WO2015005118A1

WO2015005118A1 - Substrate processing apparatus, device manufacturing system, device manufacturing method, and pattern formation apparatus

Info

Publication number: WO2015005118A1
Application number: PCT/JP2014/066885
Authority: WO
Inventors: 鈴木智也; 小宮山弘樹; 加藤正紀; 渡辺智行; 鬼頭義昭; 堀正和; 林田洋祐; 木内徹
Original assignee: 株式会社ニコン
Priority date: 2013-07-08
Filing date: 2014-06-25
Publication date: 2015-01-15
Also published as: KR20190091575A; HK1245421B; CN107255908A; KR102007627B1; TW202013096A; TWI627510B; CN105556391B; TWI681261B; KR101984360B1; KR20160029099A; TWI757817B; CN107255908B; HK1220776A1; KR102097769B1; KR20190060003A; CN108919607A; TW202041981A; CN105556391A; TW201514631A; TW201832017A

Abstract

　The purpose of the present invention is to suitably perform exposure using an exposure unit by further reducing vibration imparted to the exposure unit. A substrate processing apparatus (U3) is provided with: a shock-absorbing table (131) provided on a placement surface (E); an exposure unit (121), provided on the shock-absorbing table (131), for performing an exposure process on a supplied substrate (P); and a position adjustment unit (120) and a drive unit (122) provided on the placement surface (E) and provided, as processing units for performing a process on the exposure unit (121), in an independent state out of contact with the exposure unit (121).

Description

Substrate processing apparatus, device manufacturing system, device manufacturing method, and pattern forming apparatus

The present invention relates to a substrate processing apparatus, a device manufacturing system, a device manufacturing method, and a pattern forming apparatus for forming a pattern for an electronic device on a substrate.

Conventionally, as disclosed in JP-A-9-219353, an exposure apparatus that exposes a device pattern to a substrate provided on a moving stage that moves on a surface plate is known as a substrate processing apparatus. The surface plate of this exposure apparatus is supported on the base via a mount member having a vibration isolation mechanism. The moving stage moves in the X direction on a movable guide provided on the surface plate. The movable guide is moved in the Y direction on the surface plate by two linear motors provided on the base. The two linear motors are provided on both sides of the base in the X direction, and move the movable guide in the Y direction without contact. That is, each linear motor has a mover and a stator, and the stator is fixed on the base, while the mover is fixed on both sides in the X direction of the movable guide, It is in a non-contact state with the stator. In the exposure apparatus disclosed in Japanese Patent Application Laid-Open No. 9-219353, since the mover and the stator of the linear motor are in a non-contact state, vibration due to disturbance is transmitted to the surface plate via the movable guide and the moving stage. Is suppressed.

In the exposure apparatus disclosed in JP-A-9-219353, the movable guide is moved in the Y direction on the surface plate by two linear motors. Similarly, the movement of the movable stage with respect to the movable guide is also performed using the linear motor. Is going. Also in this case, the linear motor moves the moving stage in the X direction without contact. However, since the moving stage is moved with respect to the movable guide on the surface plate, vibration generated by the movement of the moving stage may be transmitted to the surface plate.

In addition, the exposure apparatus disclosed in Japanese Patent Laid-Open No. 9-219353 performs exposure by holding a substrate on a moving stage. However, the present invention is not limited to this configuration, and a film-like substrate is supplied in a continuous state. In some cases, a device pattern is scanned and exposed to a substrate to be formed. In this case, the substrate may vibrate when the substrate is supplied.

An aspect of the present invention has been made in view of the above-described problems, and further reduces the vibration applied to the exposure unit and can suitably perform exposure by the exposure unit, a device manufacturing system, and device manufacturing. It is an object to provide a method and a pattern forming apparatus.

1st aspect of this invention is a substrate processing apparatus, Comprising: The anti-vibration stand provided on the installation surface, The exposure unit which is provided on the said anti-vibration stand and performs the exposure process with respect to the supplied substrate And a processing unit that is provided on the installation surface, is provided in an independent state that is not in contact with the exposure unit, and performs processing on the exposure unit.

A first aspect of the present invention is the substrate processing apparatus, wherein the processing unit includes a position adjusting unit that adjusts a position in a width direction of the substrate supplied to the exposure unit, and the position adjusting unit includes: A base provided on the installation surface; a width moving mechanism provided on the base for moving the substrate in the width direction of the substrate with respect to the base; and provided on the base. The substrate after the position adjustment by the width moving mechanism may be guided toward the exposure unit, and may have a fixed roller whose position with respect to the base is fixed.

1st aspect of this invention is the said board | substrate processing apparatus, Comprising: The 1st board | substrate detection part which is fixedly provided on the said base, and detects the position in the width direction of the said board | substrate supplied to the said fixed roller. And a control unit that controls the width moving mechanism based on the detection result of the first substrate detection unit, and corrects the position in the width direction of the substrate supplied to the fixed roller to a first target position. You may prepare.

A first aspect of the present invention is the substrate processing apparatus, wherein the position adjustment unit further includes a roller position adjustment mechanism that adjusts a position of the fixed roller with respect to the exposure unit, and is provided on the vibration isolation table. A fixed second substrate detection unit configured to detect the position of the substrate supplied to the exposure unit; and the roller position adjustment mechanism based on a detection result of the second substrate detection unit to control the exposure. And a controller that corrects the position of the substrate supplied to the unit to a second target position.

According to a first aspect of the present invention, there is provided the substrate processing apparatus, the pressing mechanism that presses the substrate supplied from the position adjustment unit to the exposure unit so that a tension is applied, and the removal unit. A second substrate detection unit that is fixedly provided on a shaking table and detects the position of the substrate supplied to the exposure unit; and controls the pressing mechanism based on a detection result of the second substrate detection unit; And a controller that adjusts the amount of pressure applied to the substrate.

A first aspect of the present invention is the substrate processing apparatus, wherein the processing unit includes a drive unit that drives the exposure unit, and the exposure unit holds a mask that is illuminated with illumination light. A mask that drives the mask holding member to move the mask in the scanning direction. The mask has a member and a substrate support member that supports the substrate on which the projection light from the mask is projected. A side driving unit and a substrate side driving unit that drives the substrate support member to move the substrate in the scanning direction may be included.

A first aspect of the present invention is the substrate processing apparatus, wherein the exposure unit includes a first frame that supports the mask holding member, and a second frame that supports the substrate support member, The vibration isolation table includes: a first vibration isolation table provided between the installation surface and the first frame; a second vibration isolation table provided between the installation surface and the second frame; May be included.

1st aspect of this invention is the said substrate processing apparatus, Comprising: The said exposure unit has a flame | frame which supports the said mask holding member and the said board | substrate support member, The said vibration isolator is the said installation surface, the said You may provide between frames.

A first aspect of the present invention is the substrate processing apparatus, wherein the mask holding member holds the mask having a mask surface having a first radius of curvature around a first axis, and the mask side The drive unit rotationally drives the mask holding member to move the mask in the scanning direction, and the substrate support member is along a support surface having a second radius of curvature around the second axis. The substrate may be supported, and the substrate-side drive unit may move the substrate in the scanning direction by rotationally driving the substrate support member.

1st aspect of this invention is the said substrate processing apparatus, Comprising: The said mask holding member hold | maintains the said mask which has a mask surface used as a plane, The said mask side drive part drives the said mask holding member linearly The mask is moved in the scanning direction, and the substrate support member supports the substrate along a support surface having a second radius of curvature around the second axis, and the substrate side drive unit May move the substrate in the scanning direction by rotationally driving the substrate support member.

A first aspect of the present invention is the substrate processing apparatus, wherein the mask holding member holds the mask having a mask surface having a first radius of curvature around a first axis, and the mask side The driving unit rotates the mask holding member to move the mask in the scanning direction, and the substrate support member can rotate both sides of the substrate in the scanning direction so that the substrate has a flat surface. The substrate-side drive unit may move the substrate in the scanning direction by rotationally driving the pair of support rollers.

A second aspect of the present invention is a device manufacturing system, the substrate processing apparatus according to the first aspect of the present invention, a substrate supply apparatus that supplies the substrate to the substrate processing apparatus, and a process performed by the substrate processing apparatus. And a substrate recovery apparatus for recovering the processed substrate.

A second aspect of the present invention is the device manufacturing system, wherein the substrate supply device includes a first bearing portion on which a supply roll around which the substrate is wound in a roll shape is rotatably supported; A first elevating mechanism that elevates and lowers the first bearing unit, an entrance angle detecting unit that detects an entrance angle of the substrate with respect to a first roller around which the substrate fed from the supply roll is wound, and an entrance angle detecting unit And a controller that controls the first lifting mechanism based on a detection result and corrects the approach angle to a target approach angle.

A second aspect of the present invention is the device manufacturing system, wherein the substrate recovery apparatus is rotatably supported by a recovery roll on which the processed substrate processed by the substrate processing apparatus is wound. A second bearing part, a second raising / lowering mechanism for raising and lowering the second bearing part, and a discharge angle detecting part for detecting a discharge angle of the substrate with respect to a second roller around which the substrate sent to the collection roll is wound, And a control unit that controls the second elevating mechanism based on the detection result of the discharge angle detection unit and corrects the discharge angle to a target discharge angle.

A third aspect of the present invention is a device manufacturing method, wherein the substrate processing apparatus according to the first aspect of the present invention is used to perform an exposure process on the substrate and to process the exposed substrate. Forming a pattern of the mask.

According to a fourth aspect of the present invention, there is provided a pattern forming apparatus for forming a pattern at a predetermined position on the sheet substrate while conveying the long flexible sheet substrate in the longitudinal direction. A transport unit including a plurality of guide rollers for transporting in a longitudinal direction along a predetermined transport path, and a part of the transport path, and forming the pattern at the predetermined position on the surface of the sheet substrate A patterning device, a vibration isolation device provided between the base surface on which the patterning device is installed and the patterning device, and the patterning device separately provided on the base surface. A guide roller installed and including a guide roller for feeding the sheet substrate toward the conveyance unit of the patterning device, and a width direction orthogonal to the longitudinal direction of the sheet substrate A position adjusting device that adjusts the position of the sheet substrate, and a position change in the width direction, a posture change of the sheet substrate, or a deformation of the sheet substrate on the upstream side of the pattern forming unit in the conveyance path. A substrate error measurement unit that measures change information regarding the control unit, and a control device that controls the position adjustment device based on the change information.

A fourth aspect of the present invention is the pattern forming apparatus, wherein the substrate error measuring unit detects an edge in a width direction of the sheet substrate or a mark formed on the sheet substrate. The change information may be measured.

A fourth aspect of the present invention is the pattern forming apparatus, wherein the substrate error measuring unit is provided in at least one of the patterning apparatus and the position adjusting apparatus.

According to a fourth aspect of the present invention, there is provided a pattern forming apparatus for forming a pattern at a predetermined position on the sheet substrate while conveying the long flexible sheet substrate in the longitudinal direction. A transport unit including a plurality of guide rollers for transporting in a longitudinal direction along a predetermined transport path, and a part of the transport path, and forming the pattern at the predetermined position on the surface of the sheet substrate A patterning device, a vibration isolation device provided between the base surface on which the patterning device is installed and the patterning device, and the patterning device separately provided on the base surface. A guide roller installed and including a guide roller for feeding the sheet substrate toward the conveyance unit of the patterning device, and a width direction orthogonal to the longitudinal direction of the sheet substrate A position adjusting device for adjusting the position of the sheet substrate, a position error measuring unit for measuring change information relating to a relative position change between the patterning device and the position adjusting device, and the position adjusting device based on the change information. And a control device for controlling.

A fourth aspect of the present invention is the pattern forming apparatus, provided in the patterning apparatus, wherein a predetermined tension is applied in the longitudinal direction upstream of the pattern forming unit in the transport path. In the hung state, a tiltable adjustment roller is disposed so as to bend the conveyance path of the sheet substrate, and the control device tilts the adjustment roller based on the change information to form a pattern. You may adjust the position of the width direction of the sheet | seat board | substrate conveyed by a part.

A fifth aspect of the present invention is a device manufacturing system that sequentially performs a first process and a second process on a sheet substrate while conveying the long flexible sheet substrate in the longitudinal direction. A first processing unit that is installed on a predetermined base surface and includes a plurality of rollers for feeding the sheet substrate in a longitudinal direction along a predetermined conveyance path, and performs the first processing on the sheet substrate; A plurality of rollers installed on a base surface for sending the sheet substrate sent from the first processing unit in a longitudinal direction along a predetermined conveyance path; and performing the second processing on the sheet substrate. Second processing unit to be applied, vibration transmission between the base surface and the first processing unit, vibration transmission between the base surface and the second processing unit, or the first processing unit and the Swing with the second processing unit An anti-vibration device that insulates or suppresses transmission, a relative position change between the first processing unit and the second processing unit, or of the sheet substrate conveyed from the first processing unit to the second processing unit A change measuring unit that measures change information related to a position change, and a position adjustment device that adjusts a position in a width direction orthogonal to the longitudinal direction of the sheet substrate carried into the second processing unit based on the change information; .

5th aspect of this invention is the said device manufacturing system, Comprising: The said 2nd processing unit is formed in the surface of the said sheet | seat board | substrate in order to form the pattern for electronic devices in the elongate direction of the said sheet | seat board | substrate. The pattern is drawn on the surface of the sheet substrate by applying an exposure device that projects light energy corresponding to the pattern onto the light-sensitive layer or by applying ink containing any one of a conductive material, an insulating material, and a semiconductor material. It may be a patterning apparatus including any one of the printing apparatuses.

A fifth aspect of the present invention is the device manufacturing system, wherein the first processing unit performs one or a plurality of processes corresponding to a pre-process of a process performed on the sheet substrate by the patterning apparatus. The position adjusting device is disposed in the preprocessing device installed immediately before the patterning device on the sheet substrate conveyance path or between the preprocessing device and the patterning device immediately before. May be provided.

A fifth aspect of the present invention is the device manufacturing system, wherein the position adjusting device includes a plurality of rotating rollers that bend and guide the sheet substrate in a longitudinal direction, and the plurality of rotating rollers. A drive mechanism that translates some of the rotation rollers in the direction of the rotation center axis and a control unit that controls the drive mechanism based on the change information measured by the change measurement unit may be provided.

A fifth aspect of the present invention is the device manufacturing system, wherein the position adjusting device includes a plurality of rotating rollers that bend and guide the sheet substrate in a longitudinal direction, and the plurality of rotating rollers. You may provide the drive part which inclines the rotation center axis | shaft of some rotation rollers, and the control part which controls the said drive part based on the said change information measured by the said change measurement part.

A fifth aspect of the present invention is the device manufacturing system, wherein the change measurement unit is disposed in a conveyance path of the sheet substrate between the first processing unit and the second processing unit, and A sensor that detects a change in inclination in the width direction of the sheet substrate orthogonal to the longitudinal direction as the change information may be included.

According to the aspects of the present invention, there are provided a substrate processing apparatus, a device manufacturing system, a device manufacturing method, and a pattern forming apparatus that can further reduce the vibration applied to the exposure unit and can suitably perform exposure by the exposure unit. be able to.

FIG. 1 is a diagram illustrating a configuration of a device manufacturing system according to the first embodiment. FIG. 2 is a diagram illustrating a configuration when the device manufacturing system according to the first embodiment is simplified. FIG. 3 is a view showing a configuration of a part of the exposure apparatus (substrate processing apparatus) according to the first embodiment. FIG. 4 is a view showing a part of the arrangement of the exposure apparatus according to the first embodiment shown in FIG. FIG. 5 is a diagram showing the overall configuration of the exposure unit according to the first embodiment. FIG. 6 is a view showing the arrangement of illumination areas and projection areas of the exposure unit shown in FIG. FIG. 7 is a view showing the configuration of the projection optical system of the exposure unit shown in FIG. FIG. 8 is a flowchart showing the device manufacturing method according to the first embodiment. FIG. 9 is a view showing a part of the configuration of the exposure apparatus (substrate processing apparatus) according to the second embodiment. FIG. 10 is a view showing the overall arrangement of the exposure unit according to the second embodiment of FIG. FIG. 11 is a diagram showing an overall configuration of an exposure unit according to the third embodiment. FIG. 12 is a view showing the arrangement of an exposure apparatus according to the fourth embodiment. FIG. 13 is a view of the substrate transported in the exposure apparatus shown in FIG. 12 when viewed from the + Z direction side. FIG. 14 is a view of the substrate P transported between the last roller on the position adjustment unit side and the first roller on the exposure unit side shown in FIG. 13 when viewed from the −Y direction side. FIG. 15 is a view of the substrate transported by the rotating drum shown in FIG. 12 when viewed from the −X direction side. FIG. 16 is a diagram illustrating a configuration of the substrate adjustment unit illustrated in FIG. 12. FIG. 17A is a diagram illustrating the configuration of the second substrate detection unit illustrated in FIG. 12, FIG. 17B is a diagram illustrating the beam light emitted to the substrate by the second substrate detection unit, and FIG. 17C is a diagram illustrating the second substrate detection unit. It is a figure which shows the light beam received. It is a figure which shows the structure of the relative position detection part shown in FIG. It is a figure which shows the scanning line and alignment microscope of the spot light scanned on a board | substrate by the exposure head shown in FIG. It is a figure which shows the structure of the drawing unit of the exposure head shown in FIG.

DETAILED DESCRIPTION OF THE INVENTION A substrate processing apparatus, device manufacturing system, device manufacturing method, and pattern forming apparatus according to an aspect of the present invention will be described in detail below with reference to the accompanying drawings and preferred embodiments. In addition, the aspect of this invention is not limited to these embodiment, What added the various change or improvement is included. That is, the constituent elements described below include those that can be easily assumed by those skilled in the art and substantially the same elements, and the constituent elements described below can be appropriately combined. In addition, various omissions, substitutions, or changes of the components can be made without departing from the scope of the present invention.

[First Embodiment]
The substrate processing apparatus according to the first embodiment is an exposure apparatus that performs exposure processing on a substrate, and the exposure apparatus is incorporated in a device manufacturing system that performs various processing on a substrate after exposure to manufacture an electronic device. . First, a device manufacturing system will be described.

<Device manufacturing system>
FIG. 1 is a diagram illustrating a configuration of a device manufacturing system 1 according to the first embodiment. A device manufacturing system 1 shown in FIG. 1 is a line (flexible display manufacturing line) for manufacturing a flexible display as an electronic device (sometimes referred to as a device). Examples of the flexible display include an organic EL display. In the device manufacturing system 1, the substrate P is sent out from a supply roll FR1 obtained by winding a flexible substrate (sheet substrate) P in a roll shape, and various processes are continuously performed on the sent out substrate P. Then, a so-called roll-to-roll system is adopted in which the processed substrate P is wound up by the recovery roll FR2. In the device manufacturing system 1 according to the first embodiment, the substrate P that is a film-like sheet is sent out from the supply roll FR1, and the substrates P sent out from the supply roll FR1 are sequentially supplied to n processing apparatuses U1. , U2, U3, U4, U5,... Un, and the winding roll FR2 is shown as an example. First, the substrate P to be processed by the device manufacturing system 1 will be described.

For the substrate P, for example, a foil (foil) made of a resin or a metal such as stainless steel or an alloy is used. Examples of the resin film material include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. You may use what contained 1 or 2 or more. In addition, the thickness and rigidity (Young's modulus) of the substrate P may be in a range that does not cause folds or irreversible wrinkles due to buckling in the substrate P when it is transported. When making a flexible display panel, touch panel, color filter, electromagnetic wave prevention filter, etc. as an electronic device, a resin sheet such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) having a thickness of about 25 μm to 200 μm is used.

