JP6702404B2 - Device manufacturing system and device manufacturing method - Google Patents

Description

The present invention relates to a device manufacturing system and a device manufacturing method for forming a device on a substrate.

BACKGROUND ART Conventionally, as shown in Patent Document 1 below, as a substrate processing apparatus, an exposure apparatus that exposes a device pattern to a substrate provided on a moving stage that moves on a surface plate is known. The surface plate of this exposure apparatus is supported by the base via a mount member having a vibration isolation mechanism. The moving stage moves in the X direction on a movable guide provided on the surface plate. The movable guide is moved in the Y direction on the surface plate by two linear motors provided on the base. The two linear motors are provided on both sides of the base in the X direction, and move the movable guide in the Y direction in a non-contact manner. That is, each linear motor has a mover and a stator, and the stator is fixed on the base, while the movers are fixed on both sides of the movable guide in the X direction, respectively. It is not in contact with the stator. In the exposure apparatus of Patent Document 1, since the mover and the stator of the linear motor are in a non-contact state, it is possible to prevent vibration due to disturbance from being transmitted to the surface plate via the movable guide and the moving stage. .

In the exposure apparatus of Patent Document 1, the movable guide is moved in the Y direction on the surface plate by two linear motors, and similarly, the movement of the moving stage with respect to the movable guide is also performed using the linear motor. Also in this case, the linear motor moves the moving stage in the X direction in a non-contact manner. However, since the moving stage is moved with respect to the movable guide on the surface plate, vibration generated by the movement of the moving stage may be transmitted to the surface plate.

Further, the exposure apparatus of Patent Document 1 holds the substrate on the moving stage to perform the exposure, but the present invention is not limited to this configuration, and film-shaped substrates are continuously supplied and are supplied to the supplied substrates. The device pattern may be scanned and exposed. In this case, the substrate may vibrate when it is supplied.

JP, 9-219353, A

A first aspect of the present invention is a device manufacturing system that conveys a long substrate having flexibility in a long direction to form a device on the substrate, and is a vibration isolation device installed on an installation surface. An exposure unit, which is provided on a table and performs an exposure process on the supplied substrate, is not in contact with the exposure unit in order to adjust the position of the substrate in the width direction and supply the substrate to the exposure unit. A base installed on the installation surface in an independent state, a width moving mechanism provided on the base for moving the substrate in the width direction with respect to the base, and a position with respect to the base. In order to supply the substrate to the exposure unit , a position adjustment unit that is fixedly provided and that has a fixed roller that guides the substrate after the position adjustment by the width moving mechanism toward the exposure unit, A substrate supply device that supplies the substrate toward the position adjustment unit, and a substrate recovery device that recovers the substrate that has been subjected to the exposure processing by the exposure unit , and the substrate supply device is configured such that the substrate is rolled. A first elevating mechanism that elevates and lowers a first bearing portion that rotatably supports the wound supply roll, a first roller around which the substrate sent from the supply roll is wound , and the first roller with respect to the first roller . An approach angle detection unit that detects an approach angle of the board, and a control unit that controls the first elevating mechanism based on a detection result of the approach angle detection unit and corrects the approach angle to a target approach angle are provided. ..

A second aspect of the present invention is a device manufacturing method for forming a device on a long sheet substrate having flexibility , wherein the first bearing portion of the substrate supply device according to the first aspect of the present invention is used. The sheet supply roller having a long sheet substrate on which a photosensitive functional layer is formed is wound, the sheet substrate is conveyed to the exposure unit through the position adjusting unit , and the sheet substrate Exposing the photosensitive functional layer with a pattern corresponding to the device, and forming the pattern of the device through the photosensitive functional layer by wet-processing the exposed sheet substrate. ,including.

