CN105556391A - Substrate processing apparatus, device manufacturing system, device manufacturing method, and pattern formation apparatus - Google Patents

Substrate processing apparatus, device manufacturing system, device manufacturing method, and pattern formation apparatus Download PDF

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Publication number
CN105556391A
CN105556391A CN201480049332.7A CN201480049332A CN105556391A CN 105556391 A CN105556391 A CN 105556391A CN 201480049332 A CN201480049332 A CN 201480049332A CN 105556391 A CN105556391 A CN 105556391A
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CN
China
Prior art keywords
substrate
light shield
sheet material
unit
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
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CN201480049332.7A
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Chinese (zh)
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CN105556391B (en
Inventor
铃木智也
小宫山弘树
加藤正纪
渡边智行
鬼头义昭
堀正和
林田洋祐
木内彻
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Nikon Corp
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Nikon Corp
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Priority claimed from JP2013142922A external-priority patent/JP2015018006A/en
Priority claimed from JP2014123088A external-priority patent/JP6459234B2/en
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to CN201810608818.XA priority Critical patent/CN108919607B/en
Priority to CN201710545966.7A priority patent/CN107255908B/en
Publication of CN105556391A publication Critical patent/CN105556391A/en
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Publication of CN105556391B publication Critical patent/CN105556391B/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

The purpose of the present invention is to suitably perform exposure using an exposure unit by further reducing vibration imparted to the exposure unit. A substrate processing apparatus (U3) is provided with: a shock-absorbing table (131) provided on a placement surface (E); an exposure unit (121), provided on the shock-absorbing table (131), for performing an exposure process on a supplied substrate (P); and a position adjustment unit (120) and a drive unit (122) provided on the placement surface (E) and provided, as processing units for performing a process on the exposure unit (121), in an independent state out of contact with the exposure unit (121).

Description

Substrate board treatment, device inspection apparatus, device making method and patterning device
Technical field
The present invention relates to the substrate board treatment for forming pattern used for electronic device on substrate, device inspection apparatus, device making method and patterning device.
Background technology
In the past, as shown in Japanese Unexamined Patent Publication 9-219353 publication, as substrate board treatment, be known to the exposure device substrate be located on the mobile microscope carrier of movement on flat board being carried out to the exposure of device pattern.The flat board of this exposure device is bearing on base station via the installing component with damper mechanism.Mobile microscope carrier moves in X direction being located on the movable guiding piece on flat board.Movable guiding piece is moved along Y-direction on flat board by two linear motors be located on base station.Two linear motors are located at the both sides of the X-direction of base station, make movable guiding piece move along Y-direction in a non-contact manner.That is, each linear motor has mover and stator, and stator is fixed on base station, and on the other hand, mover is separately fixed at the both sides of the X-direction of movable guiding piece, and mover and stator are contactless state.In the exposure device of above-mentioned Japanese Unexamined Patent Publication 9-219353 publication, because the mover of linear motor and stator are contactless state, so inhibit the vibration produced because of external disturbance to be delivered on flat board via movable guiding piece and mobile microscope carrier.
Summary of the invention
In the exposure device of above-mentioned Unexamined Patent 9-219353 publication, by two linear motors, movable guiding piece is moved on flat board along Y-direction, similarly, mobile microscope carrier also utilizes linear motor to carry out relative to the movement of movable guiding piece.In this situation, linear motor also makes mobile microscope carrier move in X direction in a non-contact manner.But, owing to making mobile microscope carrier move relative to movable guiding piece on flat board, so the vibration produced because of the movement of mobile microscope carrier may be delivered to flat board.
In addition, the exposure device of above-mentioned Japanese Unexamined Patent Publication 9-219353 publication keeps substrate to expose on mobile microscope carrier, but be not limited to this structure, also exist and supply membranaceous substrate with continuous state and the situation of for the substrate of supply, device pattern being carried out to scan exposure.In this situation, when supplying substrate, substrate may vibrate.
The solution of the present invention is researched and developed in view of above-mentioned problem, its object is to provide a kind of and can reduce the vibration the substrate board treatment, device inspection apparatus, device making method and the patterning device that are exposed well by exposing unit that bring exposing unit further.
1st scheme of the present invention is a kind of substrate board treatment, and have: vibration-free tables, it is located in installation surface; Exposing unit, it is located on above-mentioned vibration-free tables, and carries out exposure-processed to the substrate of supply; And processing unit, it to be located in above-mentioned installation surface and to arrange with non-contacting separate state with above-mentioned exposing unit, and processes above-mentioned exposing unit.
1st scheme of the present invention is aforesaid substrate treating apparatus, also can be, the position adjustment unit adjusted is carried out in the above-mentioned processing unit position comprised on the Width of the aforesaid substrate of the above-mentioned exposing unit supply of subtend, and above-mentioned position adjustment unit has: base station, and it is located in above-mentioned installation surface; Width travel mechanism, it is located on above-mentioned base station, and aforesaid substrate is moved relative to the Width of above-mentioned base station along aforesaid substrate; And stationary roll, it is located on above-mentioned base station, guided by the aforesaid substrate after carrying out position adjustment, and this stationary roll is fixing relative to the position of above-mentioned base station by above-mentioned Width travel mechanism towards above-mentioned exposing unit.
1st scheme of the present invention is aforesaid substrate treating apparatus, also can be, also have: the 1st substrate test section, and it is located on above-mentioned base station regularly, detects the position be supplied on the Width of the aforesaid substrate of above-mentioned stationary roll; And control part, its testing result based on above-mentioned 1st substrate test section controls above-mentioned Width travel mechanism, thus is the 1st target location by the position correction be supplied on the Width of the aforesaid substrate of above-mentioned stationary roll.
1st scheme of the present invention is aforesaid substrate treating apparatus, also can be, above-mentioned position adjustment unit also has the roller position adjusting mechanism of the above-mentioned stationary roll of adjustment relative to the position of above-mentioned exposing unit, aforesaid substrate treating apparatus also has: the 2nd substrate test section, it is located on above-mentioned vibration-free tables regularly, detects the position being supplied to the aforesaid substrate of above-mentioned exposing unit; And control part, its testing result based on above-mentioned 2nd substrate test section controls above-mentioned roller position adjusting mechanism, thus is the 2nd target location by the position correction being supplied to the aforesaid substrate of above-mentioned exposing unit.
1st scheme of the present invention is aforesaid substrate treating apparatus, also can be, also have: dipper crowding gear, and it pushes in the mode of giving tension force the aforesaid substrate supplied from above-mentioned position adjustment unit to above-mentioned exposing unit; 2nd substrate test section, it is located on above-mentioned vibration-free tables regularly, detects the position being supplied to the aforesaid substrate of above-mentioned exposing unit; And control part, its testing result based on above-mentioned 2nd substrate test section controls above-mentioned dipper crowding gear, thus the pushing amount of adjustment to aforesaid substrate.
1st scheme of the present invention is aforesaid substrate treating apparatus, also can be, above-mentioned processing unit comprises the driver element driving above-mentioned exposing unit, and above-mentioned exposing unit has: the light shield holding member kept the light shield of illuminated optical illumination; With the substrate supporting parts that the aforesaid substrate projected the projected light from above-mentioned light shield supports, above-mentioned driver element has: drive the light shield side drive division of above-mentioned light shield holding member to make above-mentioned light shield move along direction of scanning; The substrate-side drive division of aforesaid substrate support unit is driven with in order to make aforesaid substrate move along direction of scanning.
1st scheme of the present invention is aforesaid substrate treating apparatus, also can be that above-mentioned exposing unit has: the 1st framework supporting above-mentioned light shield holding member; With the 2nd framework of supporting aforesaid substrate support unit, above-mentioned vibration-free tables comprises the 1st vibration-free tables be located between above-mentioned installation surface and above-mentioned 1st framework and the 2nd vibration-free tables be located between above-mentioned installation surface and above-mentioned 2nd framework.
1st scheme of the present invention is aforesaid substrate treating apparatus, also can be, above-mentioned exposing unit has the framework of the above-mentioned light shield holding member of supporting and aforesaid substrate support unit, and above-mentioned vibration-free tables is located between above-mentioned installation surface and said frame.
1st scheme of the present invention is aforesaid substrate treating apparatus, also can be, above-mentioned light shield holding member is to having centered by the 1st axle and be that the above-mentioned light shield in the light shield face of the 1st radius-of-curvature keeps, above-mentioned light shield side drive division makes above-mentioned light shield move along direction of scanning by making the rotary actuation of above-mentioned light shield holding member, aforesaid substrate support unit is along centered by the 2nd axle and be the carrying plane of the 2nd radius-of-curvature, support aforesaid substrate, aforesaid substrate side drive division makes aforesaid substrate move along direction of scanning by making the rotary actuation of aforesaid substrate support unit.
1st scheme of the present invention is aforesaid substrate treating apparatus, also can be, above-mentioned light shield holding member keeps the above-mentioned light shield with the light shield face becoming plane, above-mentioned light shield side drive division makes above-mentioned light shield move along direction of scanning by making above-mentioned light shield holding member linear drives, aforesaid substrate support unit is along centered by the 2nd axle and be the carrying plane of the 2nd radius-of-curvature, support aforesaid substrate, aforesaid substrate side drive division makes aforesaid substrate move along direction of scanning by making the rotary actuation of aforesaid substrate support unit.
1st scheme of the present invention is aforesaid substrate treating apparatus, also can be, above-mentioned light shield holding member is to having centered by the 1st axle and be that the above-mentioned light shield in the light shield face of the 1st radius-of-curvature keeps, above-mentioned light shield side drive division makes above-mentioned light shield move along direction of scanning by making the rotary actuation of above-mentioned light shield holding member, aforesaid substrate support unit has a pair backing roll, it is in the mode making aforesaid substrate have plane, the both sides on the direction of scanning of aforesaid substrate can be supported rotatably, aforesaid substrate side drive division makes aforesaid substrate move along direction of scanning by making above-mentioned a pair backing roll rotary actuation.
2nd scheme of the present invention is a kind of device inspection apparatus, has: the substrate board treatment of the 1st scheme of the present invention; To the substrate feeding device of above-mentioned substrate board treatment supply aforesaid substrate; With to the substrate retracting device reclaimed by the aforesaid substrate after the process of aforesaid substrate treating apparatus.
2nd scheme of the present invention is above-mentioned device inspection apparatus, also can be that aforesaid substrate feedway has: the 1st bearing portion, and supply volume can support by rotatably, and wherein aforesaid substrate wound into rolls obtains by this supply volume; 1st elevating mechanism, it makes above-mentioned 1st bearing portion lifting; Entry angle test section, it detects rolls up the aforesaid substrate the sent entry angle relative to the 1st roller of the aforesaid substrate that will reel from above-mentioned supply; And control part, its testing result based on above-mentioned entry angle test section controls above-mentioned 1st elevating mechanism, thus above-mentioned entry angle is modified to aspect angle degree.
2nd scheme of the present invention is above-mentioned device inspection apparatus, also can be, aforesaid substrate retracting device has: the 2nd bearing portion, and recovery volume can support by rotatably, and wherein this recovery volume reels to the aforesaid substrate after the process processed by aforesaid substrate treating apparatus; 2nd elevating mechanism, it makes above-mentioned 2nd bearing portion lifting; Discharge angle detection, it detects rolls up the aforesaid substrate the sent discharge angle relative to the 2nd roller of the aforesaid substrate that will reel to above-mentioned recovery; And control part, its testing result based on above-mentioned discharge angle detection controls above-mentioned 2nd elevating mechanism, thus above-mentioned discharge angle is modified to target discharge angle.
3rd scheme of the present invention is a kind of device making method, comprising: use the substrate board treatment of the 1st scheme of the present invention to carry out exposure-processed to aforesaid substrate; With by processing the aforesaid substrate after exposure-processed, form the pattern of above-mentioned light shield.
4th scheme of the present invention is a kind of patterning device, assigned position while being transported along long side direction by the sheet material substrate of the flexibility of long size on this sheet material substrate forms pattern, have: patterning apparatus, it has and comprises for above-mentioned pattern is formed into the pattern forming portion of the afore mentioned rules position on the surface of above-mentioned sheet material substrate along multiple guide reels of transporting on long side direction of transport path of regulation in interior conveying unit and the part being located at above-mentioned transport path by above-mentioned sheet material substrate; Vibration absorber, it is located at and is provided with between the base station face of above-mentioned patterning apparatus and above-mentioned patterning apparatus; Position regulator, itself and above-mentioned patterning apparatus independently arrange and are arranged on above-mentioned base station face, comprise the guide reel for sending above-mentioned sheet material substrate towards the above-mentioned conveying unit of above-mentioned patterning apparatus, and on the Width orthogonal with the long side direction of above-mentioned sheet material substrate, adjust the position of sheet above material substrate; Substrate error measuring portion, it at upstream side, measures the change information relevant to the distortion of the change in location on the above-mentioned Width of above-mentioned sheet material substrate, postural change or above-mentioned sheet material substrate relative to the above-mentioned pattern forming portion in above-mentioned transport path; And control device, it controls above-mentioned position regulator based on above-mentioned change information.
4th scheme of the present invention is above-mentioned patterning device, also can be, aforesaid substrate error measuring portion, by the edge detected on the Width of above-mentioned sheet material substrate or the mark be formed on above-mentioned sheet material substrate, measures above-mentioned change information.
4th scheme of the present invention is above-mentioned patterning device, also can be, aforesaid substrate error measuring portion is located at least one party in above-mentioned patterning apparatus and above-mentioned position regulator.
4th scheme of the present invention is a kind of patterning device, while the sheet material substrate of the flexibility of long size is transported along long side direction, assigned position on this sheet material substrate forms pattern, have: patterning apparatus, its have comprise for by above-mentioned sheet material substrate along regulation multiple guide reels of transporting on long side direction of transport path interior conveying unit and be located at above-mentioned transport path a part on and form the pattern forming portion of above-mentioned pattern in the afore mentioned rules position on the surface of above-mentioned sheet material substrate; Vibration absorber, it is located at and is provided with between the base station face of above-mentioned patterning apparatus and above-mentioned patterning apparatus; Position regulator, itself and above-mentioned patterning apparatus arrange independently and are arranged on above-mentioned base station face, comprise the guide reel for sending above-mentioned sheet material substrate towards the above-mentioned conveying unit of above-mentioned patterning apparatus, and on the Width orthogonal with the long side direction of above-mentioned sheet material substrate, adjust the position of sheet above material substrate; Site error measurement unit, it measures the above-mentioned patterning apparatus change information relevant to the relative change in location of above-mentioned position regulator; And control device, it controls above-mentioned position regulator based on above-mentioned change information.
4th scheme of the present invention is above-mentioned patterning device, also can be, there is the adjustment roller that can tilt, it is located in above-mentioned patterning apparatus, relative to the above-mentioned pattern forming portion in above-mentioned transport path at upstream side, under the state being configured to the tension force executing regulation on above-mentioned long side direction, by the above-mentioned transport path warpage of above-mentioned sheet material substrate, above-mentioned control device tilts by making above-mentioned adjustment roller based on above-mentioned change information, adjusts to the position on the Width of the sheet material substrate of pattern forming portion conveyance.
5th scheme of the present invention is a kind of device inspection apparatus, while the sheet material substrate of the flexibility of long size is transported along long side direction, 1st process, the 2nd process are implemented successively to this sheet material substrate, have: the 1st processing unit, it is located on the base station face of regulation, comprise the multiple rollers for being carried on long side direction along the transport path specified by above-mentioned sheet material substrate, and above-mentioned 1st process is implemented to above-mentioned sheet material substrate; 2nd processing unit, it is arranged on above-mentioned base station face, comprises the multiple rollers for being carried along the transport path specified at long side direction by the above-mentioned sheet material substrate transported from above-mentioned 1st processing unit, and implements above-mentioned 2nd process to above-mentioned sheet material substrate; Antihunting device, it suppresses or isolated vibration passing between above-mentioned base station face and above-mentioned 1st processing unit or the vibration passing between above-mentioned base station face and above-mentioned 2nd processing unit or the vibration passing between above-mentioned 1st processing unit and above-mentioned 2nd processing unit; Change measurement unit, it measures the change information relevant to the relative change in location of above-mentioned 1st processing unit and above-mentioned 2nd processing unit or the change in location of above-mentioned sheet material substrate that transports to above-mentioned 2nd processing unit from above-mentioned 1st processing unit; Position regulator, it adjusts the position on the Width orthogonal with long side direction of the above-mentioned sheet material substrate moved in above-mentioned 2nd processing unit based on above-mentioned change information.
5th scheme of the present invention is above-mentioned device inspection apparatus, also can be, above-mentioned 2nd processing unit is the patterning apparatus of the one party comprised in exposure device and printing equipment, wherein, this exposure device in order to form pattern used for electronic device on the long side direction of above-mentioned sheet material substrate, and projecting the luminous energy corresponding to above-mentioned pattern to the photoinduction layer on the surface being formed at sheet above material substrate, this printing equipment draws above-mentioned pattern containing a certain ink in conductive material, insulating material, semiconductor material by coating on the surface of above-mentioned sheet material substrate.
5th scheme of the present invention is above-mentioned device inspection apparatus, also can be, above-mentioned 1st processing unit by implement with the process implemented on above-mentioned sheet material substrate by above-mentioned patterning apparatus before the suitable process of operation, independent or multiple pretreating device forms, above-mentioned position regulator be located to be arranged on the carrying channel of above-mentioned sheet material substrate above-mentioned patterning apparatus tight before above-mentioned pretreating device in or between above-mentioned tight front pretreating device and above-mentioned patterning apparatus.
5th scheme of the present invention is above-mentioned device inspection apparatus, also can be that above-mentioned position regulator has: by above-mentioned sheet material substrate warpage and guide multiple rotating rollers of conveyance on long side direction; Make the driving mechanism that a part of rotating roller in the plurality of rotating roller moves in parallel along the direction of rotary middle spindle; With the control part controlling above-mentioned driving mechanism based on the above-mentioned change information measured by above-mentioned change measurement unit.
5th scheme of the present invention is above-mentioned device inspection apparatus, also can be that above-mentioned position regulator has: by above-mentioned sheet material substrate warpage and guide multiple rotating rollers of conveyance on long side direction; Make the drive division that the rotary middle spindle of a part of rotating roller in the plurality of rotating roller tilts; With the control part controlling above-mentioned drive division based on the above-mentioned change information measured by above-mentioned change measurement unit.
5th scheme of the present invention is above-mentioned device inspection apparatus, also can be, above-mentioned change measurement unit comprises sensor, this sensor is configured on the carrying channel of the above-mentioned sheet material substrate between above-mentioned 1st processing unit and above-mentioned 2nd processing unit, and the tilt variation on the Width of the above-mentioned sheet material substrate orthogonal with above-mentioned long side direction is detected as above-mentioned change information.
According to mode of the present invention, the vibration and the substrate board treatment, device inspection apparatus, device making method and the patterning device that expose well by exposing unit that can reduce further and exposing unit is brought can be provided.
Accompanying drawing explanation
Fig. 1 is the figure of the structure of the device inspection apparatus representing the 1st embodiment.
Fig. 2 is the figure of the structure represented when being simplified by the device inspection apparatus of the 1st embodiment.
Fig. 3 is the figure of a part of structure of the exposure device (substrate board treatment) representing the 1st embodiment.
Fig. 4 is the figure of a part of structure of the exposure device representing the 1st embodiment shown in Fig. 3.
Fig. 5 is the integrally-built figure of the exposing unit representing the 1st embodiment.
Fig. 6 is the figure representing the field of illumination of the exposing unit shown in Fig. 5 and the configuration of view field.
Fig. 7 is the figure of the structure of the projection optical system representing the exposing unit shown in Fig. 5.
Fig. 8 is the process flow diagram of the device making method representing the 1st embodiment.
Fig. 9 is the figure of a part of structure of the exposure device (substrate board treatment) representing the 2nd embodiment.
Figure 10 is the integrally-built figure of the exposing unit of the 2nd embodiment representing Fig. 9.
Figure 11 is the integrally-built figure of the exposing unit representing the 3rd embodiment.
Figure 12 is the figure of the structure of the exposure device representing the 4th embodiment.