As the substrate P, for example, it is desirable to select a substrate whose thermal expansion coefficient is not remarkably large so that the amount of deformation caused by heat in various processes applied to the substrate P can be substantially ignored. Moreover, when an inorganic filler, such as titanium oxide, zinc oxide, alumina, or silicon oxide, is mixed into the base resin film, the thermal expansion coefficient can be reduced. In addition, the substrate P may be a single layer of ultrathin glass having a thickness of about 100 μm manufactured by a float process or the like, and the resin film or a metal layer such as aluminum or copper is formed on the ultrathin glass. A laminate in which (foil) or the like is bonded may be used.

By the way, the flexibility of the substrate P refers to the property that the substrate P can be bent without being sheared or broken even when a force of its own weight is applied to the substrate P. In addition, flexibility includes a property of bending by a force of about its own weight. Further, the degree of flexibility varies depending on the material, size, and thickness of the substrate P, the layer structure formed on the substrate P, the environment along with the temperature and humidity, and the like. In any case, when the substrate P is correctly wound around various conveyance rollers, rotary drums, and other members for conveyance direction provided in the conveyance path in the device manufacturing system 1 according to the present embodiment, the substrate P buckles and folds. If the substrate P can be smoothly transported without being damaged or broken (breaking or cracking), it can be said that it is in the range of flexibility.

The substrate P configured in this way becomes a supply roll FR1 by being wound in a roll shape, and this supply roll FR1 is mounted on the device manufacturing system 1. The device manufacturing system 1 to which the supply roll FR1 is mounted repeatedly executes various processes for manufacturing an electronic device on the substrate P sent out from the supply roll FR1. For this reason, the processed substrate P is in a state in which a plurality of electronic devices are connected. That is, the substrate P sent out from the supply roll FR1 is a multi-sided substrate. The substrate P may be activated by modifying the surface in advance by a predetermined pretreatment, or may be formed with a fine partition structure (uneven structure) for precise patterning on the surface.

The treated substrate P is recovered as a recovery roll FR2 by being wound into a roll. The collection roll FR2 is attached to a dicing device (not shown). The dicing apparatus to which the collection roll FR2 is mounted divides the processed substrate P for each electronic device (dicing) to form a plurality of electronic devices. Regarding the dimensions of the substrate P, for example, the dimension in the width direction (short direction) is about 10 cm to 2 m, and the dimension in the length direction (long direction) is 10 m or more. In addition, the dimension of the board | substrate P is not limited to an above-described dimension.

The device manufacturing system 1 will be described with reference to FIG. In FIG. 1, an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal to each other is shown. The X direction is a transport direction of the substrate P in the horizontal plane, and is a direction connecting the supply roll FR1 and the recovery roll FR2. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. The Y direction is the axial direction of the supply roll FR1 and the recovery roll FR2. The Z direction is a direction (vertical direction) orthogonal to the X direction and the Y direction.

The device manufacturing system 1 includes a substrate supply device 2 that supplies a substrate P, processing devices U1 to Un that perform various processes on the substrate P supplied by the substrate supply device 2, and processing is performed by the processing devices U1 to Un. A substrate recovery apparatus 4 that recovers the substrate P and a host controller (control unit) 5 that controls each device of the device manufacturing system 1 are provided.

The substrate supply device 2 is rotatably mounted with a supply roll FR1. The substrate supply apparatus 2 includes a driving roller R1 that sends out the substrate P from the mounted supply roll FR1, and an edge position controller EPC1 that adjusts the position of the substrate P in the width direction (Y direction). The driving roller R1 rotates while sandwiching both front and back surfaces of the substrate P, and sends the substrate P in the transport direction (+ X direction) from the supply roll FR1 to the recovery roll FR2, thereby causing the substrate P to be processed by the processing devices U1 to Un. To supply. At this time, the edge position controller EPC1 moves the substrate P in the width direction so that the position at the edge of the edge in the width direction of the substrate P is within a range of about ± 10 μm to several tens μm with respect to the target position. It is moved to correct the position of the substrate P in the width direction.

The substrate collection device 4 is rotatably mounted with a collection roll FR2. The substrate recovery apparatus 4 includes a drive roller R2 that draws the processed substrate P toward the recovery roll FR2, and an edge position controller EPC2 that adjusts the position of the substrate P in the width direction (Y direction). The substrate recovery device 4 rotates while sandwiching the front and back surfaces of the substrate P by the driving roller R2, pulls the substrate P in the transport direction, and rotates the recovery roll FR2, thereby winding the substrate P. At this time, the edge position controller EPC2 is configured in the same manner as the edge position controller EPC1, and corrects the position in the width direction of the substrate P so that the edge of the end portion in the width direction of the substrate P does not vary in the width direction.

The processing device U1 is a coating device that applies a photosensitive functional liquid to the surface of the substrate P supplied from the substrate supply device 2. As the photosensitive functional liquid, for example, a photoresist, a photosensitive silane coupling agent, a UV curable resin liquid, a photosensitive plating reducing solution, or the like is used. The processing apparatus U1 is provided with a coating mechanism Gp1 and a drying mechanism Gp2 in order from the upstream side in the transport direction of the substrate P. The coating mechanism Gp1 includes a pressure drum DR1 around which the substrate P is wound, and a coating roller DR2 facing the pressure drum DR1. The coating mechanism Gp1 sandwiches the substrate P between the pressure drum roller DR1 and the coating roller DR2 in a state where the supplied substrate P is wound around the pressure drum roller DR1. Then, the application mechanism Gp1 applies the photosensitive functional liquid by the application roller DR2 while rotating the impression cylinder DR1 and the application roller DR2 to move the substrate P in the transport direction. The drying mechanism Gp2 blows drying air such as hot air or dry air, removes the solute (solvent or water) contained in the photosensitive functional liquid, and dries the substrate P coated with the photosensitive functional liquid. A photosensitive functional layer is formed on the substrate P.

The processing device U2 heats the substrate P conveyed from the processing device U1 to a predetermined temperature (for example, about several tens to 120 ° C.) in order to stabilize the photosensitive functional layer formed on the surface of the substrate P. Device. The processing apparatus U2 is provided with a heating chamber HA1 and a cooling chamber HA2 in order from the upstream side in the transport direction of the substrate P. The heating chamber HA1 is provided with a plurality of rollers and a plurality of air turn bars therein, and the plurality of rollers and the plurality of air turn bars constitute a transport path for the substrate P. The plurality of rollers are provided in rolling contact with the back surface of the substrate P, and the plurality of air turn bars are provided in a non-contact state on the surface side of the substrate P. The plurality of rollers and the plurality of air turn bars are arranged to form a meandering transport path so as to lengthen the transport path of the substrate P. The substrate P passing through the heating chamber HA1 is heated to a predetermined temperature while being transported along a meandering transport path. The cooling chamber HA2 cools the substrate P to the environmental temperature so that the temperature of the substrate P heated in the heating chamber HA1 matches the environmental temperature of the subsequent process (processing apparatus U3). The cooling chamber HA2 is provided with a plurality of rollers, and the plurality of rollers are arranged in a meandering manner in order to lengthen the conveyance path of the substrate P, similarly to the heating chamber HA1. The substrate P passing through the cooling chamber HA2 is cooled while being transferred along a meandering transfer path. A driving roller R3 is provided on the downstream side in the transport direction of the cooling chamber HA2, and the driving roller R3 rotates while sandwiching the substrate P that has passed through the cooling chamber HA2, thereby moving the substrate P toward the processing apparatus U3. Supply.

The processing apparatus (substrate processing apparatus) U3 is an exposure apparatus that projects and exposes a pattern such as a circuit or wiring for a display panel on the substrate P having a photosensitive functional layer formed on the surface supplied from the processing apparatus U2. It is. Although details will be described later, the processing device U3 illuminates the transmissive mask M with the illumination light beam, and the projection light beam obtained by illuminating the illumination light beam with the mask M is used as the outer peripheral surface of the rotary drum (support drum) 25. Projection exposure is performed on the substrate P wound around a part of the substrate. The processing apparatus U3 includes a driving roller R4 that sends the substrate P supplied from the processing apparatus U2 to the downstream side in the transport direction, and an edge position controller EPC3 that adjusts the position of the substrate P in the width direction (Y direction). The drive roller R4 rotates while pinching both front and back surfaces of the substrate P, and feeds the substrate P toward the exposure position by sending the substrate P downstream in the transport direction. The edge position controller EPC3 is configured in the same manner as the edge position controller EPC1, and corrects the position in the width direction of the substrate P so that the width direction of the substrate P at the exposure position becomes the target position. Further, the processing apparatus U3 has two sets of drive rollers R5 and R6 that send the substrate P to the downstream side in the transport direction in a state where the slack DL is given to the exposed substrate P. The two sets of drive rollers R5 and R6 are arranged at a predetermined interval in the transport direction of the substrate P. The driving roller R5 rotates while sandwiching the upstream side of the substrate P to be transported, and the driving roller R6 rotates while sandwiching the downstream side of the substrate P to be transported, thereby directing the substrate P toward the processing apparatus U4. And supply. At this time, since the slack DL is given to the substrate P, it is possible to absorb fluctuations in the conveyance speed that occur downstream of the drive roller R6 in the conveyance direction, and the influence of the exposure process on the substrate P due to fluctuations in the conveyance speed. Can be trimmed. Further, in the processing apparatus U3, in order to relatively align (align) the partial image of the mask pattern of the mask M with the substrate P, an alignment microscope that detects an alignment mark or the like formed in advance on the substrate P. AM1 and AM2 are provided.

The processing apparatus U4 is a wet processing apparatus that performs wet development processing, electroless plating processing, and the like on the exposed substrate P conveyed from the processing apparatus U3. The processing apparatus U4 has three processing tanks BT1, BT2, and BT3 that are hierarchized in the vertical direction (Z direction) and a plurality of rollers that transport the substrate P therein. The plurality of rollers are arranged so that the substrate P passes through the three processing tanks BT1, BT2, and BT3. A driving roller R7 is provided on the downstream side in the transport direction of the processing tank BT3. The driving roller R7 rotates while sandwiching the substrate P that has passed through the processing tank BT3, so that the substrate P is directed toward the processing apparatus U5. Supply.

Although illustration is abbreviate | omitted, the processing apparatus U5 is a drying apparatus which dries the board | substrate P conveyed from the processing apparatus U4. The processing apparatus U5 adjusts the moisture content adhering to the substrate P wet-processed in the processing apparatus U4 to a predetermined moisture content. The substrate P dried by the processing apparatus U5 is transferred to the processing apparatus Un through several processing apparatuses. Then, after being processed by the processing device Un, the substrate P is wound up on the recovery roll FR2 of the substrate recovery device 4.

The host control device 5 performs overall control of the substrate supply device 2, the substrate recovery device 4, and the plurality of processing devices U1 to Un. The host control device 5 controls the substrate supply device 2 and the substrate recovery device 4 to transport the substrate P from the substrate supply device 2 toward the substrate recovery device 4. In addition, the host controller 5 controls the plurality of processing apparatuses U1 to Un to execute various processes on the substrate P while synchronizing with the transport of the substrate P. The host controller 5 includes a computer and a storage medium in which a program is stored, and the computer executes the program stored in the storage medium, whereby the host controller 5 of the first embodiment is used. Function.

In the device manufacturing system 1 according to the first embodiment, the substrate P sent out from the supply roll FR1 is sequentially wound through the n processing apparatuses U1 to Un to the collection roll FR2. Although an example is shown, the present invention is not limited to this configuration. For example, the device manufacturing system 1 may be configured such that the substrate P sent out from the supply roll FR1 is wound around the collection roll FR2 via one processing apparatus. At this time, when different processing is performed on the substrate P, the substrate P is supplied again to different processing devices using the substrate supply device 2 and the substrate recovery device 4.

<Simplified device manufacturing system>
Next, a device manufacturing system 1 that is a simplified version of the device manufacturing system 1 of FIG. 1 will be described with reference to FIG. FIG. 2 is a diagram illustrating a configuration when the device manufacturing system 1 according to the first embodiment is simplified. As shown in FIG. 2, the simplified device manufacturing system 1 includes a substrate supply device 2, a processing device U3 (hereinafter referred to as an exposure device) as an exposure device, a substrate recovery device 4, and a host control device 5. Have. 2 is an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal to each other, and is an orthogonal coordinate system similar to that in FIG. In the simplified device manufacturing system 1, the substrate supply apparatus 2 has a configuration in which the edge position controller EPC1 is omitted. This is because the exposure apparatus U3 is provided with an edge position controller EPC3. First, the substrate supply apparatus 2 will be described with reference to FIG.

<Substrate supply device>
The substrate supply device 2 includes a first bearing portion 111 on which the supply roll FR1 is mounted, and a first lifting mechanism 112 that moves the first bearing portion 111 up and down. Further, the substrate supply device 2 has an approach angle detection unit 114, and the approach angle detection unit 114 is connected to the host control device 5. Here, in the first embodiment, the host control device 5 functions as a control device (control unit) of the substrate supply device 2. In addition, as a control device of the substrate supply device 2, a lower control device that controls the substrate supply device 2 may be provided, and the lower control device may control the substrate supply device 2.

The first bearing portion 111 rotatably supports the supply roll FR1. The supply roll FR1 pivotally supported by the first bearing portion 111 has a winding diameter of the supply roll FR1 corresponding to the amount of the substrate P fed out when the substrate P is fed (sent out) toward the exposure apparatus U3. It gets smaller. For this reason, the position at which the substrate P is sent out from the supply roll FR1 changes in accordance with the feed amount at which the substrate P is sent out.

The first elevating mechanism 112 is provided between the installation surface E and the first bearing portion 111. The first elevating mechanism 112 moves the first bearing portion 111 in the Z direction (vertical direction) together with the supply roll FR1. The first elevating mechanism 112 is connected to the host controller 5, and the host controller 5 moves the first bearing portion 111 in the Z direction by the first elevating mechanism 112 to remove the substrate P from the supply roll FR 1. Can be set to a predetermined position.

The entrance angle detection unit 114 detects the entrance angle θ1 of the substrate P entering the transport roller 127 of the exposure apparatus U3 described later. The approach angle detection unit 114 is provided around the transport roller 127. Here, the approach angle θ1 is an angle formed by a straight line extending in the vertical direction passing through the central axis of the transport roller 127 (parallel to the Z axis) and the substrate P upstream of the transport roller 127 in the XZ plane. The approach angle detection unit 114 outputs the detection result to the connected host control device 5.

The host control device 5 controls the first elevating mechanism 112 based on the detection result of the approach angle detection unit 114. Specifically, the host controller 5 controls the first elevating mechanism 112 so that the approach angle θ1 becomes a predetermined target approach angle. That is, when the delivery amount of the substrate P from the supply roll FR1 increases, the winding diameter of the supply roll FR1 decreases, so that the entry angle θ1 with respect to the target entry angle increases. For this reason, the host controller 5 moves the first elevating mechanism 112 downward (lowers) in the Z direction, thereby reducing the approach angle θ1 and correcting the approach angle θ1 to be the target approach angle. . Thus, the host controller 5 performs feedback control on the first elevating mechanism 112 based on the detection result of the approach angle detection unit 114 so that the approach angle θ1 becomes the target approach angle. For this reason, since the board | substrate supply apparatus 2 can always supply the board | substrate P with the target approach angle with respect to the conveyance roller 127, it can reduce the influence given to the board | substrate P by the change of approach angle (theta) 1. The feedback control may be any control such as P control, PI control, and PID control.

<Exposure device (substrate processing device)>
Next, the exposure apparatus U3 shown in FIG. 2 will be described with reference to FIG. The exposure apparatus U3 includes a position adjustment unit 120, an exposure unit 121, a drive unit 122 (see FIG. 3), a pressing mechanism 130, and a vibration isolation table (anti-vibration apparatus) 131. The vibration isolation table 131 is provided on the installation surface E, and reduces the transmission of vibration (so-called floor vibration) from the installation surface E to the exposure unit 121 main body. The position adjustment unit 120 is provided on the installation surface E, and includes the edge position controller EPC3 shown in FIG. The position adjustment unit 120 is provided adjacent to the substrate supply apparatus 2 in the X direction. The exposure unit 121 is provided on the vibration isolation table 131 and is provided on the opposite side of the substrate supply apparatus 2 with the position adjustment unit 120 in the X direction. The drive unit 122 (see FIG. 3) is provided on the installation surface E, and is provided adjacent to the exposure unit 121 in the Y direction. That is, the position adjustment unit 120, the exposure unit 121, and the drive unit 122 are provided at different positions on the installation surface E. Further, the exposure unit 121, the position adjustment unit 120, and the drive unit 122 (see FIG. 3) are in a mechanically non-coupled state (a non-contact independent state).

From the above, the position adjustment unit 120 and the drive unit 122 are provided on the installation surface E, while the exposure unit 121 is provided on the installation surface E via the vibration isolation table 131. For this reason, the exposure unit 121 is in a different vibration mode from the position adjustment unit 120 and the drive unit 122. In other words, the exposure unit 121 is provided in a state where the vibration is propagated from the position adjustment unit 120 and the drive unit 122 (a state in which vibrations are difficult to propagate to each other, that is, a state in which the vibrations are effectively insulated). .

Further, the exposure apparatus U3 includes a first substrate detection unit 123 and a second substrate detection unit 124 that detect the position of the substrate P. The first substrate detection unit 123 and the second substrate detection unit 124 are connected to the host control device 5. In the exposure apparatus U3 as well, as in the substrate supply apparatus 2, the host control apparatus 5 functions as a control apparatus (control unit) of the exposure apparatus U3. In addition, as a control apparatus of the exposure apparatus U3, a low-order control apparatus that controls the exposure apparatus U3 may be provided, and the low-order control apparatus may control the exposure apparatus U3.

<Position adjustment unit>
As shown in FIG. 2, the position adjustment unit 120 includes a base 125, the edge position controller EPC 3 (width movement mechanism), and a fixed roller 126. The base 125 is provided on the installation surface E and supports the edge position controller EPC3 and the fixed roller 126. The base 125 may be a vibration isolation table having a vibration isolation function. The base 125 is provided with a base position adjustment mechanism 128 that adjusts the position of the base 125 in the Y direction or the rotational direction around the Z axis. The base position adjustment mechanism 128 is connected to the host control device 5, and the host control device 5 controls the base position adjustment mechanism 128, whereby the edge position controller EPC 3 and the fixed roller 126 installed on the base 125. Can be adjusted together. That is, the base position adjustment mechanism 128 functions as a roller position adjustment mechanism that adjusts the position of the fixed roller 126 in the Y direction with respect to the exposure unit 121.

The edge position controller EPC3 is movable on the base 125 in the width direction (Y direction) of the substrate P. The edge position controller EPC3 has a plurality of rollers including a transport roller 127 provided on the most upstream side in the transport direction in which the substrate P is transported. The transport roller 127 guides the substrate P supplied from the substrate supply device 2 into the position adjustment unit 120. The edge position controller EPC3 is connected to the host controller 5 and controlled by the host controller 5 based on the detection result of the first substrate detection unit 123.

The fixed roller 126 guides the substrate P, whose position has been adjusted in the width direction by the edge position controller EPC3, toward the exposure unit 121. The fixed roller 126 is rotatable and its position with respect to the base 125 is fixed. Therefore, the position of the substrate P entering the fixed roller 126 in the width direction can be adjusted by moving the substrate P in the width direction by the edge position controller EPC3.