FIG. 1 is a diagram showing a configuration of a device manufacturing system according to the first embodiment. FIG. 2 is a diagram showing a configuration when the device manufacturing system of the first embodiment is simplified. FIG. 3 is a diagram showing a partial configuration of the exposure apparatus (substrate processing apparatus) according to the first embodiment. FIG. 4 is a diagram showing a partial configuration of the exposure apparatus of the first embodiment shown in FIG. FIG. 5 is a diagram showing the overall configuration of the exposure unit according to the first embodiment. FIG. 6 is a diagram showing an arrangement of illumination areas and projection areas of the exposure unit shown in FIG. FIG. 7 is a diagram showing the configuration of the projection optical system of the exposure unit shown in FIG. FIG. 8 is a flowchart showing the device manufacturing method according to the first embodiment. FIG. 9 is a diagram showing a partial configuration of an exposure apparatus (substrate processing apparatus) according to the second embodiment. FIG. 10 is a diagram showing the overall configuration of the exposure unit according to the second embodiment of FIG. FIG. 11 is a diagram showing the overall configuration of the exposure unit of the third embodiment. FIG. 12 is a view showing the arrangement of the exposure apparatus according to the fourth embodiment. FIG. 13 is a diagram when the substrate transported in the exposure apparatus shown in FIG. 12 is viewed from the +Z direction side. FIG. 14 is a diagram of the substrate P conveyed between the last roller on the position adjustment unit side and the first roller on the exposure unit side shown in FIG. 13, as viewed from the −Y direction side. FIG. 15 is a diagram of the substrate transported by the rotary drum shown in FIG. 12, as viewed from the −X direction side. FIG. 16 is a diagram showing a configuration of the board adjusting unit shown in FIG. FIG. 17A is a diagram showing the configuration of the second substrate detection unit shown in FIG. 12, FIG. 17B is a diagram showing beam light emitted to the substrate by the second substrate detection unit, and FIG. 17C is a diagram showing the second substrate detection unit. It is a figure which shows the light beam received. It is a figure which shows the structure of the relative position detection part shown in FIG. FIG. 13 is a diagram showing a scanning line of spot light scanned on a substrate by the exposure head shown in FIG. 12 and an alignment microscope. It is a figure which shows the structure of the drawing unit of the exposure head shown in FIG.

A substrate processing apparatus, a device manufacturing system, a device manufacturing method, and a pattern forming apparatus according to aspects of the present invention will be described below in detail with reference to the accompanying drawings, with reference to preferred embodiments. Note that the aspects of the present invention are not limited to these embodiments, and include various changes and improvements. That is, the constituent elements described below include those that can be easily conceived by those skilled in the art and substantially the same, and the constituent elements described below can be combined as appropriate. Further, various omissions, substitutions or changes of the constituent elements can be made without departing from the scope of the present invention.

[First Embodiment]
The substrate processing apparatus according to the first embodiment is an exposure apparatus that performs an exposure process on a substrate, and the exposure device is incorporated in a device manufacturing system that performs various processes on a substrate after exposure to manufacture an electronic device. .. First, the device manufacturing system will be described.

<Device manufacturing system>
FIG. 1 is a diagram showing a configuration of a device manufacturing system 1 according to the first embodiment. The device manufacturing system 1 shown in FIG. 1 is a line (flexible display manufacturing line) that manufactures a flexible display as an electronic device (sometimes called a device). An example of the flexible display is an organic EL display. In the device manufacturing system 1, the flexible substrate (sheet substrate) P is wound into a roll, and the substrate P is sent out from a supply roll FR1, and various processes are continuously performed on the sent substrate P. Then, the processed substrate P is wound by a recovery roll FR2, which is a so-called roll-to-roll system. In the device manufacturing system 1 according to the first embodiment, the substrate P which is a film-like sheet is sent out from the supply roll FR1, and the substrates P sent out from the supply roll FR1 are sequentially processed into n processing devices U1. , U2, U3, U4, U5,... Un before being wound up on the recovery roll FR2. First, the substrate P to be processed by the device manufacturing system 1 will be described.

As the substrate P, for example, a resin film, a foil made of a metal or alloy such as stainless steel, or the like is used. Examples of the material of the resin film include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. You may use what contained 1 or 2 or more. In addition, the thickness and the rigidity (Young's modulus) of the substrate P may be within a range such that the substrate P does not have folds or irreversible wrinkles due to buckling during transportation. When making a flexible display panel, a touch panel, a color filter, an electromagnetic wave prevention filter or the like as an electronic device, a resin sheet such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) having a thickness of about 25 μm to 200 μm is used.

It is desirable to select the substrate P that does not have a remarkably large coefficient of thermal expansion, for example, so that the amount of deformation of the substrate P due to the heat applied in various processes can be substantially ignored. Further, the thermal expansion coefficient can be reduced by mixing the base resin film with an inorganic filler such as titanium oxide, zinc oxide, alumina, or silicon oxide. Further, the substrate P may be a single layer body of ultra-thin glass having a thickness of about 100 μm manufactured by the float method or the like, and the resin film described above or a metal layer such as aluminum or copper is formed on the ultra-thin glass. It may be a laminate in which (foil) and the like are attached.

