HK1245421B - Device manufacturing system, and pattern formation apparatus - Google Patents

Device manufacturing system, and pattern formation apparatus

Info

Publication number
HK1245421B
HK1245421B HK18104878.9A HK18104878A HK1245421B HK 1245421 B HK1245421 B HK 1245421B HK 18104878 A HK18104878 A HK 18104878A HK 1245421 B HK1245421 B HK 1245421B
Authority
HK
Hong Kong
Prior art keywords
device manufacturing
manufacturing system
pattern formation
formation apparatus
pattern
Prior art date
Application number
HK18104878.9A
Other languages
Chinese (zh)
Inventor
鈴木智也
小宮山弘樹
加藤正紀
渡邊智行
鬼頭義昭
堀正和
林田洋祐
木內徹
Original Assignee
株式會社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013142922A external-priority patent/JP2015018006A/en
Priority claimed from JP2014123088A external-priority patent/JP6459234B2/en
Application filed by 株式會社尼康 filed Critical 株式會社尼康
Publication of HK1245421B publication Critical patent/HK1245421B/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709Vibration, e.g. vibration detection, compensation, suppression or isolation
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/24Curved surfaces
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70758Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
HK18104878.9A 2013-07-08 2016-07-21 Device manufacturing system, and pattern formation apparatus HK1245421B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013142922A JP2015018006A (en) 2013-07-08 2013-07-08 Substrate treatment apparatus, device production system, and device production method
JP2014123088A JP6459234B2 (en) 2014-06-16 2014-06-16 Substrate processing equipment

Publications (1)

Publication Number Publication Date
HK1245421B true HK1245421B (en) 2020-05-15

Family

ID=52279804

Family Applications (3)

Application Number Title Priority Date Filing Date
HK18104878.9A HK1245421B (en) 2013-07-08 2016-07-21 Device manufacturing system, and pattern formation apparatus
HK16108788.1A HK1220776A1 (en) 2013-07-08 2016-07-21 Substrate processing apparatus, device manufacturing system, device manufacturing method, and pattern formation apparatus
HK18116748.1A HK1257621A1 (en) 2013-07-08 2016-07-21 Substrate processing apparatus

Family Applications After (2)

Application Number Title Priority Date Filing Date
HK16108788.1A HK1220776A1 (en) 2013-07-08 2016-07-21 Substrate processing apparatus, device manufacturing system, device manufacturing method, and pattern formation apparatus
HK18116748.1A HK1257621A1 (en) 2013-07-08 2016-07-21 Substrate processing apparatus

Country Status (5)