Figure 13 is figure when observing the substrate transported in the exposure device shown in Figure 12 from+Z-direction side.
Figure 14 is figure when observing the substrate P transported between last roller in the position adjustment unit side shown in Figure 13 and first roller of exposing unit side from-Y-direction side.
Figure 15 is figure when observing the substrate transported by the swing roller shown in Figure 12 from-X-direction side.
Figure 16 is the figure of the structure representing the substrate adjustment part shown in Figure 12.
Figure 17 A is that the figure of the structure representing the 2nd substrate test section shown in Figure 12, Figure 17 B represent the figure being irradiated the light beam light in substrate by the 2nd substrate test section, and Figure 17 C is the figure representing the light beam light accepted by the 2nd substrate test section.
Figure 18 is the figure of the structure representing the relative position test section shown in Figure 12.
Figure 19 represents the sweep trace of some light and the figure of aligming microscope that are scanned on substrate by the photohead shown in Figure 12.
Figure 20 is the figure drawing the structure of unit representing the photohead shown in Figure 12.
Embodiment
Below, enumerate preferred embodiment, the substrate board treatment of the scheme that present invention will be described in detail with reference to the accompanying, device inspection apparatus, device making method and patterning device.In addition, the solution of the present invention is not limited to these embodiments, also comprises the scheme applying various change or improvement.That is, in the textural element of following record, comprise that those skilled in the art can easily expect, identical in fact textural element, can by appropriately combined for the textural element of following record.In addition, the omission of various textural element, displacement or change can be carried out in the scope not departing from main idea of the present invention.
[the 1st embodiment]
The substrate board treatment of the 1st embodiment is exposure device substrate being implemented to exposure-processed, and exposure device group enters implements various process in the device inspection apparatus manufacturing electron device to the substrate after exposure.First, device inspection apparatus is described.
< device inspection apparatus >
Fig. 1 is the figure of the structure of the device inspection apparatus 1 representing the 1st embodiment.Device inspection apparatus 1 shown in Fig. 1 manufactures the production line (flexible display production line) as the flexible display of electron device (also having the situation being called device).As flexible display, such as, there is OLED display etc.This device inspection apparatus 1 is so-called volume to volume (RolltoRoll) mode, namely, substrate (sheet material substrate) the P wound into rolls of flexibility is obtained supply volume FR1, this substrate P is sent from supply volume FR1, after implementing various process continuously to the substrate P sent, with reclaiming the substrate P after with volume FR2 retracting process.In the device inspection apparatus 1 of the 1st embodiment, show send substrate P as membranaceous sheet material from supply volume FR1 and roll up from supply substrate P that FR1 sends successively via n platform treating apparatus U1, U2, U3, U4, U5 ... Un is until furl the example in recovery volume FR2.First, the substrate P of the handling object becoming device inspection apparatus 1 is described.
The paper tinsel (foil) etc. that substrate P uses such as resin molding, is made up of metal or alloy such as stainless steels.As the material of resin molding, one or more the resin comprised in such as polyvinyl resin, acrylic resin, vibrin, ethylene-vinyl alcohol copolymer resin, Corvic, celluosic resin, polyamide, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin can be used.In addition, about thickness and the rigidity (Young modulus) of substrate P, as long as the scope that the fold that can not produce folding line and/or the non reversibility caused because buckling when transporting in substrate P is such.As electron device, when the display pannel, touch panel, colored filter, anti-electromagnetic wave filter etc. of manufacturing flexible, thickness is used to be the resin sheets such as the PET (polyethylene terephthalate) of 25 μm ~ about 200 μm or PEN (PEN).
For substrate P, expecting the selected not obvious large material of such as expansion coefficient, making it possible to the heat ignored in fact because being subject in the various process implemented substrate P and the deflection produced.In addition, if mix the inorganic fillers such as such as titanium dioxide, massicot, aluminium oxide, monox in as the resin molding of substrate, then also thermal expansivity can be reduced.In addition, the individual layers of substrate P can be the thickness manufactured with floating method for making etc. the be very thin glass of about 100 μm also can be the duplexer at the above-mentioned resin molding of this very thin glass bonding or the metal level such as aluminium, copper (paper tinsel) etc.
In addition, the flexibility of substrate P refers to, even if also can not cut off the power of substrate P applying deadweight degree or rupture and can make the character that this substrate P bends.In addition, by the power of degree of conducting oneself with dignity, bending character is also contained in flexibility.In addition, according to the material of substrate P, size, thickness, the film forming layer structure in substrate P, the environment etc. comprising temperature, humidity, flexible degree can change.In a word, as long as when substrate P being correctly wound in the conveyance direction conversion parts such as various conveyance rollers, swing roller on the carrying channel be located in the device inspection apparatus 1 of present embodiment, can buckle and produce folding line or transport substrate P swimmingly while damaged (destroy or break) occurs, then all can be described as flexible scope.
The substrate P of such formation becomes supply volume FR1 by wound into rolls, this supply volume FR1 is arranged on device inspection apparatus 1.The device inspection apparatus 1 being provided with supply volume FR1 repeats various process for the manufacture of electron device to rolling up the substrate P sent of FR1 from supply.Therefore, the substrate P after process becomes the state that multiple electron device is connected.That is, the substrate P sent from supply volume FR1 becomes the substrate of layout.In addition, substrate P can make its surface modification and activate by the pre-treatment of regulation in advance, or, also can be formed with fine next door structure (sag and swell) for precise pattern from the teeth outwards.
Substrate P after process is recovered as recovery volume FR2 by wound into rolls.Recovery volume FR2 is arranged on not shown cutter sweep.Substrate P after process is undertaken splitting (cutting) by each electron device by the cutter sweep being provided with recovery volume FR2, becomes multiple electron device thus.About the size of substrate P, such as, Width (becoming the direction of minor face) is of a size of about 10cm ~ 2m, and length direction (becoming the direction on long limit) is of a size of more than 10m.In addition, the size of substrate P is not limited to above-mentioned size.
With reference to Fig. 1, device inspection apparatus 1 is then described.In FIG, be orthogonal coordinate system that X-direction, Y-direction and Z-direction are orthogonal.X-direction is the conveyance direction of substrate P in surface level, is the direction linked by supply volume FR1 and recovery volume FR2.Y-direction is direction orthogonal with X-direction in surface level, is the Width of substrate P.Y-direction is the axis of supply volume FR1 and recovery volume FR2.Z-direction is the direction (vertical) orthogonal with X-direction and Y-direction.
Device inspection apparatus 1 has: the substrate feeding device 2 of supplying substrate P; The substrate P supplied by substrate feeding device 2 is implemented to the treating apparatus U1 ~ Un of various process; To the substrate retracting device 4 that the substrate P implementing process by treating apparatus U1 ~ Un reclaims; With higher level's control device (control part) 5 of each device of control device manufacturing system 1.
Substrate feeding device 2 can be provided with supply volume FR1 rotatably.Substrate feeding device 2 has: the driven roller R1 sending substrate P from installed supply volume FR1; With the marginal position controller EPC1 of the position on the Width (Y-direction) of adjustment substrate P.The table back of the body limit, two sides of driven roller R1 limit clamping substrate P rotates, and substrate P is sent along from supply volume FR1 towards the conveyance direction (+X-direction) of recovery volume FR2, substrate P is supplied to treating apparatus U1 ~ Un thus.Now, marginal position controller EPC1 collects the mode in the scope of ± tens μm ~ about tens μm to make the position of the edge of the end on the Width of substrate P relative to target location, substrate P is moved in the width direction, revises the position on the Width of substrate P.
Substrate retracting device 4 can be provided with recovery volume FR2 rotatably.Substrate retracting device 4 has: by the driven roller R2 of the substrate P after process to recovery volume FR2 side-lining; With the marginal position controller EPC2 of the position on the Width (Y-direction) of adjustment substrate P.Substrate retracting device 4 is rotated by the table back of the body limit, two sides of driven roller R2 limit clamping substrate P and substrate P is drawn along conveyance direction, and makes recovery roll up FR2 rotation, substrate P is rolled thus.Now, marginal position controller EPC2 is formed in the same manner as marginal position controller EPC1, revises the position on the Width of substrate P, produces deviation in the direction of the width with the end edge of the Width avoiding substrate P.
Treating apparatus U1 is the applying device of the surface application photonasty functional liquid to the substrate P supplied from substrate feeding device 2.As photonasty functional liquid, use such as photoresist, photonasty silane coupling agent, UV cured resin liquid, photonasty plating reducing solution etc.Treating apparatus U1 is provided with applying mechanism Gp1 and drier Gp2 in order from the upstream side of the conveyance direction of substrate P.Applying mechanism Gp1 has the pressure roller DR1 of substrate P winding and the application roll DR2 relative with pressure roller DR1.Applying mechanism Gp1, under the state that the substrate P of supply is wound in pressure roller DR1, clamps substrate P by pressure roller DR1 and application roll DR2.Further, applying mechanism Gp1 rotates by making pressure roller DR1 and application roll DR2, makes substrate P edge conveyance direction move limit and applies photonasty functional liquid by application roll DR2.The drying air such as drier Gp2 blowing hot air or dry air, remove the solute (solvent or water) comprised in photonasty functional liquid, make the substrate P being coated with photonasty functional liquid dry, form photonasty functional layer thus in substrate P.
The substrate P transported from treating apparatus U1 is heated to the heating arrangement of set point of temperature (such as, tens DEG C ~ about 120 DEG C) to make the photonasty functional layer be formed on the surface of substrate P stablize by treating apparatus U2.Treating apparatus U2 is provided with heated chamber HA1 and cooling chamber HA2 in order from the upstream side of the conveyance direction of substrate P.Heated chamber HA1 is provided with multiple roller and multiple air inversion bar (airturnbar) therein, and multiple roller and multiple air inversion bar constitute the transport path of substrate P.Multiple roller is arranged to rotate with the back side of substrate P the mode contacted, and the face side of substrate P is located at by multiple air inversion bar with contactless state.Multiple roller and multiple air inversion bar are configured to rivulose transport path to lengthen the transport path of substrate P.The substrate P limit passed through in heated chamber HA1 is heated to set point of temperature by along rivulose transport path conveyance limit.Substrate P in order to make the temperature of the substrate P in heated chamber HA1 after heating consistent with the environment temperature of subsequent handling (treating apparatus U3), and is cooled to environment temperature by cooling chamber HA2.Cooling chamber HA2 is provided with multiple roller therein, and multiple roller, in the same manner as heated chamber HA1, is configured to rivulose transport path to lengthen the transport path of substrate P.The substrate P limit passed through in cooling chamber HA2 is cooled by along rivulose transport path conveyance limit.Downstream side in the conveyance direction of cooling chamber HA2 is provided with driven roller R3, and driven roller R3 limit clamps the substrate P limit after passing through from cooling chamber HA2 and rotates, and substrate P is supplied towards treating apparatus U3 thus.
Treating apparatus (substrate board treatment) U3 is to the exposure device of the pattern from treating apparatus U2 supply, the circuit being formed with the substrate P projection exposure display pannel of photonasty functional layer on surface or wiring etc.Details will be described below, illuminating bundle throws light in the light shield M of transmission-type by treating apparatus U3, by the projected light beam by obtaining light shield M illumination illuminating bundle to the substrate P projection exposure in the outer peripheral face part being wound in swing roller (idler pulley) 25.Treating apparatus U3 has the marginal position controller EPC3 of the position on the Width (Y-direction) of driven roller R4 and the adjustment substrate P of the substrate P supplied from treating apparatus U2 being carried to the downstream side of conveyance direction.The table back of the body limit, two sides of driven roller R4 limit clamping substrate P rotates, and is sent by the downstream side of substrate P to conveyance direction, substrate P is supplied towards exposure position thus.Marginal position controller EPC3 is formed in the same manner as marginal position controller EPC1, becomes the mode of target location with the Width of the substrate P making exposure position place, revises the position on the Width of substrate P.In addition, treating apparatus U3 has two groups of driven rollers R5, R6, under the state imparting lax DL to the substrate P after exposure, is carried by the downstream side of substrate P to conveyance direction.Two groups of driven rollers R5, R6 configure in the conveyance direction of substrate P with separating predetermined distance.Driven roller R5 holds the upstream side of the substrate P of conveyance and rotates, and driven roller R6 holds the downstream side of the substrate P of conveyance and rotates, and substrate P is supplied towards treating apparatus U4 thus.Now, substrate P is owing to being endowed lax DL, so the variation of conveyance speed that the downstream side that can be absorbed in the conveyance direction compared with driven roller R6 produces, thus can block the impact of the exposure-processed on substrate P that the variation because transporting speed causes.In addition, in treating apparatus U3, be provided with to make the picture of a part for the mask pattern of light shield M and substrate P relatively contraposition (aligning) and aligming microscope AM1, AM2 of detecting the alignment mark etc. be previously formed in substrate P.
Treating apparatus U4 be to the exposure transported from treating apparatus U3 after substrate P carry out the wet type processing device of the development treatment, electroless plating process etc. of wet type.Treating apparatus U4 has therein along vertical (Z-direction) stratified three treatment troughs BT1, BT2, BT3 and multiple rollers of transporting substrate P.Multiple roller configures in the mode making substrate P and pass through from the inside of three treatment troughs BT1, BT2, BT3.Downstream side in the conveyance direction for the treatment of trough BT3 is provided with driven roller R7, and driven roller R7 limit clamps the substrate P limit after passing through from treatment trough BT3 and rotates, and substrate P is supplied towards treating apparatus U5 thus.
Although the diagram of omission, treating apparatus U5 is the drying device making the substrate P drying transported from treating apparatus U4.Moisture accompanying in substrate P after carry out wet processed in treating apparatus U4 is adjusted to the moisture of regulation by treating apparatus U5.Treating apparatus Un is transported to via some treating apparatus by the dried substrate P for the treatment of apparatus U5.And after processing in treating apparatus Un, substrate P is rolled by the recovery of substrate retracting device 4 volume FR2.
Higher level's control device 5 pairs of substrate feeding device 2, substrate retracting device 4 and multiple treating apparatus U1 ~ Un are all together control.Higher level's control device 5 controls substrate feeding device 2 and substrate retracting device 4, substrate P is transported from substrate feeding device 2 towards substrate retracting device 4.In addition, higher level's control device 5 synchronously controls multiple treating apparatus U1 ~ Un with the conveyance of substrate P, performs the various process for substrate P.The storage medium that this higher level's control device 5 comprises computing machine and has program stored therein, the program that this computing machine stores by performing storage medium, and play function as higher level's control device 5 of this 1st embodiment.
In addition, in the device inspection apparatus 1 of the 1st embodiment, to show from the substrate P sent of supply volume FR1 successively via the treating apparatus U1 ~ Un of n platform until furl the example rolling up FR2 in recoverys, but be not limited to this structure.Such as, device inspection apparatus 1 also can for furling the structure in recovery volume FR2 via 1 treating apparatus by the substrate P sent from supply volume FR1.Now, when carrying out different disposal to substrate P, using substrate feeding device 2 and substrate retracting device 4, substrate P is supplied different treating apparatus again.
The device inspection apparatus > that < simplifies
Next, in order to easily grasp characteristic of the present invention, with reference to Fig. 2, the device inspection apparatus 1 after being simplified by the device inspection apparatus 1 of Fig. 1 is described.Fig. 2 is the figure of the structure represented when being simplified by the device inspection apparatus 1 of the 1st embodiment.As shown in Figure 2, the device inspection apparatus 1 after simplification has substrate feeding device 2, treating apparatus U3 (hereinafter referred to as exposure device), substrate retracting device 4 and higher level's control device 5 as exposure device.In addition, in fig. 2, being the orthogonal coordinate system that X-direction, Y-direction and Z-direction are orthogonal, is the orthogonal coordinate system identical with Fig. 1.In addition, in device inspection apparatus 1 after simplification, substrate feeding device 2 is for eliminating the structure of marginal position controller EPC1.Its reason is, is provided with marginal position controller EPC3 in exposure device U3.First, with reference to Fig. 2, substrate feeding device 2 is described.
< substrate feeding device >
Substrate feeding device 2 has the 1st bearing portion 111 installing supply volume FR1 and the 1st elevating mechanism 112 that the 1st bearing portion 111 is elevated.In addition, substrate feeding device 2 has entry angle test section 114, and entry angle test section 114 is connected with higher level's control device 5.At this, in the 1st embodiment, higher level's control device 5 plays function as the control device (control part) of substrate feeding device 2.In addition, also can be configured to, as the control device of substrate feeding device 2, the subordinate's control device controlling substrate feeding device 2 is set, control substrate feeding device 2 by subordinate's control device.
1st bearing portion 111 can rotate ground axle suspension supply volume FR1.Axle is bearing in supply volume FR1 on the 1st bearing portion 111 when substrate P is supplied (sending) towards exposure device U3, with the sendout of substrate P correspondingly, the coil diameter that FR1 is rolled up in supply diminishes gradually.Therefore, sendout substrate P is sent from the position sent of supply volume FR1 according to substrate P and changing.
1st elevating mechanism 112 is located between installation surface E and the 1st bearing portion 111.It is mobile along Z-direction (vertical) that 1st elevating mechanism 112 makes the 1st bearing portion 111 and supply roll up together with FR1.1st elevating mechanism 112 is connected with higher level's control device 5, and higher level's control device 5 makes the 1st bearing portion 111 move along Z-direction by the 1st elevating mechanism 112, and the position that substrate P can be made thus to send from supply volume FR1 becomes assigned position.
Entry angle test section 114 detects the entry angle θ 1 entering into the substrate P of the carrying roller 127 of exposure device U3 described later.Entry angle test section 114 is located at around carrying roller 127.At this, entry angle θ 1 is in XZ face, the substrate P angulation of the straight line (parallel with Z axis) along vertical extension passed through from the central shaft of carrying roller 127 and the upstream side of carrying roller 127.Entry angle test section 114 is to connected higher level's control device 5 output detections result.
Higher level's control device 5 controls the 1st elevating mechanism 112 based on the testing result of entry angle test section 114.Specifically, higher level's control device 5, in the mode making entry angle θ 1 become prespecified aspect angle degree, controls the 1st elevating mechanism 112.That is, if substrate P from supply volume FR1 to send quantitative change many, then the coil diameter that FR1 is rolled up in supply diminishes, and becomes large thus relative to the entry angle θ 1 of aspect angle degree.Therefore, higher level's control device 5 makes the 1st elevating mechanism 112 move (decline) to the lower side of Z-direction, thus, reduces entry angle θ 1, revises in the mode making entry angle θ 1 become aspect angle degree.Like this, higher level's control device 5, based on the testing result of entry angle test section 114, in the mode making entry angle θ 1 become aspect angle degree, carries out FEEDBACK CONTROL to the 1st elevating mechanism 112.Therefore, because substrate feeding device 2 can relative to carrying roller 127 all the time with aspect angle degree supplying substrate P, so the impact brought substrate P because of the change of entry angle θ 1 can be reduced.In addition, as FEEDBACK CONTROL, can be the controls arbitrarily such as P controls, PI controls, PID controls.
< exposure device (substrate board treatment) >
Then, with reference to Fig. 3, the exposure device U3 shown in Fig. 2 is described simultaneously.Exposure device U3 comprises position adjustment unit 120, exposing unit 121, driver element 122 (with reference to Fig. 3), dipper crowding gear 130 and vibration-free tables (antihunting device) 131.Vibration-free tables 131 is located on installation surface E, and the vibration (so-called ground vibration) reduced from installation surface E is delivered to exposing unit 121 main body.Position adjustment unit 120 is located on installation surface E, comprises the above-mentioned marginal position controller EPC3 shown in Fig. 1 and forms.Position adjustment unit 120 is adjacent to arrange with substrate feeding device 2 in the X direction.Exposing unit 121 is located on vibration-free tables 131, is located at the opposition side of substrate feeding device 2 in the X direction across position adjustment unit 120.Driver element 122 (with reference to Fig. 3) is located on installation surface E, is adjacent to arrange in the Y direction with exposing unit 121.That is, position adjustment unit 120, exposing unit 121 and driver element 122 are located at diverse location on installation surface E.In addition, exposing unit 121 is mechanically unbound state (non-contacting separate state) with position adjustment unit 120 and driver element 122 (with reference to Fig. 3).