The first substrate detection unit 123 detects the position in the width direction of the substrate P conveyed from the edge position controller EPC3 to the fixed roller 126. The first substrate detection unit 123 is fixed on the base 125. Therefore, the first substrate detection unit 123 is in the same vibration mode as the edge position controller EPC3 and the fixed roller 126. The first substrate detection unit 123 detects the position of the edge of the end portion of the substrate P that is in rolling contact with the fixed roller 126. The first substrate detection unit 123 outputs the detection result to the connected host control device 5.

The second substrate detection unit 124 detects the position of the substrate P supplied from the position adjustment unit 120 to the exposure unit 121. The second substrate detection unit 124 is fixed on a vibration isolation table 131 on which the exposure unit 121 is installed. For this reason, the second substrate detection unit 124 is in the same vibration mode as the exposure unit 121. The second substrate detection unit 124 is provided on the introduction side where the substrate P of the exposure unit 121 is introduced. Specifically, the second substrate detection unit 124 is provided adjacent to the guide roller 28 at a position on the upstream side of the most upstream guide roller 28 in the transport direction provided in the exposure unit 121. The second substrate detector 124 detects the position of the substrate P supplied to the exposure unit 121 in the width direction (Y direction) and the vertical direction (Z direction). The second substrate detection unit 124 outputs the detection result to the connected host controller 5.

The host control device 5 controls the edge position controller EPC3 based on the detection result of the first substrate detection unit 123. Specifically, the host controller 5 determines the Y direction from the positions of the edges (both edges in the Y direction) of both ends of the substrate P that is in contact with (rolls into) the fixed roller 126 detected by the first substrate detection unit 123. And the difference between the first target position (target center position) defined in advance. Then, the host controller 5 feedback-controls the edge position controller EPC3 so that the difference becomes zero, moves the substrate P in the width direction, and sets the center position in the width direction of the substrate P with respect to the fixed roller 126 as the first position. Correct to the target center position. For this reason, the edge position controller EPC3 can maintain the position in the width direction of the substrate P with respect to the fixed roller 126 at the first target position, so that the positional deviation in the width direction of the substrate P with respect to the fixed roller 126 can be reduced. Also in this case, the feedback control may be any control such as P control, PI control, PID control and the like.

Further, the host controller 5 controls the base position adjustment mechanism 128 based on the detection result of the second substrate detection unit 124. Specifically, the host controller 5 calculates the difference between the center position obtained from the positions of both ends in the width direction of the substrate P detected by the second substrate detection unit 124 and the second target center position defined in advance. . Then, the host controller 5 feedback-controls the base position adjustment mechanism 128 so that the difference becomes zero, and adjusts the position of the base 125 by the base position adjustment mechanism 128, thereby The position of the fixed roller 126 in the Y direction is adjusted. At this time, the host controller 5 adjusts the position of the fixed roller 126 so that the substrate P is not twisted and not displaced in the width direction. For example, the host controller 5 adjusts the position so that the axial direction of the fixed roller 126 is parallel to the axial direction of the guide roller 28. Then, the host controller 5 adjusts the position of the fixed roller 126 in the Y direction or the rotation direction around the Z axis by the base position adjustment mechanism 128, thereby the center in the width direction of the substrate P supplied to the exposure unit 121. Since the position can be maintained at the second target center position, the twist of the substrate P and the positional deviation in the width direction can be reduced. Also in this case, the feedback control may be any control such as P control, PI control, PID control and the like.

Thus, the position adjustment unit 120 can correct the position in the width direction of the substrate P supplied to the fixed roller 126 to the first target position, and the position of the substrate P supplied to the guide roller 28 of the exposure unit 121 is the first position. Two target positions can be corrected.

In the first embodiment, the position of the substrate P supplied from the position adjustment unit 120 to the exposure unit 121 is corrected. However, the present invention is not limited to this configuration. For example, the substrate P is supplied from the substrate supply device 2 to the position adjustment unit 120. The position of the substrate P to be processed may be corrected. In this case, a substrate detection unit is provided on the upstream side in the conveyance direction of the conveyance roller 127, and a roll position adjustment mechanism for adjusting the position of the supply roll FR1 is provided. And the high-order control apparatus 5 may adjust supply roll FR1 by controlling a roll position adjustment mechanism based on the detection result of a board | substrate detection part. Similarly, the position of the substrate P supplied from the exposure unit 121 to the substrate recovery apparatus 4 may be corrected.

<Exposure unit>
Next, the configuration of the exposure unit 121 of the exposure apparatus U3 according to the first embodiment will be described with reference to FIGS. FIG. 3 is a view showing a part of the configuration of the exposure apparatus (substrate processing apparatus) U3 according to the first embodiment, and FIG. 4 is a view showing the structure of the drive unit of the substrate support mechanism 12 in FIG. It is. FIG. 5 is a diagram showing the overall configuration of the exposure unit 121 according to the first embodiment. FIG. 6 is a view showing the arrangement of the illumination area IR and the projection area PA of the exposure unit 121 shown in FIG. FIG. 7 is a view showing the configuration of the projection optical system PL of the exposure unit 121 shown in FIG.

The exposure unit 121 shown in FIGS. 2 to 5 is a so-called scanning exposure apparatus, and includes a plurality of guide rollers 28 constituting a substrate support mechanism (substrate transport mechanism) 12 and a rotatable cylindrical rotating drum 25. While carrying P in the carrying direction (scanning direction), the mask pattern image formed on the planar mask M is projected and exposed onto the surface of the substrate P. 3 and 4 are views of the exposure unit 121 as viewed from the −X side, and FIGS. 5 and 7 are orthogonal coordinate systems in which the X, Y, and Z directions are orthogonal. 1 is the same orthogonal coordinate system.

First, the mask M used in the exposure unit 121 will be described. The mask M is created as a transmission type planar mask in which a mask pattern is formed with a light shielding layer together with chromium on one surface (mask surface P1) of a flat glass plate, for example, and is held on a mask stage 21 described later. Used in the state. The mask M has a pattern non-formation region in which no mask pattern is formed, and is attached on the mask stage 21 in the pattern non-formation region. The mask M can be released with respect to the mask stage 21.

Note that the mask M may be formed with the whole or a part of the panel pattern corresponding to one display device, or may be a multi-surface pattern in which panel patterns corresponding to a plurality of display devices are formed. May be. Further, a plurality of panel patterns may be repeatedly formed on the mask M in the scanning direction (X direction) of the mask M, or small panel patterns may be repeatedly formed in a direction orthogonal to the scanning direction (Y direction). A plurality may be formed. Further, the mask M may be formed with a panel pattern for the first display device and a panel pattern for the second display device having a size different from that of the first display device.

As shown in FIGS. 3 and 5, the exposure unit 121 installed on the vibration isolation table 131 includes a mask holding mechanism 11 that supports the apparatus frame 132 and the mask stage 21 in addition to the alignment microscopes AM 1 and AM 2 described above. And a substrate support mechanism 12, a projection optical system PL, and a low-order control device (control unit) 16. The exposure unit 121 receives the illumination light beam EL1 from the illumination mechanism 13 and transmits the transmitted light (imaging light beam) generated from the mask pattern of the mask M held by the mask holding mechanism 11 to the substrate support mechanism 12. Projection is performed on the substrate P supported by the rotary drum 25, and a projection image of a part of the mask pattern is formed on the surface of the substrate P.

The lower-level control device 16 controls each part of the exposure apparatus U3 and causes each part to execute processing. The lower level control device 16 may be a part or all of the higher level control device 5 of the device manufacturing system 1. Further, the lower level control device 16 may be a device controlled by the higher level control device 5 and different from the higher level control device 5. The lower control device 16 includes, for example, a computer.

The vibration isolation table 131 is provided on the installation surface E and supports the device frame 132. Specifically, as shown in FIG. 3, the vibration isolation table 131 includes a first vibration isolation table 131a provided outside in the Y direction and a second vibration isolation table provided inside the first vibration isolation table 131a. 131b.

The apparatus frame 132 is provided on the first vibration isolation table 131a and the second vibration isolation table 131b, and supports the mask holding mechanism 11, the substrate support mechanism 12, the illumination mechanism 13, and the projection optical system PL. The apparatus frame 132 includes a first frame 132 a that supports the mask holding mechanism 11, the illumination mechanism 13, and the projection optical system PL, and a second frame 132 b that supports the substrate support mechanism 12. The first frame 132a and the second frame 132b are provided independently, and are arranged so that the first frame 132a covers the second frame 132b. The first frame 132a is provided on the first vibration isolation table 131a, and the second frame 132b is provided on the second vibration isolation table 131b.

The first frame 132a includes a first lower frame 135 provided on the first vibration isolation base 131a, a first upper frame 136 provided above the first lower frame 135 in the Z direction, and a first upper frame 136. And an arm portion 137 standing upright. The first lower frame 135 has a leg portion 135a standing on the first vibration isolation base 131a and an upper surface portion 135b supported by the leg portion 135a, and the projection optical system via the holding member 143 on the upper surface portion 135b. System PL is supported. When viewed in the XY plane, the holding member 143 is kinematically supported by washer members 145 made of metal balls or the like disposed at three locations on the upper surface portion 135b. The leg portion 135a is arranged at a predetermined portion so that a rotation axis AX2 of the rotary drum 25 described later is inserted in the Y direction.

Similarly to the first lower frame 135, the first upper frame 136 also has a leg portion 136a standing on the upper surface portion 135b and an upper surface portion 136b supported by the leg portion 136a, and holds the mask on the upper surface portion 136b. The mechanism 11 (mask stage 21) is supported. The arm part 137 stands on the upper surface part 136 b and supports the illumination mechanism 13 so that the illumination mechanism 13 is positioned above the mask holding mechanism 11.

The second frame 132b is composed of a lower surface portion 139 provided on the second vibration isolation table 131b and a pair of bearing portions 140 standing upright on the lower surface portion 139 in the Y direction. The pair of bearing portions 140 is provided with an air bearing 141 that pivotally supports the rotation axis AX2 that is the rotation center of the rotary drum 25.

The mask holding mechanism 11 transmits power to a mask stage (mask holding member) 21 for holding the mask M, a moving mechanism (linear guide, air bearing, etc.) (not shown) for moving the mask stage 21, and a moving mechanism. And a transmission member 23 for the purpose. The mask stage 21 is configured in a frame shape surrounding a pattern formation region of the mask M, and an upper surface portion 136b of the first upper frame 136 by a mask side drive portion (drive source such as a motor) 22 provided in the drive unit 122. In the X direction which is the scanning direction. The driving force transmitted from the transmission member 23 is used for linear driving of the mask stage 21 by the moving mechanism.

In the present embodiment, since the mask stage 21 linearly moves in the X direction for scanning exposure, the mask side drive unit (drive source) 22 is fixed to the column frame 146 so as to extend in the X direction. The linear motor includes a magnet track (stator) of the linear motor, and the transmission member 23 includes a linear motor coil unit (movable element) facing the magnet track with a certain gap. In FIG. 3, the holding member 143 that supports the projection optical system PL on the apparatus frame 132 side corresponds to the exposure position by the projection optical system PL on the outer peripheral surface of the rotating drum 25 (or the surface of the substrate P). A displacement sensor SG1 for measuring a change in the height of the surface and a displacement sensor SG2 for measuring a change in the position of the mask M in the Z direction from the lower side of the mask stage 21 are provided.

On the other hand, as shown in FIGS. 2 and 3, the rotating drum 25 that supports the substrate P by winding it around a substantially half circumference is provided with a substrate-side drive unit (drive of a rotary motor or the like) provided in the drive unit 122 shown in FIG. It is rotated by the source 26. As shown also in FIG. 5, the rotary drum 25 is formed in a cylindrical shape having an outer peripheral surface (circumferential surface) having a curvature radius Rfa centered on the rotation axis AX2 extending in the Y direction. Here, a plane including the center line of the rotation axis AX2 and parallel to the YZ plane is defined as a center plane CL (see FIG. 5). A part of the circumferential surface of the rotary drum 25 is a support surface P2 that supports the substrate P with a predetermined tension. That is, the rotary drum 25 supports the substrate P in a stable cylindrical curved surface by winding the substrate P around the support surface P2 with a constant tension.

Each air bearing 141 that supports the rotary shaft AX2 with the bearing portions 140 on both sides rotatably supports the rotary shaft AX2 in a non-contact state. In the present embodiment, the rotary shaft AX2 is supported by the air bearing 141 at both ends of the rotary drum 25. However, a normal bearing using a ball or needle processed with high accuracy may be used. As shown in FIGS. 2 and 5, the plurality of guide rollers 28 are respectively provided on the upstream side and the downstream side in the transport direction of the substrate P with the rotary drum 25 interposed therebetween. For example, four guide rollers 28 are provided, two on the upstream side in the transport direction and two on the downstream side in the transport direction.

Therefore, the substrate support mechanism 12 guides the substrate P transported from the position adjustment unit 120 to the rotary drum 25 by the two guide rollers 28. The substrate support mechanism 12 rotates the rotating drum 25 through the rotation axis AX2 by the substrate side driving unit 26, thereby supporting the substrate P introduced into the rotating drum 25 while supporting the substrate P on the support surface P2 of the rotating drum 25. It is conveyed toward the roller 28. The substrate support mechanism 12 guides the substrate P conveyed to the guide roller 28 toward the substrate recovery device 4.

Here, an example of the configuration of the substrate side drive unit 26 will be described with reference to FIG. In FIG. 4, a disk-like scale plate 25c having substantially the same diameter as the radius Rfa of the outer peripheral surface 25a of the rotary drum 25 is fixed coaxially with the rotation axis AX2 on at least one end side of the rotary drum 25 around which the substrate P is wound. Has been. A diffraction grating is formed at a constant pitch in the circumferential direction on the outer peripheral surface of the scale plate 25c, and the rotation angle or rotation of the rotary drum 25 is detected by optically detecting the diffraction grating by the read head EH for encoder measurement. The amount of movement of the surface 25a of the drum 25 in the circumferential direction is measured. The rotation angle information of the rotary drum 25 measured by the read head EH is also used as a feedback signal for servo control of the motor that rotates the rotary drum 25. In FIG. 4, the displacement sensor SG 1 is arranged so as to measure the displacement (radial displacement) of the height position of the surface of the substrate P, but the region on the end side of the rotary drum 25 that is not covered with the substrate P. You may arrange | position so that the displacement (radial direction displacement) of the height position of the surface of 25b may be measured.

On the end side of the rotary shaft AX2 supported by the air bearing 141, a rotor RT in which a magnet unit MUr of a rotary motor that generates torque around the rotary shaft AX2 is annularly arranged and an axial direction on the rotary shaft AX2 And a magnet unit MUs for a voice coil motor that gives a thrust of. On the stator side fixed to the support frame 146 in FIG. 3, a coil unit CUr disposed so as to face the magnet unit MUr around the rotor RT, and a coil wound so as to surround the magnet unit MUs. Units CUs are provided. With such a configuration, the rotating drum 25 (and the scale plate 25c) integrated with the rotating shaft AX2 can be smoothly rotated by the torque applied to the rotor RT.

Further, since the voice coil motor (MUs, CUs) generates thrust in the direction of the rotation axis AX2 (Y direction) even when the rotary drum 25 is rotating, the rotary drum 25 (and the scale plate 25c) is moved to Y. Can be finely moved in the direction. Thereby, a minute positional shift in the Y direction of the substrate P during scanning exposure can be sequentially corrected.

4 is provided with a displacement sensor DT1 for measuring the displacement in the Y direction of the end surface Tp of the rotation axis AX2, or a displacement sensor DT2 for measuring the displacement in the Y direction of the end surface of the scale plate 25c. The change in the position of the rotary drum 25 in the Y direction can be sequentially measured in real time. Therefore, if the voice coil motors (MUs, CUs) are servo-controlled based on the measurement signals from the displacement sensors DT1, DT2, the position of the rotary drum 25 in the Y direction can be accurately determined. .

Here, as shown in FIG. 6, the exposure apparatus U3 of the first embodiment is an exposure apparatus assuming a so-called multi-lens system. 6 is a plan view of the illumination area IR (IR1 to IR6) on the mask M held by the mask stage 21 as viewed from the −Z side (left figure in FIG. 6), and is supported by the rotary drum 25. A plan view (right view of FIG. 6) of the projection area PA (PA1 to PA6) on the substrate P viewed from the + Z side is shown. A symbol Xs in FIG. 6 indicates the scanning direction (rotating direction) of the mask stage 21 and the rotating drum 25. The multi-lens type exposure apparatus U3 illuminates the illumination light beam EL1 on a plurality of (for example, six in the first embodiment) illumination regions IR1 to IR6 on the mask M, and each illumination light beam EL1 corresponds to each illumination region IR1. A plurality of projection light beams EL2 obtained by irradiating with IR6 are projected and exposed to a plurality of projection areas PA1 to PA6 (for example, six in the first embodiment) on the substrate P.

First, the plurality of illumination areas IR1 to IR6 illuminated by the illumination mechanism 13 will be described. As shown in FIG. 6, the plurality of illumination regions IR1 to IR6 are arranged in two rows in the scanning direction of the substrate P across the center plane CL, and the illumination regions IR1, IR3,. And IR5 are arranged, and illumination regions IR2, IR4, and IR6 are arranged on the mask M on the downstream side in the scanning direction. Each of the illumination regions IR1 to IR6 is an elongated trapezoidal region having parallel short sides and long sides extending in the width direction (Y direction) of the mask M. At this time, each of the trapezoidal illumination areas IR1 to IR6 is an area where the short side is located on the center plane CL side and the long side is located outside. The odd-numbered illumination areas IR1, IR3, and IR5 are arranged at a predetermined interval in the Y direction. The even-numbered illumination areas IR2, IR4, and IR6 are arranged at a predetermined interval in the Y direction. At this time, the illumination area IR2 is arranged between the illumination area IR1 and the illumination area IR3 in the Y direction. Similarly, the illumination area IR3 is arranged between the illumination area IR2 and the illumination area IR4 in the Y direction. The illumination area IR4 is arranged between the illumination area IR3 and the illumination area IR5 in the Y direction. The illumination area IR5 is arranged between the illumination area IR4 and the illumination area IR6 in the Y direction. The illumination areas IR1 to IR6 are arranged so that the triangular portions of the hypotenuses of adjacent trapezoidal illumination areas overlap each other when viewed from the scanning direction of the mask M. In the first embodiment, each of the illumination areas IR1 to IR6 is a trapezoidal area, but may be a rectangular area.

The mask M has a pattern formation area A3 where a mask pattern is formed and a pattern non-formation area A4 where a mask pattern is not formed. The pattern non-formation region A4 is a low reflection region that absorbs the illumination light beam EL1, and is arranged so as to surround the pattern formation region A3 in a frame shape. The illumination areas IR1 to IR6 are arranged so as to cover the entire width of the pattern formation area A3 in the Y direction.

The illumination mechanism 13 emits an illumination light beam EL1 that is illuminated by the mask M. The illumination mechanism 13 includes a light source device and an illumination optical system IL. The light source device includes, for example, a lamp light source such as a mercury lamp, a solid-state light source such as a laser diode or a light emitting diode (LED). Illumination light emitted from the light source device includes, for example, bright lines (g-line, h-line, i-line) emitted from a lamp light source, far-ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), and ArF excimer laser light. (Wavelength 193 nm). The illumination light emitted from the light source device has a uniform illuminance distribution and is guided to the illumination optical system IL via a light guide member such as an optical fiber.

