TWI627739B - 發光裝置及其製造方法 - Google Patents

發光裝置及其製造方法 Download PDF

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Publication number
TWI627739B
TWI627739B TW103109278A TW103109278A TWI627739B TW I627739 B TWI627739 B TW I627739B TW 103109278 A TW103109278 A TW 103109278A TW 103109278 A TW103109278 A TW 103109278A TW I627739 B TWI627739 B TW I627739B
Authority
TW
Taiwan
Prior art keywords
leds
light
stand
contact
led
Prior art date
Application number
TW103109278A
Other languages
English (en)
Chinese (zh)
Other versions
TW201503339A (zh
Inventor
廣興 亨利 蔡
Kwong-Hin Henry CHOY
Original Assignee
皇家飛利浦有限公司
Koninklijke Philips N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 皇家飛利浦有限公司, Koninklijke Philips N.V. filed Critical 皇家飛利浦有限公司
Publication of TW201503339A publication Critical patent/TW201503339A/zh
Application granted granted Critical
Publication of TWI627739B publication Critical patent/TWI627739B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

Landscapes

  • Led Device Packages (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Devices (AREA)
TW103109278A 2013-03-15 2014-03-14 發光裝置及其製造方法 TWI627739B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361798858P 2013-03-15 2013-03-15
US61/798,858 2013-03-15

Publications (2)

Publication Number Publication Date
TW201503339A TW201503339A (zh) 2015-01-16
TWI627739B true TWI627739B (zh) 2018-06-21

Family

ID=50390146

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103109278A TWI627739B (zh) 2013-03-15 2014-03-14 發光裝置及其製造方法

Country Status (7)

Country Link
US (2) US9478712B2 (enExample)
EP (1) EP2973714B1 (enExample)
JP (2) JP6649773B2 (enExample)
KR (1) KR101991960B1 (enExample)
CN (1) CN105190893B (enExample)
TW (1) TWI627739B (enExample)
WO (1) WO2014141009A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6927970B2 (ja) * 2015-11-20 2021-09-01 ルミレッズ ホールディング ベーフェー 異なる電気的構成を可能にするダイボンドパッド設計
KR102586691B1 (ko) * 2015-11-20 2023-10-11 루미리즈 홀딩 비.브이. 상이한 전기적 구성들을 가능하게 하는 다이 본드 패드 설계
EP4160679B1 (en) * 2020-04-28 2024-01-31 Nichia Corporation Light-emitting device
JP7114854B2 (ja) * 2020-04-28 2022-08-09 日亜化学工業株式会社 発光装置
CN115020566A (zh) * 2020-08-20 2022-09-06 厦门三安光电有限公司 发光二极管模组、背光模组和显示模组
CN120660465A (zh) * 2022-12-16 2025-09-16 亮锐有限责任公司 用于密集封装的阵列的管芯金属化

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006095949A1 (en) * 2005-03-11 2006-09-14 Seoul Semiconductor Co., Ltd. Led package having an array of light emitting cells coupled in series
US20080211421A1 (en) * 2005-06-28 2008-09-04 Seoul Opto Device Co., Ltd. Light Emitting Device For Ac Power Operation
TW201216504A (en) * 2010-10-13 2012-04-16 Intematix Technology Ct Corp Light emitting device
US8760068B1 (en) * 2011-09-07 2014-06-24 Iml International Driving LEDs in LCD backlight

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6547249B2 (en) 2001-03-29 2003-04-15 Lumileds Lighting U.S., Llc Monolithic series/parallel led arrays formed on highly resistive substrates
JP4254141B2 (ja) * 2001-07-30 2009-04-15 日亜化学工業株式会社 発光装置
JP4438492B2 (ja) * 2003-09-11 2010-03-24 日亜化学工業株式会社 半導体装置およびその製造方法
WO2007018360A1 (en) * 2005-08-09 2007-02-15 Seoul Opto Device Co., Ltd. Ac light emitting diode and method for fabricating the same
JP4856463B2 (ja) 2005-10-17 2012-01-18 株式会社 日立ディスプレイズ 液晶表示装置
US7910395B2 (en) * 2006-09-13 2011-03-22 Helio Optoelectronics Corporation LED structure
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
TWI419360B (zh) 2008-08-11 2013-12-11 璨圓光電股份有限公司 Solid crystal light-emitting device having an insulating layer and a method for manufacturing the same
US8648359B2 (en) * 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
JP2012028749A (ja) * 2010-07-22 2012-02-09 Seoul Opto Devices Co Ltd 発光ダイオード
US9053958B2 (en) * 2011-01-31 2015-06-09 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
RU2014113263A (ru) * 2011-09-06 2015-10-20 Конинклейке Филипс Н.В. Топология распределения и соединения led в матрице большой площади
JP2013118292A (ja) * 2011-12-02 2013-06-13 Citizen Electronics Co Ltd Ｌｅｄ発光装置
US9039746B2 (en) * 2013-02-08 2015-05-26 Cree, Inc. Solid state light emitting devices including adjustable melatonin suppression effects

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006095949A1 (en) * 2005-03-11 2006-09-14 Seoul Semiconductor Co., Ltd. Led package having an array of light emitting cells coupled in series
US20080211421A1 (en) * 2005-06-28 2008-09-04 Seoul Opto Device Co., Ltd. Light Emitting Device For Ac Power Operation
TW201216504A (en) * 2010-10-13 2012-04-16 Intematix Technology Ct Corp Light emitting device
US8760068B1 (en) * 2011-09-07 2014-06-24 Iml International Driving LEDs in LCD backlight

Also Published As

Publication number Publication date
EP2973714B1 (en) 2019-05-08
JP6649773B2 (ja) 2020-02-19
EP2973714A1 (en) 2016-01-20
WO2014141009A1 (en) 2014-09-18
KR20150132410A (ko) 2015-11-25
JP6928128B2 (ja) 2021-09-01
CN105190893B (zh) 2018-11-13
CN105190893A (zh) 2015-12-23
US20150380610A1 (en) 2015-12-31
JP2020057821A (ja) 2020-04-09
US20170025470A1 (en) 2017-01-26
US9478712B2 (en) 2016-10-25
US10134805B2 (en) 2018-11-20
TW201503339A (zh) 2015-01-16
KR101991960B1 (ko) 2019-06-25
JP2016510180A (ja) 2016-04-04

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