As known from the above, position adjustment unit 120 and driver element 122 are located on installation surface E, and on the other hand, exposing unit 121 is located on installation surface E via vibration-free tables 131.Therefore, exposing unit 121 becomes the vibration mode different from position adjustment unit 120 and driver element 122.In other words, exposing unit 121 is arranged with the state blocked in vibration transmission from position adjustment unit 120 and driver element 122 (being difficult to the state of transmission vibration mutually, i.e. the state of effectively isolated vibration).
In addition, exposure device U3 has the 1st substrate test section 123 and the 2nd substrate test section 124 of the position detecting substrate P.1st substrate test section 123 and the 2nd substrate test section 124 are connected with higher level's control device 5.In addition, in exposure device U3, in the same manner as substrate feeding device 2, higher level's control device 5 also plays function as the control device (control part) of exposure device U3.In addition, also can be configured to, as the control device of exposure device U3, the subordinate's control device controlling exposure device U3 is set, control exposure device U3 by subordinate's control device.
< position adjustment unit >
As shown in Figure 2, position adjustment unit 120 has base station 125, above-mentioned marginal position controller EPC3 (Width travel mechanism) and stationary roll 126.Base station 125 is located on installation surface E, support edge positioner EPC3 and stationary roll 126.Base station 125 also can for having the vibration-free tables of vibration-damping function.On this base station 125, be provided with the position of base station 125 along Y-direction or the base station position adjusting mechanism 128 that adjusts around the sense of rotation of Z axis.Base station position adjusting mechanism 128 is connected with higher level's control device 5, and higher level's control device 5 can adjust by controlling base station position adjusting mechanism 128 position being arranged on marginal position controller EPC3 on base station 125 and stationary roll 126 together.That is, base station position adjusting mechanism 128 plays function as the roller position adjusting mechanism of the position adjusting stationary roll 126 relative to exposing unit 121 along Y-direction.
Marginal position controller EPC3 can be mobile along the Width (Y-direction) of substrate P on base station 125.Marginal position controller EPC3 has to comprise and is located at substrate P by the multiple rollers of the carrying roller 127 of the side, most upstream of conveyance direction transported.The inside of the substrate P supplied from substrate feeding device 2 to position adjustment unit 120 guides by carrying roller 127.Marginal position controller EPC3 is connected with higher level's control device 5, based on the 1st substrate test section 123 testing result and controlled by higher level's control device 5.
Substrate P after carrying out position adjustment in the width direction by marginal position controller EPC3 guides towards exposing unit 121 by stationary roll 126.Stationary roll 126 can rotate, and is fixing relative to the position of base station 125.Therefore, by making substrate P move in the width direction by marginal position controller EPC3, and the position on the Width of the substrate P entering into stationary roll 126 can be adjusted.
1st substrate test section 123 detects the position be transported to from marginal position controller EPC3 the Width of the substrate P of stationary roll 126.1st substrate test section 123 is fixed on base station 125.Therefore, the 1st substrate test section 123 is the vibration mode identical with marginal position controller EPC3 and stationary roll 126.1st substrate test section 123 detects the position of rotating the edge of the end of the substrate P contacted with stationary roll 126.1st substrate test section 123 is to connected higher level's control device 5 output detections result.
2nd substrate test section 124 detects the position of the substrate P being supplied to exposing unit 121 from position adjustment unit 120.2nd substrate test section 124 is fixed on and is provided with on the vibration-free tables 131 of exposing unit 121.Therefore, the 2nd substrate test section 124 becomes the vibration mode identical with exposing unit 121.2nd substrate test section 124 is located at the introduction side of the importing substrate P of exposing unit 121.Specifically, the position of the upstream side of the guide reel 28 of the most upstream side of the 2nd substrate test section 124 in the conveyance direction being located at exposing unit 121, is adjacent to arrange with guide reel 28.2nd substrate test section 124 detects the position be supplied in the Width (Y-direction) of the substrate P of exposing unit 121 and vertical (Z-direction).2nd substrate test section 124 is to connected higher level's control device 5 output detections result.
Higher level's control device 5 controls marginal position controller EPC3 based on the testing result of the 1st substrate test section 123.Specifically, higher level's control device 5 calculates the difference between the center in the Y-direction obtained according to the position at the edge (two edges of Y-direction) rotating the both ends of the substrate P contacting (entering stationary roll 126) with stationary roll 126 detected by the 1st substrate test section 123 and prespecified the 1st target location (target's center position).Then, higher level's control device 5 carries out FEEDBACK CONTROL with the mode edge positioner EPC3 making this difference and become zero, substrate P is moved in the width direction, substrate P is modified to the 1st target's center position relative to stationary roll 126 center in the direction of the width.Therefore, because substrate P can be maintained the 1st target location relative to stationary roll 126 position in the direction of the width by marginal position controller EPC3, so substrate P can be reduced relative to stationary roll 126 position skew in the direction of the width.In addition, in this situation, can be the controls arbitrarily such as P controls, PI controls, PID controls as FEEDBACK CONTROL.
In addition, higher level's control device 5 controls base station position adjusting mechanism 128 based on the testing result of the 2nd substrate test section 124.Specifically, higher level's control device 5 calculates the difference between the center obtained according to the position at the two ends on the Width of the substrate P detected by the 2nd substrate test section 124 and the 2nd prespecified target's center position.Then, higher level's control device 5 carries out FEEDBACK CONTROL in the mode making this difference and become zero to base station position adjusting mechanism 128, adjusted the position of base station 125 by base station position adjusting mechanism 128, thus, adjustment stationary roll 126 is relative to guide reel 28 position in the Y direction.Now, higher level's control device 5 is to avoid the mode of the position skew produced in substrate P on distortion and Width, the position of adjustment stationary roll 126.Such as, higher level's control device 5 is to make the axis of stationary roll 126 mode parallel with the axis of guide reel 28 to adjust position.And, higher level's control device 5 passes through base station position adjusting mechanism 128 along Y-direction or the position adjusting stationary roll 126 around the sense of rotation of Z axis, the center be supplied on the Width of the substrate P of exposing unit 121 can be maintained the 2nd target's center position thus, thus the position skew on the distortion of substrate P and Width can be reduced.In addition, in this situation, as FEEDBACK CONTROL, can be the controls arbitrarily such as P controls, PI controls, PID controls.
Like this, the position correction be supplied on the Width of the substrate P of stationary roll 126 can be the 1st target location by position adjustment unit 120, can be the 2nd target location by the position correction being supplied to the substrate P of the guide reel 28 of exposing unit 121.
In addition, in the 1st embodiment, revise the position of the substrate P being supplied to exposing unit 121 from position adjustment unit 120, but be not limited to this structure, such as, also can revise the position of the substrate P being supplied to position adjustment unit 120 from substrate feeding device 2.In this situation, while the upstream side in the conveyance direction of carrying roller 127 arranges substrate test section, the volume position adjusting mechanism that the position of FR1 is rolled up in adjustment supply can be set.Further, higher level's control device 5 controls to roll up position adjusting mechanism based on the testing result of substrate test section, adjusts supply volume FR1 thus.Similarly, the position of the substrate P being supplied to substrate retracting device 4 from exposing unit 121 can also be revised.
< exposing unit >
Then, the structure of the exposing unit 121 of the exposure device U3 of the 1st embodiment is described with reference to Fig. 2 to Fig. 7.The figure of Fig. 3 to be the figure of a part of structure of exposure device (substrate board treatment) U3 representing the 1st embodiment, Fig. 4 be structure of the drive division of the base supporting mechanism 12 represented in Fig. 3.Fig. 5 is the integrally-built figure of the exposing unit 121 representing the 1st embodiment.Fig. 6 is the figure representing the field of illumination IR of the exposing unit 121 shown in Fig. 5 and the configuration of view field PA.Fig. 7 is the figure of the structure of the projection optical system PL representing the exposing unit 121 shown in Fig. 5.
Exposing unit 121 shown in Fig. 2 to Fig. 5 is so-called scanning-exposure apparatus, limit by multiple guide reels 28 of forming base supporting mechanism (substrate transport mechanism) 12 and the swing roller 25 of cylindrical shape that can rotate by substrate P along conveyance direction (direction of scanning) conveyance, while by the picture projection exposure of mask pattern that is formed on the plane light shield M surface to substrate P.In addition, the orthogonal coordinate system that Fig. 3 and Fig. 4 to be the figure observed from-X side of exposing unit 121, Fig. 5 and Fig. 7 be X-direction, Y-direction and Z-direction is orthogonal is the orthogonal coordinate system identical with Fig. 1.
First, the light shield M used in exposing unit 121 is described.The face (light shield face P1) that light shield M is made for such as good at flatness glass plate is formed with the plane light shield of the transmission-type of mask pattern with light shield layers such as chromium, uses being held under the state on light shield microscope carrier 21 described later.Light shield M has the non-formation region of the pattern not forming mask pattern, and in pattern non-formation region, place is installed on light shield microscope carrier 21.Light shield M can discharge relative to light shield microscope carrier 21.
In addition, light shield M can be formed with entirety or the part of the panel pattern corresponding with display device, also can for being formed with the layout of the panel pattern corresponding with multiple display device.In addition, on light shield M, can repeat to be formed with multiple panel pattern along the direction of scanning of light shield M (X-direction), also can repeat along the direction (Y-direction) orthogonal with direction of scanning to be formed with multiple small-sized panel pattern.And, light shield M can also be formed the 1st display device panel pattern and compared with the 1st display device the panel pattern of the 2nd display device that size etc. is different.
As shown in Fig. 3, Fig. 5, be arranged at exposing unit 121 on vibration-free tables 131 except above-mentioned aligming microscope AM1, AM2, also there is device frame 132, the light shield maintaining body 11 of supporting light shield microscope carrier 21, base supporting mechanism 12, projection optical system PL and subordinate's control device (control part) 16.This exposing unit 121 accepts the irradiation of the illuminating bundle EL1 from lighting mechanism 13, the substrate P projection of the transmitted light (imaging beam) mask pattern from the light shield M being held in light shield maintaining body 11 produced on the swing roller 25 being supported on base supporting mechanism 12, is imaged onto the surface of substrate P by the projection image of a part for mask pattern.
Subordinate's control device 16 controls each several part of exposure device U3, makes each several part perform process.Subordinate's control device 16 can be part or all of higher level's control device 5 of device inspection apparatus 1.In addition, subordinate's control device 16 can be controlled and the device different from higher level's control device 5 by higher level's control device 5.Subordinate's control device 16 such as comprises computing machine.
Vibration-free tables 131 to be located on installation surface E and fulcrum arrangement framework 132.Specifically, as shown in Figure 3, vibration-free tables 131 comprises the 1st vibration-free tables 131a being located at outside in the Y direction and the 2nd vibration-free tables 131b be located at inside the 1st vibration-free tables 131a.
Device frame 132 is located on the 1st vibration-free tables 131a and the 2nd vibration-free tables 131b, and supports light shield maintaining body 11, base supporting mechanism 12, lighting mechanism 13 and projection optical system PL.Device frame 132 has supporting light shield maintaining body 11, lighting mechanism 13 and the 1st framework 132a of projection optical system PL and the 2nd framework 132b of supporting substrates supporting device 12.1st framework 132a and the 2nd framework 132b is separately arranged, and the 1st framework 132a configures in the mode covering the 2nd framework 132b.1st framework 132a is located on the 1st vibration-free tables 131a, and the 2nd framework 132b is located on the 2nd vibration-free tables 131b.
1st framework 132a is made up of at the arm 137 of the 1st top frame 136 the 1st time square bearer 135 be located on the 1st vibration-free tables 131a, the 1st top frame 136 and erecting that is located at the top of the Z-direction of the 1st time square bearer 135.1st time square bearer 135 has the leg 135a erected on the 1st vibration-free tables 131a and the upper surface part 135b being supported on leg 135a, and upper surface part 135b is supported with projection optical system PL via holding member 143.When holding member 143 is observed in XY face, by with being configured at the gasket part 145 based on Metal Ball etc. at three places on upper surface part 135b and passive movement (kinematically) supporting.Leg 135a is configured in the position of regulation, interts along Y-direction to make the turning axle AX2 of swing roller 25 described later.
1st top frame 136 is also in the same manner as the 1st time square bearer 135, there is the leg 136a erected on upper surface part 135b and the upper surface part 136b being supported on leg 136a, upper surface part 136b is supported with light shield maintaining body 11 (light shield microscope carrier 21).Arm 137 erects on upper surface part 136b, supports lighting mechanism 13 in the mode making lighting mechanism 13 be positioned at the top of light shield maintaining body 11.
2nd framework 132b is made up of the lower surface portion 139 erected on the 2nd vibration-free tables 131b and the pair of bearings portion 140 that erects separatedly along Y-direction in lower surface portion 139.Pair of bearings portion 140 is provided with the air bearing 141 of the turning axle AX2 of the rotation center becoming swing roller 25 being carried out to axle supporting.
Light shield maintaining body 11 has: keep the light shield microscope carrier (light shield holding member) 21 of light shield M, for making not shown travel mechanism's (Linear guide, air bearing etc.) of light shield microscope carrier 21 movement and the transferring elements 23 for transmitting power to travel mechanism.Light shield microscope carrier 21 is configured to the frame-shaped of the pattern forming region of surrounding light shield M, moves on the upper surface part 136b of the 1st top frame 136 by being located at light shield side drive division on driver element 122 drive sources such as () motors 22 along the X-direction becoming direction of scanning.The driving force transmitted from transferring elements 23 by travel mechanism for the linear drives of light shield microscope carrier 21.
In the present embodiment, light shield microscope carrier 21 is in order to carry out scan exposure and rectilinear motion in X direction, therefore, light shield side drive division (drive source) 22 is included in the magnet track (stator) of the linear motor that newel frame 146 is fixed in X direction extended mode, and transferring elements 23 comprises with this magnet track with the coil unit (mover) of the relative linear motor in fixed interval (FI).In addition, in figure 3, on the holding member 143 projection optical system PL being supported on device frame 132 side, the displacement transducer SG1 that the height change being provided with in the outer peripheral face (or surface of substrate P) to swing roller 25, corresponding with the exposure position exposed based on projection optical system PL surface measures; With the displacement transducer SG2 that the downside from light shield microscope carrier 21 measures the change in location in the Z-direction of light shield M.
On the other hand, as shown in Figure 2 and Figure 3, within the scope of roughly half cycle, the swing roller 25 of supporting substrates P is reeled by being located at the substrate-side drive division (drive source such as rotation motor) 26 of the driver element 122 shown in Fig. 3 and rotating.As shown in Figure 5, swing roller 25 is formed as drum, and this drum has the outer peripheral face (periphery) that the radius-of-curvature centered by the turning axle AX2 to extend along Y-direction is Rfa simultaneously.At this, the center line of turning axle AX2 will be comprised and the face parallel with YZ face is set to central plane CL (with reference to Fig. 5).A part for the periphery of swing roller 25 becomes the carrying plane P2 of the tension force supporting substrates P specified.That is, swing roller 25 to reel substrate P with fixing tension force on its carrying plane P2, substrate P can be supported with stable cylinder curved thus.
By each air bearing 141 of the bearing portion 140 axle supporting rotating shaft AX2 of both sides with non-contacting state rotatable earth's axis supporting rotating shaft AX2.In addition, in the present embodiment, at the two ends of swing roller 25 by air bearing 141 supporting rotating shaft AX2, but also can be the common bearing of ball or the needle roller using high precision to process.As shown in figures 2 and 5, multiple guide reel 28 is located at upstream side and the downstream side of the conveyance direction of substrate P respectively across swing roller 25.Such as guide reel 28 is provided with four altogether, two upstream sides being configured at conveyance direction, two downstream sides being configured at conveyance direction.
Therefore, the substrate P transported from position adjustment unit 120 is guided to swing roller 25 by two guide reels 28 by base supporting mechanism 12.Base supporting mechanism 12 is by substrate-side drive division 26 and via turning axle AX2, swing roller 25 is rotated, and thus, is transported on the substrate P limit being directed into swing roller 25 by the carrying plane P2 side-strut of swing roller 25 towards guide reel 28.The substrate P being transported to guide reel 28 guides towards substrate retracting device 4 by base supporting mechanism 12.
At this, an example of the structure of substrate-side drive division 26 is described with reference to Fig. 4.In the diagram, at least one side of swing roller 25 of winding substrate P, be fixed with the roughly the same discoideus Measure Board 25c of the radius R fa of the outer surface 25a of radius and swing roller 25 coaxially with turning axle AX2.The outer peripheral face of this Measure Board 25c is circumferentially formed with diffraction grating with constant spacing, detect this diffraction grating optically by the read head EH measured by scrambler, measure the amount of movement in the circumference of the anglec of rotation of swing roller 25 or the surperficial 25a of swing roller 25.The rotation angle information of the swing roller 25 measured by read head EH etc. are also as the servo-controlled feedback signal of the motor making swing roller 25 rotate.In addition, in the diagram, displacement transducer SG1 is configured to the displacement (radial displacement) of the height and position on the surface measuring substrate P, but also can be configured to the displacement (radial displacement) of the height and position on the surface of the region 25b of the end side measuring the swing roller 25 do not covered by substrate P.
In the end side of the turning axle AX2 supported by air bearing 141 axle, be provided with the magnet unit Mur that produces around the rotation motor of the moment of torsion of turning axle AX2 with the rotor R T of annular arrangement and the magnet unit MUs of voice coil motor turning axle AX2 being given to axial thrust.In the stator side of the newel frame 146 be fixed in Fig. 3, be provided with the coil unit CUr that configures in the mode relative with the magnet unit Mur around rotor R T and with the coil unit CUs be rolled into around the mode of magnet unit MUs.By such structure, the swing roller 25 (and Measure Board 25c) integrated with turning axle AX2 can be made to be rotated smoothly by the moment of torsion given rotor R T.
In addition, voice coil motor (MUs, CUs) even if the thrust on the direction (Y-direction) of turning axle AX2 also can be produced in the rotation of swing roller 25, therefore, it is possible to make swing roller 25 (and Measure Board 25c) along Y-direction fine motion.Thereby, it is possible to successively revise the small position skew in the Y-direction of the substrate P in scan exposure.
In addition, in the structure of Fig. 4, be provided with the displacement transducer DT1 that the displacement in the Y-direction of the end face Tp of turning axle AX2 is measured or the displacement transducer DT2 that the displacement in the Y-direction of the end face of Measure Board 25c is measured, the change in location in the Y-direction of the swing roller 25 in scan exposure can be measured in real time successively.Therefore, as long as carry out servocontrol based on the measurement signal from these displacement transducers DT1, DT2 to voice coil motor (MUs, CUs), just can accurately by the location, position in the Y-direction of swing roller 25.
At this, as shown in Figure 6, the exposure device U3 of the 1st embodiment is the exposure device being assumed to be so-called poly-lens mode.In addition, in figure 6, show the planimetric map (the left figure of Fig. 6) observed from-Z side of the field of illumination IR (IR1 ~ IR6) be held on the light shield M of light shield microscope carrier 21 and be supported on the planimetric map (the right figure of Fig. 6) observed from+Z side of the view field PA (PA1 ~ PA6) the substrate P of swing roller 25.Reference numeral Xs in Fig. 6 represents the direction of scanning (sense of rotation) of light shield microscope carrier 21 and swing roller 25.The exposure device U3 of poly-lens mode irradiates illuminating bundle EL1 respectively to multiple (being such as six in the 1st embodiment) field of illumination IR1 ~ IR6 on light shield M, by the multiple projected light beam EL2 obtained in each field of illumination IR1 ~ IR6 because each illuminating bundle EL1 is illuminated to multiple (being such as six in the 1st embodiment) view field PA1 ~ PA6 projection exposure in substrate P.