The illumination optical system IL is provided with a plurality (for example, six in the first embodiment) of illumination modules IL1 to IL6 corresponding to the plurality of illumination regions IR1 to IR6. The illumination light beam EL1 from the light source device is incident on each of the plurality of illumination modules IL1 to IL6. Each of the illumination modules IL1 to IL6 guides the illumination light beam EL1 incident from the light source device to each of the illumination regions IR1 to IR6. That is, the illumination module IL1 guides the illumination light beam EL1 to the illumination region IR1, and similarly, the illumination modules IL2 to IL6 guide the illumination light beam EL1 to the illumination regions IR2 to IR6. The plurality of illumination modules IL1 to IL6 are arranged in two rows in the scanning direction of the mask M across the center plane CL. The illumination modules IL1, IL3, and IL5 are arranged on the side (left side in FIG. 5) where the illumination regions IR1, IR3, and IR5 are arranged with respect to the center plane CL. The illumination modules IL1, IL3, and IL5 are arranged at a predetermined interval in the Y direction. The illumination modules IL2, IL4, and IL6 are arranged on the side (right side in FIG. 5) where the illumination regions IR2, IR4, and IR6 are arranged with respect to the center plane CL. The illumination modules IL2, IL4, and IL6 are arranged at a predetermined interval in the Y direction. At this time, the illumination module IL2 is disposed between the illumination module IL1 and the illumination module IL3 in the Y direction. Similarly, the illumination module IL3 is disposed between the illumination module IL2 and the illumination module IL4 in the Y direction. The illumination module IL4 is disposed between the illumination module IL3 and the illumination module IL5 in the Y direction. The illumination module IL5 is disposed between the illumination module IL4 and the illumination module IL6 in the Y direction. The illumination modules IL1, IL3, and IL5 and the illumination modules IL2, IL4, and IL6 are symmetrically arranged with respect to the center plane CL as viewed from the Y direction.

Each of the plurality of illumination modules IL1 to IL6 includes a plurality of optical members such as an integrator optical system, a rod lens, and a fly-eye lens, and illuminates each of the illumination regions IR1 to IR6 with an illumination light beam EL1 having a uniform illuminance distribution. In the first embodiment, the plurality of illumination modules IL1 to IL6 are arranged above the mask M in the Z direction. Each of the plurality of illumination modules IL1 to IL6 illuminates each illumination region IR of the mask pattern formed on the mask M from above the mask M.

Next, a plurality of projection areas PA1 to PA6 that are projected and exposed by the projection optical system PL will be described. As shown in FIG. 6, the plurality of projection areas PA1 to PA6 on the substrate P are arranged in correspondence with the plurality of illumination areas IR1 to IR6 on the mask M. That is, the plurality of projection areas PA1 to PA6 on the substrate P are arranged in two rows in the transport direction across the center plane CL, and the projection areas PA1, PA3, PA3, PA3 are arranged on the upstream substrate P in the transport direction (scanning direction). PA5 is arranged, and projection areas PA2, PA4, and PA6 are arranged on the substrate P on the downstream side in the transport direction. Each of the projection areas PA1 to PA6 is an elongated trapezoidal area having a short side and a long side extending in the width direction (Y direction) of the substrate P. At this time, each of the trapezoidal projection areas PA1 to PA6 is an area where the short side is located on the center plane CL side and the long side is located outside. The projection areas PA1, PA3, and PA5 are arranged at a predetermined interval in the width direction. Further, the projection areas PA2, PA4, and PA6 are arranged at a predetermined interval in the width direction. At this time, the projection area PA2 is arranged between the projection area PA1 and the projection area PA3 in the axial direction of the rotation axis AX2. Similarly, the projection area PA3 is disposed between the projection area PA2 and the projection area PA4 in the axial direction of the rotation axis AX2. The projection area PA4 is disposed between the projection area PA3 and the projection area PA5 in the axial direction of the rotation axis AX2. The projection area PA5 is disposed between the projection area PA4 and the projection area PA6 in the axial direction of the rotation axis AX2. As in the illumination areas IR1 to IR6, the projection areas PA1 to PA6 are overlapped so that the triangular portions of the oblique sides of the adjacent trapezoidal projection areas PA overlap each other when viewed from the transport direction of the substrate P. ) Is arranged. At this time, the projection area PA has such a shape that the exposure amount in the area where the adjacent projection areas PA overlap is substantially the same as the exposure amount in the non-overlapping area. The projection areas PA1 to PA6 are arranged so as to cover the entire width in the Y direction of the exposure area A7 exposed on the substrate P.

Here, in FIG. 5, when viewed in the XZ plane, the length from the center point of the illumination area IR1 (and IR3, IR5) on the mask M to the center point of the illumination area IR2 (and IR4, IR6) is The circumferential length from the center point of the projection area PA1 (and PA3, PA5) on the substrate P following the support surface P2 to the center point of the projection area PA2 (and PA4, PA6) is set to be substantially equal.

Further, as shown in FIG. 5, the projection optical system PL is provided with a plurality (for example, six in the first embodiment) of projection modules PL1 to PL6 corresponding to the plurality of projection areas PA1 to PA6. A plurality of projection light beams EL2 from the plurality of illumination regions IR1 to IR6 are incident on the plurality of projection modules PL1 to PL6, respectively. Each projection module PL1 to PL6 guides each projection light beam EL2 from the mask M to each projection area PA1 to PA6. That is, the projection module PL1 guides the projection light beam EL2 from the illumination region IR1 to the projection region PA1, and similarly, the projection modules PL2 to PL6 each project the projection light beam EL2 from the illumination regions IR2 to IR6 to the projection regions PA2 to PA6. Lead. The plurality of projection modules PL1 to PL6 are arranged in two rows in the scanning direction of the mask M across the center plane CL. Projection modules PL1, PL3, and PL5 are arranged on the side (left side in FIG. 5) on which projection areas PA1, PA3, and PA5 are arranged with respect to center plane CL. Projection modules PL1, PL3, and PL5 are arranged at a predetermined interval in the Y direction. Further, the projection modules PL2, PL4, and PL6 are arranged on the side where the projection areas PA2, PA4, and PA6 are arranged (right side in FIG. 5) with respect to the center plane CL. Projection modules PL2, PL4, and PL6 are arranged at a predetermined interval in the Y direction. At this time, the projection module PL2 is disposed between the projection module PL1 and the projection module PL3 in the axial direction of the rotation axis AX2. Similarly, the projection module PL3 is disposed between the projection module PL2 and the projection module PL4 in the axial direction of the rotation axis AX2. The projection module PL4 is disposed between the projection module PL3 and the projection module PL5 in the axial direction of the rotation axis AX2. The projection module PL5 is disposed between the projection module PL4 and the projection module PL6 in the axial direction of the rotation axis AX2. Further, the projection modules PL1, PL3, and PL5 and the projection modules PL2, PL4, and PL6 are arranged symmetrically about the center plane CL as viewed from the Y direction.

The plurality of projection modules PL1 to PL6 are provided corresponding to the plurality of illumination modules IL1 to IL6. That is, the projection module PL1 projects an image of the mask pattern of the illumination area IR1 illuminated by the illumination module IL1 onto the projection area PA1 on the substrate P. Similarly, the projection modules PL2 to PL6 project the mask pattern images of the illumination areas IR2 to IR6 illuminated by the illumination modules IL2 to IL6 onto the projection areas PA2 to PA6 on the substrate P.

Next, the projection modules PL1 to PL6 will be described with reference to FIG. Since each of the projection modules PL1 to PL6 has the same configuration, the projection module PL1 will be described as an example.

The projection module PL1 projects an image of the mask pattern in the illumination area IR (illumination area IR1) on the mask M onto the projection area PA on the substrate P. As shown in FIG. 7, the projection module PL1 includes a first optical system 61 that forms an image of the mask pattern in the illumination region IR on the intermediate image plane P7, and at least one of the intermediate images formed by the first optical system 61. A second optical system 62 that re-images the image on the projection area PA of the substrate P, and a projection field stop 63 disposed on the intermediate image plane P7 on which the intermediate image is formed. The projection module PL1 includes a focus correction optical member 64, an image shift optical member 65, a magnification correction optical member 66, and a rotation correction mechanism 67.

The first optical system 61 and the second optical system 62 are, for example, telecentric catadioptric optical systems obtained by modifying a Dyson system. The first optical system 61 has its optical axis (hereinafter referred to as the second optical axis BX2) substantially orthogonal to the center plane CL. The first optical system 61 includes a first deflecting member 70, a first lens group 71, and a first concave mirror 72. The first deflecting member 70 is a triangular prism having a first reflecting surface P3 and a second reflecting surface P4. The first reflecting surface P3 is a surface that reflects the projection light beam EL2 from the mask M and causes the reflected projection light beam EL2 to enter the first concave mirror 72 through the first lens group 71. The second reflecting surface P4 is a surface on which the projection light beam EL2 reflected by the first concave mirror 72 enters through the first lens group 71 and reflects the incident projection light beam EL2 toward the projection field stop 63. . The first lens group 71 includes various lenses, and the optical axes of the various lenses are disposed on the second optical axis BX2. The first concave mirror 72 is arranged on a pupil plane on which a large number of point light sources generated by the fly-eye lens are imaged by various lenses from the fly-eye lens to the first concave mirror 72 via the illumination field stop.

The projection light beam EL2 from the mask M passes through the focus correction optical member 64 and the image shift optical member 65, is reflected by the first reflecting surface P3 of the first deflecting member 70, and is the upper half field of view of the first lens group 71. The light enters the first concave mirror 72 through the region. The projection light beam EL2 incident on the first concave mirror 72 is reflected by the first concave mirror 72, passes through the lower half field of view of the first lens group 71, and enters the second reflective surface P4 of the first deflecting member 70. The projection light beam EL2 incident on the second reflecting surface P4 is reflected by the second reflecting surface P4 and enters the projection field stop 63.

The projection field stop 63 has an opening that defines the shape of the projection area PA. That is, the shape of the opening of the projection field stop 63 defines the shape of the projection area PA.

The second optical system 62 has the same configuration as that of the first optical system 61, and is provided symmetrically with the first optical system 61 with the intermediate image plane P7 interposed therebetween. The second optical system 62 has an optical axis (hereinafter referred to as a third optical axis BX3) that is substantially perpendicular to the center plane CL and parallel to the second optical axis BX2. The second optical system 62 includes a second deflecting member 80, a second lens group 81, and a second concave mirror 82. The second deflecting member 80 has a third reflecting surface P5 and a fourth reflecting surface P6. The third reflecting surface P5 is a surface that reflects the projection light beam EL2 from the projection field stop 63 and causes the reflected projection light beam EL2 to enter the second concave mirror 82 through the second lens group 81. The fourth reflecting surface P6 is a surface on which the projection light beam EL2 reflected by the second concave mirror 82 enters through the second lens group 81 and reflects the incident projection light beam EL2 toward the projection area PA. The second lens group 81 includes various lenses, and the optical axes of the various lenses are disposed on the third optical axis BX3. The second concave mirror 82 is arranged on a pupil plane on which a large number of point light source images formed by the first concave mirror 72 are imaged by various lenses from the first concave mirror 72 through the projection field stop 63 to the second concave mirror 82. ing.

The projection light beam EL2 from the projection field stop 63 is reflected by the third reflecting surface P5 of the second deflecting member 80, and enters the second concave mirror 82 through the upper half field region of the second lens group 81. The projection light beam EL 2 that has entered the second concave mirror 82 is reflected by the second concave mirror 82, passes through the lower half field of view of the second lens group 81, and enters the fourth reflecting surface P 6 of the second deflecting member 80. The projection light beam EL2 incident on the fourth reflection surface P6 is reflected by the fourth reflection surface P6, passes through the magnification correction optical member 66, and is projected onto the projection area PA. Thereby, the image of the mask pattern in the illumination area IR is projected to the projection area PA at the same magnification (× 1).

The focus correction optical member 64 is disposed between the mask M and the first optical system 61. The focus correction optical member 64 adjusts the focus state of the mask pattern image projected onto the substrate P. For example, the focus correction optical member 64 is formed by superposing two wedge-shaped prisms in opposite directions (in the opposite direction in the X direction in FIG. 7) so as to form a transparent parallel plate as a whole. By sliding the pair of prisms in the direction of the slope without changing the distance between the faces facing each other, the thickness of the parallel plate is made variable. As a result, the effective optical path length of the first optical system 61 is finely adjusted, and the focus state of the mask pattern image formed on the intermediate image plane P7 and the projection area PA is finely adjusted.

The image shift optical member 65 is disposed between the mask M and the first optical system 61. The image shift optical member 65 adjusts the image of the mask pattern projected onto the substrate P so as to be movable in the image plane. The image shifting optical member 65 is composed of a transparent parallel flat glass that can be tilted in the XZ plane of FIG. 6 and a transparent parallel flat glass that can be tilted in the YZ plane of FIG. By adjusting the respective tilt amounts of the two parallel flat glass plates, the image of the mask pattern formed on the intermediate image plane P7 and the projection area PA can be slightly shifted in the X direction and the Y direction.

The magnification correcting optical member 66 is disposed between the second deflection member 80 and the substrate P. In the magnification correcting optical member 66, for example, a concave lens, a convex lens, and a concave lens are arranged coaxially at predetermined intervals, the front and rear concave lenses are fixed, and the convex lens between them is moved in the optical axis (principal ray) direction. It is configured. As a result, the mask pattern image formed in the projection area PA is isotropically enlarged or reduced by a small amount while maintaining a telecentric imaging state. The optical axes of the three lens groups constituting the magnification correcting optical member 66 are inclined in the XZ plane so as to be parallel to the principal ray of the projection light beam EL2.

The rotation correction mechanism 67 is a mechanism that slightly rotates the first deflecting member 70 around an axis perpendicular to the second optical axis BX2 by an actuator (not shown), for example. The rotation correction mechanism 67 can slightly rotate the image of the mask pattern formed on the intermediate image plane P7 by rotating the first deflection member 70 within the plane P7.

In the thus configured projection modules PL1 to PL6, the projection light beam EL2 from the mask M exits from the illumination area IR in the normal direction of the mask surface P1 and enters the first optical system 61. The projection light beam EL2 incident on the first optical system 61 is transmitted through the focus correction optical member 64 and the image shift optical member 65, and the first reflection surface (plane mirror) P3 of the first deflection member 70 of the first optical system 61. And is reflected by the first concave mirror 72 through the first lens group 71. The projection light beam EL2 reflected by the first concave mirror 72 passes through the first lens group 71 again, is reflected by the second reflecting surface (plane mirror) P4 of the first deflecting member 70, and enters the projection field stop 63. The projection light beam EL2 that has passed through the projection field stop 63 is reflected by the third reflecting surface (planar mirror) P5 of the second deflecting member 80 of the second optical system 62, and then reflected by the second concave mirror 82 through the second lens group 81. Is done. The projection light beam EL2 reflected by the second concave mirror 82 passes through the second lens group 81 again, is reflected by the fourth reflecting surface (plane mirror) P6 of the second deflecting member 80, and enters the magnification correcting optical member 66. . The projection light beam EL2 emitted from the magnification correcting optical member 66 is incident on the projection area PA on the substrate P, and an image of the mask pattern appearing in the illumination area IR is projected to the projection area PA at the same magnification (× 1). .

<Control of drive unit>
Next, control of the drive unit 122 will be described with reference to FIG. The drive unit 122 includes a mask side drive unit 22 attached to a support frame 146 installed on the installation surface E, and a substrate side drive unit 26.

As described above, the mask side drive unit 22 is connected to the linear motor magnet track (stator) fixed to the column frame 146 so as to extend in the X direction, and the transmission member 23 coupled to the mask stage 21. It is composed of a linear motor coil unit (movable element) that is fixed and faces the magnet track with a certain gap. Further, as shown in FIG. 4, the board side drive unit 26 includes a coil unit CUr fixed as a stator on the column frame 146 side, and a mover on the rotor RT on the rotation axis AX2 side of the rotary drum 25. And a voice coil motor (MUs, CUs) that applies thrust in the direction of the rotation axis AX2 (Y direction) to the rotary drum 25 from the support frame 146 side. Including. As described above, the mask side drive unit 22 and the substrate side drive unit 26 have a configuration capable of transmitting power directly to the transmission member 23 and the rotation shaft AX2 in a non-contact manner (direct drive method). Not exclusively. For example, the board-side drive unit 26 includes an electric motor and a magnetic gear, and the electric motor is fixed to the support frame 146 side, and a magnetic gear is interposed between the output shaft of the electric motor and the rotation shaft AX2. Also good.

In the configuration of the drive unit 122 as described above, the lower-level control device 16 shown in FIG. 5 moves the mask stage 21 and the rotary drum 25 in synchronization. For this reason, the image of the mask pattern formed on the mask surface P1 of the mask M is curved following the surface (circumferential surface) of the substrate P wound around the support surface P2 (25a in FIG. 4) of the rotary drum 25. Surface) is continuously and repeatedly exposed to projection. In the exposure apparatus U3 of the first embodiment, after performing scanning exposure by synchronous movement of the mask M in the + X direction, an operation (rewinding) of returning the mask M to the initial position in the −X direction is required. Therefore, when the rotating drum 25 is continuously rotated at a constant speed and the substrate P is continuously fed at a constant speed, the pattern exposure is not performed on the substrate P during the rewinding operation of the mask M, and the panel P is transported in the transport direction of the substrate P. The working pattern is formed in a jump (separated) manner. However, since the speed of the substrate P (peripheral speed here) and the speed of the mask M during scanning exposure are assumed to be 50 mm / s to 100 mm / s in practice, the mask stage is used when the mask M is rewound. If 21 is driven at a maximum speed of, for example, 500 mm / s, the margin in the transport direction between panel patterns formed on the substrate P can be reduced.

In the present embodiment, the movement position and speed of the mask stage 21 in the X direction are precisely measured by a laser interferometer or a linear encoder, and the movement position and speed of the outer peripheral surface of the rotary drum 25 are determined by the scale plate 25c in FIG. By accurately measuring with the read head EH, positional synchronization and speed synchronization in the scanning exposure direction between the mask M and the substrate P can be ensured accurately.

<Pressing mechanism>
Next, the pressing mechanism 130 will be described with reference to FIG. The pressing mechanism 130 is provided between the position adjustment unit 120 and the exposure unit 121. The pressing mechanism 130 presses the substrate P supplied from the position adjustment unit 120 to the exposure unit 121 so that tension is applied. The pressing mechanism 130 includes a pressing member 151 and an elevating mechanism 152 that moves the pressing member 151 up and down. The pressing member 151 presses the substrate P against the substrate P in a contact or non-contact state. As the pressing member 151, for example, an air turn bar having an air ejection port and a suction port for making a non-contact state with the substrate P, or a friction roller in contact with the substrate P is used. The elevating mechanism 152 elevates and lowers the pressing member 151 in a direction in which the pressing member 151 is pressed from one surface (back surface) of the substrate P to the other surface (front surface), that is, in the Z direction. The elevating mechanism 152 is connected to the host controller 5 and controlled by the host controller 5 based on the detection result of the second substrate detector 124.

The host control device 5 controls the pressing mechanism 130 based on the detection result of the second substrate detection unit 124. Specifically, the host control device 5 calculates the displacement amount of the position per unit time (for example, several milliseconds) of the substrate P from the position of the substrate P detected by the second substrate detection unit 124. The host controller 5 adjusts the amount of movement of the pressing member 151 in the Z direction according to the calculated amount of displacement. That is, if the calculated displacement amount is large, the host controller 5 controls the lifting mechanism 152 to raise the pressing member 151 in the Z direction, assuming that the vibration of the substrate P is large. The host control device 5 raises the pressing member 151 in the Z direction to apply tension to the substrate P, and the vibration of the substrate P is suppressed by the pressing member 151.