By the way, the flexibility of the substrate P means a property that the substrate P can be bent without being sheared or broken even when a force of about its own weight is applied to the substrate P. Further, flexibility includes a property of bending by a force of about its own weight. The degree of flexibility changes depending on the material and size of the substrate P, the thickness, the layer structure formed on the substrate P, the environment with temperature and humidity, and the like. In any case, when the substrate P is correctly wound around the transport direction changing member such as various transport rollers and rotary drums provided in the transport path in the device manufacturing system 1 according to the present embodiment, the substrate P buckles and folds. If the substrate P can be smoothly transported without being damaged or damaged (breakage or cracking occurs), it can be said to be in the range of flexibility.

The substrate P configured in this manner becomes a supply roll FR1 by being wound in a roll shape, and the supply roll FR1 is mounted in the device manufacturing system 1. The device manufacturing system 1 in which the supply roll FR1 is mounted repeatedly executes various processes for manufacturing an electronic device on the substrate P sent from the supply roll FR1. Therefore, the processed substrate P is in a state in which a plurality of electronic devices are connected. That is, the substrate P sent from the supply roll FR1 is a substrate for multiple cutting. Note that the substrate P may be one whose surface has been modified and activated in advance by a predetermined pretreatment, or one which has a fine partition structure (uneven structure) for precision patterning formed on the surface.

The processed substrate P is wound as a roll to be collected as a collecting roll FR2. The recovery roll FR2 is mounted on a dicing device (not shown). The dicing apparatus equipped with the recovery roll FR2 divides (dices) the processed substrate P into electronic devices to form a plurality of electronic devices. The dimension of the substrate P is, for example, about 10 cm to 2 m in the width direction (shorter direction) and 10 m or more in the length direction (longer direction). The size of the substrate P is not limited to the above size.

The device manufacturing system 1 will be continuously described with reference to FIG. In FIG. 1, an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal to each other. The X direction is the transport direction of the substrate P in the horizontal plane, and is the direction that connects the supply roll FR1 and the recovery roll FR2. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. The Y direction is the axial direction of the supply roll FR1 and the recovery roll FR2. The Z direction is a direction (vertical direction) orthogonal to the X and Y directions.

The device manufacturing system 1 includes a substrate supply device 2 that supplies a substrate P, processing devices U1 to Un that perform various processes on the substrate P supplied by the substrate supply device 2, and processing devices U1 to Un. A substrate recovery device 4 for recovering the processed substrate P and a host controller 5 for controlling each device of the device manufacturing system 1 are provided.

A supply roll FR1 is rotatably mounted on the substrate supply device 2. The substrate supply device 2 includes a drive roller R1 that sends out the substrate P from the mounted supply roll FR1 and an edge position controller EPC1 that adjusts the position of the substrate P in the width direction (Y direction). The drive roller R1 rotates while sandwiching both front and back surfaces of the substrate P, and sends the substrate P in the transport direction (+X direction) from the supply roll FR1 to the recovery roll FR2, thereby processing the substrates P1 to Un. Supply to. At this time, the edge position controller EPC1 moves the board P in the width direction so that the position at the edge of the end portion in the width direction of the board P falls within a range of ±10 μm to several tens μm with respect to the target position. It is moved to correct the position of the substrate P in the width direction.

A recovery roll FR2 is rotatably mounted on the substrate recovery device 4. The substrate recovery device 4 includes a drive roller R2 that draws the processed substrate P toward the recovery roll FR2 side, and an edge position controller EPC2 that adjusts the position of the substrate P in the width direction (Y direction). The substrate collecting device 4 rotates while holding both front and back surfaces of the substrate P by the drive roller R2, pulls the substrate P in the transport direction, and rotates the collecting roll FR2 to wind up the substrate P. At this time, the edge position controller EPC2 is configured similarly to the edge position controller EPC1, and corrects the position of the substrate P in the width direction so that the edge of the end portion of the substrate P in the width direction does not vary in the width direction.