First, the multiple field of illumination IR1 ~ IR6 thrown light on by lighting mechanism 13 are described.As shown in Figure 6, multiple field of illumination IR1 ~ IR6 is configured to two row across central plane CL along the direction of scanning of substrate P, the light shield M of the upstream side in direction of scanning is configured with field of illumination IR1, IR3 and IR5, the light shield M of the downstream side in direction of scanning is configured with field of illumination IR2, IR4 and IR6.Each field of illumination IR1 ~ IR6 is the region of the elongated trapezoidal shape with parallel minor face that the Width (Y-direction) along light shield M extends and long limit.Now, each field of illumination IR1 ~ IR6 of trapezoidal shape is the region that its minor face is positioned at central plane CL side, its long limit is positioned at outside.Field of illumination IR1, IR3 and IR5 of odd number separate the interval of regulation along Y-direction and configure.In addition, field of illumination IR2, IR4 and IR6 of even number separate the interval of regulation along Y-direction and configure.Now, field of illumination IR2 is configured between field of illumination IR1 and field of illumination IR3 in the Y direction.Similarly, field of illumination IR3 is configured between field of illumination IR2 and field of illumination IR4 in the Y direction.Field of illumination IR4 is configured between field of illumination IR3 and field of illumination IR5 in the Y direction.Field of illumination IR5 is configured between field of illumination IR4 and field of illumination IR6 in the Y direction.Each field of illumination IR1 ~ IR6, when observing from the direction of scanning of light shield M, configures in the mode of the triangular part overlap (overlap) in the hypotenuse portion of the field of illumination of adjacent trapezoidal shape.In addition, in the 1st embodiment, each field of illumination IR1 ~ IR6 is the region of trapezoidal shape, but also can be OBL region.
In addition, light shield M has the pattern forming region A3 being formed with mask pattern and the non-formation region A4 of the pattern not forming mask pattern.Pattern non-formation region A4 is the low reflector space absorbing illuminating bundle EL1, and is configured with surrounding with frame-shaped by pattern forming region A3.Field of illumination IR1 ~ IR6 configures in the mode of the whole width in the Y-direction of overlay pattern forming region A3.
Lighting mechanism 13 penetrates the illuminating bundle EL1 thrown light on to light shield M.Lighting mechanism 13 has light supply apparatus and lamp optical system IL.Light supply apparatus comprises the solid light sources such as the lamp source such as such as mercury vapor lamp, laser diode or light emitting diode (LED).The illumination light of light supply apparatus injection is such as from the bright line (g line, h line, i line) of lamp source injection, extreme ultraviolet light (DUV light), the ArF excimer laser (wavelength 193nm) etc. such as KrF excimer laser (wavelength 248nm).Homogenized from the Illumination Distribution of the illumination light of light supply apparatus injection, import to lamp optical system IL via light guide members such as such as optical fiber.
Lamp optical system IL and multiple field of illumination IR1 ~ IR6 is correspondingly provided with multiple (being such as six in the 1st embodiment) lighting module IL1 ~ IL6.Illuminating bundle EL1 from light supply apparatus incides in multiple lighting module IL1 ~ IL6 respectively.Illuminating bundle EL1 from light supply apparatus incidence guides respectively to each field of illumination IR1 ~ IR6 by each lighting module IL1 ~ IL6.That is, illuminating bundle EL1 guides to field of illumination IR1 by lighting module IL1, and similarly, illuminating bundle EL1 guides to field of illumination IR2 ~ IR6 by lighting module IL2 ~ IL6.Multiple lighting module IL1 ~ IL6 is configured to two row across central plane CL along the direction of scanning of light shield M.Lighting module IL1, IL3 and IL5 are configured in the configuration side (left side of Fig. 5) of field of illumination IR1, IR3 and IR5 relative to central plane CL.Lighting module IL1, IL3 and IL5 separate the interval of regulation along Y-direction and configure.In addition, lighting module IL2, IL4 and IL6 is configured in the configuration side (right side of Fig. 5) of field of illumination IR2, IR4 and IR6 relative to central plane CL.Lighting module IL2, IL4 and IL6 separate the interval of regulation along Y-direction and configure.Now, lighting module IL2 is configured between lighting module IL1 and lighting module IL3 in the Y direction.Similarly, lighting module IL3 is configured between lighting module IL2 and lighting module IL4 in the Y direction.Lighting module IL4 is configured between lighting module IL3 and lighting module IL5 in the Y direction.Lighting module IL5 is configured between lighting module IL4 and lighting module IL6 in the Y direction.In addition, lighting module IL1, IL3 and IL5 and lighting module IL2, IL4 and IL6 configure centered by central plane CL symmetrically when observing from Y-direction.
Multiple lighting module IL1 ~ IL6 comprises multiple opticses such as such as integrator optical system, bar lens, fly's-eye lens respectively, is thrown light on to each field of illumination IR1 ~ IR6 by Illumination Distribution uniform illuminating bundle EL1.In the 1st embodiment, multiple lighting module IL1 ~ IL6 is configured in the upper side in the Z-direction of light shield M.Multiple lighting module IL1 ~ IL6 throws light on from each field of illumination IR of the upper side of light shield M to the mask pattern be formed at light shield M respectively.
Next, the multiple view field PA1 ~ PA6 being projected exposure by projection optical system PL are described.As shown in Figure 6, the multiple view field PA1 ~ PA6 in substrate P and the multiple field of illumination IR1 ~ IR6 on light shield M configures accordingly.That is, multiple view field PA1 ~ PA6 in substrate P are configured to two row across central plane CL along conveyance direction, the substrate P of the upstream side of conveyance direction (direction of scanning) is configured with view field PA1, PA3 and PA5, the substrate P of the downstream side of conveyance direction is configured with view field PA2, PA4 and PA6.Each view field PA1 ~ PA6 is the region of the elongated trapezoidal shape with minor face that the Width (Y-direction) along substrate P extends and long limit.Now, each view field PA1 ~ PA6 of trapezoidal shape is the region that its minor face is positioned at central plane CL side, its long limit is positioned at outside.View field PA1, PA3 and PA5 separate the interval of regulation in the width direction and configure.In addition, view field PA2, PA4 and PA6 separates the interval of regulation in the width direction and configures.Now, view field PA2 being axially configured between view field PA1 and view field PA3 at turning axle AX2.Similarly, view field PA3 being axially configured between view field PA2 and view field PA4 at turning axle AX2.View field PA4 being axially configured between view field PA3 and view field PA5 at turning axle AX2.View field PA5 being axially configured between view field PA4 and view field PA6 at turning axle AX2.Each view field PA1 ~ PA6, in the same manner as each field of illumination IR1 ~ IR6, when observing from the conveyance direction of substrate P, configures in the mode of the triangular part overlap (overlap) in the hypotenuse portion of the view field PA of adjacent trapezoidal shape.Now, view field PA is exposure in the repeat region of adjacent view field PA and the identical such shape of exposure essence in not repeat region.And view field PA1 ~ PA6 configures in the mode of the whole width in the Y-direction of the exposure area A7 that covered substrate P will expose.
At this, in Figure 5, when observing in XZ face, copy the girth essence of central point to the central point of view field PA2 (and PA4, PA6) of the view field PA1 (and PA3, PA5) in the substrate P of carrying plane P2 equal from the length setting Cheng Yucong of central point to the central point of field of illumination IR2 (and IR4, IR6) of the field of illumination IR1 (and IR3, IR5) light shield M.
In addition, as shown in Figure 5, projection optical system PL and multiple view field PA1 ~ PA6 is correspondingly provided with multiple (being such as six in the 1st embodiment) projection module PL1 ~ PL6.Multiple projected light beam EL2 from multiple field of illumination IR1 ~ IR6 incide multiple projection module PL1 ~ PL6 respectively.Each projected light beam EL2 from light shield M guides respectively to each view field PA1 ~ PA6 by each projection module PL1 ~ PL6.That is, the projected light beam EL2 from field of illumination IR1 guides to view field PA1 by projection module PL1, and similarly, each projected light beam EL2 from field of illumination IR2 ~ IR6 guides to view field PA2 ~ PA6 by projection module PL2 ~ PL6.Multiple projection module PL1 ~ PL6 is configured to two row across central plane CL along the direction of scanning of light shield M.Projection module PL1, PL3 and PL5 are configured in the configuration side (left side of Fig. 5) of view field PA1, PA3 and PA5 relative to central plane CL.Projection module PL1, PL3 and PL5 separate the interval of regulation along Y-direction and configure.In addition, projection module PL2, PL4 and PL6 is configured in the configuration side (right side of Fig. 5) of view field PA2, PA4 and PA6 relative to central plane CL.Projection module PL2, PL4 and PL6 separate the interval of regulation along Y-direction and configure.Now, projection module PL2 being axially configured between projection module PL1 and projection module PL3 at turning axle AX2.Similarly, projection module PL3 being axially configured between projection module PL2 and projection module PL4 at turning axle AX2.Projection module PL4 being axially configured between projection module PL3 and projection module PL5 at turning axle AX2.Projection module PL5 being axially configured between projection module PL4 and projection module PL6 at turning axle AX2.In addition, projection module PL1, PL3 and PL5 and projection module PL2, PL4 and PL6 configure centered by central plane CL symmetrically when observing from Y-direction.
Multiple projection module PL1 ~ PL6 and multiple lighting module IL1 ~ IL6 is arranged accordingly.That is, the picture of the mask pattern of the field of illumination IR1 thrown light on by lighting module IL1 projects to the view field PA1 in substrate P by projection module PL1.Similarly, the picture of the mask pattern of the field of illumination IR2 ~ IR6 thrown light on by lighting module IL2 ~ IL6 projects to the view field PA2 ~ PA6 in substrate P by projection module PL2 ~ PL6.
Next, with reference to Fig. 7, each projection module PL1 ~ PL6 is described.In addition, each projection module PL1 ~ PL6 is identical structure, is therefore described for projection module PL1.
The picture of the mask pattern in the field of illumination IR (field of illumination IR1) on light shield M is projected on the view field PA in substrate P by projection module PL1.As shown in Figure 7, projection module PL1 has: the 1st optical system 61 picture of the mask pattern in the IR of field of illumination being imaged in intermediate image plane P7; By 2nd optical system 62 of the re-imaging at least partially of the intermediary image by the 1st optical system 61 imaging in the view field PA of substrate P; With the projection visual field diaphragm 63 be configured on the intermediate image plane P7 supplying intermediary image formation.In addition, projection module PL1 has focus correction optics 64, image shift optics 65, multiplying power correction optics 66 and curl correction mechanism 67.
1st optical system 61 and the 2nd optical system 62 are the reflection and refraction optical system of the heart far away such as Dai Sen (Dyson) system variant obtained.The optical axis (hereinafter referred to as the 2nd optical axis BX2) of the 1st optical system 61 is orthogonal in fact relative to central plane CL.1st optical system 61 has the 1st deflection component 70, the 1st lens combination 71 and the 1st concave mirror 72.1st deflection component 70 is the triangular prisms with the 1st reflecting surface P3 and the 2nd reflecting surface P4.1st reflecting surface P3 makes the projected light beam EL2 from light shield M reflect and the projected light beam EL2 of reflection to be passed through and to the face of the 1st concave mirror 72 incidence from the 1st lens combination 71.2nd reflecting surface P4 passes through and face that is incident and that reflected towards projection visual field diaphragm 63 by the projected light beam EL2 of incidence from the 1st lens combination 71 for the projected light beam EL2 reflected by the 1st concave mirror 72.1st lens combination 71 comprises various lens, and the optical axis of various lens is configured on the 2nd optical axis BX2.1st concave mirror 72 be configured in by multiple pointolites of being generated by fly's-eye lens by from fly's-eye lens via illumination visual field diaphragm until the pupil plane of the various lens of the 1st concave mirror 72 and imaging.
Projected light beam EL2 from light shield M passes through from focus correction optics 64 and image shift optics 65, and reflect at the 1st reflecting surface P3 of the 1st deflection component 70, to pass through and incident to the 1st concave mirror 72 from the area of visual field of the first half of the 1st lens combination 71.The projected light beam EL2 inciding the 1st concave mirror 72 reflects at the 1st concave mirror 72, to pass through and the 2nd reflecting surface P4 to the 1st deflection component 70 is incident from the area of visual field of the latter half of the 1st lens combination 71.The projected light beam EL2 inciding the 2nd reflecting surface P4 reflects at the 2nd reflecting surface P4, and incident to projection visual field diaphragm 63.
Projection visual field diaphragm 63 has the opening of the shape specifying view field PA.That is, the shape of the opening of projection visual field diaphragm 63 specifies the shape of view field PA.
2nd optical system 62 is structures identical with the 1st optical system 61, arranges symmetrically across intermediate image plane P7 and the 1st optical system 61.The optical axis (hereinafter referred to as the 3rd optical axis BX3) of the 2nd optical system 62 is orthogonal in fact relative to central plane CL, parallel with the 2nd optical axis BX2.2nd optical system 62 has the 2nd deflection component 80, the 2nd lens combination 81 and the 2nd concave mirror 82.2nd deflection component 80 has the 3rd reflecting surface P5 and the 4th reflecting surface P6.3rd reflecting surface P5 makes the projected light beam EL2 from projection visual field diaphragm 63 reflect and the projected light beam EL2 of reflection to be passed through and to the face of the 2nd concave mirror 82 incidence from the 2nd lens combination 81.4th reflecting surface P6 to pass through and incident and make the face that incident projected light beam EL2 reflects towards view field PA from the 2nd lens combination 81 for the projected light beam EL2 that reflected by the 2nd concave mirror 82.2nd lens combination 81 comprises various lens, and the optical axis of various lens is configured on the 3rd optical axis BX3.2nd concave mirror 82 be configured in by multiple pointolite pictures of imaging in the 1st concave mirror 72 by from the 1st concave mirror 72 via projection visual field diaphragm 63 until the pupil plane of the various lens of the 2nd concave mirror 82 and imaging.
Projected light beam EL2 from projection visual field diaphragm 63 reflect at the 3rd reflecting surface P5 of the 2nd deflection component 80, to pass through and to the 2nd concave mirror 82 incidence from the area of visual field of the first half of the 2nd lens combination 81.The projected light beam EL2 inciding the 2nd concave mirror 82 reflects at the 2nd concave mirror 82, to pass through and the 4th reflecting surface P6 to the 2nd deflection component 80 is incident from the area of visual field of the latter half of the 2nd lens combination 81.The projected light beam EL2 inciding the 4th reflecting surface P6 reflects at the 4th reflecting surface P6, passes through and project to view field PA from multiplying power correction optics 66.Thus, the picture of the mask pattern in the IR of field of illumination is projected on view field PA with equimultiple (× 1).
Focus correction optics 64 is configured between light shield M and the 1st optical system 61.The adjustment of focus correction optics 64 is projected on the focus state of the picture of the mask pattern in substrate P.Focus correction optics 64 is the parts such as making the prism of two pieces of wedge-likes become oppositely (be in the figure 7 reverse about X-direction) and overlap in the mode becoming transparent parallel flat as a whole.Slided along bevel direction by the compartment of terrain making this pair prism not change between respect to one another, the variable thickness as parallel flat can be made.Thus inching is carried out to the actual effective optical path length of the 1st optical system 61, inching is carried out to focusing (punt) state of picture of the mask pattern being formed at intermediate image plane P7 and view field PA.
Image shift optics 65 is configured between light shield M and the 1st optical system 61.Image shift optics 65 to the mask pattern be projected in substrate P picture the mode of movement can adjust in image planes.Image shift optics 65 is by can the transparent parallel plate glass tilted in the XZ face of Fig. 6 and can forming at the transparent parallel plate glass that the YZ face of Fig. 7 is tilted.By adjusting each tilt quantity of this two panels parallel plate glass, can make the mask pattern being formed at intermediate image plane P7 and view field PA picture in X direction with Y-direction slight shift.
Multiplying power correction optics 66 is configured between the 2nd deflection component 80 and substrate P.Multiplying power correction optics 66 is configured to such as concavees lens, convex lens, these three lens of concavees lens to configure coaxially at predetermined intervals, is fixed by the concavees lens of front and back, and middle convex lens are moved along optical axis (chief ray) direction.Thus, the picture being formed at the mask pattern of view field PA can maintain the image formation state of the heart far away, isotropically only zooms in or out with small quantity simultaneously.In addition, the optical axis forming three lens combination of multiplying power correction optics 66 is tilted in XZ face in the mode parallel with the chief ray of projected light beam EL2.
Curl correction mechanism 67 makes the small rotation around the axle vertical with the 2nd optical axis BX2 of the 1st deflection component 70 by such as actuator (diagram slightly).This curl correction mechanism 67 rotates by making the 1st deflection component 70, and can make picture small rotation in the P7 of this face of the mask pattern being formed at intermediate image plane P7.
In the projection module PL1 ~ PL6 formed like this, the projected light beam EL2 from light shield M penetrates from field of illumination IR along the normal direction of light shield face P1, and incident to the 1st optical system 61.Incide the projected light beam EL2 of the 1st optical system 61 from focus correction optics 64 and image shift optics 65 transmission, in the upper reflection of the 1st reflecting surface (level crossing) P3 of the 1st deflection component 70 of the 1st optical system 61, pass through from the 1st lens combination 71 and reflect at the 1st concave mirror 72.The projected light beam EL2 reflected by the 1st concave mirror 72 again passes through from the 1st lens combination 71 and reflects at the 2nd reflecting surface (level crossing) P4 of the 1st deflection component 70, and incident to projection visual field diaphragm 63.The projected light beam EL2 passed through from projection visual field diaphragm 63 reflects at the 3rd reflecting surface (level crossing) P5 of the 2nd deflection component 80 of the 2nd optical system 62, passes through and reflect at the 2nd concave mirror 82 from the 2nd lens combination 81.The projected light beam EL2 reflected by the 2nd concave mirror 82 again passes through from the 2nd lens combination 81 and reflects at the 4th reflecting surface (level crossing) P6 of the 2nd deflection component 80, and incident with optics 66 to multiplying power correction.The projected light beam EL2 penetrated with optics 66 from multiplying power correction is incident to the view field PA substrate P, and the picture of the mask pattern be revealed in the IR of field of illumination is projected on view field PA with equimultiple (× 1).
The control > of < driver element
Next, the control of driver element 122 is described with reference to Fig. 3.Driver element 122 comprises the light shield side drive division 22 and substrate-side drive division 26 that are arranged on the newel frame 146 be arranged on installation surface E and forms.
As formerly illustrated, light shield side drive division 22 is made up of the magnet track (stator) of linear motor and the coil unit (mover) of linear motor, this magnet track is fixed in mode extended in X direction in newel frame 146, and the coil unit of this linear motor to be fixed on the transferring elements 23 that combines with light shield microscope carrier 21 and relative with fixed interval (FI) with this magnet track.In addition, substrate-side drive division 2 is as shown in previous Fig. 4, comprise: rotation motor, its by the coil unit Cur fixing as stator in newel frame 146 side and on the rotor R T of the turning axle AX2 side of swing roller 25 the magnet unit MUr fixing as mover form; With voice coil motor (MUs, CUs), it gives the thrust the direction (Y-direction) of turning axle AX2 from newel frame 146 side direction swing roller 25.Like this, light shield side drive division 22 and substrate-side drive division 26 are the structures (Direct driver (directdrive) mode) directly can transmitting power in a non-contact manner to transferring elements 23 and turning axle AX2, but are not limited to said structure.Such as, also can be, substrate-side drive division 26 has electro-motor and magnetic gear, electro-motor is fixed on newel frame 146 side, sandwiched magnetic gear between the output shaft and turning axle AX2 of electro-motor.
In the structure of driver element 122 such above, the subordinate's control device 16 shown in Fig. 5 makes light shield microscope carrier 21 and swing roller 25 synchronously move.Therefore, the surface (copying the bending face of periphery) being formed at the substrate P of picture on the carrying plane P2 (25a in Fig. 4) being wound in swing roller 25 of the mask pattern on the light shield face P1 of light shield M repeats projection exposure continuously.In the exposure device U3 of the 1st embodiment, carry out scan exposure in the synchronizing moving of light shield M to+X-direction after, need to carry out to make light shield M to turn back to the-action (rollback) of the initial position of X-direction.Therefore, when making swing roller 25 continue conveying substrate P with fixed speed continuous rotation with constant speed, during the rollback action of light shield M, substrate P does not carry out pattern exposure, formed with jumping (separation) at the conveyance direction top panel pattern of substrate P.But, due to the speed (in this case peripheral speed) of substrate P during scan exposure and the speed of light shield M preferring as 50mm/s ~ 100mm/s by practicality, if so the most at a high speed drive light shield microscope carrier 21 when light shield M rollback with such as 500mm/s, then can by between the panel pattern that is formed in substrate P in conveyance direction more than white constriction.
