate 311 can be formed to be extremely small, and thereby the evaporation material can be prevented Went in from this gap.

In addition, the flatness of the intermediate plate 32 is improved by the pressing unit 35, and the flatness of the substrate W imitating the lower surface 32a of the intermediate plate 32 can also be ensured. As a result, a high-precision mask forming process can be realized on the film forming surface of the substrate W. Furthermore, by reciprocating the evaporation source 20 in the horizontal direction, By performing the film forming process, the in-plane uniformity of the film forming process can be improved over the entire film forming surface of the substrate W.

After the film formation process is completed, the substrate holding device 30 moves the holding plate 33 from the lowered position shown in FIG. 3 to the raised position shown in FIG. 2. At this time, until the holding plate 33 moves a specified distance (equivalent to the distance of G1-G3), the substrate W can be kept pressed by the pressing force of the pressing unit 35 and the weight of the intermediate unit itself. The state of the cover plate 311. This prevents the substrate W from shifting the position of the mask plate 311, so that the vapor deposition pattern formed on the film formation surface can be prevented from being damaged at the mask opening. In addition, since the intermediate plate 32 is made of a non-magnetic material, the magnet 331 can easily pull the shield plate 311 away.

After the holding plate 33 moves to the raised position, the support unit 36 will rise toward the substrate receiving position (FIG. 2). Then, the substrate W after the film formation is carried out toward the outside of the film forming chamber 10 through a substrate conveying device (not shown). After that, the new substrate W to be film-formed is transported toward the support unit 36, and the substrate W is held and film-formed by the same operation as described above.

As described above, the intermediate plate 32 has a function of maintaining the planar state of the substrate W by contacting the non-film-forming surface of the substrate W facing the mask plate 311. On the other hand, the larger the intermediate plate 32 or the smaller the thickness of the intermediate plate 32, the lower the flatness of the intermediate plate 32 itself. Therefore, the substrate holding device 30 of this embodiment includes: Part of the pressing mechanism 34 that is pressed toward the mask plate 311 side. Thereby, the flatness of the intermediate plate 32 can be improved, and as a result, the flatness of the substrate contacting the intermediate plate 32 can also be maintained, and excellent adhesion to the mask plate 311 can be ensured. In addition, since the intermediate plate 32 can be thinned, it is possible to ensure a stable adhesion force between the mask plate 311 and the substrate W regardless of the substrate size.

In addition, in the substrate holding device 30 of this embodiment, since the pressing mechanism 34 (pressing unit 35) is arranged to face the upper surface 32b of the intermediate plate 32, it is not necessary to provide any mechanism on the evaporation source 20 side The mask plate 311 is in close contact with the substrate W. Therefore, the adhesion effect between the mask plate 311 and the substrate W can be stably maintained without depending on the aperture ratio of the mask plate 311 or the arrangement of the mask openings.

In addition, since the pressing mechanism 34 is provided on the holding plate 33, the device configuration can be simplified, and the desired position of the intermediate plate 32 can be stably pressed.

Furthermore, in the substrate holding device 30 of the present embodiment, the intermediate plate 32 can be pressed by the pressing mechanism 34 in the direction of gravity. Thereby, the weight of the intermediate plate 32 can also be used to prevent the flatness from being reduced due to the flexural deformation of the substrate W or the intermediate plate 32, so that the desired film forming accuracy can be stably obtained.

Although the embodiments of the present invention have been described above, The present invention is not limited to the above-mentioned embodiment, and of course various changes can be applied.

For example, in the above embodiments, the vacuum evaporation apparatus has been described as an example of the film forming apparatus, but it is not limited to this, and the present invention can also be applied to other film forming such as a sputtering device (sputter device) Device. In this case, the sputtering cathode holding the sputtering target is configured as a film forming source.