The processing device U1 is a coating device that coats the photosensitive functional liquid on the surface of the substrate P supplied from the substrate supply device 2. As the photosensitive functional liquid, for example, a photoresist, a photosensitive silane coupling agent, a UV curable resin liquid, a photosensitive plating reducing solution or the like is used. The processing unit U1 is provided with a coating mechanism Gp1 and a drying mechanism Gp2 in order from the upstream side in the transport direction of the substrate P. The coating mechanism Gp1 includes an impression cylinder roller DR1 around which the substrate P is wound, and an application roller DR2 that faces the impression cylinder roller DR1. The coating mechanism Gp1 holds the substrate P between the impression cylinder roller DR1 and the application roller DR2 while the supplied substrate P is wound around the impression cylinder roller DR1. Then, the application mechanism Gp1 applies the photosensitive functional liquid by the application roller DR2 while moving the substrate P in the transport direction by rotating the impression cylinder roller DR1 and the application roller DR2. The drying mechanism Gp2 blows drying air such as hot air or dry air to remove the solute (solvent or water) contained in the photosensitive functional liquid, and dries the substrate P coated with the photosensitive functional liquid. A photosensitive functional layer is formed on the substrate P.

The processing apparatus U2 heats the substrate P transported from the processing apparatus U1 to a predetermined temperature (for example, several tens of degrees Celsius to 120 degrees Celsius) in order to stabilize the photosensitive functional layer formed on the surface of the substrate P. It is a device. The processing apparatus U2 is provided with a heating chamber HA1 and a cooling chamber HA2 in order from the upstream side in the transport direction of the substrate P. The heating chamber HA1 is provided therein with a plurality of rollers and a plurality of air turnbars, and the plurality of rollers and the plurality of air turnbars form a transfer path for the substrate P. The plurality of rollers are provided in rolling contact with the back surface of the substrate P, and the plurality of air turn bars are provided in the non-contact state on the front surface side of the substrate P. The plurality of rollers and the plurality of air turn bars are arranged in a meandering transfer path in order to lengthen the transfer path of the substrate P. The substrate P passing through the heating chamber HA1 is heated to a predetermined temperature while being transported along a meandering transport path. The cooling chamber HA2 cools the substrate P to the environmental temperature so that the temperature of the substrate P heated in the heating chamber HA1 becomes equal to the environmental temperature of the subsequent process (processing device U3). The cooling chamber HA2 is provided with a plurality of rollers therein, and the plurality of rollers are arranged in a meandering transfer path in order to lengthen the transfer path of the substrate P, similarly to the heating chamber HA1. The substrate P passing through the cooling chamber HA2 is cooled while being transported along a meandering transport path. A drive roller R3 is provided on the downstream side in the transport direction of the cooling chamber HA2, and the drive roller R3 rotates while nipping the substrate P that has passed through the cooling chamber HA2, so that the substrate P is directed toward the processing apparatus U3. Supply.

The processing device (substrate processing device) U3 is an exposure device that projects and exposes a pattern such as a circuit or wiring for a display panel on the substrate P, which is supplied from the processing device U2 and has a photosensitive functional layer formed on its surface. Is. As will be described later in detail, the processing device U3 illuminates the transmissive mask M with an illumination light flux, and the projection light flux obtained by the illumination light flux being illuminated by the mask M emits a projection light flux to the outer peripheral surface of the rotary drum (support drum) 25. The projection exposure is performed on the substrate P wound around a part of the. The processing device U3 includes a drive roller R4 that sends the substrate P supplied from the processing device U2 to the downstream side in the transport direction, and an edge position controller EPC3 that adjusts the position of the substrate P in the width direction (Y direction). The driving roller R4 rotates while sandwiching both front and back surfaces of the substrate P, and sends the substrate P toward the exposure position by sending the substrate P to the downstream side in the transport direction. The edge position controller EPC3 is configured similarly to the edge position controller EPC1, and corrects the position of the substrate P in the width direction so that the width direction of the substrate P at the exposure position becomes the target position. Further, the processing apparatus U3 has two sets of drive rollers R5 and R6 that send the substrate P to the downstream side in the transport direction in a state where the slack DL is given to the substrate P after exposure. The two sets of drive rollers R5 and R6 are arranged at a predetermined interval in the substrate P transport direction. The drive roller R5 holds and rotates the upstream side of the conveyed substrate P, and the drive roller R6 holds and rotates the downstream side of the conveyed substrate P to turn the substrate P toward the processing apparatus U4. Supply. At this time, since the substrate P is provided with the slack DL, it is possible to absorb the fluctuation in the transport speed that occurs on the downstream side of the drive roller R6 in the transport direction, and the influence of the exposure process on the substrate P due to the fluctuation in the transport speed. Can be trimmed. Further, in the processing unit U3, an alignment microscope for detecting alignment marks or the like formed in advance on the substrate P in order to relatively align (align) the image of a part of the mask pattern of the mask M and the substrate P. AM1 and AM2 are provided.