In the present embodiment, shift position in the X-direction of light shield microscope carrier 21 and speed is critically measured by laser interferometer or linear encoder, and critically measure shift position on the outer peripheral face of swing roller 25 and speed by the read head EH of the Measure Board 25c in Fig. 4, thereby, it is possible to guarantee light shield M and speed sync synchronous with the position of substrate P on scan exposure direction exactly.
< dipper crowding gear >
Next, with reference to Fig. 2, dipper crowding gear 130 is described.Dipper crowding gear 130 is located between position adjustment unit 120 and exposing unit 121.Dipper crowding gear 130 pushes in the mode of the substrate P supplied from position adjustment unit 120 to exposing unit 121 being given to tension force.The elevating mechanism 152 that dipper crowding gear 130 has push part 151 and push part 151 is elevated.Push part 151 pushes substrate P relative to substrate P with contact or non-contacting state.As push part 151, such as, use and have for realizing and the air ejiction opening of substrate P contactless state and the air inversion bar of suction inlet or the friction roller etc. that contacts with substrate P.Elevating mechanism 152 makes direction, i.e. Z-direction that push part 151 is pushing from a face (back side) of substrate P to another face (surface) be elevated.Elevating mechanism 152 is connected with higher level's control device 5, and the testing result based on the 2nd substrate test section 124 is controlled by higher level's control device 5.
Higher level's control device 5 controls dipper crowding gear 130 based on the testing result of the 2nd substrate test section 124.Specifically, higher level's control device 5, according to the position of the substrate P detected by the 2nd substrate test section 124, calculates the position displacement amount of the time per unit (such as several milliseconds) of substrate P.Higher level's control device 5, according to the displacement calculated, adjusts the amount of movement in the Z-direction of push part 151.That is, the displacement calculated is larger, then the vibration being considered as substrate P is larger, and higher level's control device 5 controls elevating mechanism 152 makes push part 151 rise along Z-direction.Higher level's control device 5 rises along Z-direction by making push part 151, gives tension force, make the vibration of substrate P by push part 151 vibration damping to substrate P.
< substrate retracting device >
Next, referring again to Benq's plate retracting device 4 Fig. 2.Substrate retracting device 4 has position adjustment unit 160, installs the 2nd bearing portion 161 that FR2 is rolled up in recovery and the 2nd elevating mechanism 162 that the 2nd bearing portion 161 is elevated.In addition, substrate retracting device 4 has discharges angle detection 164 and the 3rd substrate test section 165, and discharge angle detection 164 and the 3rd substrate test section 165 are connected with higher level's control device 5.At this, in the 1st embodiment, in the same manner as substrate feeding device 2, higher level's control device 5 plays function as the control device (control part) of substrate retracting device 4.In addition, also can be configured to, as the control device of substrate retracting device 4, the subordinate's control device controlling substrate retracting device 4 is set, control substrate retracting device 4 by subordinate's control device.
Position adjustment unit 160 comprises the above-mentioned marginal position controller EPC2 shown in Fig. 1 and forms.In addition, position adjustment unit 160 is roughly the same with the structure of the position adjustment unit 120 of exposure device U3, has base station 170 and marginal position controller EPC2.Base station 170 is located on installation surface E, and support edge positioner EPC2.Base station 170 also can be the vibration-free tables with vibration-damping function.
Marginal position controller EPC2 can be mobile along the Width (Y-direction) of substrate P on base station 170.Marginal position controller EPC2 has multiple rollers of the carrying roller 167 of the most downstream side comprising the conveyance direction being located at substrate P.The substrate P of discharging from position adjustment unit 160 guides to recovery volume FR2 by carrying roller 167.Marginal position controller EPC2 is connected with higher level's control device 5, and is controlled by higher level's control device 5 based on the testing result of the 3rd substrate test section 165.
3rd substrate test section 165 to being recovered to recovery from marginal position controller EPC2, detect by the position of rolling up on the Width of the substrate P of FR2.3rd substrate test section 165 is fixed on the 2nd elevating mechanism 162.Therefore, the 3rd substrate test section 165 becomes and rolls up the identical vibration mode of FR2 with recovery.The position at edge of end of 3rd substrate test section 165 to the substrate P being recovered to recovery volume FR2 is detected.3rd substrate test section 165 is to connected higher level's control device 5 output detections result.
Higher level's control device 5 controls marginal position controller EPC2 based on the testing result of the 3rd substrate test section 165.Specifically, higher level's control device 5 calculates the difference between the position being recovered to the edge of the end of the substrate P of recovery volume FR2 detected by the 3rd substrate test section 165 and the 3rd prespecified target location.Then, higher level's control device 5 carries out FEEDBACK CONTROL with the mode edge positioner EPC2 making this difference and become zero, and substrate P is moved in the width direction, makes substrate P become the 3rd target location relative to recovery volume FR2 position in the direction of the width.Therefore, substrate P can be held in the 3rd target location relative to recovery volume FR2 location dimension in the direction of the width by marginal position controller EPC2.Thus, due to substrate P can be made to fix relative to recovery volume FR2 position in the direction of the width, so can by the alignment of end face axially of recovery volume FR2.In addition, in this situation, as FEEDBACK CONTROL, can be the controls arbitrarily such as P controls, PI controls, PID controls.
2nd bearing portion 161 can rotate ground axle suspension recovery volume FR2.Axle is supported on recovery volume FR2 on the 2nd bearing portion 161 when reclaiming substrate P, with the yield of substrate P correspondingly, the coil diameter that FR2 is rolled up in recovery becomes large gradually.Therefore, the position that substrate P is recovered in recovery volume FR2 and the yield of substrate P correspondingly change.
2nd elevating mechanism 162 is located between installation surface E and the 2nd bearing portion 161.It is mobile along Z-direction (vertical) that 2nd elevating mechanism 162 makes the 2nd bearing portion 161 and recovery roll up together with FR2.2nd elevating mechanism 162 is connected with higher level's control device 5, and higher level's control device 5 makes the 2nd bearing portion 161 move along Z-direction by the 2nd elevating mechanism 162, thereby, it is possible to become the position of regulation by the recovery volume FR2 position that makes substrate P be recovered.
Discharge the discharge angle θ 2 of angle detection 164 to the substrate P that the carrying roller 167 from marginal position controller EPC2 is discharged to detect.Discharge angle detection 164 to be located at around carrying roller 167.At this, discharge the substrate P angulation of downstream side that angle θ 2 is the straight line extended along vertical and the carrying rollers 167 passed through from the central shaft of carrying roller 167 in XZ face.Discharge angle detection 164 to connected higher level's control device 5 output detections result.
Higher level's control device 5 controls the 2nd elevating mechanism 162 based on the testing result of discharging angle detection 164.Specifically, to make discharge angle θ 2 become, mode that prespecified target discharges angle controls the 2nd elevating mechanism 162 to higher level's control device 5.That is, when substrate P is many to the recovery quantitative change of recovery volume FR2, reclaims and become large by the coil diameter of volume FR2, the discharge angle θ 2 discharging angle relative to target thus diminishes.Therefore, higher level's control device 5 moves (rising) to the upper side of Z-direction by making the 2nd elevating mechanism 162, makes discharge angle θ 2 become large, revises in the mode making discharge angle θ 2 become target discharge angle.Like this, higher level's control device 5, based on the testing result of discharging angle detection 164, becomes to make discharge angle θ 2 mode that target discharges angle, carries out FEEDBACK CONTROL to the 2nd elevating mechanism 162.Therefore, angle can be discharged with target all the time due to substrate retracting device 4 and discharge substrate P from carrying roller 167, so the impact brought substrate P because discharging the change of angle θ 2 can be reduced.In addition, in this situation, as FEEDBACK CONTROL, can be the controls arbitrarily such as P controls, PI controls, PID controls.
< device making method >
Next, with reference to Fig. 8, device making method is described.Fig. 8 is the process flow diagram of the device making method representing the 1st embodiment.
In the device making method shown in Fig. 8, first, such as, function/performance design is carried out to the display panel based on self-emission devices such as organic EL, the circuit pattern necessary by designs such as CAD and wiring pattern (step S201).Then, based on the various patterns of the every one deck designed by CAD etc., the light shield M (step S202) of necessary layer amount is made.In addition, prepare supply volume FR1 in advance, this supply volume FR1 volume has the flexible substrate P (resin molding, metal foil film, plastics etc.) (step S203) of the base material becoming display panel.In addition, the web-like substrate P prepared in this step S203 can be the substrate having carried out modification as required and to its surface, the substrate, the in advance lamination that define basalis (such as based on the minute asperities of marking (imprint) mode) in advance has the substrate of photosensitive functional membrane and/or hyaline membrane (insulating material).
Then, substrate P is formed bottom surface (backplane) layer be made up of the electrode forming display panel device, wiring, dielectric film, TFT (thin film semiconductor) etc., and forms the luminescent layer (display pixel portion) (step S204) based on self-emission devices such as organic EL in the mode of lamination on this bottom surface.In this step S204, also comprise the photo-mask process in the past using the exposure device U3 illustrated in previous each embodiment to expose photoresist layer, but also can comprise the process based on following operation: replace photoresist layer and pattern exposure carried out to the substrate P being coated with photonasty silane coupling agent and forms the exposure process of the pattern of hydrophilic and hydrophobic from the teeth outwards; Pattern exposure is carried out to the catalyst layer of photoinduction and is formed the wet type operation of pattern (wiring, electrode etc.) of metal film by electroless plating method; Or by drawing the printing process etc. of pattern containing the electric conductivity inks of conductive material such as silver nano-grain, the ink containing insulating material or the ink etc. containing semiconductor material (pentacene: pentacene, semiconducting nanotubes etc.).
Then; by each display panel device manufactured continuously in the substrate P of long size in volume mode; substrate P is cut; on the surface of each display panel device, bonding protective film (resistance to environmental barrier layer) and colored filter film etc., carry out assembly device (step S205).Then, carry out display panel device whether work orderly or whether meet desired performance and the inspection operation (step S206) of characteristic.By more than, display panel (flexible display) can be manufactured.
Above, in the 1st embodiment, on installation surface E, exposing unit 121 can be set via vibration-free tables 131, and exposing unit 121 and position adjustment unit 120 and driver element 122 are arranged with separate state respectively.That is, in the 1st embodiment, by vibration-free tables 131 by isolated between exposing unit 121 and position adjustment unit 120 and driver element 122, even if they become different vibration modes.Therefore, exposing unit 121 can reduce vibration from position adjustment unit 120 and driver element 122 by vibration-free tables 131.
In addition, in the 1st embodiment, substrate P can be held in the 1st target location relative to stationary roll 126 location dimension in the direction of the width.Therefore, because substrate P is supplied to same position relative to stationary roll 126, so the position the Width of the substrate P supplied from stationary roll 126 can be made to fix.Thus, in the 1st embodiment, due to the position the Width of the substrate P sent from stationary roll 126 can be made to fix, so can reduce because the variation of the position on the Width of substrate P is on impacts such as the vibrations that substrate P is brought.
In addition, in the 1st embodiment, substrate P can be held in the 2nd target location relative to the location dimension of carrying roller 127.Therefore, in the 1st embodiment, the position of the substrate P being supplied to exposing unit 121 can be made to fix.Thus, in the 1st embodiment, due to the position of the substrate P being supplied to carrying roller 127 can be made to fix, so can reduce because the variation of the position of substrate P is on impacts such as the vibrations that substrate P is brought.
In addition, in the 1st embodiment, push substrate P by dipper crowding gear 130, thereby, it is possible to reduce the vibration of the substrate P supplied from position adjustment unit 120 to exposing unit 121 further.
In addition, in the 1st embodiment, device frame 132 can be separated into the 1st framework 132a and the 2nd framework 132b, the 1st framework 132a support light shield microscope carrier 21, and support swing roller 25 on the 2nd framework 132b.Therefore, it is possible to the 1st framework 132a and the 2nd framework 132b is arranged with separate state respectively.That is, even if the 1st framework 132a can be completely cut off them from the 2nd framework 132b to become different vibration modes.Therefore, it is possible to reduce the mutual vibration passing of the 1st framework 132a and the 2nd framework 132b.
In addition, in the 1st embodiment, the substrate P that the carrying roller 127 from supply volume FR1 to the position adjustment unit 120 of exposure device U3 can be made to supply, fixing relative to the entry angle θ 1 of carrying roller 127.Therefore, it is possible to reduce because the displacement of entry angle θ 1 is on the impact of substrate P.
In addition, in the 1st embodiment, can make roll up the substrate P of FR2 supply from the carrying roller 167 of the position adjustment unit 160 of substrate retracting device 4 to recovery, fixing relative to the discharge angle θ 2 of carrying roller 167.Therefore, it is possible to reduce the impact (substrate P to the cinch etc. that reclaim with volume FR2) of the displacement because discharging angle θ 2 on substrate P.
[the 2nd embodiment]
Next, the exposure device U3 of the 2nd embodiment is described with reference to Fig. 9.In addition, in the 2nd embodiment, in order to avoid the record repeated, be only described the part different from the 1st embodiment, for the textural element identical with the 1st embodiment, the mark Reference numeral identical with the 1st embodiment is described.Fig. 9 is the figure of a part of structure of exposure device (substrate board treatment) U3 representing the 2nd embodiment.In the exposing unit 121 of the exposure device U3 of the 1st embodiment, device frame 132 is separated into the 1st framework 132a and the 2nd framework 132b, but the exposing unit 121a of the exposure device U3 of the 2nd embodiment is the device frame 180 of monomer.
In the exposing unit 121a of the 2nd embodiment, device frame 180 is located on vibration-free tables 131, and the light shield maintaining body 11 of the cylinder light shield MA of supporting maintenance transmission-type, base supporting mechanism 12, lighting mechanism 13 and projection optical system PL.Device frame 180 by the lower surface portion 181 be located on vibration-free tables 131, the pair of bearings portion 182 erected in lower surface portion 181, the pars intermedia 183 be bearing in pair of bearings portion 182, the leg 184 erected on pars intermedia 183, be bearing in the upper surface part 185 on leg 184 and the arm 186 erected in upper surface part 185 is formed.
Pair of bearings portion 182 is respectively equipped with the air bearing 141 of the turning axle AX2 of the swing roller 25 of base supporting mechanism 12 being carried out to axle supporting.Turning axle AX2 supports with the rotatable earth's axis of non-contacting state by each air bearing 141.Pars intermedia 183 is provided with projection optical system PL via holding member 143.Three places between holding member 143 and pars intermedia 183, are folded with gasket part 145.Holding member 143 is bearing on pars intermedia 183 with being moved by the gasket part 145 at three places.Upper surface part 185 is provided with for supporting light shield maintaining body 11 (cylinder of hollow) and around rotation centerline AX1, cylinder light shield MA being carried out to the driven roller (capstan winch roller) 94 of rotary actuation.Lighting mechanism 13 is configured in the inside of light shield maintaining body 11, throws light on from inner side to the field of illumination IR (IR1 ~ IR6) cylinder light shield MA with arrangement such shown in the left figure in Fig. 6.
And be provided with the bearing 187 for the turning axle of driven roller 94 being carried out rotatably axle supporting in upper surface part 185, the light shield side drive division 22 driven roller 94 being carried out to rotary actuation is formed in the same manner as the substrate-side drive division 26 shown in previous Fig. 4.Although not shown, but the both ends in the rotation centerline AX1 direction at the light shield maintaining body 11 of cylinder shape, be provided with scale (diffraction grating) or Measure Board 25c that the scrambler identical with previous Fig. 4 measure, and critically measured the circumferential position of cylinder light shield MA by the read head EH correspondingly thereto configured.
Above, in the 2nd embodiment, light shield maintaining body 11, base supporting mechanism 12, lighting mechanism 13 and projection optical system PL can be supported by the device frame 180 of monomer.Therefore, in the 2nd embodiment, due to the position relationship of light shield maintaining body 11, base supporting mechanism 12, lighting mechanism 13 and projection optical system PL can be made to fix, so the position relationship ground that significantly can adjust them is easily arranged.
Next, with reference to the exposure device U3 (exposing unit 121a) of 2nd embodiment of Figure 10 in further detail shown in key diagram 9.In the exposing unit 121a of Figure 10, light shield maintaining body 11 has the guide reel 93 keeping the light shield of the light shield MA of transmission-type to keep cylinder 21a with cylindrical shape, support light shield maintenance cylinder 21a, the driven roller 94 and the light shield side drive division 22 that keep cylinder 21a around center line AX1 driving light shield.
Light shield keeps the light shield face P1 being configured with field of illumination IR on cylinder 21a formation light shield MA.In the present embodiment, light shield face P1 comprises the face (hereinafter referred to as barrel surface) that line segment (bus) is rotated around the axle (central shaft of drum) parallel with this line segment.Barrel surface is the outer peripheral face of such as cylinder, the outer peripheral face etc. of cylinder.Light shield keeps cylinder 21a to be made up of such as glass or quartz etc., and be the cylindrical shape with constant wall thickness, its outer peripheral face (barrel surface) forms light shield face P1.That is, in the present embodiment, the field of illumination IR on light shield MA bends to the cylinder planar from the 1st axle AX1 with radii fixus Rm.Light shield keep in cylinder 21a keep the radial direction of cylinder 21a to observe from light shield time the part overlapping with the mask pattern of light shield MA, such as light shield keep the middle body beyond the both end sides of the Y-direction of cylinder 21a to have light transmission relative to illuminating bundle EL1.
The face that light shield MA is made for the very thin glass plate (such as thickness is 100 ~ 500 μm) of such as good at flatness short strip shape is formed plane light shield of figuratum transmission-type with light shield layers such as chromium, make it copy light shield keep the outer peripheral face of cylinder 21a and bend, and use under the state of this outer peripheral face at winding (stickup).Light shield MA has the non-formation region A4 of the pattern not forming pattern, is installed on light shield keeps cylinder 21a at A4 place, pattern non-formation region.Light shield MA can keep cylinder 21a to discharge relative to light shield.About light shield MA, also can be substituted in the light shield formed based on transparent cylinder mother metal and keep the upper winding of cylinder 21a, and on the outer peripheral face of the light shield maintenance cylinder 21a formed based on transparent cylinder mother metal, directly draw formation integrated based on the mask pattern of the light shield layers such as chromium.In this situation, light shield keeps cylinder 21a also to play function as the support unit of light shield MA.
Guide reel 93 and driven roller 94 extend along the Y-direction keeping the central shaft of cylinder 21a parallel relative to light shield.Guide reel 93 and driven roller 94 are arranged in the mode that can rotate around the axle parallel with central shaft.The external diameter of guide reel 93 and the respective axial end of driven roller 94 is larger than the external diameter of other parts, and this end and light shield keep cylinder 21a external.Like this, guide reel 93 and driven roller 94 with not be held in the mode that light shield keeps the light shield MA of cylinder 21a to contact and arrange.Driven roller 94 is connected with light shield side drive division 22.Power from light shield side drive division 22 keeps cylinder 21a to transmit to light shield by driven roller 94, makes light shield keep cylinder 21a to rotate around central shaft AX1 thus.
In addition, light shield maintaining body 11 has a guide reel 93, but quantity does not limit, and also can be two or more.Similarly, light shield maintaining body 11 has a driven roller 94, but quantity does not limit, and also can be two or more.At least one in guide reel 93 and driven roller 94 can be configured in the inner side that light shield keeps cylinder 21a, and keeps connecing in cylinder 21a with light shield.In addition, light shield keep in cylinder 21a keep the radial direction of cylinder 21a to observe from light shield time not overlapping with the mask pattern of light shield MA part (both end sides of Y-direction) light transmission can be had relative to illuminating bundle EL1, also can not have light transmission.In addition, one or both in guide reel 93 and driven roller 94 can be such as round table-like, and its central shaft (turning axle) is not parallel relative to central shaft AX1.
