HK1245421B - 器件製造系統及圖案形成裝置 - Google Patents

器件製造系統及圖案形成裝置

Info

Publication number
HK1245421B
HK1245421B HK18104878.9A HK18104878A HK1245421B HK 1245421 B HK1245421 B HK 1245421B HK 18104878 A HK18104878 A HK 18104878A HK 1245421 B HK1245421 B HK 1245421B
Authority
HK
Hong Kong
Prior art keywords
device manufacturing
manufacturing system
pattern formation
formation apparatus
pattern
Prior art date
Application number
HK18104878.9A
Other languages
English (en)
Inventor
鈴木智也
小宮山弘樹
加藤正紀
渡邊智行
鬼頭義昭
堀正和
林田洋祐
木內徹
Original Assignee
株式會社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013142922A external-priority patent/JP2015018006A/ja
Priority claimed from JP2014123088A external-priority patent/JP6459234B2/ja
Application filed by 株式會社尼康 filed Critical 株式會社尼康
Publication of HK1245421B publication Critical patent/HK1245421B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
HK18104878.9A 2013-07-08 2016-07-21 器件製造系統及圖案形成裝置 HK1245421B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013142922A JP2015018006A (ja) 2013-07-08 2013-07-08 基板処理装置、デバイス製造システム及びデバイス製造方法
JP2014123088A JP6459234B2 (ja) 2014-06-16 2014-06-16 基板処理装置

Publications (1)

Publication Number Publication Date
HK1245421B true HK1245421B (zh) 2020-05-15

Family

ID=52279804

Family Applications (3)

Application Number Title Priority Date Filing Date
HK16108788.1A HK1220776A1 (zh) 2013-07-08 2016-07-21 基板處理裝置、器件製造系統、器件製造方法及圖案形成裝置
HK18116748.1A HK1257621A1 (zh) 2013-07-08 2016-07-21 基板處理裝置
HK18104878.9A HK1245421B (zh) 2013-07-08 2016-07-21 器件製造系統及圖案形成裝置

Family Applications Before (2)

Application Number Title Priority Date Filing Date
HK16108788.1A HK1220776A1 (zh) 2013-07-08 2016-07-21 基板處理裝置、器件製造系統、器件製造方法及圖案形成裝置
HK18116748.1A HK1257621A1 (zh) 2013-07-08 2016-07-21 基板處理裝置

Country Status (5)