In addition, the plurality of pressing units 35 constituting the pressing mechanism 34 are not limited to the case where they are arranged at the central portion and / or the peripheral portion of the intermediate plate 32. As shown schematically in FIG. 10, according to the shape, size, thickness, etc. of the intermediate plate 32, in addition to the central portion, the peripheral portion, and the four corner portions of the intermediate plate 32, it can also be at these intermediate positions, etc. The pressing unit 35 is configured. The number of arrangements of the pressing unit 35 is not particularly limited. When pressing any part of the intermediate plate, at least one is sufficient, and when pressing substantially the entire area of the intermediate plate, as long as it is arranged at a narrow pitch, Press the unit. In addition, as shown in FIG. 11, a frame-shaped pressing unit 37 capable of pressing the peripheral portion of the intermediate plate 32 in batches may be used.

In the above embodiment, although the example in which the pressing mechanism 34 is provided on the holding plate 33 has been described, it is not limited to this, and may be configured independently of the holding plate 33.

Claims (8)

A substrate holding device includes: a shield plate made of a magnetic material; an intermediate plate having a first surface facing the shield plate and a second surface opposite to the first surface, and the first One surface is configured to be able to contact the substrate disposed on the mask plate; a holding plate is provided to support the intermediate plate so as to be relatively movable in the axial direction orthogonal to the mask plate, and has a structure configured to be permeable The intermediate plate and the substrate to magnetically attract the magnet of the shield plate; and the pressing mechanism, which is arranged to face the second face, and is configured to be able to press at least a part of the second face along the axial direction; The intermediate plate is configured to be capable of contacting the substrate at least a part of the first surface and having a relative distance to the holding plate at a first distance and a relative distance to the holding plate at a distance greater than the first distance Moving between the holding positions of a smaller second distance; the pressing mechanism moves during the movement of the intermediate plate from the contact position toward the holding position The axially pressing the second surface. The substrate holding device according to claim 1, wherein the pressing mechanism is provided on the holding plate. The substrate holding device according to claim 2, wherein the pressing mechanism includes a plurality of pressing units configured to be able to press a plurality of parts of the second surface, respectively. The substrate holding device according to claim 3, wherein the pressing unit includes: a pressing member disposed facing the second surface; and an elastic member disposed between the pressing member and the second surface and capable of Elastic deformation in the aforementioned axial direction. The substrate holding device according to claim 3, wherein the pressing unit is configured to be able to press the central portion and / or the peripheral portion of the second surface. The substrate holding device according to claim 1, wherein the intermediate plate is made of a non-magnetic material. A film-forming device, comprising: a film-forming chamber; a film-forming source, arranged in the film-forming chamber; a shield plate, which is arranged opposite to the film-forming source, and is composed of a magnetic material; A first surface facing the cover plate and a second surface opposite to the first surface, and the first surface is configured to be able to contact with the substrate arranged on the cover plate; The intermediate plate is supported so as to be relatively movable in the axial direction orthogonal to the shield plate, and has a magnet configured to magnetically attract the shield plate through the intermediate plate and the substrate; and a pressing mechanism and the second Arranged facing each other, and configured to be able to press at least a portion of the second surface along the axial direction; the intermediate plate is configured to be able to contact the substrate on at least a portion of the first surface with respect to the holding plate The relative distance of the first distance is the contact position, and the relative distance with respect to the holding plate is a second distance smaller than the first distance. The pressing mechanism is The intermediate plate from the contact position toward the holding position during movement along the axial direction of the second pressing surface. A substrate holding method comprising the steps of arranging a substrate on a shield plate made of a magnetic material; contacting an intermediate plate above the substrate; and pressing a mechanism to direct at least a part of the intermediate plate toward the shield plate Pressing; and arranging a holding plate having a magnet that magnetically attracts the shield plate above the intermediate plate, thereby integrally holding the intermediate plate, the substrate, and the shield plate; the intermediate plate is configured to: At least a portion of the first surface of the intermediate plate opposed to the mask plate contacts the substrate at a contact distance of a first distance from the holding plate, and a relative distance from the holding plate is greater than the first position Moving between the holding positions at a second distance that is smaller; the pressing mechanism presses the opposite side of the first surface along the axial direction during the movement of the intermediate plate from the contact position toward the holding position The second side.