Lighting mechanism 13 is formed in a same manner as in the first embodiment, and multiple lighting module ILa1 ~ ILa6 of lighting mechanism 13 are configured in the inner side of light shield maintenance cylinder 21a.Multiple lighting module ILa1 ~ ILa6 guides the illuminating bundle EL1 from light source injection respectively, and keeps the inside of cylinder 21a to irradiate to light shield MA from light shield the illuminating bundle EL1 guided.Lighting mechanism 13 is thrown light on the field of illumination IR of uniform brightness to the light shield MA that light shield maintaining body 11 keeps by illuminating bundle EL1.In addition, light source can be configured in the inner side that light shield keeps cylinder 21a, also can be configured in the outside that light shield keeps cylinder 21a.In addition, light source can be and exposure device U3 independently device (external device (ED)).
Like this, in 2nd embodiment, even if the light shield MA of exposing unit 121a is the light shield of cylindric transmission-type, also exposing unit 121a and position adjustment unit 120 and driver element 122 can be arranged with separate state (state that the transmission of vibration is isolated) respectively.Therefore, exposing unit 121a can reduce vibration from position adjustment unit 120 and driver element 122 by vibration-free tables 131, can obtain the effect identical with above-mentioned 1st embodiment.
[the 3rd embodiment]
Next, the exposure device U3 of the 3rd embodiment is described with reference to Figure 11.In addition, in the 3rd embodiment, also in order to avoid repeat record and only the part different with the 2nd embodiment from the 1st embodiment is described, for the textural element identical with the 2nd embodiment with the 1st embodiment, the mark Reference numeral identical with the 1st or the 2nd embodiment is described.Figure 11 illustrates the one-piece construction of the exposing unit 121b of the 3rd embodiment, be use cylindric reflection-type light shield MB and by substrate P with the structure of plane supporting.
First, the light shield MB used in the exposure device U3 of the 3rd embodiment is described.Light shield MB is the light shield of the reflection-type such as using metal cylinder.Light shield MB is formed as the cylinder with the outer peripheral face (periphery) that the radius-of-curvature centered by the 1st axle AX1 extended along Y-direction is Rm, and radial direction has constant wall thickness.The periphery of light shield MB is the light shield face P1 of the mask pattern being formed with regulation.Light shield face P1 has in the prescribed direction with the high reverse--bias portion of high-level efficiency folded light beam and not folded light beam or the reflection suppressing portion with inefficient folded light beam in the prescribed direction, and mask pattern is formed by high reverse--bias portion and reflection suppressing portion.Such light shield MB owing to being metal cylinder, so can manufacture at an easy rate.
In addition, as long as light shield MB has the periphery that the radius-of-curvature centered by the 1st axle AX1 is Rm, the shape of cylinder is not limited to.Such as, light shield MB also can be the sheet material of the arc-shaped with periphery.In addition, light shield MB can be lamellar, laminal light shield MB also can be made bending and have periphery.
Light shield maintaining body 11 has the light shield maintenance cylinder 21b keeping light shield MB.Light shield keeps cylinder 21b to keep light shield MB in the mode making the 1st axle AX1 of light shield M and become rotation center.Light shield side drive division 22 is connected with subordinate control device 16, with the 1st axle AX1 for rotation center makes light shield keep cylinder 21b to rotate.
In addition, light shield maintaining body 11 keeps cylinder 21b to keep the light shield M of cylinder by light shield, but is not limited to this structure.Light shield maintaining body 11 also can copy light shield to keep the outer peripheral face of cylinder 21b to be kept by laminal light shield MB winding.In addition, light shield maintaining body 11 can keep the light shield MB as arc-shaped sheet material on the outer peripheral face that light shield keeps cylinder 21b.
Base supporting mechanism 12 have lodge substrate P a pair driven roller 196, with the air microscope carrier 197 of plane supporting substrates P and multiple guide reel 28.A pair driven roller 196 is rotated by substrate-side drive division 26, and substrate P is moved along direction of scanning.Air microscope carrier 197 is located between a pair driven roller 196, and is located at the rear side of the substrate P of fixing tension force lodge between a pair driven roller 196, with contactless state or low Frotteurism with plane supporting substrates P.Multiple guide reel 28 is located at upstream side and the downstream side of the conveyance direction of substrate P respectively across a pair driven roller 196.Such as guide reel 28 is provided with four altogether, two upstream sides being located at conveyance direction, two downstream sides being located at conveyance direction.
Therefore, the substrate P transported from position adjustment unit 120 is guided by the driven roller 196 of two guide reels 28 to a side by base supporting mechanism 12.The substrate P being directed into the driven roller 196 of a side is guided by the driven roller 196 to the opposing party, thus, with fixing tension force lodge on a pair driven roller 196.Base supporting mechanism 12 makes a pair driven roller 196 rotate by substrate-side drive division 26, is transported on the substrate P limit of lodge on a pair driven roller 196 thus by air microscope carrier 197 side-strut towards guide reel 28.The substrate P being transported to guide reel 28 guides towards substrate retracting device 4 by base supporting mechanism 12.
When using the light shield MB of cylindric reflection-type, lighting mechanism 13 keeps the outer circumferential side of cylinder 21b to irradiate illuminating bundle EL1 from light shield.That is, the light supply apparatus of lighting mechanism 13 and lamp optical system IL are located at the periphery that light shield keeps cylinder 21b.Lamp optical system IL be use polarizing beam splitter PBS fall to penetrating illuminator.Polarizing beam splitter PBS and 1/4 wavelength plate 198 is provided with between each lighting module IL1 ~ IL6 and light shield MB of lamp optical system IL.That is, from the light incident side of the illuminating bundle EL1 from light supply apparatus, lighting module IL1 ~ IL6, polarizing beam splitter PBS, 1/4 wavelength plate 198 is provided with in order.
At this, to pass through from the illuminating bundle EL1 of light supply apparatus injection from lighting module IL1 ~ IL6 and incident to polarizing beam splitter PBS.The illuminating bundle EL1 inciding polarizing beam splitter PBS, after being reflected by polarizing beam splitter PBS, passes through from 1/4 wavelength plate 198 and throws light on to field of illumination IR.The projected light beam EL2 reflected from field of illumination IR passes through from 1/4 wavelength plate 198 again, converts the light beam of transmission in polarizing beam splitter PBS thus to.The projected light beam EL2 passed through from 1/4 wavelength plate 198 is incident to projection optical system PL by polarizing beam splitter PBS.
Above, in 3rd embodiment, even if when the light shield MB of exposing unit 121b be the light shield of cylindric reflection-type and substrate P with plane supporting, also exposing unit 121b and position adjustment unit 120 and driver element 122 can be arranged with separate state (state that the transmission of vibration is isolated) respectively.Therefore, exposing unit 121b can reduce vibration from position adjustment unit 120 and driver element 122 by row's vibration-free tables 131, can obtain the effect identical with above-mentioned 2nd embodiment.
[the 4th embodiment]
Next, exposure device (patterning device) U3 of the 4th embodiment is described.In addition, in the 4th embodiment, also be only described the part different from the 1st ~ 3rd embodiment in order to avoid the record that repeats, for the textural element identical with the 1st ~ 3rd embodiment, also the description thereof will be omitted mark the Reference numeral identical with the 1st ~ 3rd embodiment.
Figure 12 figure that to be the figure of the structure of the exposure device U3 representing the 4th embodiment, Figure 13 be when observing the substrate P transported in the exposure device U3 shown in Figure 12 from top (+Z-direction) side.Figure 14 figure that to be figure when observing the substrate P transported between last roller 126 and first roller AR1 of exposing unit 121c side of the position adjustment unit 120a side shown in Figure 13 from-Y-direction side, Figure 15 be from-X-direction side when observing the substrate P transported by the swing roller 25 shown in Figure 12.Exposure device (treating apparatus) U3 has position adjustment unit 120a and is located at the exposing unit 121c of downstream side (+X-direction side) of conveyance direction of substrate P relative to position adjustment unit 120a.Position adjustment unit 120a and exposing unit 121c is set to individual components.That is, position adjustment unit 120a and exposing unit 121c can be arranged with non-contacting separate state, or, contact with each other via corrugated etc. the dirt-proof boot 121d that the carrying channel of the substrate P after the carrying channel of the substrate P between position adjustment unit 120a and exposing unit 121c and exposing unit 121c is covered, but arrange under the state (suppressing the state of vibration passing) that the vibration component produced in position adjustment unit 120a can not be directly delivered to exposing unit 121c.Exposing unit 121c is located on installation surface (base station face) E via passive type or active vibration-free tables (vibration absorber, antihunting device) 131.Position adjustment unit 120a is located on installation surface E via base station 200.Thus, can not transmit from the vibration of other treating apparatus U1, U2, U4 ~ Un etc. and the vibration from position adjustment unit 120a to exposing unit 121c via installation surface E.That is, the vibration passing between (completely cutting off) exposing unit 121c and position adjustment unit 120a and other treating apparatus U etc. can be blocked.In other words, the state that the vibration between the vibration of position adjustment unit 120a and other treating apparatus U etc. and exposing unit 121c completely cuts off mutually is become.In addition, base station 200 also can be the vibration-free tables (vibration absorber, antihunting device) with vibration damping/anti-vibration functions.
Position adjustment unit (position regulator) 120a has marginal position controller EPC3a, stationary roll (guide reel) the 126, the 1st substrate test section 202 and subordinate's control device (control part) 204.Marginal position controller EPC3a, stationary roll 126 and the 1st substrate test section 202 are arranged from the upstream side (-X-direction side) of the conveyance direction of substrate P by said sequence.Marginal position controller EPC3a is to make to have regulation tension force (such as, the fixed value of the scope of 20 ~ 200N) and to be adjusted (correction) the position on the Width of substrate P by the mode that the position on the Width of substrate P that transports becomes target location along long side direction.Marginal position controller EPC3a can be mobile along the Width (Y-direction) of substrate P in position adjustment unit 120a.Marginal position controller EPC3a is moved along Y-direction by the driving of actuator 206 (with reference to Figure 13), adjusts the position on the Width of substrate P.Marginal position controller EPC3a has guide reel Rs1, Rs2 for substrate P being transported towards stationary roll 126 and driven roller NR.Guide reel Rs1, Rs2 substrate P to conveyance guides, and the table back of the body limit, two sides of driven roller NR limit clamping substrate P rotates and transports substrate P.In addition, the Reference numeral 207a of Figure 13 is the support unit (framework of marginal position controller EPC3a) that can support guide reel Rs1, Rs2 and driven roller NR rotatably.In addition, Reference numeral 207b is supporting the 1st substrate test section 202 and the support unit (main body frame of position adjustment unit 120a) that can be supported rotatably by stationary roll 126, and this main body frame 207b can be equipped with along Y-direction the framework 207a of marginal position controller EPC3a movably.
Substrate P after being carried out position adjustment in the width direction by marginal position controller EPC3a guides towards exposing unit 121c by stationary roll 126.By this guide reel Rs1, Rs2, driven roller NR and stationary roll 126, substrate P is guided conveyance by warpage on long side direction.1st substrate test section (substrate error measuring portion, change measurement unit) 202 detects the position on the Width of the substrate P transported from stationary roll 126 towards exposing unit 121c.Specifically, as shown in figure 13, the test section 202b that the Y-direction position of the edge part Eb of the test section 202a that the 1st substrate test section 202 is detected by the Y-direction position of the edge part Ea to the-Y side on the Width of substrate P and right+Y side is detected is formed, based on the detection signal from two test sections 202a, 202b, the change in location on the Width of substrate P is measured.And, 1st substrate test section 202 (202a, 202b) also for except the position of Width detecting substrate P, also can detect (measurement) such sensor construction to the change information relevant to the postural change (small inclination) of substrate P, the distortion (flexible on Width) of substrate P etc.On the Width of the substrate P detected by the 1st substrate test section 202, the change information of position and substrate P is sent to subordinate's control device 204.In addition, the 1st substrate test section 202 also can detect the position on the Width of the substrate P transported from marginal position controller EPC3a towards stationary roll 126.
When the small skew around X-axis (in YZ face) by the substrate P on the postural change of the 1st substrate test section 202 pairs of substrate P, especially parallel with the surface level (XY face) from stationary roll 126 to exposing unit 121c carrying channel measures, as shown in figure 14, test section 202a, 202b separately in group enter to measure the Z sensor of the change of edge part Ea, Eb Z position separately (height and position on the normal to a surface direction of substrate P) Ze1, Ze2 of substrate P.Test section 202a, 202b only configure dividually with fixed range from stationary roll 126 in the conveyance direction of substrate P, therefore, when relative to stationary roll 126, exposing unit 121c side (roller AR1) is relative to XY face small skew, the difference between the Z position Ze1 detected by test section 202a and the Z position Ze2 detected by test section 202b changes according to tilt quantity.By obtaining difference like this, stationary roll 126 (position adjustment unit 120a) and exposing unit 121c (roller AR1) relative change in location Δ Zs is in z-direction cancelled, thus correctly obtains the small skew (around X-axis) of the substrate P of the position being configured with test section 202a, 202b.
If the distance in the Y-direction of the Z sensor part of test section 202a, 202b is Lz (fixed value), then can calculate the tilt quantity (angle delta ψ) of the reality of substrate P with tan Δ ψ=(Ze1-Ze2)/Lz.Like this, the change of the small skew of the substrate P to the Z sensor measurement in test section 202a, 202b is entered by group also corresponding to the relative tilt variation around Z axis of stationary roll 126 i.e. position adjustment unit 120a with exposing unit 121c.As Z sensor, the gap sensor etc. of the non-contact type of optical profile type or static capacitive can be utilized.In addition, in the substrate P between the stationary roll 126 and first roller (AR1) of exposing unit 121c side of Figure 14, fixing tension force is also gived along long side direction.Therefore, the possibility of substrate P flexure is therebetween little, but also bends sometimes when tension force is little, may cause error to the measurement of Z sensor.Thus, preferably test section 202a, 202b (Z sensor part) are configured on the long side direction (conveyance direction) of substrate P first roller (AR1) of exposing unit 121c side near position.
In addition, as shown in figure 14, when observing from stationary roll 126, if transport substrate P at exposing unit 121c (first roller AR1) under the state that YZ face is tilted, then impaired by the collimation between the conveyance direction (-Z-direction) of the substrate P after roller AR1 warpage and XZ plane, and under tension, substrate P can to the side of Width (+Y-direction or-Y-direction) displacement gradually, result be supported on swing roller 25 substrate P also gradually along Y-direction displacement.Although position adjustment unit 120a (marginal position controller EPC3a) can play function in the mode revising the displacement in such Y-direction of substrate P, also can be revised by the substrate adjustment part 214 (details will be described below) comprising the roller AR1 being located at exposing unit 121c side.Therefore, based on the change information relevant to the small skew (around X-axis) of substrate P detected by test section 202a, 202b, one party in control position adjustment unit 120a and substrate adjustment part 214 or both sides, can maintain the position in the Y-direction of the substrate P being supported on swing roller 25 thus accurately.In addition, about the position adjustment on the Width of the substrate P of arrival swing roller 25, also position adjustment unit 120a can be used for coarse regulation, substrate adjustment part 214 is used for inching.
The marginal position controller EPC3a of subordinate's control device 204 control position adjustment unit 120a or substrate adjustment part 214 etc., control the position on the Width of substrate P.This subordinate's control device 204 can be part or all of higher level's control device 5, also can be the computing machine different from higher level's control device 5 controlled by higher level's control device 5.
Exposing unit (patterning apparatus) 121c has base supporting mechanism 12a, the 2nd substrate test section 208, lighting mechanism 13a, photohead (pattern forming portion) 210 and subordinate's control device (control part) 212.Exposing unit 121c is accommodated in temperature adjustment chamber ECV.Inside is remained the temperature of regulation by this temperature adjustment chamber ECV, suppresses the change of shape produced at the Yin Wendu of the substrate P of inside conveyance thus.This temperature adjustment chamber ECV is configured on installation surface E via passive type or active vibration-free tables 131.
Base supporting mechanism (conveying unit) 12a side supporting transports to downstream side (+X-direction) from the substrate P limit that position adjustment unit 120a transports by it, has substrate adjustment part 214, guide reel Rs3, jockey pulley RT1, swing roller 25, jockey pulley RT2 and driven roller R5, R6 in order from the upstream side (-X-direction side) of the conveyance direction of substrate P.
Substrate adjustment part 214 has multiple roller (AR1, RT3, AR2), revises the distortion and fold that produce in substrate P while substrate P transported along conveyance direction (+X-direction) by the position adjusted on the Width of substrate P.Structure about this substrate adjustment part 214 will in rear explanation.Substrate P after position on Width by the 214 pairs of substrate P in substrate adjustment part adjusts by guide reel Rs3 transports to swing roller 25.Rotation limit, swing roller 25 limit keeps the part that substrate P will expose predetermined pattern with periphery, substrate P is transported to driven roller R5, R6 side simultaneously.About the function of driven roller R5, R6 as described in above-mentioned 1st embodiment.Jockey pulley RT1, RT2 give the tension force of regulation to be supported on swing roller 25 substrate P with reeling.In addition, the Reference numeral 215 of Figure 13 is the support unit (main body frame of exposing unit 121c) that multiple rollers of substrate adjustment part 214, guide reel Rs3, jockey pulley RT1, swing roller 25, jockey pulley RT2 and driven roller R5, R6 can be supported rotatably.
Figure 16 is the figure of the structure representing substrate adjustment part 214.Substrate adjustment part 214 has adjustment roller AR1, AR2 and jockey pulley RT3.Adjustment roller AR1, jockey pulley RT3 and adjustment roller AR2 are arranged from the upstream side (-X-direction side) of the conveyance direction of substrate P by said sequence.This adjustment roller AR1, AR2, under the state of tension force (tension) executing regulation, configure in the mode of the transport path warpage making substrate P.Specifically, by arranging jockey pulley RT3 in the lower side (-Z-direction side) of adjustment roller AR1, AR2, by adjusting roller AR1, AR2 under the state of tension force being applied with regulation by transport path warpage.Thus, from the substrate P of position adjustment unit 120a edge+X-direction conveyance with the state being applied in the tension force of regulation by adjustment roller AR1 by downwards (-Z-direction) warpage and guiding to jockey pulley RT3, from jockey pulley RT3 upward (+Z-direction) substrate P of transporting guided to guide reel Rs3 by+X-direction warpage by adjusting roller AR2 with the state being applied in the tension force of regulation.In addition, jockey pulley RT3 is in the mode that can move in parallel along Z-direction, and the two ends of Y-direction are supported by axle, and during substrate P is transported, edge-Z-direction produces the acting force of regulation and gives tension force to substrate P.
Adjustment roller AR1 can be rotated relative to turning axle AX3a by bearing 214a, and adjustment roller AR2 similarly, can be rotated relative to turning axle AX3b by bearing 214b.Turning axle AX3a, AX3b are arranged along the Y direction abreast.Adjustment roller AR1, AR2 can tilt relative to axle parallel along the Y direction.That is, the end side (-Y-direction side) adjusting the turning axle AX3a of roller AR1 can with another side (+Y-direction side) for fulcrum be to Z-direction and X-direction minute movement.Similarly, the end side (-Y-direction side) of turning axle AX3b can with another side (+Y-direction side) for fulcrum moves to X-direction and Z-direction adjustment roller AR2.The minute movement of the end side (-Y-direction side) of turning axle AX3a, AX3b is driven by actuators such as not shown piezoelectric elements.By making adjustment roller AR1, AR2 small skew, inching can be carried out along with the conveyance of the long side direction of substrate P to the position on the Width of substrate P, the small distortion produced in substrate P and the small in-plane deformation (or fold) produced because of the internal stress of substrate P can be revised.In addition, in figure 16, be set to two adjustment rollers AR1, AR2 and tilt minutely in XY face or in YZ face, but adjustment roller AR1, AR2 also can not be enable to tilt and jockey pulley RT1 is tilted.And, adjustment roller AR1 can not also be enable to tilt and adjustment roller AR2 and jockey pulley RT1 is tilted.