<Substrate recovery device>
Next, the substrate recovery apparatus 4 will be described with reference to FIG. 2 again. The substrate collection apparatus 4 includes a position adjustment unit 160, a second bearing portion 161 on which the collection roll FR2 is mounted, and a second lifting mechanism 162 that raises and lowers the second bearing portion 161. The substrate recovery apparatus 4 includes a discharge angle detection unit 164 and a third substrate detection unit 165, and the discharge angle detection unit 164 and the third substrate detection unit 165 are connected to the host control device 5. Yes. Here, in the first embodiment, the host control device 5 functions as a control device (control unit) of the substrate recovery device 4, similarly to the substrate supply device 2. In addition, as a control device of the substrate recovery apparatus 4, a low-order control device that controls the substrate recovery apparatus 4 may be provided, and the low-order control device may control the substrate recovery apparatus 4.

The position adjustment unit 160 includes the edge position controller EPC2 shown in FIG. The position adjustment unit 160 has substantially the same configuration as the position adjustment unit 120 of the exposure apparatus U3, and includes a base 170 and an edge position controller EPC2. The base 170 is provided on the installation surface E and supports the edge position controller EPC2. The base 170 may be a vibration isolation table having a vibration isolation function.

The edge position controller EPC2 is movable on the base 170 in the width direction (Y direction) of the substrate P. The edge position controller EPC2 has a plurality of rollers including a transport roller 167 provided on the most downstream side in the transport direction of the substrate P. The transport roller 167 guides the substrate P discharged from the position adjustment unit 160 to the collection roll FR2. The edge position controller EPC2 is connected to the host controller 5 and controlled by the host controller 5 based on the detection result of the third substrate detector 165.

The third substrate detection unit 165 detects the position in the width direction of the substrate P recovered from the edge position controller EPC2 to the recovery roll FR2. The third substrate detection unit 165 is fixed on the second lifting mechanism 162. For this reason, the 3rd board | substrate detection part 165 becomes the same vibration mode as collection | recovery roll FR2. The third substrate detection unit 165 detects the position of the edge of the end portion of the substrate P recovered by the recovery roll FR2. The third substrate detection unit 165 outputs the detection result to the connected higher order control device 5.

The host controller 5 controls the edge position controller EPC2 based on the detection result of the third substrate detector 165. Specifically, the host controller 5 determines the difference between the position of the edge of the end of the substrate P recovered by the recovery roll FR2 detected by the third substrate detection unit 165 and the predetermined third target position. Is calculated. Then, the host controller 5 feedback-controls the edge position controller EPC2 so that the difference becomes zero, moves the substrate P in the width direction, and sets the position in the width direction of the substrate P with respect to the collection roll FR2 to the third position. The target position. Therefore, the edge position controller EPC2 can maintain the position in the width direction of the substrate P with respect to the collection roll FR2 at the third target position. Therefore, since the position in the width direction of the substrate P with respect to the collection roll FR2 can be made constant, the end faces in the axial direction of the collection roll FR2 can be aligned. Also in this case, the feedback control may be any control such as P control, PI control, PID control and the like.

The second bearing portion 161 rotatably supports the collection roll FR2. When the substrate P is collected, the collection roll FR2 pivotally supported by the second bearing portion 161 has a winding diameter of the collection roll FR2 corresponding to the collection of the substrate P. For this reason, the position where the substrate P is recovered in the recovery roll FR2 changes according to the recovery amount of the substrate P.

The second elevating mechanism 162 is provided between the installation surface E and the second bearing portion 161. The second elevating mechanism 162 moves the second bearing portion 161 together with the recovery roll FR2 in the Z direction (vertical direction). The second elevating mechanism 162 is connected to the host controller 5, and the host controller 5 moves the second bearing portion 161 in the Z direction by the second elevator mechanism 162, so that the substrate P is collected by the collection roll FR 2. The position where the water is collected can be set to a predetermined position.

The discharge angle detector 164 detects the discharge angle θ2 of the substrate P discharged from the transport roller 167 of the edge position controller EPC2. The discharge angle detection unit 164 is provided around the transport roller 167. Here, the discharge angle θ2 is an angle formed by a straight line extending in the vertical direction passing through the central axis of the transport roller 167 and the substrate P on the downstream side of the transport roller 167 in the XZ plane. The discharge angle detection unit 164 outputs a detection result to the connected host control device 5.

The host control device 5 controls the second elevating mechanism 162 based on the detection result of the discharge angle detecting unit 164. Specifically, the host controller 5 controls the second elevating mechanism 162 such that the discharge angle θ2 becomes a predetermined target discharge angle. That is, when the collection amount of the substrate P to the collection roll FR2 increases, the winding diameter of the collection roll FR2 increases, and the discharge angle θ2 with respect to the target discharge angle decreases. Therefore, the host controller 5 moves the second lifting mechanism 162 upward (in the Z direction) to increase the discharge angle θ2 and correct the discharge angle θ2 to be the target discharge angle. . Thus, the host controller 5 feedback-controls the second elevating mechanism 162 based on the detection result of the discharge angle detection unit 164 so that the discharge angle θ2 becomes the target discharge angle. For this reason, since the board | substrate collection | recovery apparatus 4 can always discharge | emit the board | substrate P from the conveyance roller 167 with a target discharge | emission angle, it can reduce the influence given to the board | substrate P by the change of discharge | emission angle (theta) 2. Also in this case, the feedback control may be any control such as P control, PI control, PID control and the like.

<Device manufacturing method>
Next, a device manufacturing method will be described with reference to FIG. FIG. 8 is a flowchart showing the device manufacturing method according to the first embodiment.

In the device manufacturing method shown in FIG. 8, first, for example, the function / performance design of a display panel using a self-luminous element such as an organic EL is performed, and necessary circuit patterns and wiring patterns are designed by CAD or the like (step S201). Next, a mask M for a necessary layer is manufactured based on the pattern for each layer designed by CAD or the like (step S202). In addition, a supply roll FR1 around which a flexible substrate P (resin film, metal foil film, plastic, or the like) serving as a display panel base material is wound is prepared (step S203). The roll-shaped substrate P prepared in step S203 has a surface modified as necessary, a pre-formed base layer (for example, micro unevenness by an imprint method), and light sensitivity. These functional films and transparent films (insulating materials) may be laminated in advance.

Next, a backplane layer composed of electrodes, wiring, insulating film, TFT (thin film semiconductor), etc. constituting the display panel device is formed on the substrate P, and an organic EL or the like is laminated on the backplane. A light emitting layer (display pixel portion) is formed by the self light emitting element (step S204). This step S204 includes a conventional photolithography process in which the photoresist layer is exposed using the exposure apparatus U3 described in each of the previous embodiments, but a photosensitive silane coupling agent is used instead of the photoresist. An exposure process for pattern-exposing the coated substrate P to form a pattern based on hydrophilicity and water repellency on the surface, and pattern exposure of the photosensitive catalyst layer to form a metal film pattern (wiring, electrode, etc.) by electroless plating A wet process, or a printing process in which a pattern is drawn by a conductive ink containing a conductive material such as silver nanoparticles, an ink containing an insulating material, or an ink containing a semiconductor material (pentacene, semiconductor nanorod, etc.), etc. Processing by is also included.

Next, the substrate P is diced for each display panel device continuously manufactured on the long substrate P by a roll method, or a protective film (environmental barrier layer) or a color filter is formed on the surface of each display panel device. A device is assembled by pasting sheets or the like (step S205). Next, an inspection process is performed to determine whether the display panel device functions normally or satisfies desired performance and characteristics (step S206). As described above, a display panel (flexible display) can be manufactured.

As described above, in the first embodiment, the exposure unit 121 is installed on the installation surface E via the vibration isolation table 131, and the exposure unit 121, the position adjustment unit 120, and the drive unit 122 are provided in an independent state. Can do. That is, in the first embodiment, the exposure unit 121, the position adjustment unit 120, and the drive unit 122 can be separated by the vibration isolation table 131, that is, can be in different vibration modes. Therefore, the exposure unit 121 can reduce vibration from the position adjustment unit 120 and the drive unit 122 by the vibration isolation table 131.

In the first embodiment, the position of the substrate P in the width direction with respect to the fixed roller 126 can be maintained at the first target position. For this reason, since the board | substrate P is supplied to the same position with respect to the fixed roller 126, the position in the width direction of the board | substrate P supplied from the fixed roller 126 can be made constant. Thereby, the first embodiment can make the position in the width direction of the substrate P sent out from the fixed roller 126 constant, so that the influence of vibrations and the like given to the substrate P due to the variation in the position in the width direction of the substrate P is affected. Can be reduced.

Further, in the first embodiment, the position of the substrate P with respect to the transport roller 127 can be maintained at the second target position. For this reason, in the first embodiment, the position of the substrate P supplied to the exposure unit 121 can be made constant. Thereby, since the position of the board | substrate P supplied to the conveyance roller 127 can be made constant in 1st Embodiment, the influence of the vibration etc. which are given to the board | substrate P by the fluctuation | variation of the position of the board | substrate P can be reduced. .

In the first embodiment, the vibration of the substrate P supplied from the position adjustment unit 120 to the exposure unit 121 can be further reduced by pressing the substrate P by the pressing mechanism 130.

In the first embodiment, the apparatus frame 132 is divided into a first frame 132a and a second frame 132b, the mask stage 21 is supported on the first frame 132a, and the rotary drum 25 is mounted on the second frame 132b. Can be supported. For this reason, the 1st frame 132a and the 2nd frame 132b can be provided in an independent state, respectively. That is, the first frame 132a and the second frame 132b can be cut off, that is, different vibration modes can be set. For this reason, the transmission of the mutual vibration of the 1st frame 132a and the 2nd frame 132b can be reduced.

Further, in the first embodiment, the entrance angle θ1 of the substrate P supplied from the supply roll FR1 to the transport roller 127 of the position adjustment unit 120 of the exposure apparatus U3 with respect to the transport roller 127 can be made constant. For this reason, the influence on the board | substrate P by the displacement of approach angle (theta) 1 can be reduced.

In the first embodiment, the discharge angle θ2 of the substrate P supplied from the transport roller 167 of the position adjustment unit 160 of the substrate recovery apparatus 4 to the recovery roll FR2 with respect to the transport roller 167 can be made constant. For this reason, it is possible to reduce the influence on the substrate P due to the displacement of the discharge angle θ2 (such as uneven winding of the substrate P on the collection roll FR2).

[Second Embodiment]
Next, an exposure apparatus U3 according to the second embodiment will be described with reference to FIG. In the second embodiment, only parts that are different from the first embodiment will be described in order to avoid overlapping descriptions, and the same components as those in the first embodiment will be described. Description will be made with the same reference numerals as the form. FIG. 9 is a view showing a part of the configuration of an exposure apparatus (substrate processing apparatus) U3 according to the second embodiment. In the exposure unit 121 of the exposure apparatus U3 of the first embodiment, the apparatus frame 132 is separated into the first frame 132a and the second frame 132b, but the exposure unit of the exposure apparatus U3 of the second embodiment. 121a is a single device frame 180.

In the exposure unit 121a of the second embodiment, the apparatus frame 180 is provided on the vibration isolation table 131, and holds the transmissive cylindrical mask MA, the mask holding mechanism 11, the substrate support mechanism 12, the illumination mechanism 13, and the projection. Supports the optical system PL. The apparatus frame 180 includes a lower surface portion 181 provided on the vibration isolation table 131, a pair of bearing portions 182 standing on the lower surface portion 181, an intermediate portion 183 supported on the pair of bearing portions 182, A leg portion 184 standing on the portion 183, an upper surface portion 185 supported by the leg portion 184, and an arm portion 186 standing on the upper surface portion 185.

Each of the pair of bearing portions 182 is provided with an air bearing 141 that pivotally supports the rotation axis AX2 of the rotary drum 25 of the substrate support mechanism 12. Each air bearing 141 rotatably supports the rotary shaft AX2 in a non-contact state. In the intermediate portion 183, the projection optical system PL is installed via the holding member 143. Washers 145 are interposed at three locations between the holding member 143 and the intermediate portion 183. The holding member 143 is kinematically supported on the intermediate portion 183 by three washer members 145. The upper surface portion 185 is provided with a driving roller (capstan roller) 94 for supporting the mask holding mechanism 11 (hollow cylindrical body) and for rotationally driving the cylindrical mask MA around the rotation center line AX1. . The illumination mechanism 13 is arranged inside the mask holding mechanism 11 and illuminates the illumination area IR (IR1 to IR6) on the cylindrical mask MA from the inside in an arrangement as shown in the left diagram of FIG.

Further, the upper surface portion 185 is provided with a bearing 187 for rotatably supporting the rotation shaft of the drive roller 94, and the mask side drive portion 22 for rotationally driving the drive roller 94 is shown in FIG. The configuration is the same as that of the substrate side drive unit 26. Although not shown, encoder measuring scales (diffraction gratings) or scale plates 25c similar to those in FIG. 4 are provided at both ends of the cylindrical mask holding mechanism 11 in the direction of the rotation center line AX1. The position in the circumferential direction of the cylindrical mask MA is precisely measured by the read head EH arranged so as to oppose it.

As described above, in the second embodiment, the mask holding mechanism 11, the substrate support mechanism 12, the illumination mechanism 13, and the projection optical system PL can be supported by a single device frame 180. For this reason, since the positional relationship among the mask holding mechanism 11, the substrate support mechanism 12, the illumination mechanism 13, and the projection optical system PL can be fixed in the second embodiment, the positional relationship can be easily adjusted without significant adjustment. It becomes possible to install in.

Next, the exposure apparatus U3 (exposure unit 121a) of the second embodiment shown in FIG. 9 will be described in more detail with reference to FIG. In the exposure unit 121a of FIG. 10, the mask holding mechanism 11 has a mask holding drum 21a for holding the transmission type mask MA in a cylindrical shape, a guide roller 93 for supporting the mask holding drum 21a, and the mask holding drum 21a as a center line. A driving roller 94 that drives around AX1 and a mask side driving unit 22 are provided.

The mask holding drum 21a forms a mask surface P1 on which the illumination area IR on the mask MA is arranged. In the present embodiment, the mask surface P1 includes a surface (hereinafter referred to as a cylindrical surface) obtained by rotating a line segment (bus line) around an axis (cylindrical center axis) parallel to the line segment. The cylindrical surface is, for example, an outer peripheral surface of a cylinder, an outer peripheral surface of a column, or the like. The mask holding drum 21a is made of, for example, glass or quartz and has a cylindrical shape having a certain thickness, and the outer peripheral surface (cylindrical surface) forms the mask surface P1. That is, in the present embodiment, the illumination region IR on the mask MA is curved in a cylindrical surface shape having a constant radius Rm from the first axis AX1. Of the mask holding drum 21a, a portion that overlaps the mask pattern of the mask MA when viewed from the radial direction of the mask holding drum 21a, for example, a central portion other than both ends in the Y direction of the mask holding drum 21a is transparent to the illumination light beam EL1. Has light properties.

The mask MA is created as a transmission type planar sheet mask in which a pattern is formed with a light-shielding layer such as chromium on one surface of a strip-like ultrathin glass plate (for example, a thickness of 100 to 500 μm) with good flatness, It is used in a state in which it is curved along the outer peripheral surface of the mask holding drum 21a and wound (attached) around this outer peripheral surface. The mask MA has a pattern non-formation region A4 where no pattern is formed, and is attached to the mask holding drum 21a in the pattern non-formation region A4. The mask MA can be released to the mask holding drum 21a. Instead of wrapping around the mask holding drum 21a made of a transparent cylindrical base material, the mask MA may be integrated by drawing a mask pattern made of a light shielding layer such as chromium directly on the outer peripheral surface of the mask holding drum 21a made of a transparent cylindrical base material. . Also in this case, the mask holding drum 21a functions as a support member for the mask MA.

The guide roller 93 and the driving roller 94 extend in the Y direction parallel to the central axis of the mask holding drum 21a. The guide roller 93 and the drive roller 94 are provided to be rotatable around an axis parallel to the central axis. Each of the guide roller 93 and the drive roller 94 has an outer diameter at the end portion in the axial direction larger than the outer shape of the other portion, and this end portion circumscribes the mask holding drum 21a. Thus, the guide roller 93 and the drive roller 94 are provided so as not to contact the mask MA held on the mask holding drum 21a. The drive roller 94 is connected to the mask side drive unit 22. The driving roller 94 rotates the mask holding drum 21a around the central axis AX1 by transmitting the power from the mask side driving unit 22 to the mask holding drum 21a.

The mask holding mechanism 11 includes one guide roller 93, but the number is not limited and may be two or more. Similarly, the mask holding mechanism 11 includes one drive roller 94, but the number is not limited and may be two or more. At least one of the guide roller 93 and the driving roller 94 is disposed inside the mask holding drum 21a and may be inscribed in the mask holding drum 21a. In addition, portions of the mask holding drum 21a that do not overlap with the mask pattern of the mask MA as viewed from the radial direction of the mask holding drum 21a (both ends in the Y direction) are translucent to the illumination light beam EL1. It does not have to be translucent. Further, one or both of the guide roller 93 and the driving roller 94 may have a truncated cone shape, for example, and the central axis (rotating axis) thereof may be non-parallel to the central axis AX1.

The illumination mechanism 13 is configured in the same manner as in the first embodiment, and the plurality of illumination modules ILa1 to ILa6 of the illumination mechanism 13 are arranged inside the mask holding drum 21a. Each of the plurality of illumination modules ILa1 to ILa6 guides the illumination light beam EL1 emitted from the light source, and irradiates the mask MA with the guided illumination light beam EL1 from the inside of the mask holding drum 21a. The illumination mechanism 13 illuminates the illumination area IR of the mask MA held by the mask holding mechanism 11 with uniform brightness using the illumination light beam EL1. The light source may be arranged inside the mask holding drum 21a or may be arranged outside the mask holding drum 21a. The light source may be a device (external device) different from the exposure device U3.

As described above, in the second embodiment, even if the mask MA of the exposure unit 121a is a cylindrical transmissive mask, the exposure unit 121a, the position adjustment unit 120, and the drive unit 122 are independent from each other. It can be provided in a state where transmission of vibration is insulated. For this reason, the exposure unit 121a can reduce the vibration from the position adjustment unit 120 and the drive unit 122 by the vibration isolation table 131, and can obtain the same effect as the first embodiment.

[Third Embodiment]
Next, an exposure apparatus U3 according to a third embodiment will be described with reference to FIG. In the third embodiment, only parts different from the first embodiment and the second embodiment will be described in order to avoid overlapping descriptions, and the first embodiment and the second embodiment will be described. Constituent elements similar to those of the embodiment will be described with the same reference numerals as those of the first or second embodiment. FIG. 11 shows the overall configuration of the exposure unit 121b according to the third embodiment, which uses a cylindrical reflective mask MB and supports the substrate P in a planar shape.

First, the mask MB used in the exposure apparatus U3 of the third embodiment will be described. The mask MB is a reflective mask using, for example, a metal cylinder. The mask MB is formed in a cylindrical body having an outer peripheral surface (circumferential surface) having a curvature radius Rm with the first axis AX1 extending in the Y direction as the center, and has a constant thickness in the radial direction. The circumferential surface of the mask MB is a mask surface P1 on which a predetermined mask pattern is formed. The mask surface P1 includes a high reflection part that reflects the light beam in a predetermined direction with high efficiency and a reflection suppression part that does not reflect the light beam in the predetermined direction or reflects with low efficiency, and the mask pattern includes the high reflection part and the reflection suppression. It is formed by the part. Since such a mask MB is a metal cylinder, it can be produced at low cost.

