TWI627510B - Substrate processing device - Google Patents
Substrate processing device Download PDFInfo
- Publication number
- TWI627510B TWI627510B TW103123245A TW103123245A TWI627510B TW I627510 B TWI627510 B TW I627510B TW 103123245 A TW103123245 A TW 103123245A TW 103123245 A TW103123245 A TW 103123245A TW I627510 B TWI627510 B TW I627510B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- unit
- mask
- exposure
- roller
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 829
- 238000012545 processing Methods 0.000 title claims abstract description 144
- 238000009434 installation Methods 0.000 claims abstract description 25
- 238000001514 detection method Methods 0.000 claims description 193
- 230000007246 mechanism Effects 0.000 claims description 155
- 238000005286 illumination Methods 0.000 claims description 112
- 238000002955 isolation Methods 0.000 claims description 46
- 238000003825 pressing Methods 0.000 claims description 27
- 230000003287 optical effect Effects 0.000 description 99
- 230000008859 change Effects 0.000 description 66
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- 238000011084 recovery Methods 0.000 description 50
- 238000000059 patterning Methods 0.000 description 37
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- 239000010408 film Substances 0.000 description 15
- 102100031941 Enhancer of polycomb homolog 2 Human genes 0.000 description 14
- 101000920664 Homo sapiens Enhancer of polycomb homolog 2 Proteins 0.000 description 14
- 230000006870 function Effects 0.000 description 14
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- 239000011248 coating agent Substances 0.000 description 13
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- 102100031948 Enhancer of polycomb homolog 1 Human genes 0.000 description 6
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- 238000007639 printing Methods 0.000 description 5
- 239000005357 flat glass Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000002346 layers by function Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 230000007261 regionalization Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
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- 238000009826 distribution Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 210000001747 pupil Anatomy 0.000 description 2
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- 238000005096 rolling process Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 208000013200 Stress disease Diseases 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002073 nanorod Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013142922A JP2015018006A (ja) | 2013-07-08 | 2013-07-08 | 基板処理装置、デバイス製造システム及びデバイス製造方法 |
| JP2014123088A JP6459234B2 (ja) | 2014-06-16 | 2014-06-16 | 基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201514631A TW201514631A (zh) | 2015-04-16 |
| TWI627510B true TWI627510B (zh) | 2018-06-21 |
Family
ID=52279804
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107115588A TWI681261B (zh) | 2013-07-08 | 2014-07-07 | 元件製造系統 |
| TW109126679A TWI757817B (zh) | 2013-07-08 | 2014-07-07 | 圖案形成裝置 |