2nd substrate test section (substrate error measuring portion, change measurement unit) 208 detects from jockey pulley RT1 towards swing roller 25 along the position on the Width of the substrate P of+Z-direction conveyance.Specifically, as shown in figure 15, the 2nd substrate test section 208 is located at the both end sides of the Width of substrate P respectively, detects the edge at the both ends on the Width of substrate P.Figure 17 A is the figure of the structure representing the 2nd substrate test section 208, Figure 17 B is represent the figure being irradiated the light beam light Bm in substrate P by the 2nd substrate test section 208, and Figure 17 C is the figure representing the light beam light Bm accepted by the 2nd substrate test section 208.2nd substrate test section 208 has the irradiation system 216 of illumination beam light Bm and accepts the receiving system 218 of light beam light Bm.Irradiation system 216 has light-projecting portion 220, cylindrical lens 222 and catoptron 224, and receiving system 218 has catoptron 226, imaging optical system 228 and imaging apparatus 230.Light-projecting portion 220 comprises the light source sending light beam light Bm, is irradiated by the light beam light Bm sent towards substrate P.The light beam light Bm that light-projecting portion 220 irradiates is irradiated in substrate P via cylindrical lens 222 and catoptron 224.The light beam light Bm of incidence as seen in this fig. 17b, in the mode making incident light beam light Bm become the light beam light Bm of the slit-shaped parallel with the Y-direction of substrate P in substrate P, restrains by cylindrical lens 222 in z-direction.The length of this light beam light Bm irradiated towards substrate P is set to Lbm.The light beam light Bm's irradiated towards substrate P side is reflected by substrate P at least partially, and the light beam light Bm of the remainder do not contacted with substrate P is not kept straight ahead reflectingly by substrate P.
Incident to imaging optical system 228 via catoptron 226 at the light beam light Bm of the slit-shaped of substrate P reflection.Imaging optical system 228 makes light beam light Bm imaging on imaging apparatus 230 of reflecting from catoptron 226, and the light beam light Bm of imaging apparatus 230 to incidence takes.The length of light beam light Bm should taken by imaging apparatus 230 as shown in Figure 17 C, is the length Lbm1 of light beam light Bm reflected in substrate P, therefore, it is possible to detected the position at the edge of substrate P by the length measuring this Lbm1.By having such structure, the 2nd substrate test section 208 can detect accurately from jockey pulley RT1 towards swing roller 25 along the position the Width of the substrate P of+Z-direction conveyance.In addition, the 2nd substrate test section 208, by detecting the position of substrate P, can detect the change information that the distortion (stretching of Width) of (measurement) and the change in location on the Width of substrate P, substrate P etc. is relevant.Position on the Width of the substrate P detected by the 2nd substrate test section 208 and the change information of substrate P are sent to subordinate's control device 204.Reference numeral 230a represents the shooting area of imaging apparatus 230.In addition, the structure of the 1st substrate test section 202 also can be the structure identical with the 2nd substrate test section 208.
Each aligming microscope (substrate error measuring portion, change measurement unit) AM1, AM2 of exposing unit 121c are provided with multiple along the Width of substrate P, detect the alignment mark Ks be formed in substrate P as shown in Figure 15.In the example shown in Figure 15, the long side direction of alignment mark Ks in the side, both ends of substrate P along substrate P is formed with fixed intervals, and between the exposure area A7 and exposure area A7 of the long side direction arrangement in substrate P, the Width along substrate P is provided with five with fixed intervals.Therefore, in order to detect the alignment mark Ks be formed in substrate P, aligming microscope AM1 (with reference to Figure 19), AM2 are provided with five along the Width of substrate P with fixed intervals.By detecting alignment mark Ks by aligming microscope AM1, AM2, limit can be detected accurately and be supported in swing roller 25 limit by the position on the Width of substrate P that transports.In addition, aligming microscope AM1, AM2, by detecting the position of alignment mark Ks, can detect the change information that the distortion of (measurement) and the change in location on the Width of substrate P, postural change, substrate P etc. is relevant.
The positional information that the long side direction (conveyance direction) of the alignment mark Ks that should be detected by aligming microscope AM1, AM2 and Width are gone up separately is sent to subordinate's control device 212.Subordinate's control device 212 is based on the positional information of the alignment mark Ks obtained, generate for revising the update information of pattern forming position and sending to photohead (pattern forming portion) 210, further, the change information of the position on the Width of substrate P and substrate P is calculated and sent to subordinate's control device 204.In addition, the Reference numeral 232 of Figure 15 represents the surveyed area (the detection visual field) of each aligming microscope AM1, and the outer peripheral face that the position of five surveyed areas 232 in the conveyance direction of substrate P (being Z-direction in Figure 15) is set in substrate P and swing roller 25 stably touches such position.Size in the substrate P of surveyed area 232 sets according to the size of alignment mark Ks and alignment precision (position measurement precision), is the size of 100 ~ 500 μm of square left and right.
In addition, as shown in figure 12, between position adjustment unit 120a and exposing unit 121c, be provided with the relative position test section (site error measurement unit, change measurement unit) 234 that the change information relevant with change in location to the relative position of exposing unit 121c to position adjustment unit 120a detects (measurement).Figure 18 is the figure of the structure representing relative position test section 234.Relative position test section 234 is located between position adjustment unit 120a and exposing unit 121c, and to be located at respectively-end side of Y-direction and the end side of+Y-direction.Relative position test section 234 has the 1st test section 236 detected the position adjustment unit 120a in YZ plane and the relative change in location of exposing unit 121c and the 2nd test section 238 detected the relative change in location of the position adjustment unit 120a in XZ plane and exposing unit 121c.Thus, relative position test section 234 can detect relative position and the change information of position adjustment unit 120a and exposing unit 121c with three-dimensional (XYZ space).
1st test section 236 has towards the light-projecting portion 240a of+X-direction irradiating laser and the light accepting part 242a accepting the laser that light-projecting portion 240a irradiates.2nd test section 238 has towards the light-projecting portion 240b of+Y-direction irradiating laser and the light accepting part 242b accepting the laser that light-projecting portion 240b irradiates.The light-projecting portion 240a of the 1st the test section 236 and light-projecting portion 240b of the 2nd test section 238 is located at the face side (+X-direction side) relative with exposing unit 121c of position adjustment unit 120a.In addition, the light accepting part 242b of the 1st the test section 236 and light accepting part 242b of the 2nd test section 238 is located at the face side (-X-direction side) relative with position adjustment unit 120a of exposing unit 121c.
Light accepting part 242a, 242b are made up of four segmentation sensors.That is, light accepting part 242a, 242b have four photodiodes (photo-electric conversion element) 244, use the difference of respective the accepted light income of these four photodiodes 244 (difference of signal level) to detect change in location in the face vertical with the beam center of laser.Laser to light accepting part 242a incidence is the light that edge+X-direction is advanced, and therefore light accepting part 242a detects position and the change in location at center in the YZ plane vertical with X-direction, laser.In addition, the laser to light accepting part 242b incidence is the light that edge+Y-direction is advanced, and therefore light accepting part 242b detects position and the change in location at center in the XZ plane vertical with Y-direction, laser.Thereby, it is possible to dimensionally detect (measurement) position adjustment unit 120a change information relevant with change in location to the relative position of exposing unit 121c.Especially, can by the difference or average of each Detection Information of a pair the 1st test sections 236 of separating along Y-direction, measure the relative position error in the relative rotation error around X-axis (relative tilt in YZ face) of position adjustment unit 120a and exposing unit 121c and Y-direction in real time.In addition, can by the difference of each Detection Information of a pair the 2nd test sections 238 of separating along Y-direction, measure the relative rotation error around Z axis (relative tilt in XY face) of position adjustment unit 120a and exposing unit 121c in real time.
Turn back to the explanation of Figure 12, lighting mechanism 13a has lasing light emitter, penetrates laser (exposing light beam) LB for exposing.This laser LB can be the ultraviolet at the wave band of below 370nm with peak wavelength.Laser LB also can be with the pulsed light of oscillation frequency Fs luminescence.Laser LB emitted by lighting mechanism 13a is incident to photohead 210.
Photohead 210 has draws cells D U (DU1 ~ DU5) for the multiple of laser LB incidence from lighting mechanism 13a respectively.That is, guided to the light import optical system 250 with catoptron, beam splitter etc. from the laser LB of lighting mechanism 13a that backward multiple to draw cells D U (DU1 ~ DU5) incident.Photohead 210 is transported by base supporting mechanism 12a, in a part for the substrate P supported at the periphery by swing roller 25, draws pattern by multiple cells D U (DU1 ~ DU5) that draws.Photohead 210 has identical multiple of structure and draws cells D U (DU1 ~ DU5), is the photohead 210 of so-called Multibeam thus.Draw cells D U1, DU3, DU5 are configured in the conveyance direction of substrate P upstream side (-X-direction side) relative to the turning axle AX2 of swing roller 25, draw cells D U2, DU4 are configured in the conveyance direction of substrate P downstream side (+X-direction side) relative to the turning axle AX2 of swing roller 25.
Respectively drawing cells D U makes incident laser LB restrain in substrate P and become a light, and, make this photoscanning along sweep trace at high speed by polygonal rotating mirror (polygonmirror) etc.The sweep trace L respectively drawing cells D U is set as, (Width of substrate P) is not be separated from each other but connect as shown in figure 19 in the Y direction.In Figure 19, the sweep trace L drawing cells D U1 is represented with L1, the sweep trace L drawing cells D U2 is represented with L2.Similarly, by drawing cells D U3, the sweep trace L of DU4, DU5 represents with L3, L4, L5.Like this, to cover the mode of the whole Width of exposure area A7 by all drawing cells D U1 ~ DU5, scanning area is shared by respectively drawing cells D U.In addition, such as, if the width (length of sweep trace L) of drawing being drawn the Y-direction under cells D U is set to about 20 ~ 50mm, then by drawing cells D U1, DU3, DU5 these three, the drawing cells D U2, DU4 these two, amount to five and draw cells D U of even number along Y-direction configuration odd number, can by the width expansion of Y-direction that can draw to about 100 ~ 250mm.In addition, aligming microscope AM1, AM2 are located at the upstream side (-X-direction side) of the conveyance direction of substrate P compared with sweep trace L1, L3, L5, further, opposite side close contact and being detected by the alignment mark Ks that the substrate that transports is formed by side-strut on the periphery of swing roller 25.
This draws cells D U as disclosed in International Publication No. 2013/146184 pamphlet (with reference to Figure 36) is like that known technology, but use Figure 20 is described simply to drawing cells D U.In addition, respectively draw cells D U (DU1 ~ DU5) and there is identical structure, therefore only illustrate and draw cells D U2, cells D U is drawn for other and then omits the description.
As shown in figure 20, draw cells D U2 have such as collector lens 252, draw with optical element (photomodulator) 254, absorber 256, collimation lens 258, catoptron 260, cylindrical lens 262, condenser lens 264, catoptron 266, polygonal mirror (photoscanning parts) 268, catoptron 270, f-θ lens 272 and cylindrical lens 274.
To the top downward (-Z-direction) advance of laser LB from vertical of drawing cells D U2 incidence, incident to drawing with optical element 254 via collector lens 252.Collector lens 252 make to draw with the laser LB of optical element 254 incidence draw with in optical element 254 to become the mode optically focused (convergence) of beam waist.Draw and relative to laser LB, there is transmittance with optical element 254, use such as acousto-optic element (AOM:Acousto-OpticModulator).
Draw with optical element 254 when the state that the drive singal (high-frequency signal) from subordinate's control device 212 is off, by the laser LB of incidence to absorber 256 side transmission, when the state that the drive singal (high-frequency signal) from subordinate's control device 212 is on, make incident laser LB diffraction and towards catoptron 260.Absorber 256 is to prevent laser LB from externally leaking and the ligh trap (lighttrap) of absorbing laser LB.Like this, by making correspondingly to carry out on/off at high speed to drawing the drive singal (hyperacoustic frequency) drawn applied with optical element 254 with pattern data (black in vain), laser LB is switched towards catoptron 260 or towards absorber 256.This means, when observing from substrate P, arriving the intensity of the laser LB (some light SP) of light-sensitive surface and pattern data correspondingly by one party that High Speed Modulation is in high level and low level (such as, zero level).
Collimation lens 258 makes to become directional light with optical element 254 towards the laser LB of catoptron 260 from drawing.Catoptron 260 makes incident laser LB to-X-direction reflection, irradiates to catoptron 266 via cylindrical lens 262, condenser lens 264.The laser LB of incidence irradiates to polygonal mirror 268 by catoptron 266.Polygonal mirror (polygonal rotating mirror) 268 makes the reflection angle of laser LB change continuously by rotating, along direction of scanning (Width of substrate P), the position of the laser LB of irradiation in substrate P is scanned.Polygonal mirror 268 is rotated with fixing speed (such as 10,000 revs/min) by not shown rotary driving source (such as, motor and reducing gear etc.).
Be located at cylindrical lens between catoptron 260 and catoptron 266 262 and condenser lens 264 synergistically, the non-scan direction (Z-direction) orthogonal with above-mentioned direction of scanning makes laser LB optically focused (convergence) on the reflecting surface of polygonal mirror 268.By this cylindrical lens 262, even if there is the situation (tilting from the normal in XY face and the equilibrium state of above-mentioned reflecting surface) that above-mentioned reflecting surface tilts relative to Z-direction, also it can be suppressed to affect, suppress the irradiation position of the laser LB be radiated in substrate P to offset in X direction.
The laser LB reflected by polygonal mirror 268 by catoptron 270 to the reflection of-Z-direction, incident to the f-θ lens 272 with the optical axis AXu parallel with Z axis.These f-θ lens 272 become the such telecentric system of the normal to a surface of substrate P, thereby, it is possible to scan laser LB to uniform velocity exactly along Y-direction in a scan all the time for making the chief ray of the laser LB being projeced into substrate P.The laser LB irradiated from f-θ lens 272, via the bus cylindrical lens 274 parallel with Y-direction, becomes the small some light SP of the circular of diameter about several μm and is irradiated in substrate P.Point light (analyzing spot light) SP is scanned along a direction along the sweep trace L2 extended in the Y direction one-dimensionally by polygonal mirror 268.
Subordinate's control device 212 controls lighting mechanism 13a and photohead 210 etc., comes to give pattern to substrate P.That is, subordinate's control device 212 controls lighting mechanism 13a and carrys out irradiating laser LB, and based on the position of the alignment mark Ks detected by aligming microscope AM1, control photohead 210 respectively draw that cells D U has draw with optical element 254, thus, exposure is drawn to pattern in the assigned position in substrate P, i.e. exposure area A7.This subordinate's control device 212 can be part or all of higher level's control device 5, also can be controlled by higher level's control device 5, the computing machine different from higher level's control device 5.
At this, by the long side direction of substrate P and the turning axle AX2 of swing roller 25 orthogonal and under the state not producing distortion or fold etc. in substrate P, substrate P is transported to swing roller 25, pattern improves to the exposure accuracy of substrate P.Therefore, expect to make each roller (Rs1 ~ Rs3, NR, 126, AR1, AR2, RT1 ~ RT3, R5, R6) carrying out substrate conveyance of exposure device U3 and the turning axle of swing roller 25 mutually to configure abreast along the Y direction, and transport substrate P with the long side direction of substrate P relative to the mode of the rotating shaft direct cross of these each rollers and swing roller 25.
But, in fact, there is the situation that turning axle offsets setting knifeedge, the turning axle of each roller is not parallel to each other of each roller (Rs1 ~ Rs3, NR, 126, AR1, AR2, RT1 ~ RT3, R5, R6).In addition, also exist because because vibration etc. causes position adjustment unit 120a and relative change the in position of exposing unit 121c, the turning axle of roller of position adjustment unit 120a and the turning axle of the roller of exposing unit 121c become uneven situation.Thus, small stress disorder, distortion, fold etc. is produced in the inside of substrate P, reel under the state that the long side direction of substrate P tilts a little relative to the turning axle AX2 of swing roller 25, or substrate P is significantly being out of shape the state lower support of (face internal strain) in swing roller 25 compared with the line width dimensions of the pattern that should draw.
Therefore, in the 4th embodiment, subordinate's control device 204, based on the testing result of the 1st substrate test section 202, the 2nd substrate test section 208, aligming microscope AM1, AM2 and relative position test section 234, controls marginal position controller EPC3a and substrate adjustment part 214.
In detail, subordinate's control device 204 controls the actuator (driving mechanism) 206 of marginal position controller EPC3a based on the change information of the position on the Width of the substrate P detected by the 1st substrate test section 202 and substrate P, adjusts the position on the Width of substrate P thus.Such as, center in the Y-direction that the position of subordinate's control device 204 to the edge at the both ends according to the substrate P detected by the 1st substrate test section 202 is obtained and the difference between target location calculate, the difference calculated to make this be zero (0) mode FEEDBACK CONTROL is carried out to actuator 206, substrate P is moved along Y-direction.Thereby, it is possible to make the position of the Width of the substrate P from position adjustment unit 120a conveyance become target location, thus can suppress to produce small distortion or fold etc. in substrate P.Thus, due to the position in the Y-direction of the substrate P being wound in swing roller 25 can be made to fix accurately, so can reliably continue to catch the multiple alignment mark Ks arranged along the long side direction of substrate P in the surveyed area of each aligming microscope AM1 (the detection visual field) 232.
In addition, subordinate's control device 204 uses the change information relevant with change in location to the relative position of the position adjustment unit 120a detected by relative position test section 234 and exposing unit 121c, control the actuator 206 of marginal position controller EPC3a, thereby, it is possible to revise as soon as possible change in location on the Width of substrate P (with heeling condition change, substrate P is to the displacement of Width).In addition, subordinate's control device 204 is based on the information relevant with change in location to the relative position detected by relative position test section 234, adjust the angle of inclination of adjustment roller AR1, AR2 of substrate adjustment part 214, thus, the position on the Width of adjustment substrate P.The adjustment at the angle of inclination of this adjustment roller AR1, AR2 can perform by making the actuators such as above-mentioned piezoelectric element (drive division) drive.Thus, even if when the relative position of position adjustment unit 120a and exposing unit 121c there occurs change, also the position on the Width of the substrate P transported to swing roller 25 can be continued to be set in target location in response highland accurately, thus can suppress to produce small distortion or fold etc. in substrate P.
In addition, the position of the alignment mark Ks detected by aligming microscope AM1, AM2, the postural change of the substrate P of the position on the Width of also known substrate P, the small distortion of substrate P or fold etc., distortion the change information of being correlated with.Therefore, subordinate's control device 204 is based on the position of the alignment mark Ks detected, control marginal position controller EPC3a (actuator 206) and substrate adjustment part 214 (actuator such as above-mentioned piezoelectric element), adjust the position on the Width of substrate P thus.Thereby, it is possible to the position on the Width of the substrate P transported to swing roller 25 is set to target location in response highland accurately, thus can suppress to produce small distortion or fold etc. in substrate P.
In addition, subordinate's control device 204 is based on the position on the Width that will be transported to the substrate P of swing roller 25 detected by the 2nd substrate test section 208, confirm whether the position on the Width of substrate P is positioned at target location, in substrate P, whether create distortion (inclination) etc.In the detection of the distortion (inclination) of substrate P, when relative to the incident angle of substrate P, substrate P is shifted along normal to a surface direction (being X-direction in Figure 17 A) the light beam light Bm increasing the detection system illustrated in Figure 17 A, to be shifted this situation along Z-direction at the reflection image Bm of the camera watch region 230a inner light beam Bm of imaging apparatus 230 as long as utilize.2nd substrate test section 208 is also arranged respectively accordingly with edge part Ea, Eb of the both sides of substrate P, therefore, compared (obtaining difference) by the shift amount to Z-direction in camera watch region 230a of the picture to folded light beam Bm, also can obtain substrate P small tilt quantity in the direction of the width.
And, position on the Width of substrate P is not positioned at target location, subordinate's control device 204 is based on the change information of the position on the Width of the substrate P detected by the 2nd substrate test section 208 and substrate P, control marginal position controller EPC3a (actuator 206) and substrate adjustment part 214 (actuator such as above-mentioned piezoelectric element), thus, the position on the Width of substrate P is adjusted.Thereby, it is possible to make the position on the Width of the substrate P transported to swing roller 25 become target location.
But, because the 2nd substrate test section 208 is configured in the position that substrate P is about to be wound in swing roller 25, so produce suddenly significant change on the Width of substrate P, such as in this position, alignment mark Ks departs from such visibility point offset error from the surveyed area 232 of aligming microscope AM1, the pattern being difficult to should be formed in the A7 of exposure area is critically located.Under these circumstances, before alignment mark Ks is trapped in surveyed area 232, execution error program (eroorsequence (again attempting action etc.), as the pattern stopped for exposure area A7 is formed and skips, or temporarily make substrate P only with the reversion of certain length amount, and alignment mark Ks etc. is detected again based on aligming microscope AM1 in edge forward conveyance limit again.