Country Link
KR (5) KR102007627B1 (zh)
CN (3) CN108919607B (zh)
HK (3) HK1220776A1 (zh)
TW (4) TWI757817B (zh)
WO (1) WO2015005118A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6561474B2 (ja) * 2015-01-20 2019-08-21 大日本印刷株式会社 フレキシブルな表示装置の製造方法
WO2016204202A1 (ja) * 2015-06-15 2016-12-22 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子の製造方法
CN110869855A (zh) * 2017-07-14 2020-03-06 Asml荷兰有限公司 量测设备和衬底平台输送装置系统
KR102267473B1 (ko) * 2019-06-26 2021-06-22 한국기계연구원 실시간 장력제어를 이용한 미세패턴 롤 제작시스템, 및 이를 이용한 미세패턴 롤 제작방법
JP2019200433A (ja) * 2019-08-01 2019-11-21 株式会社ニコン パターン描画方法
KR20210059549A (ko) * 2019-11-15 2021-05-25 캐논 톡키 가부시키가이샤 성막장치
CN111580473B (zh) * 2020-04-10 2021-05-28 彩虹集团有限公司 一种液晶基板玻璃引出量自动控制的方法
US12063633B2 (en) 2020-08-24 2024-08-13 Qualcomm Incorporated SPS and ULCG enhancements
KR20230073216A (ko) * 2020-09-28 2023-05-25 에이에스엠엘 네델란즈 비.브이. 투영 시스템의 위치 제어를 갖는 계측 툴
JP2023130748A (ja) * 2022-03-08 2023-09-21 株式会社Ｓｃｒｅｅｎホールディングス 露光装置および露光方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6019037U (ja) * 1983-07-18 1985-02-08 株式会社リコー 露光装置
JP2880314B2 (ja) * 1991-03-26 1999-04-05 ウシオ電機株式会社 フィルム搬送機構およびこのフィルム搬送機構を具えた露光装置
JP3741013B2 (ja) * 2001-09-17 2006-02-01 ウシオ電機株式会社 蛇行修正機構を備えた帯状ワークの露光装置
JP4296741B2 (ja) 2002-01-28 2009-07-15 パナソニック電工株式会社 コージェネレーションシステム
JP2006098718A (ja) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd 描画装置
JP2006102991A (ja) * 2004-09-30 2006-04-20 Fuji Photo Film Co Ltd 画像記録装置及び画像記録方法
CN100517080C (zh) * 2006-04-27 2009-07-22 株式会社Orc制作所 搬运装置
JP5181451B2 (ja) * 2006-09-20 2013-04-10 株式会社ニコン マスク、露光装置及び露光方法、並びにデバイス製造方法
JP2009220945A (ja) * 2008-03-17 2009-10-01 Orc Mfg Co Ltd 搬送装置
CN101364052B (zh) * 2008-10-08 2010-10-27 上海微电子装备有限公司 主动减振系统及其预见控制方法
JP2010207961A (ja) * 2009-03-10 2010-09-24 Fuji Electric Systems Co Ltd 長尺フィルムの型抜き加工方法および装置
US8541163B2 (en) * 2009-06-05 2013-09-24 Nikon Corporation Transporting method, transporting apparatus, exposure method, and exposure apparatus
KR101070734B1 (ko) * 2009-06-30 2011-10-07 건국대학교 산학협력단 전자소자 연속공정 롤투롤 인쇄를 위한 초정밀 횡방향 레지스터 제어 시스템 및 방법
US8379186B2 (en) * 2009-07-17 2013-02-19 Nikon Corporation Pattern formation apparatus, pattern formation method, and device manufacturing method
KR101948467B1 (ko) * 2010-02-12 2019-02-14 가부시키가이샤 니콘 기판 처리 장치 및 기판 처리 방법
US9696633B2 (en) * 2010-04-12 2017-07-04 Asml Netherlands B.V. Substrate handling apparatus and lithographic apparatus
JP5929761B2 (ja) * 2010-12-15 2016-06-08 株式会社ニコン 基板処理システム及び表示素子の製造方法

Also Published As

Publication number Publication date
HK1220776A1 (zh) 2017-05-12
CN105556391B (zh) 2018-06-29
TW201832017A (zh) 2018-09-01
KR20190091575A (ko) 2019-08-06
CN105556391A (zh) 2016-05-04
CN108919607A (zh) 2018-11-30
HK1257621A1 (zh) 2019-10-25
KR20200037452A (ko) 2020-04-08
WO2015005118A1 (ja) 2015-01-15
KR102007627B1 (ko) 2019-08-05
KR20190060003A (ko) 2019-05-31
TWI757817B (zh) 2022-03-11
TW202013096A (zh) 2020-04-01
TW201514631A (zh) 2015-04-16
KR20160029099A (ko) 2016-03-14
TWI627510B (zh) 2018-06-21
TWI681261B (zh) 2020-01-01
KR102219169B1 (ko) 2021-02-23
KR102097769B1 (ko) 2020-04-07
KR101984360B1 (ko) 2019-05-30
CN108919607B (zh) 2020-10-30
CN107255908B (zh) 2019-08-06
TW202041981A (zh) 2020-11-16
KR20190141793A (ko) 2019-12-24
KR102058830B1 (ko) 2019-12-23
CN107255908A (zh) 2017-10-17
TWI706234B (zh) 2020-10-01

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20230624