| TW108146949A TWI706234B (zh) | 2013-07-08 | 2014-07-07 | 圖案形成裝置 |
| TW103123245A TWI627510B (zh) | 2013-07-08 | 2014-07-07 | Substrate processing device |
Family Applications Before (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107115588A TWI681261B (zh) | 2013-07-08 | 2014-07-07 | 元件製造系統 |
| TW109126679A TWI757817B (zh) | 2013-07-08 | 2014-07-07 | 圖案形成裝置 |
| TW108146949A TWI706234B (zh) | 2013-07-08 | 2014-07-07 | 圖案形成裝置 |
Country Status (5)
| Country | Link |
|---|---|
| KR (5) | KR102219169B1 (ko) |
| CN (3) | CN108919607B (ko) |
| HK (3) | HK1245421B (ko) |
| TW (4) | TWI681261B (ko) |
| WO (1) | WO2015005118A1 (ko) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6561474B2 (ja) * | 2015-01-20 | 2019-08-21 | 大日本印刷株式会社 | フレキシブルな表示装置の製造方法 |
| WO2016204202A1 (ja) * | 2015-06-15 | 2016-12-22 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンス素子の製造方法 |
| JP7364323B2 (ja) * | 2017-07-14 | 2023-10-18 | エーエスエムエル ネザーランズ ビー．ブイ． | 計測装置及び基板ステージ・ハンドラ・システム |
| KR102267473B1 (ko) * | 2019-06-26 | 2021-06-22 | 한국기계연구원 | 실시간 장력제어를 이용한 미세패턴 롤 제작시스템, 및 이를 이용한 미세패턴 롤 제작방법 |
| JP2019200433A (ja) * | 2019-08-01 | 2019-11-21 | 株式会社ニコン | パターン描画方法 |
| KR20210059549A (ko) * | 2019-11-15 | 2021-05-25 | 캐논 톡키 가부시키가이샤 | 성막장치 |
| CN111580473B (zh) * | 2020-04-10 | 2021-05-28 | 彩虹集团有限公司 | 一种液晶基板玻璃引出量自动控制的方法 |
| US12063633B2 (en) | 2020-08-24 | 2024-08-13 | Qualcomm Incorporated | SPS and ULCG enhancements |
| WO2022063508A1 (en) * | 2020-09-28 | 2022-03-31 | Asml Netherlands B.V. | Metrology tool with position control of projection system |
| JP2023130748A (ja) * | 2022-03-08 | 2023-09-21 | 株式会社Ｓｃｒｅｅｎホールディングス | 露光装置および露光方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6019037U (ja) * | 1983-07-18 | 1985-02-08 | 株式会社リコー | 露光装置 |
| JPH04296741A (ja) * | 1991-03-26 | 1992-10-21 | Ushio Inc | フィルム搬送機構およびこのフィルム搬送機構を具えた露光装置 |
| JP2006098718A (ja) * | 2004-09-29 | 2006-04-13 | Fuji Photo Film Co Ltd | 描画装置 |
| JP2008076650A (ja) * | 2006-09-20 | 2008-04-03 | Nikon Corp | マスク、露光装置及び露光方法、並びにデバイス製造方法 |
| JP2010207961A (ja) * | 2009-03-10 | 2010-09-24 | Fuji Electric Systems Co Ltd | 長尺フィルムの型抜き加工方法および装置 |
| WO2011099563A1 (ja) * | 2010-02-12 | 2011-08-18 | 株式会社ニコン | 基板処理装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3741013B2 (ja) * | 2001-09-17 | 2006-02-01 | ウシオ電機株式会社 | 蛇行修正機構を備えた帯状ワークの露光装置 |
| JP4296741B2 (ja) | 2002-01-28 | 2009-07-15 | パナソニック電工株式会社 | コージェネレーションシステム |
| JP2006102991A (ja) * | 2004-09-30 | 2006-04-20 | Fuji Photo Film Co Ltd | 画像記録装置及び画像記録方法 |
| CN100517080C (zh) * | 2006-04-27 | 2009-07-22 | 株式会社Orc制作所 | 搬运装置 |
| JP2009220945A (ja) * | 2008-03-17 | 2009-10-01 | Orc Mfg Co Ltd | 搬送装置 |
| CN101364052B (zh) * | 2008-10-08 | 2010-10-27 | 上海微电子装备有限公司 | 主动减振系统及其预见控制方法 |
| US8541163B2 (en) * | 2009-06-05 | 2013-09-24 | Nikon Corporation | Transporting method, transporting apparatus, exposure method, and exposure apparatus |
| KR101070734B1 (ko) * | 2009-06-30 | 2011-10-07 | 건국대학교 산학협력단 | 전자소자 연속공정 롤투롤 인쇄를 위한 초정밀 횡방향 레지스터 제어 시스템 및 방법 |
| US8379186B2 (en) * | 2009-07-17 | 2013-02-19 | Nikon Corporation | Pattern formation apparatus, pattern formation method, and device manufacturing method |