The mask MB only needs to have a circumferential surface having a radius of curvature Rm with the first axis AX1 as the center, and is not limited to a cylindrical shape. For example, the mask MB may be an arc-shaped plate material having a circumferential surface. The mask MB may be a thin plate shape, or the thin plate mask MB may be curved so as to have a circumferential surface.

The mask holding mechanism 11 has a mask holding drum 21b that holds the mask MB. The mask holding drum 21b holds the mask MB so that the first axis AX1 of the mask M is the center of rotation. The mask side drive unit 22 is connected to the low order control device 16 and rotates the mask holding drum 21b around the first axis AX1.

Although the mask holding mechanism 11 holds the cylindrical mask M with the mask holding drum 21b, the present invention is not limited to this configuration. The mask holding mechanism 11 may wind and hold the thin plate-like mask MB along the outer peripheral surface of the mask holding drum 21b. The mask holding mechanism 11 may hold the mask MB, which is an arc-shaped plate material, on the outer peripheral surface of the mask holding drum 21b.

The substrate support mechanism 12 includes a pair of drive rollers 196 over which the substrate P is stretched, an air stage 197 that supports the substrate P in a planar shape, and a plurality of guide rollers 28. The pair of driving rollers 196 is rotated by the substrate side driving unit 26 to move the substrate P in the scanning direction. The air stage 197 is provided between the pair of driving rollers 196 and is provided on the back side of the substrate P that is stretched between the pair of driving rollers 196 with a certain tension, and is in a non-contact state or a low friction state. The substrate P is supported in a flat shape. The plurality of guide rollers 28 are respectively provided on the upstream side and the downstream side in the transport direction of the substrate P with the pair of drive rollers 196 interposed therebetween. For example, four guide rollers 28 are provided, two on the upstream side in the transport direction and two on the downstream side in the transport direction.

Therefore, the substrate support mechanism 12 guides the substrate P transported from the position adjustment unit 120 to one drive roller 196 by the two guide rollers 28. The substrate P guided by one drive roller 196 is passed over the pair of drive rollers 196 with a constant tension by being guided by the other drive roller 196. The substrate support mechanism 12 rotates the pair of drive rollers 196 by the substrate-side drive unit 26, so that the substrate P stretched over the pair of drive rollers 196 is directed toward the guide roller 28 while being supported by the air stage 197. Transport. The substrate support mechanism 12 guides the substrate P conveyed to the guide roller 28 toward the substrate recovery device 4.

When the cylindrical reflection type mask MB is used, the illumination mechanism 13 illuminates the illumination light beam EL1 from the outer peripheral side of the mask holding drum 21b. That is, in the illumination mechanism 13, the light source device and the illumination optical system IL are provided on the outer periphery of the mask holding drum 21b. The illumination optical system IL is an epi-illumination system using a polarization beam splitter PBS. Between each of the illumination modules IL1 to IL6 of the illumination optical system IL and the mask MB, a polarization beam splitter PBS and a quarter wavelength plate 198 are provided. That is, the illumination modules IL1 to IL6, the polarization beam splitter PBS, and the quarter wavelength plate 198 are provided in order from the incident side of the illumination light beam EL1 from the light source device.

Here, the illumination light beam EL1 emitted from the light source device enters the polarization beam splitter PBS through the illumination modules IL1 to IL6. The illumination light beam EL1 incident on the polarization beam splitter PBS is reflected by the polarization beam splitter PBS, passes through the quarter-wave plate 198, and is illuminated on the illumination region IR. The projection light beam EL2 reflected from the illumination region IR passes through the quarter-wave plate 198 again, and is converted into a light beam that passes through the polarization beam splitter PBS. The projection light beam EL2 that has passed through the quarter-wave plate 198 passes through the polarization beam splitter PBS and enters the projection optical system PL.

As described above, in the third embodiment, even when the mask MB of the exposure unit 121b is a cylindrical reflective mask and the substrate P is supported in a planar shape, the position adjustment with the exposure unit 121b is performed. The unit 120 and the drive unit 122 can be provided in an independent state (a state in which vibration transmission is insulated). For this reason, the exposure unit 121b can reduce the vibration from the position adjustment unit 120 and the drive unit 122 by the vibration isolation table 131, and can obtain the same effect as that of the second embodiment.

[Fourth Embodiment]
Next, an exposure apparatus (pattern forming apparatus) U3 of the fourth embodiment will be described. Also in the fourth embodiment, only parts different from the first to third embodiments will be described in order to avoid overlapping descriptions, and the same components as those in the first to third embodiments will be described. The same reference numerals as those in the first to third embodiments are given, and the description thereof is omitted.

FIG. 12 is a view showing a configuration of an exposure apparatus U3 according to the fourth embodiment, and FIG. 13 is a view when the substrate P transported in the exposure apparatus U3 shown in FIG. 12 is viewed from above (+ Z direction). FIG. 14 is a view when the substrate P transported between the last roller 126 on the position adjustment unit 120a side and the first roller AR1 on the exposure unit 121c side shown in FIG. 13 is viewed from the −Y direction side. 15 is a view of the substrate P transported by the rotary drum 25 shown in FIG. 12 when viewed from the −X direction side. The exposure apparatus (processing apparatus) U3 includes a position adjustment unit 120a and an exposure unit 121c provided on the downstream side (+ X direction side) in the transport direction of the substrate P with respect to the position adjustment unit 120a. The position adjustment unit 120a and the exposure unit 121c are provided separately. That is, the position adjustment unit 120a and the exposure unit 121c are in an independent state where they are not in contact with each other, or the transport path of the substrate P between the position adjustment unit 120a and the exposure unit 121c or the transport path of the substrate P after the exposure unit 121c. They may be in contact with each other via a dust-proof cover 121d such as a bellows type covering them, but in a state where vibration components generated in the position adjustment unit 120a are not directly transmitted to the exposure unit 121c (state in which transmission of vibration is suppressed). Is provided. The exposure unit 121c is provided on an installation surface (base surface) E via a passive or active vibration isolation table (vibration isolation device, vibration isolation device) 131. The position adjustment unit 120 a is provided on the installation surface E via the base 200. Thereby, vibrations from other processing apparatuses U1, U2, U4 to Un, etc. and vibrations from the position adjustment unit 120a are not transmitted to the exposure unit 121c via the installation surface E. That is, the vibration propagation between the exposure unit 121c and the position adjustment unit 120a and other processing apparatus U can be cut off (insulated). In other words, the vibration of the position adjustment unit 120a and other processing apparatus U and the vibration of the exposure unit 121c are insulated from each other. The base 200 may be a vibration isolation table (vibration isolation device, vibration isolation device) having a vibration isolation / anti-vibration function.

The position adjustment unit (position adjustment device) 120a includes an edge position controller EPC3a, a fixed roller (guide roller) 126, a first substrate detection unit 202, and a lower control device (control unit) 204. The edge position controller EPC3a, the fixed roller 126, and the first substrate detection unit 202 are provided in the order described above from the upstream side (−X direction side) in the transport direction of the substrate P. The edge position controller EPC3a is arranged in the width direction of the substrate P so that the position in the width direction of the substrate P transported with a predetermined tension (for example, a constant value in the range of 20 to 200N) in the longitudinal direction becomes the target position. Adjust (correct) the position at. The edge position controller EPC3a is movable in the width direction (Y direction) of the substrate P in the position adjustment unit 120a. The edge position controller EPC3a moves in the Y direction when the actuator 206 (see FIG. 13) is driven, and adjusts the position of the substrate P in the width direction. The edge position controller EPC3a has guide rollers Rs1, Rs2 and a driving roller NR for transporting the substrate P toward the fixed roller 126. The guide rollers Rs1 and Rs2 guide the substrate P to be transported, and the drive roller NR transports the substrate P by rotating while sandwiching both front and back surfaces of the substrate P. Reference numeral 207a in FIG. 13 is a support member (a frame of the edge position controller EPC3a) that rotatably supports the guide rollers Rs1, Rs2 and the driving roller NR. Reference numeral 207b denotes a support member (a main body frame of the position adjustment unit 120a) that supports the first substrate detection unit 202 and rotatably supports the fixed roller 126, and an edge position on the main body frame 207b. A frame 207a of the controller EPC3a is mounted so as to be movable in the Y direction.

The fixed roller 126 guides the substrate P, whose position has been adjusted in the width direction by the edge position controller EPC3a, toward the exposure unit 121c. By the guide rollers Rs1, Rs2, the driving roller NR, and the fixed roller 126, the substrate P is bent and guided and conveyed in the longitudinal direction. The first substrate detection unit (substrate error measurement unit, change measurement unit) 202 detects the position in the width direction of the substrate P conveyed from the fixed roller 126 toward the exposure unit 121c. Specifically, as shown in FIG. 13, the first substrate detection unit 202 includes a detection unit 202a that detects the Y-direction position of the −Y side edge portion Ea in the width direction of the substrate P, and a + Y side edge portion. A detection unit 202b that detects the position of Eb in the Y direction, and measures a change in the position of the substrate P in the width direction based on detection signals from both

detection units

202a and 202b. Furthermore, the first substrate detection unit 202 (202a, 202b) is not limited to detecting the position of the substrate P in the width direction, but is related to a change in the posture of the substrate P (a slight inclination), a deformation of the substrate P (extension in the width direction), and the like. A sensor configuration that detects (measures) information may be used. The position in the width direction of the substrate P detected by the first substrate detection unit 202 and the change information of the substrate P are sent to the lower control device 204. The first substrate detection unit 202 may detect the position in the width direction of the substrate P conveyed toward the fixed roller 126 from the edge position controller EPC3a.

The first substrate detector 202 changes the posture of the substrate P, in particular, a slight inclination around the X axis (in the YZ plane) of the substrate P in the transport path parallel to the horizontal plane (XY plane) from the fixed roller 126 to the exposure unit 121c. 14, as shown in FIG. 14, each of the

detection units

202 a and 202 b includes a Z position (a height position in the normal direction of the surface of the substrate P) Ze1 of each of the edge portions Ea and Eb of the substrate P. A Z sensor capable of measuring changes in Ze2 is incorporated. Since the

detection units

202a and 202b are arranged at a certain distance from the fixed roller 126 in the conveyance direction of the substrate P, the exposure unit 121c side (roller AR1) is slightly inclined with respect to the XY plane with respect to the fixed roller 126. The difference value between the Z position Ze1 detected by the detection unit 202a and the Z position Ze2 detected by the detection unit 202b changes according to the amount of inclination. By obtaining the difference value in this way, the relative position change ΔZs in the Z direction between the fixed roller 126 (position adjustment unit 120a) and the exposure unit 121c (roller AR1) is canceled out, and the

detection units

202a and 202b are arranged. The slight inclination (around the X axis) of the substrate P at the position obtained can be accurately obtained.

The actual tilt amount (angle Δψ) of the substrate P can be calculated as tan Δψ = (Ze1−Ze2) / Lz, where the distance in the Y direction of the Z sensor unit of the

detection units

202a and 202b is Lz (a constant value). As described above, the slight inclination change of the substrate P measured by the Z sensors incorporated in the

detection units

202a and 202b is the relative inclination around the Z axis between the fixed roller 126, that is, the position adjustment unit 120a and the exposure unit 121c. Responds to change. As the Z sensor, an optical or capacitive non-contact type gap sensor can be used. Further, a constant tension is also applied to the substrate P between the fixed roller 126 and the first roller (AR1) on the exposure unit 121c side in FIG. For this reason, there is little possibility that the substrate P bends in the meantime, but when the tension is small, the bending may occur, and an error may occur in the measurement by the Z sensor. For this reason, the

detection units

202a and 202b (Z sensor unit) are preferably arranged at positions close to the first roller (AR1) on the exposure unit 121c side in the longitudinal direction (transport direction) of the substrate P.

As shown in FIG. 14, when the substrate P is transported while the exposure unit 121c (first roller AR1) is inclined in the YZ plane as viewed from the fixed roller 126, the substrate P is bent by the roller AR1. In the transport direction (−Z direction) of the substrate P, the parallelism with the XZ plane is impaired, and the substrate P is gradually displaced to one side in the width direction (+ Y direction or −Y direction) by the action of tension. As a result, the substrate P supported by the rotary drum 25 is also gradually displaced in the Y direction. The position adjustment unit 120a (edge position controller EPC3a) functions to correct such displacement of the substrate P in the Y direction, but includes a substrate adjustment unit 214 (in detail, including a roller AR1 provided on the exposure unit 121c side). It can also be corrected by (described later). Therefore, by controlling one or both of the position adjustment unit 120a and the substrate adjustment unit 214 based on the change information regarding the slight inclination (around the X axis) of the substrate P detected by the

detection units

202a and 202b, The position of the substrate P supported by the rotary drum 25 in the Y direction can be maintained with high accuracy. Further, regarding the position adjustment in the width direction of the substrate P until it reaches the rotary drum 25, the position adjustment unit 120a can be used as a rough adjustment, and the substrate adjustment unit 214 can be used as a fine adjustment.

The lower-level control device 204 controls the position of the substrate P in the width direction by controlling the edge position controller EPC3a of the position adjustment unit 120a, the substrate adjustment unit 214, or the like. The lower level control device 204 may be a part or all of the higher level control device 5, or may be a computer different from the higher level control device 5 controlled by the higher level control device 5.

The exposure unit (patterning device) 121c includes a substrate support mechanism 12a, a second substrate detection unit 208, an illumination mechanism 13a, an exposure head (pattern formation unit) 210, and a lower level control device (control unit) 212. The exposure unit 121c is stored in the temperature control chamber ECV. This temperature control chamber ECV keeps the inside at a predetermined temperature, thereby suppressing the shape change due to the temperature of the substrate P transported inside. The temperature control chamber ECV is disposed on the installation surface E via a passive or active vibration isolation table 131.

The substrate support mechanism (transport unit) 12a transports the substrate P sent from the position adjustment unit 120a to the downstream side (+ X direction) while supporting the substrate P. The upstream side in the transport direction of the substrate P (−X The substrate adjustment unit 214, the guide roller Rs3, the tension roller RT1, the rotating drum 25, the tension roller RT2, and the driving rollers R5 and R6 are provided in this order from the direction side.

The substrate adjustment unit 214 has a plurality of rollers (AR1, RT3, AR2), and adjusts the position in the width direction of the substrate P, thereby correcting the torsion and wrinkle generated on the substrate P, while adjusting the substrate P. Transport in the transport direction (+ X direction). The configuration of the substrate adjustment unit 214 will be described later. The guide roller Rs3 conveys the substrate P, whose position in the width direction of the substrate P has been adjusted by the substrate adjusting unit 214, to the rotary drum 25. The rotating drum 25 conveys the substrate P toward the driving rollers R5 and R6 while holding a portion where a predetermined pattern is exposed on the substrate P while rotating on the circumferential surface. The functions of the driving rollers R5 and R6 are as described in the first embodiment. The tension rollers RT1 and RT2 apply a predetermined tension to the substrate P that is wound around and supported by the rotary drum 25. Reference numeral 215 in FIG. 13 denotes a support member that rotatably supports the plurality of rollers of the substrate adjustment unit 214, the guide roller Rs3, the tension roller RT1, the rotating drum 25, the tension roller RT2, and the driving rollers R5 and R6. (Main body frame of the exposure unit 121c).

FIG. 16 is a diagram illustrating a configuration of the substrate adjustment unit 214. The substrate adjustment unit 214 includes adjustment rollers AR1 and AR2 and a tension roller RT3. The adjustment roller AR1, the tension roller RT3, and the adjustment roller AR2 are provided in the order described above from the upstream side (−X direction side) in the transport direction of the substrate P. The adjustment rollers AR1 and AR2 are arranged so as to bend the transport path of the substrate P in a state where a predetermined tension is applied. Specifically, by providing the tension roller RT3 below the adjustment rollers AR1 and AR2 (−Z direction side), the conveyance path is bent in a state where a predetermined tension is applied by the adjustment rollers AR1 and AR2. As a result, the substrate P transported in the + X direction from the position adjustment unit 120a is bent downward (−Z direction) by the adjustment roller AR1 in a state where a predetermined tension is applied, and is guided to the tension roller RT3. The substrate P transported upward (in the + Z direction) is bent in the + X direction by the adjustment roller AR2 and guided to the guide roller Rs3 in a state where a predetermined tension is applied. The tension roller RT3 is pivotally supported at both ends in the Y direction so that it can be translated in the Z direction. While the substrate P is being transported, a predetermined biasing force is generated in the −Z direction to tension the substrate P. give.

The adjustment roller AR1 is rotatable with respect to the rotation axis AX3a by the bearing 214a, and the adjustment roller AR2 is also rotatable with respect to the rotation axis AX3b by the bearing 214b. The rotation axes AX3a and AX3b are provided in parallel along the Y direction. The adjustment rollers AR1 and AR2 can be tilted with respect to an axis parallel to the Y direction. That is, one end side (−Y direction side) of the rotation shaft AX3a of the adjustment roller AR1 can be slightly moved in the Z direction and the X direction with the other end side (+ Y direction side) as a fulcrum. Similarly, the adjustment roller AR2 can move in the X direction and the Z direction on one end side (−Y direction side) of the rotation axis AX3b with the other end side (+ Y direction side) as a fulcrum. The minute movement on one end side (−Y direction side) of the rotation shafts AX3a and AX3b is driven by an actuator such as a piezo element (not shown). By slightly tilting the adjustment rollers AR1 and AR2, the position in the width direction of the substrate P can be finely adjusted along with the conveyance of the substrate P in the longitudinal direction. A slight in-plane deformation (or wrinkle) due to the internal stress of P can be corrected. In FIG. 16, the two adjustment rollers AR1 and AR2 are slightly tilted in the XY plane or the YZ plane, but the tension roller RT1 may be tilted without tilting the adjustment rollers AR1 and AR2. . Further, the adjusting roller AR2 and the tension roller RT1 may be tilted without tilting the adjusting roller AR1.

The second substrate detection unit (substrate error measurement unit, change measurement unit) 208 detects the position in the width direction of the substrate P conveyed in the + Z direction from the tension roller RT1 toward the rotary drum 25. Specifically, as shown in FIG. 15, the second substrate detection unit 208 is provided on each of both ends in the width direction of the substrate P, and detects edges at both ends in the width direction of the substrate P. FIG. 17A is a diagram illustrating the configuration of the second substrate detection unit 208, FIG. 17B is a diagram illustrating the beam light Bm irradiated onto the substrate P by the second substrate detection unit 208, and FIG. 17C is a diagram illustrating the second substrate detection unit 208. It is a figure which shows the beam light Bm light-received by. The second substrate detection unit 208 includes an irradiation system 216 that irradiates the beam light Bm, and a light receiving system 218 that receives the beam light Bm. The irradiation system 216 includes a light projecting unit 220, a cylindrical lens 222, and a reflection mirror 224, and the light receiving system 218 includes a reflection mirror 226, an imaging optical system 228, and an image sensor 230. The light projecting unit 220 includes a light source that emits the light beam Bm, and irradiates the emitted light beam Bm toward the substrate P. The beam light Bm irradiated by the light projecting unit 220 is irradiated onto the substrate P via the cylindrical lens 222 and the reflection mirror 224. As shown in FIG. 17B, the cylindrical lens 222 converges the incident light beam Bm with respect to the Z direction so as to be a slit-shaped light beam Bm parallel to the Y direction of the substrate P on the substrate P. The length of the beam light Bm irradiated toward the substrate P is Lbm. At least a part of the beam light Bm irradiated toward the substrate P is reflected by the substrate P, and the remaining beam light Bm that does not hit the substrate P goes straight without being reflected by the substrate P.

