KR101991960B1 - 발광 구조체 및 마운트 - Google Patents

발광 구조체 및 마운트 Download PDF

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Publication number
KR101991960B1
KR101991960B1 KR1020157029226A KR20157029226A KR101991960B1 KR 101991960 B1 KR101991960 B1 KR 101991960B1 KR 1020157029226 A KR1020157029226 A KR 1020157029226A KR 20157029226 A KR20157029226 A KR 20157029226A KR 101991960 B1 KR101991960 B1 KR 101991960B1
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South Korea
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mount
leds
light emitting
led
emitting structure
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Korean (ko)
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KR20150132410A (ko
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광인 헨리 최
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루미리즈 홀딩 비.브이.
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H01L27/156—
    • H01L33/38—
    • H01L33/62—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

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  • Led Device Packages (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Devices (AREA)
KR1020157029226A 2013-03-15 2014-03-05 발광 구조체 및 마운트 Active KR101991960B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361798858P 2013-03-15 2013-03-15
US61/798,858 2013-03-15
PCT/IB2014/059466 WO2014141009A1 (en) 2013-03-15 2014-03-05 Light emitting structure and mount

Publications (2)

Publication Number Publication Date
KR20150132410A KR20150132410A (ko) 2015-11-25
KR101991960B1 true KR101991960B1 (ko) 2019-06-25

Family

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Family Applications (1)

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KR1020157029226A Active KR101991960B1 (ko) 2013-03-15 2014-03-05 발광 구조체 및 마운트

Country Status (7)

Country Link
US (2) US9478712B2 (enExample)
EP (1) EP2973714B1 (enExample)
JP (2) JP6649773B2 (enExample)
KR (1) KR101991960B1 (enExample)
CN (1) CN105190893B (enExample)
TW (1) TWI627739B (enExample)
WO (1) WO2014141009A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017087116A1 (en) * 2015-11-20 2017-05-26 Koninklijke Philips N.V. Die bond pad design to enable different electrical configurations
JP6927970B2 (ja) * 2015-11-20 2021-09-01 ルミレッズ ホールディング ベーフェー 異なる電気的構成を可能にするダイボンドパッド設計
JP7114854B2 (ja) * 2020-04-28 2022-08-09 日亜化学工業株式会社 発光装置
EP3905326B1 (en) 2020-04-28 2023-01-04 Nichia Corporation Light-emitting device
CN111987200B (zh) * 2020-08-20 2022-07-01 厦门三安光电有限公司 发光二极管模组、背光模组和显示模组
WO2024129810A1 (en) * 2022-12-16 2024-06-20 Lumileds Llc Die metallization for dense packed arrays

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6547249B2 (en) 2001-03-29 2003-04-15 Lumileds Lighting U.S., Llc Monolithic series/parallel led arrays formed on highly resistive substrates
JP4254141B2 (ja) * 2001-07-30 2009-04-15 日亜化学工業株式会社 発光装置
JP4438492B2 (ja) * 2003-09-11 2010-03-24 日亜化学工業株式会社 半導体装置およびその製造方法
EP1864339A4 (en) * 2005-03-11 2010-12-29 Seoul Semiconductor Co Ltd LED CAPSULATION WITH A GROUP IN A SERIES OF SWITCHED LUMINAIRES
EP1905102B1 (en) * 2005-06-28 2018-08-29 Seoul Viosys Co., Ltd Light emitting device for ac power operation
US8901575B2 (en) * 2005-08-09 2014-12-02 Seoul Viosys Co., Ltd. AC light emitting diode and method for fabricating the same
JP4856463B2 (ja) 2005-10-17 2012-01-18 株式会社 日立ディスプレイズ 液晶表示装置
WO2008031280A1 (fr) * 2006-09-13 2008-03-20 Helio Optoelectronics Corporation Structure de diode électroluminescente
US10295147B2 (en) * 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
TWI419360B (zh) * 2008-08-11 2013-12-11 璨圓光電股份有限公司 Solid crystal light-emitting device having an insulating layer and a method for manufacturing the same
US8648359B2 (en) * 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
JP2012028749A (ja) * 2010-07-22 2012-02-09 Seoul Opto Devices Co Ltd 発光ダイオード
TWI472058B (zh) * 2010-10-13 2015-02-01 英特明光能股份有限公司 發光二極體裝置
US9053958B2 (en) * 2011-01-31 2015-06-09 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
WO2013035024A1 (en) * 2011-09-06 2013-03-14 Koninklijke Philips Electronics N.V. Topology of distributing and connecting leds in a large area matrix
US8760068B1 (en) * 2011-09-07 2014-06-24 Iml International Driving LEDs in LCD backlight
JP2013118292A (ja) * 2011-12-02 2013-06-13 Citizen Electronics Co Ltd Ｌｅｄ発光装置
US9039746B2 (en) * 2013-02-08 2015-05-26 Cree, Inc. Solid state light emitting devices including adjustable melatonin suppression effects

Also Published As

Publication number Publication date
TWI627739B (zh) 2018-06-21
EP2973714B1 (en) 2019-05-08
JP2020057821A (ja) 2020-04-09
JP6928128B2 (ja) 2021-09-01
US20170025470A1 (en) 2017-01-26
US10134805B2 (en) 2018-11-20
CN105190893B (zh) 2018-11-13
KR20150132410A (ko) 2015-11-25
WO2014141009A1 (en) 2014-09-18
EP2973714A1 (en) 2016-01-20
JP2016510180A (ja) 2016-04-04
US9478712B2 (en) 2016-10-25
TW201503339A (zh) 2015-01-16
JP6649773B2 (ja) 2020-02-19
US20150380610A1 (en) 2015-12-31
CN105190893A (zh) 2015-12-23

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