Like this, in the 4th embodiment, also exposing unit 121c and position adjustment unit 120a can be arranged with separate state (state that the transmission of vibration is isolated) respectively.Therefore, exposing unit 121c can reduce vibration from position adjustment unit 120a by vibration-free tables 131, can obtain the effect identical with above-mentioned 1st embodiment.And in the 4th embodiment, subordinate's control device 204, based on the testing result of the 1st substrate test section 202, the 2nd substrate test section 208 and aligming microscope AM1, AM2, controls marginal position controller EPC3a and substrate adjustment part 214.Thereby, it is possible to improve the exposure accuracy of the pattern generated based on photohead 210 pairs of substrate P.Subordinate's control device 204, based on the testing result of relative position test section 234, controls marginal position controller EPC3a and substrate adjustment part 214.Thus, even if when the relative position of position adjustment unit 120a and exposing unit 121c there occurs change, the exposure accuracy of the pattern generated based on photohead 210 pairs of substrate P also can be improved.
In addition, in above-mentioned 4th embodiment, for being provided with the structure of position adjustment unit 120a and exposing unit 121c in exposure device U3, as long as but the structure that when observing from the conveyance direction of substrate P, exposing unit 121c is immediately arranged after position adjustment unit 120a.Therefore, also can not in exposure device U3 setting position adjustment unit 120a.In this situation, position adjustment unit 120a when observing from the conveyance direction of substrate P, can be located at and being configured at tight front treating apparatus U (U2) side of the such exposure device U3 of Fig. 1.Or, when substrate feeding device 2 be located at exposure device U3 tight before, the function of setting position adjustment unit 120a in this substrate feeding device 2.
In addition, operation before the photo-patterning operation of carrying out based on (the 2nd processing units) such as exposure device U3, exposing unit 121,121c is tight, with formed on the surface of substrate P (coating) aqueous photographic layer operation, make the operation of this photographic layer drying (baking) complete.But, when using dry type film as photographic layer, become and use the transfer device of the compression joint types such as laminater to be transferred to by crimping by the photographic layer on dry type film as the operation (formation process of photographic layer) on the surface of the substrate P being exposed substrate, also there is the situation not needing drying process.Therefore, as the pretreating device (the 1st processing unit) administering the tight front operation of photo-patterning operation, for formed on the surface of substrate P photographic layer photographic layer forming apparatus or by drying (heating) device of substrate P drying, can the downstream side (substrate takes out of portion) of substrate carrying channel in these pretreating devices or the function of setting position adjustment unit 120a between this pretreating device and photo-patterning device.
In addition, as patterning operation, when using printing machine, operation before tight as it, implement in order to improve ink to the close attachment on substrate P surface to the surface integral of substrate P or only the corresponding part forming pattern carry out the operation (selectivity of giving lyophobicity/lyophily gives operation etc.) of modification.Such surface modification treatment operation is also independent or implement in multiple pretreating device, therefore, it is possible to the downstream side (substrate takes out of portion) of substrate carrying channel in pretreating device before being located at printing machine and being tight or the function of setting position adjustment unit 120a between this pretreating device and printing machine.
In above-mentioned 4th embodiment, position adjustment unit 120a arranges the 1st substrate test section 202 and the 2nd substrate test section 208 is set on exposing unit 121c, but the one party in the 1st substrate test section 202 and the 2nd substrate test section 208 also can be only set.In addition, the 1st substrate test section 202 and the 2nd substrate test section 208 both sides also can not be set.This is because, even without the 1st substrate test section 202 and the 2nd substrate test section 208, the position etc. on the Width of substrate P also can be detected by aligming microscope AM1, AM2.
In above-mentioned 4th embodiment, describe treating apparatus U3 as exposure device, as long as but the patterning device of pattern can be given to substrate P.Such as, as patterning device, except exposure device, the ink-jet printer etc. by coating ink, substrate P being given to pattern can be enumerated.In this situation, photohead 210 is replaced as to be had by making ink material become drop and optionally giving and draw the nozzle head (pattern forming portion) of multiple nozzles of pattern in substrate P, and exposing unit 121,121a ~ 121c are replaced as the patterning apparatus with pattern forming portion.In addition, in above-mentioned 1st ~ 3rd embodiment similarly, treating apparatus U3 can be patterning device substrate P being given to pattern.
As illustrated in the respective embodiments described above, substrate P is formed in the patterning apparatus such as the exposure device of fine pattern used for electronic device or ink-jet printer, pattern is critically located and formed by substrate P is important.As the vibration making this positioning precision reduce one of such external interference factor, from be arranged at pneumatics built-in neighbouring treating apparatus with or the generation such as the compressor of liquid or pump, be delivered to the support unit such as swing roller 25 of photohead (pattern forming portion) 210, supporting substrates P via the ground of factory.In order to the path of this vibration passing isolated, it is effective that patterning apparatus arranges antihunting device (vibration-free tables 131 etc.).In addition, expect to make the ground of factory (basis) as far as possible firmly and to be constructed into resonant frequency low, in above-mentioned each embodiment, even if surface condition is so strict, also substrate P critically can be transported and realize high-precision patterning.
Such as, when constructing production line, in order to avoid the substrate P passed through from patterning apparatus (exposing unit 121,121a ~ 121c) is shifted in the width direction, and the parallelization operation between roller in the treating apparatus of the upstream side of the roller carried out in patterning apparatus and patterning apparatus (position adjustment unit 120,120a), but after the process starting substrate P, exist along with the time through because of the impact of device load etc. local, ground cave in a little and situation about tilting.Even if under these circumstances, position displacement on the Width that also can measure when substrate P is moved in patterning apparatus by the 1st substrate test section 202 (202a, 202b) and relative position test section 234 and distortion (because of the small skew that distortion causes), and pass through substrate adjustment part 214 (roller AR1, RT3, AR2) and revise.
In addition, when the 4th embodiment, the substrate adjustment part 214 that multiple rollers (at least one roller wherein can tilt) such are as shown in Figure 16 formed is located on the main body frame 215 of exposing unit 121c side as shown in figure 12, but also can be located on the main body frame 207b in position adjustment unit 120a.In this situation, in the position adjustment unit 120a (the 1st treating apparatus) be separated from each other to completely cut off or suppress vibration passing and exposing unit 121c (the 2nd treating apparatus), the 2nd substrate test section 208 being located at exposing unit 121c side, in the same manner as the 2nd substrate test section 124 shown in Fig. 2, is located near guide reel Rs3 or jockey pulley RT1.Moreover, it can be, position adjustment unit 120a (the 1st treating apparatus) and exposing unit 121c (the 2nd treating apparatus) is all independent, is located on installation surface E substrate adjustment part 214 as independent unit.
When carry out photo-patterning operation exposing unit 121,121c etc. (the 2nd processing unit) and administer photo-patterning operation tight before operation pretreating device (the 1st processing unit) between setting position adjustment unit 120a or the 1st substrate test section 202, the change in location of the substrate P transported to the 2nd processing unit from the 1st processing unit can be detected by the 1st substrate test section 202.In addition, when the downstream side setting position adjustment unit 120a of the conveyance direction of the substrate P in the 1st processing unit or the 1st substrate test section 202, the change in location of the substrate P transported to the 2nd processing unit from the 1st processing unit can be detected by the 1st substrate test section 202, also the position of substrate P also detected by the 1st substrate test section 202 and the position of substrate P that detected by the 2nd substrate test section 208 or aligming microscope AM1, AM2 can detect the change in location of the substrate P transported to the 2nd processing unit from the 1st processing unit.In addition, by being detected relative position and the change in location of position adjustment unit 120a and exposing unit 121c by relative position test section 234, the change in location of the substrate P transported to the 2nd processing unit from the 1st processing unit can also be detected.

Claims (26)

1. a substrate board treatment, is characterized in that, has:
Vibration-free tables, it is located in installation surface;
Exposing unit, it is located on described vibration-free tables, and carries out exposure-processed to the substrate of supply; With
Processing unit, it to be located in described installation surface and to arrange with non-contacting separate state with described exposing unit, and processes described exposing unit.
2. substrate board treatment as claimed in claim 1, is characterized in that,
The position adjustment unit adjusted is carried out in the described processing unit position comprised on the Width of the described substrate of exposing unit supply described in subtend,
Described position adjustment unit has:
Base station, it is located in described installation surface;
Width travel mechanism, it is located on described base station, and described substrate is moved relative to the Width of described base station along described substrate; With
Stationary roll, it is located on described base station, guided by the described substrate after carrying out position adjustment, and this stationary roll is fixing relative to the position of described base station by described Width travel mechanism towards described exposing unit.
3. substrate board treatment as claimed in claim 2, is characterized in that also having:
1st substrate test section, it is located on described base station regularly, detects the position be supplied on the Width of the described substrate of described stationary roll; With
Control part, its testing result based on described 1st substrate test section controls described Width travel mechanism, thus is the 1st target location by the position correction be supplied on the Width of the described substrate of described stationary roll.
4. substrate board treatment as claimed in claim 2 or claim 3, is characterized in that,
Described position adjustment unit also has the roller position adjusting mechanism of the described stationary roll of adjustment relative to the position of described exposing unit,
Described substrate board treatment also has:
2nd substrate test section, it is located on described vibration-free tables regularly, detects the position being supplied to the described substrate of described exposing unit; With
Control part, its testing result based on described 2nd substrate test section controls described roller position adjusting mechanism, thus is the 2nd target location by the position correction being supplied to the described substrate of described exposing unit.
5. the substrate board treatment according to any one of claim 2 ~ 4, is characterized in that, also has:
Dipper crowding gear, it pushes in the mode of giving tension force the described substrate supplied from described position adjustment unit to described exposing unit;
2nd substrate test section, it is located on described vibration-free tables regularly, detects the position being supplied to the described substrate of described exposing unit; With
Control part, its testing result based on described 2nd substrate test section controls described dipper crowding gear, thus the pushing amount of adjustment to described substrate.
6. the substrate board treatment according to any one of Claims 1 to 5, is characterized in that,
Described processing unit comprises the driver element driving described exposing unit,
Described exposing unit has:
To the light shield holding member that the light shield of illuminated optical illumination keeps; With
The substrate supporting parts that the described substrate projected the projected light from described light shield supports,
Described driver element has:
The light shield side drive division of described light shield holding member is driven in order to make described light shield move along direction of scanning; With
The substrate-side drive division of described substrate supporting parts is driven in order to make described substrate move along direction of scanning.
7. substrate board treatment as claimed in claim 6, is characterized in that,
Described exposing unit has:
Support the 1st framework of described light shield holding member; With
Support the 2nd framework of described substrate supporting parts,
Described vibration-free tables comprises the 1st vibration-free tables be located between described installation surface and described 1st framework and the 2nd vibration-free tables be located between described installation surface and described 2nd framework.
8. substrate board treatment as claimed in claim 6, is characterized in that,
Described exposing unit has the framework of the described light shield holding member of supporting and described substrate supporting parts,
Described vibration-free tables is located between described installation surface and described framework.
9. the substrate board treatment according to any one of claim 6 ~ 8, is characterized in that,
Described light shield holding member is to having centered by the 1st axle and be that the described light shield in the light shield face of the 1st radius-of-curvature keeps,
Described light shield side drive division makes described light shield move along direction of scanning by making the rotary actuation of described light shield holding member,
Described substrate supporting parts, along centered by the 2nd axle and be the carrying plane of the 2nd radius-of-curvature, support described substrate,
Described substrate-side drive division makes described substrate move along direction of scanning by making the rotary actuation of described substrate supporting parts.
10. the substrate board treatment according to any one of claim 6 ~ 8, is characterized in that,
Described light shield holding member keeps the described light shield with the light shield face becoming plane,
Described light shield side drive division makes described light shield move along direction of scanning by making described light shield holding member linear drives,
Described substrate supporting parts, along centered by the 2nd axle and be the carrying plane of the 2nd radius-of-curvature, support described substrate,
Described substrate-side drive division makes described substrate move along direction of scanning by making the rotary actuation of described substrate supporting parts.
11. substrate board treatments according to any one of claim 6 ~ 8, is characterized in that,
Described light shield holding member is to having centered by the 1st axle and be that the described light shield in the light shield face of the 1st radius-of-curvature keeps,
Described light shield side drive division makes described light shield move along direction of scanning by making the rotary actuation of described light shield holding member,
Described substrate supporting parts have a pair backing roll, and it can support the both sides on the direction of scanning of described substrate rotatably in the mode making described substrate have plane,
Described substrate-side drive division makes described substrate move along direction of scanning by making described a pair backing roll rotary actuation.
12. 1 kinds of device inspection apparatus, is characterized in that having:
Substrate board treatment according to any one of claim 1 ~ 11;
The substrate feeding device of described substrate is supplied to described substrate board treatment; With
To the substrate retracting device reclaimed by the described substrate after described substrate board treatment process.
13. device inspection apparatus as claimed in claim 12, is characterized in that,
Described substrate feeding device has:
1st bearing portion, it supports this supply volume to make supply roll up the mode that can rotate, and described substrate wound into rolls obtains by this supply volume;
1st elevating mechanism, it makes described 1st bearing portion lifting;
Entry angle test section, it detects rolls up the described substrate the sent entry angle relative to the 1st roller of the described substrate that will reel from described supply; With
Control part, its testing result based on described entry angle test section controls described 1st elevating mechanism, thus described entry angle is modified to aspect angle degree.
14. device inspection apparatus as described in claim 12 or 13, is characterized in that,
Described substrate retracting device has:
2nd bearing portion, it supports this recovery volume to make recovery roll up the mode that can rotate, and this recovery volume reels to the described substrate after the process processed by described substrate board treatment;
2nd elevating mechanism, it makes described 2nd bearing portion lifting;
Discharge angle detection, it detects rolls up the described substrate the sent discharge angle relative to the 2nd roller of the described substrate that will reel to described recovery; With
Control part, its testing result based on described discharge angle detection controls described 2nd elevating mechanism, thus described discharge angle is modified to target discharge angle.
15. 1 kinds of device making methods, is characterized in that, comprising:
The substrate board treatment according to any one of claim 6 ~ 11 is used to carry out exposure-processed to described substrate; With
By processing the described substrate after exposure-processed, form the pattern of described light shield.
16. 1 kinds of patterning devices, while being transported along long side direction by the sheet material substrate of the flexibility of long size, the assigned position on this sheet material substrate forms pattern, it is characterized in that having:
Patterning apparatus, it has and comprises for described pattern is formed into the pattern forming portion of the described assigned position on the surface of described sheet material substrate along multiple guide reels of transporting on long side direction of transport path of regulation in interior conveying unit and the part being located at described transport path by described sheet material substrate;
Vibration absorber, it is located at and is provided with between the base station face of described patterning apparatus and described patterning apparatus;
Position regulator, itself and described patterning apparatus arrange independently and are arranged on described base station face, comprise the guide reel for sending described sheet material substrate towards the described conveying unit of described patterning apparatus, and on the Width orthogonal with the long side direction of described sheet material substrate, adjust the position of described sheet material substrate;
Substrate error measuring portion, it at upstream side, measures the change information relevant to the distortion of the change in location on the described Width of described sheet material substrate, postural change or described sheet material substrate relative to the described pattern forming portion in described transport path; With
Control device, it controls described position regulator based on described change information.
17. patterning devices as claimed in claim 16, is characterized in that,
Described substrate error measuring portion, by the edge detected on the Width of described sheet material substrate or the mark be formed on described sheet material substrate, measures described change information.
18. patterning devices as described in claim 16 or 17, is characterized in that,
Described substrate error measuring portion is located at least one party in described patterning apparatus and described position regulator.
19. 1 kinds of patterning devices, while being transported along long side direction by the sheet material substrate of the flexibility of long size, the assigned position on this sheet material substrate forms pattern, it is characterized in that having:
Patterning apparatus, its have comprise for by described sheet material substrate along regulation multiple guide reels of transporting on long side direction of transport path interior conveying unit and be located at described transport path a part on and form the pattern forming portion of described pattern in the described assigned position on the surface of described sheet material substrate;
Vibration absorber, it is located at and is provided with between the base station face of described patterning apparatus and described patterning apparatus;
Position regulator, itself and described patterning apparatus arrange independently and are arranged on described base station face, comprise the guide reel for sending described sheet material substrate towards the described conveying unit of described patterning apparatus, and on the Width orthogonal with the long side direction of described sheet material substrate, adjust the position of described sheet material substrate;
Site error measurement unit, the change information that its measurement is relevant to the relative change in location of described position regulator with described patterning apparatus; With
Control device, it controls described position regulator based on described change information.
20. patterning devices according to any one of claim 16 ~ 19, is characterized in that,
There is the adjustment roller that can tilt, it is located in described patterning apparatus, relative to the described pattern forming portion in described transport path at upstream side, under the state being configured to the tension force executing regulation on described long side direction, by the described transport path warpage of described sheet material substrate
Described control device tilts by making described adjustment roller based on described change information, adjusts to the position on the Width of the sheet material substrate of pattern forming portion conveyance.
21. 1 kinds of device inspection apparatus, while the sheet material substrate of the flexibility of long size is transported along long side direction, the 1st process, the 2nd process are implemented successively to this sheet material substrate, it is characterized in that having:
1st processing unit, it is located on the base station face of regulation, comprises the multiple rollers for being carried on long side direction along the transport path specified by described sheet material substrate, and implements described 1st process to described sheet material substrate;
2nd processing unit, it is arranged on described base station face, comprises the multiple rollers for being carried along the transport path specified at long side direction by the described sheet material substrate transported from described 1st processing unit, and implements described 2nd process to described sheet material substrate;
Antihunting device, it suppresses or isolated vibration passing between described base station face and described 1st processing unit or the vibration passing between described base station face and described 2nd processing unit or the vibration passing between described 1st processing unit and described 2nd processing unit;
Change measurement unit, it measures the change information relevant to the relative change in location of described 1st processing unit and described 2nd processing unit or the change in location of described sheet material substrate that transports to described 2nd processing unit from described 1st processing unit;
Position regulator, it adjusts the position on the Width orthogonal with long side direction of the described sheet material substrate moved in described 2nd processing unit based on described change information.
22. device inspection apparatus as claimed in claim 21, is characterized in that,
Described 2nd processing unit is the patterning apparatus of the one party comprised in exposure device and printing equipment, wherein, this exposure device in order to form pattern used for electronic device on the long side direction of described sheet material substrate, and projecting the luminous energy corresponding to described pattern to the photoinduction layer on the surface being formed at described sheet material substrate, this printing equipment draws described pattern containing a certain ink in conductive material, insulating material, semiconductor material by coating on the surface of described sheet material substrate.
23. device inspection apparatus as claimed in claim 22, is characterized in that,
Described 1st processing unit by implement with the process implemented on described sheet material substrate by described patterning apparatus before the suitable process of operation, independent or multiple pretreating device forms,
Described position regulator be located to be arranged on the carrying channel of described sheet material substrate described patterning apparatus tight before described pretreating device in, or to be located between described tight front pretreating device and described patterning apparatus.
24. device inspection apparatus according to any one of claim 21 ~ 23, is characterized in that,
Described position regulator has: by described sheet material substrate warpage and guide multiple rotating rollers of conveyance on long side direction; Make the driving mechanism that a part of rotating roller in the plurality of rotating roller moves in parallel along the direction of rotary middle spindle; With the control part controlling described driving mechanism based on the described change information measured by described change measurement unit.
25. device inspection apparatus according to any one of claim 21 ~ 24, is characterized in that,
Described position regulator has: by described sheet material substrate warpage and guide multiple rotating rollers of conveyance on long side direction; Make the drive division that the rotary middle spindle of a part of rotating roller in the plurality of rotating roller tilts; With the control part controlling described drive division based on the described change information measured by described change measurement unit.
26. device inspection apparatus as described in claim 24 or 25, is characterized in that,
Described change measurement unit comprises sensor, this sensor is configured on the carrying channel of the described sheet material substrate between described 1st processing unit and described 2nd processing unit, and the tilt variation on the Width of the described sheet material substrate orthogonal with described long side direction is detected as described change information.
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