The slit-shaped light beam Bm reflected from the substrate P enters the imaging optical system 228 via the reflection mirror 226. The imaging optical system 228 images the beam light Bm reflected from the reflection mirror 226 on the image sensor 230, and the image sensor 230 images the incident beam light Bm. As shown in FIG. 17C, the length of the beam light Bm imaged by the image sensor 230 becomes the length Lbm1 of the beam light Bm reflected from the substrate P. Therefore, the length of the Lbm1 is measured to measure the length of the substrate. The position of the edge of P can be detected. By having such a configuration, the second substrate detection unit 208 can detect the position in the width direction of the substrate P conveyed in the + Z direction from the tension roller RT1 toward the rotary drum 25 with high accuracy. Further, the second substrate detection unit 208 detects (measures) change information related to a change in the position of the substrate P in the width direction, deformation of the substrate P (extension in the width direction), and the like by detecting the position of the substrate P. Can do. The position in the width direction of the substrate P detected by the second substrate detection unit 208 and the change information of the substrate P are sent to the lower control device 204. Reference numeral 230 a indicates an imaging region of the imaging element 230. The configuration of the first substrate detection unit 202 may be the same as that of the second substrate detection unit 208.

A plurality of alignment microscopes (substrate error measurement unit, change measurement unit) AM1 and AM2 of the exposure unit 121c are provided along the width direction of the substrate P, and are formed on the substrate P as shown in FIG. The mark Ks is detected. In the example shown in FIG. 15, the alignment marks Ks are formed at regular intervals along the longitudinal direction of the substrate P on both ends of the substrate P, and the exposure areas A7 aligned in the longitudinal direction on the substrate P. And five exposure regions A7 are provided at regular intervals along the width direction of the substrate P. Accordingly, five alignment microscopes AM1 (see FIG. 19) and AM2 are provided at regular intervals along the width direction of the substrate P so that the alignment marks Ks formed on the substrate P can be detected. When the alignment microscopes AM1 and AM2 detect the alignment mark Ks, the position in the width direction of the substrate P being conveyed while being supported by the rotary drum 25 can be detected with high accuracy. In addition, the alignment microscopes AM1 and AM2 can detect (measure) change information regarding the position change in the width direction of the substrate P, the posture change, the deformation of the substrate P, and the like by detecting the position of the alignment mark Ks.

The positional information of the alignment mark Ks detected by the alignment microscopes AM1 and AM2 in each of the longitudinal direction (conveying direction) and the width direction is sent to the lower-level control device 212. The lower-level control device 212 generates correction information for correcting the pattern formation position based on the acquired position information of the alignment mark Ks, sends it to the exposure head (pattern formation unit) 210, and also in the width direction of the substrate P. The change information of the position and the substrate P is calculated and sent to the lower control device 204. Reference numeral 232 in FIG. 15 indicates a detection region (detection field of view) of each alignment microscope AM1, and the positions of the five detection regions 232 in the transport direction (Z direction in FIG. 15) of the substrate P are rotated by the substrate P. The position is set so as to stably come into close contact with the outer peripheral surface of the drum 25. The size of the detection region 232 on the substrate P is set according to the size of the alignment mark Ks and the alignment accuracy (position measurement accuracy), but is about 100 to 500 μm square.

By the way, as shown in FIG. 12, a relative position between the position adjustment unit 120a and the exposure unit 121c is detected (measured) relative to the position adjustment unit 120a and the exposure unit 121c. A position detection unit (position error measurement unit, change measurement unit) 234 is provided. FIG. 18 is a diagram illustrating a configuration of the relative position detection unit 234. The relative position detector 234 is provided between the position adjustment unit 120a and the exposure unit 121c, on the end side in the −Y direction and on the end side in the + Y direction, respectively. The relative position detector 234 detects the relative position change between the position adjustment unit 120a and the exposure unit 121c in the YZ plane, and the relative position between the position adjustment unit 120a and the exposure unit 121c in the XZ plane. And a second detector 238 for detecting a change in position. Thereby, the relative position detector 234 can detect the relative position and change information between the position adjustment unit 120a and the exposure unit 121c in three dimensions (XYZ space).

The first detection unit 236 includes a light projecting unit 240a that emits laser light in the + X direction and a light receiving unit 242a that receives the laser light emitted by the light projecting unit 240a. The second detection unit 238 includes a light projecting unit 240b that emits laser light in the + Y direction and a light receiving unit 242b that receives the laser light emitted by the light projecting unit 240b. The light projecting unit 240a of the first detection unit 236 and the light projecting unit 240b of the second detection unit 238 are provided on the surface side (+ X direction side) facing the exposure unit 121c of the position adjustment unit 120a. Further, the light receiving unit 242b of the first detection unit 236 and the light receiving unit 242b of the second detection unit 238 are provided on the surface side (−X direction side) facing the position adjustment unit 120a of the exposure unit 121c.

The

light receiving units

242a and 242b are configured by four-divided sensors. That is, the

light receiving units

242a and 242b have four photodiodes (photoelectric conversion elements) 244, and the difference in the amount of light received by each of the four photodiodes 244 (signal level difference) is used. Changes in position in a plane perpendicular to the beam center are detected. Since the laser light incident on the light receiving unit 242a is light traveling in the + X direction, the light receiving unit 242a detects the position and position change of the center of the laser light in the YZ plane perpendicular to the X direction. In addition, since the laser light incident on the light receiving unit 242b is light traveling in the + Y direction, the light receiving unit 242b detects the position and position change of the center of the laser light in the XZ plane perpendicular to the Y direction. As a result, the relative position between the position adjustment unit 120a and the exposure unit 121c and the change information regarding the position change can be detected (measured) in three dimensions. In particular, the relative rotation error about the X axis between the position adjustment unit 120a and the exposure unit 121c (relative tilt in the YZ plane) is determined by the difference or average of the detection information of the pair of first detection units 236 separated in the Y direction. ) And relative position errors in the Y direction can be measured in real time. Further, the relative rotation error (relative tilt in the XY plane) about the Z axis between the position adjustment unit 120a and the exposure unit 121c is caused by the difference between the detection information of the pair of second detection units 238 separated in the Y direction. It can be measured in real time.

Returning to the explanation of FIG. 12, the illumination mechanism 13a has a laser light source and emits a laser beam (exposure beam) LB used for exposure. This laser beam LB may be ultraviolet light having a peak wavelength in a wavelength band of 370 nm or less. The laser beam LB may be pulsed light emitted at the oscillation frequency Fs. The laser beam LB emitted from the illumination mechanism 13a enters the exposure head 210.

The exposure head 210 includes a plurality of drawing units DU (DU1 to DU5) on which the laser beams LB from the illumination mechanism 13a are respectively incident. That is, the laser beam LB from the illumination mechanism 13a is guided to the light introducing optical system 250 having a reflection mirror, a beam splitter, etc., and enters the plurality of drawing units DU (DU1 to DU5). The exposure head 210 draws a pattern on a part of the substrate P conveyed by the substrate support mechanism 12a and supported by the circumferential surface of the rotary drum 25 by a plurality of drawing units DU (DU1 to DU5). The exposure head 210 is a so-called multi-beam type exposure head 210 by having a plurality of drawing units DU (DU1 to DU5) having the same configuration. The drawing units DU1, DU3, and DU5 are arranged on the upstream side (−X direction side) in the transport direction of the substrate P with respect to the rotation axis AX2 of the rotating drum 25. The drawing units DU2 and DU4 are the rotating shafts of the rotating drum 25. It is arranged on the downstream side (+ X direction side) in the transport direction of the substrate P with respect to AX2.

Each drawing unit DU converges the incident laser beam LB on the substrate P to be spot light, and scans the spot light at high speed along a scanning line by a rotating polygon mirror or the like. As shown in FIG. 19, the scanning lines L of the drawing units DU are set so as to be connected without being separated from each other in the Y direction (width direction of the substrate P). In FIG. 19, the scanning line L of the drawing unit DU1 is represented by L1, and the scanning line L of the drawing unit DU2 is represented by L2. Similarly, the scanning lines L of the drawing units DU3, DU4, and DU5 are represented by L3, L4, and L5. In this way, each drawing unit DU shares the scanning area so that the drawing units DU1 to DU5 all cover the entire width of the exposure area A7. For example, if the drawing width in the Y direction (the length of the scanning line L) by one drawing unit DU is about 20 to 50 mm, three odd-numbered drawing units DU1, DU3, and DU5 and even-numbered drawing By arranging a total of five drawing units DU, two units DU2 and DU4, in the Y direction, the width in the Y direction that can be drawn is increased to about 100 to 250 mm. The alignment microscopes AM1 and AM2 are provided on the upstream side (−X direction side) in the transport direction of the substrate P from the scanning lines L1, L3, and L5, and are closely supported by the circumferential surface of the rotary drum 25. The alignment mark Ks formed on the substrate being conveyed is detected.

This drawing unit DU is a known technique as disclosed in International Publication No. 2013/146184 pamphlet (see FIG. 36), but the drawing unit DU will be briefly described with reference to FIG. Since each drawing unit DU (DU1 to DU5) has the same configuration, only the drawing unit DU2 will be described, and description of the other drawing units DU will be omitted.

As shown in FIG. 20, the drawing unit DU2 includes, for example, a condenser lens 252, a drawing optical element (light modulator) 254, an absorber 256, a collimator lens 258, a reflection mirror 260, a cylindrical lens 262, a focus lens 264, A reflection mirror 266, a polygon mirror (light scanning member) 268, a reflection mirror 270, an f-θ lens 272, and a cylindrical lens 274 are included.

The laser beam LB incident on the drawing unit DU2 travels from the upper side to the lower side (−Z direction) in the vertical direction, and enters the drawing optical element 254 via the condenser lens 252. The condensing lens 252 condenses (converges) the laser beam LB incident on the drawing optical element 254 so as to be a beam waist in the drawing optical element 254. The drawing optical element 254 is transparent to the laser beam LB, and for example, an acousto-optic element (AOM: Acousto-Optic Modulator) is used.

The drawing optical element 254 transmits the incident laser beam LB to the absorber 256 side when the drive signal (high frequency signal) from the low order control device 212 is off, and the drive signal (from the low order control device 212 ( When the high-frequency signal is on, the incident laser beam LB is diffracted and directed to the reflection mirror 260. The absorber 256 is an optical trap that absorbs the laser light LB in order to suppress leakage of the laser light LB to the outside. In this manner, the laser beam LB is applied to the reflection mirror 260 by turning on / off the drawing drive signal (ultrasonic frequency) to be applied to the drawing optical element 254 at high speed according to the pattern data (black and white). Switching to or from the absorber 256 is switched. This means that when viewed on the substrate P, the intensity of the laser light LB (spot light SP) reaching the photosensitive surface is rapidly modulated to either a high level or a low level (for example, zero level) according to the pattern data. Means that

The collimator lens 258 converts the laser beam LB from the drawing optical element 254 toward the reflection mirror 260 into parallel light. The reflection mirror 260 reflects the incident laser beam LB in the −X direction and irradiates the reflection mirror 266 via the cylindrical lens 262 and the focus lens 264. The reflection mirror 266 irradiates the polygon mirror 268 with the incident laser beam LB. The polygon mirror (rotating polygonal mirror) 268 rotates to continuously change the reflection angle of the laser beam LB, thereby changing the position of the laser beam LB irradiated on the substrate P in the scanning direction (width direction of the substrate P). Scan to. The polygon mirror 268 rotates at a constant speed (for example, 10,000 rotations / minute) by a rotation drive source (for example, a motor, a speed reduction mechanism, etc.) not shown.

A cylindrical lens 262 provided between the reflection mirror 260 and the reflection mirror 266 cooperates with the focus lens 264 to transmit the laser beam LB in the non-scanning direction (Z direction) orthogonal to the scanning direction of the polygon mirror 268. Condensed (converged) on the reflective surface. The cylindrical lens 262 can suppress the influence even when the reflection surface is inclined with respect to the Z direction (inclination from the equilibrium state between the normal line of the XY surface and the reflection surface). The irradiation position of the laser beam LB irradiated on the substrate P is prevented from shifting in the X direction.

The laser beam LB reflected by the polygon mirror 268 is reflected in the −Z direction by the reflection mirror 270 and enters the f-θ lens 272 having an optical axis AXu parallel to the Z axis. The f-θ lens 272 is a telecentric system in which the principal ray of the laser beam LB projected onto the substrate P is always normal to the surface of the substrate P during scanning. Therefore, it is possible to scan at a uniform speed. The laser beam LB emitted from the f-θ lens 272 becomes a substantially circular minute spot beam SP having a diameter of about several μm on the substrate P through a cylindrical lens 274 whose bus is parallel to the Y direction. Is irradiated. The spot light (scanning spot light) SP is one-dimensionally scanned in one direction along the scanning line L2 extending in the Y direction by the polygon mirror 268.

The subordinate control device 212 controls the illumination mechanism 13a, the exposure head 210, and the like to apply a pattern to the substrate P. That is, the lower order control device 212 controls the illumination mechanism 13a to irradiate the laser beam LB, and based on the position of the alignment mark Ks detected by the alignment microscope AM1, the drawing unit DU of each exposure head 210 has a drawing purpose. By controlling the optical element 254, a pattern is drawn and exposed at a predetermined position on the substrate P, that is, in the exposure region A7. The lower level control device 212 may be a part or all of the higher level control device 5, or may be a computer different from the higher level control device 5 controlled by the higher level control device 5.

Here, the substrate P is transported to the rotating drum 25 in a state in which the longitudinal direction of the substrate P is orthogonal to the rotation axis AX2 of the rotating drum 25 and the substrate P is not twisted or wrinkled, whereby the substrate P The exposure accuracy of the pattern is improved. Therefore, the rollers (Rs1 to Rs3, NR, 126, AR1, AR2, RT1 to RT3, R5, R6) for carrying the substrate of the exposure apparatus U3 and the rotation shaft of the rotary drum 25 are arranged in parallel with each other along the Y direction. Then, it is desirable to transport the substrate P so that the longitudinal direction of the substrate P is orthogonal to the rotation axes of these rollers and the rotating drum 25.

However, in actuality, the rotation axes of the rollers (Rs1 to Rs3, NR, 126, AR1, AR2, RT1 to RT3, R5, R6) are slightly offset and the rotation axes of the rollers are not parallel to each other. There is a case. Further, the relative positions of the position adjustment unit 120a and the exposure unit 121c may change due to vibration or the like, and the rotation axis of the roller of the position adjustment unit 120a may not be parallel to the rotation axis of the roller of the exposure unit 121c. . As a result, slight stress disturbances, twists, wrinkles, etc. occur inside the substrate P, and the substrate P is wound in a state where the longitudinal direction of the substrate P is slightly inclined with respect to the rotation axis AX2 of the rotary drum 25. It is supported by the rotary drum 25 in a state of being greatly deformed (in-plane distortion deformation) compared to the line width dimension of the pattern to be drawn.

Therefore, in the fourth embodiment, the lower control device 204 is based on the detection results of the first substrate detection unit 202, the second substrate detection unit 208, the alignment microscopes AM1 and AM2, and the relative position detection unit 234. The edge position controller EPC3a and the substrate adjustment unit 214 are controlled.

Specifically, the lower-level control device 204 controls the actuator (drive mechanism) 206 of the edge position controller EPC3a based on the position in the width direction of the substrate P detected by the first substrate detection unit 202 and the change information of the substrate P. The position of the substrate P in the width direction is adjusted. For example, the lower-level control device 204 calculates the difference between the center position in the Y direction obtained from the edge positions of both ends of the substrate P detected by the first substrate detection unit 202 and the target position, and the calculated difference is zero. The actuator 206 is feedback controlled so as to be (0), and the substrate P is moved in the Y direction. Accordingly, the position in the width direction of the substrate P transported from the position adjustment unit 120a can be set as the target position, and occurrence of minute twists, wrinkles, etc. on the substrate P can be suppressed. As a result, the position in the Y direction of the substrate P wound around the rotary drum 25 can be made constant with high accuracy, and a plurality of alignment marks Ks arranged in the longitudinal direction of the substrate P can be detected by the detection region of each alignment microscope AM1. (Detection field) 232 can continue to be reliably captured.

Further, the lower-level control device 204 controls the actuator 206 of the edge position controller EPC3a using change information regarding the relative position and position change between the position adjustment unit 120a and the exposure unit 121c detected by the relative position detection unit 234. Thus, the position change in the width direction of the substrate P (shift in the width direction of the substrate P accompanying the change in the tilt state) can be corrected at an early stage. Further, the lower-level control device 204 adjusts the inclination angles of the adjustment rollers AR1 and AR2 of the substrate adjustment unit 214 based on information on the relative position and position change detected by the relative position detection unit 234, so that the substrate P Adjust the position in the width direction. The adjustment of the inclination angles of the adjustment rollers AR1 and AR2 can be performed by driving an actuator (drive unit) such as the piezo element. Thereby, even when the relative position between the position adjustment unit 120a and the exposure unit 121c changes, the position in the width direction of the substrate P transported to the rotary drum 25 is set to the target position with high accuracy and high responsiveness. And the occurrence of minute twists, wrinkles and the like on the substrate P can be suppressed.

In addition, the position in the width direction of the substrate P, the change in the posture of the substrate P such as a minute twist or wrinkle of the substrate P, and the change information regarding the deformation are also known by the position of the alignment mark Ks detected by the alignment microscopes AM1 and AM2. Therefore, the lower-level control device 204 controls the edge position controller EPC3a (actuator 206) and the substrate adjustment unit 214 (actuator such as the piezo element) based on the detected position of the alignment mark Ks. The position of P in the width direction is adjusted. As a result, the position in the width direction of the substrate P conveyed to the rotary drum 25 can be set to the target position with high accuracy and high responsiveness, and the occurrence of minute twists, wrinkles, etc. on the substrate P can be suppressed. it can.

Further, the low order control device 204 determines whether the position in the width direction of the substrate P is at the target position based on the position in the width direction of the substrate P immediately before being transported to the rotary drum 25 detected by the second substrate detection unit 208. It is confirmed whether or not the substrate P is twisted (tilted). In detecting the twist (tilt) of the substrate P, the incident angle of the light beam Bm with respect to the substrate P by the detection system described in FIG. 17A is increased, and the substrate P is shifted in the normal direction of the surface (X direction in FIG. 17A). In this case, the fact that the reflected image Bm of the beam Bm is shifted in the Z direction within the imaging region 230a of the imaging device 230 may be used. Since the second substrate detection unit 208 is also provided corresponding to each of the edge portions Ea and Eb on both sides of the substrate P, the shift amount in the Z direction of the image of the reflected beam Bm within the imaging region 230a is compared. By obtaining the difference value, it is also possible to obtain a minute amount of inclination in the width direction of the substrate P.

If the position in the width direction of the substrate P is not at the target position, the lower control device 204 determines the edge position based on the position in the width direction of the substrate P detected by the second substrate detection unit 208 and the change information of the substrate P. The position of the substrate P in the width direction is adjusted by controlling the controller EPC3a (actuator 206) and the substrate adjusting unit 214 (actuator such as the piezo element). Thereby, the position in the width direction of the substrate P conveyed to the rotary drum 25 can be set as the target position.

However, since the second substrate detection unit 208 is disposed at a position immediately before the substrate P is wound around the rotary drum 25, a large change in the width direction of the substrate P suddenly occurs at this position, for example, the alignment microscope AM1. When a large misalignment error that causes the alignment mark Ks to deviate from the detection area 232 occurs, it is difficult to accurately position the pattern to be formed in the exposure area A7. In such a case, until the alignment mark Ks is captured in the detection region 232, the pattern formation for the exposure region A7 is stopped and skipped, or the substrate P is temporarily reversed by a certain length, and the sequence is repeated again. An error sequence (retry operation or the like) such as re-detection of the alignment mark Ks by the alignment microscope AM1 is performed while being conveyed in the direction.