| NL2006385A (en) * | 2010-04-12 | 2011-10-13 | Asml Netherlands Bv | Substrate handling apparatus and lithographic apparatus. |
| JP5929761B2 (ja) * | 2010-12-15 | 2016-06-08 | 株式会社ニコン | 基板処理システム及び表示素子の製造方法 |
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2014
- 2014-06-25 KR KR1020207009396A patent/KR102219169B1/ko active IP Right Grant
- 2014-06-25 KR KR1020197014816A patent/KR102007627B1/ko active IP Right Grant
- 2014-06-25 KR KR1020167002859A patent/KR101984360B1/ko active IP Right Grant
- 2014-06-25 CN CN201810608818.XA patent/CN108919607B/zh active Active
- 2014-06-25 KR KR1020197037109A patent/KR102097769B1/ko active IP Right Grant
- 2014-06-25 CN CN201480049332.7A patent/CN105556391B/zh active Active
- 2014-06-25 KR KR1020197022344A patent/KR102058830B1/ko active IP Right Grant
- 2014-06-25 CN CN201710545966.7A patent/CN107255908B/zh active Active
- 2014-06-25 WO PCT/JP2014/066885 patent/WO2015005118A1/ja active Application Filing
- 2014-07-07 TW TW107115588A patent/TWI681261B/zh active
- 2014-07-07 TW TW109126679A patent/TWI757817B/zh active
- 2014-07-07 TW TW108146949A patent/TWI706234B/zh active
- 2014-07-07 TW TW103123245A patent/TWI627510B/zh active
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2016
- 2016-07-21 HK HK18104878.9A patent/HK1245421B/zh not_active IP Right Cessation
- 2016-07-21 HK HK16108788.1A patent/HK1220776A1/zh not_active IP Right Cessation
- 2016-07-21 HK HK18116748.1A patent/HK1257621A1/zh unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS6019037U (ja) * | 1983-07-18 | 1985-02-08 | 株式会社リコー | 露光装置 |
| JPH04296741A (ja) * | 1991-03-26 | 1992-10-21 | Ushio Inc | フィルム搬送機構およびこのフィルム搬送機構を具えた露光装置 |
| JP2006098718A (ja) * | 2004-09-29 | 2006-04-13 | Fuji Photo Film Co Ltd | 描画装置 |
| JP2008076650A (ja) * | 2006-09-20 | 2008-04-03 | Nikon Corp | マスク、露光装置及び露光方法、並びにデバイス製造方法 |
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| WO2011099563A1 (ja) * | 2010-02-12 | 2011-08-18 | 株式会社ニコン | 基板処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102058830B1 (ko) | 2019-12-23 |
| TWI757817B (zh) | 2022-03-11 |
| WO2015005118A1 (ja) | 2015-01-15 |
| HK1257621A1 (zh) | 2019-10-25 |
| TW202041981A (zh) | 2020-11-16 |
| CN105556391B (zh) | 2018-06-29 |
| KR101984360B1 (ko) | 2019-05-30 |
| KR20190091575A (ko) | 2019-08-06 |
| KR20200037452A (ko) | 2020-04-08 |
| CN107255908A (zh) | 2017-10-17 |
| CN105556391A (zh) | 2016-05-04 |
| TW201832017A (zh) | 2018-09-01 |
| TWI681261B (zh) | 2020-01-01 |
| HK1220776A1 (zh) | 2017-05-12 |
| KR102097769B1 (ko) | 2020-04-07 |
| TW202013096A (zh) | 2020-04-01 |
| KR20190060003A (ko) | 2019-05-31 |
| TW201514631A (zh) | 2015-04-16 |
| CN108919607A (zh) | 2018-11-30 |
| TWI706234B (zh) | 2020-10-01 |
| HK1245421B (zh) | 2020-05-15 |
| KR102219169B1 (ko) | 2021-02-23 |
| KR20160029099A (ko) | 2016-03-14 |
| KR20190141793A (ko) | 2019-12-24 |
| KR102007627B1 (ko) | 2019-08-05 |
| CN108919607B (zh) | 2020-10-30 |
| CN107255908B (zh) | 2019-08-06 |
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