Country Link
KR (5) KR101984360B1 (en)
CN (3) CN105556391B (en)
HK (3) HK1245421B (en)
TW (4) TWI627510B (en)
WO (1) WO2015005118A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6561474B2 (en) * 2015-01-20 2019-08-21 大日本印刷株式会社 Method for manufacturing flexible display device
WO2016204202A1 (en) * 2015-06-15 2016-12-22 コニカミノルタ株式会社 Production method for organic electroluminescent elements
WO2019012495A1 (en) * 2017-07-14 2019-01-17 エーエスエムエル ネザーランズ ビー.ブイ. Measurement apparatus
KR102267473B1 (en) * 2019-06-26 2021-06-22 한국기계연구원 Fine pattern roll manufacturing system via tension control, and method of manufacturing fine pattern roll using the same
JP2019200433A (en) * 2019-08-01 2019-11-21 株式会社ニコン Pattern drawing method
KR20210059549A (en) * 2019-11-15 2021-05-25 캐논 톡키 가부시키가이샤 Film forming apparatus
JP7441076B2 (en) * 2020-03-03 2024-02-29 株式会社Screenホールディングス drawing device
CN111580473B (en) * 2020-04-10 2021-05-28 彩虹集团有限公司 Method for automatically controlling glass extraction amount of liquid crystal substrate
US12063633B2 (en) 2020-08-24 2024-08-13 Qualcomm Incorporated SPS and ULCG enhancements
CN116420069A (en) * 2020-09-28 2023-07-11 Asml荷兰有限公司 Position control metrology tool with projection system
JP2023130748A (en) * 2022-03-08 2023-09-21 株式会社Screenホールディングス Exposure apparatus and exposure method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6019037U (en) * 1983-07-18 1985-02-08 株式会社リコー exposure equipment
JP2880314B2 (en) * 1991-03-26 1999-04-05 ウシオ電機株式会社 Film transport mechanism and exposure apparatus equipped with this film transport mechanism
JP3741013B2 (en) * 2001-09-17 2006-02-01 ウシオ電機株式会社 Belt-shaped workpiece exposure device with meandering correction mechanism
JP4296741B2 (en) 2002-01-28 2009-07-15 パナソニック電工株式会社 Cogeneration system
JP2006098718A (en) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd Drawing apparatus
JP2006102991A (en) * 2004-09-30 2006-04-20 Fuji Photo Film Co Ltd Image recording device and image recording method
CN100517080C (en) * 2006-04-27 2009-07-22 株式会社Orc制作所 Conveying device
JP5181451B2 (en) * 2006-09-20 2013-04-10 株式会社ニコン Mask, exposure apparatus, exposure method, and device manufacturing method
JP2009220945A (en) * 2008-03-17 2009-10-01 Orc Mfg Co Ltd Conveyance apparatus
CN101364052B (en) * 2008-10-08 2010-10-27 上海微电子装备有限公司 Active vibration damping system and forecast control method thereof
JP2010207961A (en) * 2009-03-10 2010-09-24 Fuji Electric Systems Co Ltd Die cutting method for long film and device therefor
US8541163B2 (en) * 2009-06-05 2013-09-24 Nikon Corporation Transporting method, transporting apparatus, exposure method, and exposure apparatus
KR101070734B1 (en) * 2009-06-30 2011-10-07 건국대학교 산학협력단 Feedforward control of cross direction register system and methode for printed electronics roll-to-roll
US8379186B2 (en) * 2009-07-17 2013-02-19 Nikon Corporation Pattern formation apparatus, pattern formation method, and device manufacturing method
KR101816327B1 (en) * 2010-02-12 2018-01-08 가부시키가이샤 니콘 Substrate processing device
JP5738981B2 (en) * 2010-04-12 2015-06-24 エーエスエムエル ネザーランズ ビー.ブイ. Substrate handling apparatus, lithographic apparatus, tool, and device manufacturing method
WO2012081607A1 (en) * 2010-12-15 2012-06-21 株式会社ニコン Substrate processing system and method for producing display elements

Also Published As

Publication number Publication date
KR20190091575A (en) 2019-08-06
CN105556391B (en) 2018-06-29
CN107255908B (en) 2019-08-06
TW202013096A (en) 2020-04-01
KR102007627B1 (en) 2019-08-05
CN105556391A (en) 2016-05-04
CN108919607B (en) 2020-10-30
KR20190141793A (en) 2019-12-24
HK1220776A1 (en) 2017-05-12
TW202041981A (en) 2020-11-16
KR20160029099A (en) 2016-03-14
KR102219169B1 (en) 2021-02-23
TW201832017A (en) 2018-09-01
KR20190060003A (en) 2019-05-31
KR20200037452A (en) 2020-04-08
KR102097769B1 (en) 2020-04-07
HK1257621A1 (en) 2019-10-25
CN107255908A (en) 2017-10-17
WO2015005118A1 (en) 2015-01-15
TWI757817B (en) 2022-03-11
KR102058830B1 (en) 2019-12-23
TWI706234B (en) 2020-10-01
TW201514631A (en) 2015-04-16
CN108919607A (en) 2018-11-30
TWI627510B (en) 2018-06-21
TWI681261B (en) 2020-01-01
KR101984360B1 (en) 2019-05-30

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20230624