Thus, also in the fourth embodiment, the exposure unit 121c and the position adjustment unit 120a can be provided in an independent state (a state in which vibration transmission is insulated). For this reason, the exposure unit 121c can reduce the vibration from the position adjustment unit 120a by the vibration isolation table 131, and can obtain the same effect as the first embodiment. Furthermore, in the fourth embodiment, the low-order control device 204 includes the edge position controller EPC3a and the first substrate detection unit 202, the second substrate detection unit 208, and the edge position controller EPC3a based on the detection results of the alignment microscopes AM1 and AM2. The substrate adjustment unit 214 is controlled. Thereby, the exposure accuracy of the pattern on the substrate P by the exposure head 210 can be improved. The low-order control device 204 controls the edge position controller EPC3a and the substrate adjustment unit 214 based on the detection result of the relative position detection unit 234. Thereby, even if the relative position of the position adjustment unit 120a and the exposure unit 121c changes, the exposure accuracy of the pattern on the substrate P by the exposure head 210 can be improved.

In the fourth embodiment, the position adjustment unit 120a and the exposure unit 121c are provided in the exposure apparatus U3. However, the exposure unit 121c is located immediately after the position adjustment unit 120a as viewed from the transport direction of the substrate P. Any configuration may be used. Therefore, the position adjustment unit 120a may not be provided in the exposure apparatus U3. In this case, the position adjustment unit 120a may be provided on the side of the processing apparatus U (U2) arranged immediately before the exposure apparatus U3 as shown in FIG. Alternatively, when the substrate supply apparatus 2 is provided immediately before the exposure apparatus U3, the function of the position adjustment unit 120a may be provided in the substrate supply apparatus 2.

Further, the process immediately before the photopatterning process by the exposure apparatus U3, the

exposure units

121, 121c, etc. (second processing unit) includes a process of forming (coating) a liquid photosensitive layer on the surface of the substrate P, and a process for forming the photosensitive layer. The process of drying (baking) is a set. However, when a dry film is used as the photosensitive layer, a process of transferring the photosensitive layer on the dry film to the surface of the substrate P to be exposed by pressure bonding using a pressure transfer device such as a laminator (photosensitive layer Forming step) and the drying step may be unnecessary. Therefore, the pre-processing apparatus (first processing unit) that controls the process immediately before the photo-patterning process is a photosensitive layer forming apparatus that forms a photosensitive layer on the surface of the substrate P or a drying (heating) apparatus that dries the substrate P. In addition, the function of the position adjustment unit 120a can be provided on the downstream side (substrate unloading portion) of the substrate transport path in the pretreatment apparatus or between the pretreatment apparatus and the optical patterning device.

Further, when a printing machine is used as the patterning process, as a process immediately before that, the entire surface of the substrate P or only the portion where the pattern is to be formed is modified in order to improve the adhesion of the ink to the surface of the substrate P. A quality treatment step (such as a step of selectively imparting liquid repellency / lyophilicity) is performed. Since such a surface modification process is also performed by a single or a plurality of pretreatment apparatuses, the downstream side (substrate unloading section) of the substrate conveyance path in the pretreatment apparatus installed immediately before the printing press, or its The function of the position adjustment unit 120a can be provided between the preprocessing device and the printing press.

In the fourth embodiment, the first substrate detection unit 202 is provided in the position adjustment unit 120a and the second substrate detection unit 208 is provided in the exposure unit 121c. However, the first substrate detection unit 202 and the second substrate detection unit are provided. Only one of 208 may be provided. Further, both the first substrate detection unit 202 and the second substrate detection unit 208 may not be provided. This is because the position and the like in the width direction of the substrate P can be detected by the alignment microscopes AM1 and AM2 without the first substrate detection unit 202 and the second substrate detection unit 208.

In the fourth embodiment, the processing apparatus U3 has been described as an exposure apparatus, but any pattern forming apparatus that applies a pattern to the substrate P may be used. Examples of the pattern forming apparatus include an ink jet printer that applies a pattern to the substrate P by applying ink in addition to the exposure apparatus. In this case, the exposure head 210 is replaced with a nozzle head portion (pattern forming portion) having a large number of nozzles for drawing a pattern on the substrate P by selectively applying the ink material as droplets. , 121a to 121c are replaced with a patterning apparatus having a pattern forming portion. Similarly, in the first to third embodiments, the processing apparatus U3 may be a pattern forming apparatus that applies a pattern to the substrate P.

As described in the above embodiments, in a patterning apparatus such as an exposure apparatus or an ink jet printer that forms a fine pattern for an electronic device on a substrate P, the pattern can be precisely positioned and formed on the substrate P. is important. Vibration, which is one of the disturbance factors that lowers the positioning accuracy, is generated by pneumatic or liquid compressors and pumps built in nearby processing equipment, and passes through the factory floor. It is transmitted to a support member such as the rotary drum 25 that supports the exposure head (pattern forming unit) 210 and the substrate P. In order to insulate the vibration transmission path, it is effective to provide an anti-vibration device (such as a vibration isolation table 131) in the patterning device. In addition, it is desirable to construct the factory floor (foundation) as strong as possible and to reduce the resonance frequency. However, in each of the above-described embodiments, the substrate P is precisely formed even if the floor conditions are not so strict. And can be patterned with high accuracy.

For example, when the production line is constructed, the rollers in the patterning device and the processing device (position adjustment) on the upstream side of the patterning device are prevented so that the substrate P passing through the patterning device (

exposure units

121, 121a to 121c) does not shift in the width direction. When the floor of the

unit

120, 120a) is made parallel with the rollers in the unit 120 and the processing of the substrate P is started, the floor is partially dented and tilted due to the influence of the apparatus load or the like with time. There is. Even in such a case, the first substrate detection unit 202 (202a, 202b) or the relative position detection unit 234 causes positional displacement or deformation in the width direction when the substrate P is carried into the patterning apparatus (a slight inclination due to twisting). Can be measured and corrected by the substrate adjustment unit 214 (rollers AR1, RT3, AR2).

Further, in the case of the fourth embodiment, the substrate adjustment unit 214 composed of a plurality of rollers as shown in FIG. 16 (of which at least one roller can be tilted) includes an exposure unit 121c as shown in FIG. Although it is provided on the main body frame 215 on the side, it may be provided on the main body frame 207b in the position adjustment unit 120a. In that case, in the position adjustment unit 120a (first processing apparatus) and the exposure unit 121c (second processing apparatus) which are separated from each other in order to insulate or suppress vibration transmission, the second is provided on the exposure unit 121c side. The substrate detection unit 208 is provided in the vicinity of the guide roller Rs3 or the tension roller RT1, similarly to the second substrate detection unit 124 shown in FIG. Further, the substrate adjustment unit 214 may be provided on the installation surface E as a single unit independently of any of the position adjustment unit 120a (first processing apparatus) and the exposure unit 121c (second processing apparatus).

Position adjustment unit 120a or first substrate between

exposure units

121, 121c and the like (second processing unit) that perform the optical patterning process and a pre-processing apparatus (first processing unit) that manages the process immediately before the optical patterning process When the detection unit 202 is provided, the first substrate detection unit 202 can detect a change in the position of the substrate P transported from the first processing unit to the second processing unit. Further, when the position adjustment unit 120a or the first substrate detection unit 202 is provided on the downstream side in the transport direction of the substrate P in the first processing unit, the first processing unit 202 changes the first processing unit to the second processing unit. The position change of the substrate P conveyed to the substrate may be detected, the position of the substrate P detected by the first substrate detection unit 202, and the substrate P detected by the second substrate detection unit 208 or the alignment microscopes AM1 and AM2. The position change of the substrate P transported from the first processing unit to the second processing unit may be detected from this position. Further, the relative position detection unit 234 detects the relative position or position change between the position adjustment unit 120a and the exposure unit 121c, thereby detecting the position change of the substrate P transported from the first processing unit to the second processing unit. It may be detected.

Claims

A vibration isolator provided on the installation surface;
An exposure unit that is provided on the vibration isolation table and performs an exposure process on a substrate to be supplied;
A processing unit that is provided on the installation surface and is provided in an independent state that is not in contact with the exposure unit, and performs processing on the exposure unit;
A substrate processing apparatus comprising:
The substrate processing apparatus according to claim 1,
The processing unit includes a position adjustment unit that adjusts a position in the width direction of the substrate supplied to the exposure unit,
The position adjustment unit includes:
A base provided on the installation surface;
A width moving mechanism that is provided on the base and moves the substrate in the width direction of the substrate with respect to the base;
A fixed roller provided on the base and guiding the substrate after position adjustment by the width moving mechanism toward the exposure unit, and a position fixed to the base;
A substrate processing apparatus.
The substrate processing apparatus according to claim 2,
A first substrate detection unit that is fixed on the base and detects a position in the width direction of the substrate supplied to the fixed roller;
A control unit that controls the width moving mechanism based on a detection result of the first substrate detection unit and corrects a position in the width direction of the substrate supplied to the fixed roller to a first target position;
A substrate processing apparatus further comprising:
The substrate processing apparatus according to claim 2 or 3,
The position adjustment unit further includes a roller position adjustment mechanism that adjusts the position of the fixed roller with respect to the exposure unit;
A second substrate detection unit fixed on the vibration isolation table and detecting the position of the substrate supplied to the exposure unit;
A controller that controls the roller position adjustment mechanism based on the detection result of the second substrate detector, and corrects the position of the substrate supplied to the exposure unit to a second target position;
A substrate processing apparatus further comprising:
The substrate processing apparatus according to any one of claims 2 to 4, comprising:
A pressing mechanism that presses the substrate supplied from the position adjustment unit to the exposure unit so that tension is applied;
A second substrate detection unit fixed on the vibration isolation table and detecting the position of the substrate supplied to the exposure unit;
A control unit that controls the pressing mechanism based on a detection result of the second substrate detection unit and adjusts a pressing amount to the substrate;
A substrate processing apparatus further comprising:
A substrate processing apparatus according to any one of claims 1 to 5,
The processing unit includes a drive unit that drives the exposure unit,
The exposure unit includes
A mask holding member for holding a mask illuminated with illumination light;
A substrate support member for supporting the substrate on which projection light from the mask is projected;
Have
The drive unit is
A mask side drive unit for driving the mask holding member to move the mask in the scanning direction;
A substrate-side drive unit that drives the substrate support member to move the substrate in the scanning direction;
A substrate processing apparatus.
The substrate processing apparatus according to claim 6,
The exposure unit includes
A first frame that supports the mask holding member;
A second frame for supporting the substrate support member;
Have
The vibration isolation table includes: a first vibration isolation table provided between the installation surface and the first frame; a second vibration isolation table provided between the installation surface and the second frame; A substrate processing apparatus.
The substrate processing apparatus according to claim 6,
The exposure unit has a frame that supports the mask holding member and the substrate support member,
The vibration isolation table is a substrate processing apparatus provided between the installation surface and the frame.
The substrate processing apparatus according to any one of claims 6 to 8, comprising:
The mask holding member holds the mask having a mask surface having a first radius of curvature around a first axis;
The mask side drive unit moves the mask in the scanning direction by rotating the mask holding member,
The substrate support member supports the substrate along a support surface having a second radius of curvature around the second axis;
The substrate processing apparatus, wherein the substrate side driving unit moves the substrate in a scanning direction by rotationally driving the substrate support member.
The substrate processing apparatus according to any one of claims 6 to 8, comprising:
The mask holding member holds the mask having a flat mask surface,
The mask side drive unit moves the mask in the scanning direction by linearly driving the mask holding member,
The substrate support member supports the substrate along a support surface having a second radius of curvature around the second axis;
The substrate processing apparatus, wherein the substrate side driving unit moves the substrate in a scanning direction by rotationally driving the substrate support member.
The substrate processing apparatus according to any one of claims 6 to 8, comprising:
The mask holding member holds the mask having a mask surface having a first radius of curvature around a first axis;
The mask side drive unit moves the mask in the scanning direction by rotating the mask holding member,
The substrate support member has a pair of support rollers that rotatably support both sides of the substrate in the scanning direction so that the substrate has a flat surface.
The substrate processing apparatus, wherein the substrate side driving unit moves the substrate in a scanning direction by rotationally driving the pair of support rollers.
A substrate processing apparatus according to any one of claims 1 to 11,
A substrate supply apparatus for supplying the substrate to the substrate processing apparatus;
A substrate recovery apparatus for recovering the substrate processed by the substrate processing apparatus;
A device manufacturing system comprising:
A device manufacturing system according to claim 12,
The substrate supply apparatus includes:
A first bearing portion rotatably supported by a supply roll on which the substrate is wound in a roll;
A first lifting mechanism for lifting and lowering the first bearing portion;
An approach angle detection unit for detecting an approach angle of the substrate with respect to a first roller around which the substrate sent from the supply roll is wound;
A controller that controls the first elevating mechanism based on a detection result of the approach angle detector and corrects the approach angle to a target approach angle;
A device manufacturing system.
The device manufacturing system according to claim 12 or 13,
The substrate recovery apparatus is
A second bearing portion rotatably supported by a recovery roll on which the substrate after processing processed by the substrate processing apparatus is wound;
A second lifting mechanism for lifting and lowering the second bearing part;
A discharge angle detection unit for detecting a discharge angle of the substrate with respect to a second roller around which the substrate sent to the collection roll is wound;
A control unit that controls the second lifting mechanism based on a detection result of the discharge angle detection unit and corrects the discharge angle to a target discharge angle;
A device manufacturing system.
Performing an exposure process on the substrate using the substrate processing apparatus according to any one of claims 6 to 11,
Processing the exposed substrate to form a pattern of the mask;
A device manufacturing method including:
A pattern forming apparatus for forming a pattern at a predetermined position on a sheet substrate while conveying a long flexible sheet substrate in the longitudinal direction,
A conveyance unit including a plurality of guide rollers for conveying the sheet substrate in a longitudinal direction along a predetermined conveyance path; and a part of the conveyance path, and the predetermined position on the surface of the sheet substrate at the predetermined position. A patterning device comprising: a pattern forming unit that forms a pattern;
A vibration isolator provided between a base surface on which the patterning device is installed and the patterning device;
The guide plate is provided separately from the patterning device and installed on the base surface. The guide roller includes a guide roller for feeding the sheet substrate toward the transport unit of the patterning device, and is orthogonal to the longitudinal direction of the sheet substrate. A position adjusting device for adjusting the position of the sheet substrate with respect to the width direction,
A substrate error measurement unit that measures change information regarding the position change, posture change, or deformation of the sheet substrate on the upstream side of the pattern forming unit in the conveyance path;
A control device that controls the position adjustment device based on the change information;
A pattern forming apparatus comprising:
The pattern forming apparatus according to claim 16, wherein
The said board | substrate error measurement part is a pattern formation apparatus which measures the said change information by detecting the edge of the width direction of the said sheet | seat board | substrate, or the mark formed on the said sheet | seat board | substrate.
The pattern forming apparatus according to claim 16 or 17,
The substrate error measuring unit is a pattern forming device provided in at least one of the patterning device and the position adjusting device.
A pattern forming apparatus for forming a pattern at a predetermined position on a sheet substrate while conveying a long flexible sheet substrate in the longitudinal direction,
A conveyance unit including a plurality of guide rollers for conveying the sheet substrate in a longitudinal direction along a predetermined conveyance path; and a part of the conveyance path, and the predetermined position on the surface of the sheet substrate at the predetermined position. A patterning device comprising: a pattern forming unit that forms a pattern;
A vibration isolator provided between a base surface on which the patterning device is installed and the patterning device;
The guide plate is provided separately from the patterning device and installed on the base surface. The guide roller includes a guide roller for feeding the sheet substrate toward the transport unit of the patterning device, and is orthogonal to the longitudinal direction of the sheet substrate. A position adjusting device for adjusting the position of the sheet substrate with respect to the width direction,
A position error measurement unit that measures change information regarding a relative position change between the patterning device and the position adjustment device;
A control device that controls the position adjustment device based on the change information;
A pattern forming apparatus comprising:
The pattern forming apparatus according to any one of claims 16 to 19,
The transport path of the sheet substrate is bent in a state where a predetermined tension is applied in the longitudinal direction on the upstream side with respect to the pattern forming unit in the transport path, provided in the patterning apparatus. With a tiltable adjusting roller arranged,
The said control apparatus is a pattern formation apparatus which adjusts the position of the width direction of the sheet | seat board | substrate conveyed by a pattern formation part by inclining the said adjustment roller based on the said change information.
A device manufacturing system for sequentially performing a first process and a second process on a sheet substrate while conveying a long flexible sheet substrate in the longitudinal direction,
A first processing unit that is installed on a predetermined base surface and includes a plurality of rollers for feeding the sheet substrate in a longitudinal direction along a predetermined conveyance path, and performs the first processing on the sheet substrate;
A plurality of rollers installed on the base surface for sending the sheet substrate sent from the first processing unit in a longitudinal direction along a predetermined conveyance path; A second processing unit for applying
Vibration transmission between the base surface and the first processing unit, vibration transmission between the base surface and the second processing unit, or between the first processing unit and the second processing unit. A vibration isolator that insulates or suppresses vibration transmission of
A change measuring unit that measures change information related to a relative position change between the first processing unit and the second processing unit or a position change of the sheet substrate conveyed from the first processing unit to the second processing unit. When,
A position adjusting device that adjusts the position in the width direction orthogonal to the longitudinal direction of the sheet substrate carried into the second processing unit based on the change information;
A device manufacturing system comprising:
The device manufacturing system according to claim 21,
The second processing unit is configured to project light energy corresponding to the pattern onto a photosensitive layer formed on the surface of the sheet substrate in order to form a pattern for an electronic device in the longitudinal direction of the sheet substrate. A device manufacturing system comprising: an apparatus, or a patterning apparatus including any one of a printing apparatus that draws the pattern on the surface of the sheet substrate by applying an ink containing any one of a conductive material, an insulating material, and a semiconductor material .
The device manufacturing system according to claim 22,
The first processing unit is configured by a single or a plurality of pre-processing devices that perform processing corresponding to a pre-process of processing performed on the sheet substrate by the patterning device,
The device manufacturing system, wherein the position adjusting device is provided in the pre-processing device installed immediately before the patterning device on the conveyance path of the sheet substrate or between the pre-processing device just before and the patterning device.
The device manufacturing system according to any one of claims 21 to 23,
The position adjusting device is configured to drive a plurality of rotating rollers that bend and guide the sheet substrate in a longitudinal direction and to translate a part of the rotating rollers in the direction of the rotation center axis. A device manufacturing system comprising: a mechanism; and a control unit that controls the drive mechanism based on the change information measured by the change measurement unit.
The device manufacturing system according to any one of claims 21 to 24, wherein the position adjusting device includes a plurality of rotating rollers configured to bend and guide and convey the sheet substrate in a longitudinal direction, and the plurality of rotating rollers. A device manufacturing system comprising: a drive unit that inclines the rotation center axis of some of the rotation rollers; and a control unit that controls the drive unit based on the change information measured by the change measurement unit.
A device manufacturing system according to claim 24 or claim 25,
The change measuring unit is disposed in a conveyance path of the sheet substrate between the first processing unit and the second processing unit, and changes the inclination change in the width direction of the sheet substrate perpendicular to the longitudinal direction. A device manufacturing system that includes sensors that detect change information.