The processing unit U4 is a wet processing unit that performs wet development processing, electroless plating processing, and the like on the exposed substrate P transported from the processing unit U3. The processing apparatus U4 has therein three processing tanks BT1, BT2, BT3 hierarchically arranged in the vertical direction (Z direction), and a plurality of rollers for transporting the substrate P. The plurality of rollers are arranged so that the substrate P passes through the inside of the three processing baths BT1, BT2, BT3. A drive roller R7 is provided on the downstream side in the transport direction of the processing bath BT3, and the drive roller R7 rotates while sandwiching the substrate P that has passed through the processing bath BT3, so that the substrate P is directed toward the processing apparatus U5. Supply.

Although illustration is omitted, the processing device U5 is a drying device that dries the substrate P transported from the processing device U4. The processing unit U5 adjusts the water content attached to the substrate P that has been wet-processed in the processing unit U4 to a predetermined water content. The substrate P dried by the processing device U5 is transported to the processing device Un via some processing devices. Then, after being processed by the processing device Un, the substrate P is wound up on the recovery roll FR2 of the substrate recovery device 4.

The host controller 5 centrally controls the substrate supply device 2, the substrate recovery device 4, and the plurality of processing devices U1 to Un. The host controller 5 controls the substrate supply device 2 and the substrate recovery device 4 to convey the substrate P from the substrate supply device 2 toward the substrate recovery device 4. Further, the host controller 5 controls the plurality of processing devices U1 to Un in synchronization with the transportation of the substrate P to execute various processes on the substrate P. The host controller 5 includes a computer and a storage medium in which the program is stored. The computer executes the program stored in the storage medium to provide the host controller 5 of the first embodiment. Function.

In the device manufacturing system 1 according to the first embodiment, the substrates P sent from the supply roll FR1 are sequentially wound on the recovery roll FR2 via the n processing devices U1 to Un. Although an example is shown, the configuration is not limited to this. For example, the device manufacturing system 1 may have a configuration in which the substrate P sent from the supply roll FR1 is wound around the recovery roll FR2 via one processing apparatus. At this time, when different processing is performed on the substrate P, the substrate P is supplied again to the different processing apparatus by using the substrate supply device 2 and the substrate recovery device 4.

<Simplified device manufacturing system>
Next, a device manufacturing system 1 which is a simplified version of the device manufacturing system 1 of FIG. 1 will be described with reference to FIG. FIG. 2 is a diagram showing a configuration when the device manufacturing system 1 according to the first embodiment is simplified. As shown in FIG. 2, the simplified device manufacturing system 1 includes a substrate supply device 2, a processing device U3 (hereinafter referred to as an exposure device) as an exposure device, a substrate recovery device 4, and a host controller 5. Have. Note that, in FIG. 2, an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal to each other is the same as the orthogonal coordinate system in FIG. 1. Further, in the simplified device manufacturing system 1, the substrate supply device 2 has a configuration in which the edge position controller EPC1 is omitted. This is because the exposure apparatus U3 is provided with the edge position controller EPC3. First, the substrate supply device 2 will be described with reference to FIG.

<Substrate supply device>
The substrate supply device 2 has a first bearing unit 111 on which the supply roll FR1 is mounted, and a first elevating mechanism 112 for elevating the first bearing unit 111. Further, the substrate supply device 2 has an approach angle detection unit 114, and the approach angle detection unit 114 is connected to the host controller 5. Here, in the first embodiment, the host controller 5 functions as a controller (control unit) of the substrate supply device 2. As a control device for the substrate supply device 2, a lower control device for controlling the substrate supply device 2 may be provided, and the lower control device may control the substrate supply device 2.

The first bearing portion 111 rotatably supports the supply roll FR1. When the substrate P is supplied (sent out) toward the exposure apparatus U3, the supply roll FR1 axially supported by the first bearing portion 111 has a winding diameter of the supply roll FR1 corresponding to the amount of the substrate P sent out. It gets smaller. Therefore, the position at which the substrate P is delivered from the supply roll FR1 changes according to the delivery amount at which the substrate P is delivered.

The first elevating mechanism 112 is provided between the installation surface E and the first bearing portion 111. The first elevating mechanism 112 moves the first bearing portion 111 together with the supply roll FR1 in the Z direction (vertical direction). The first elevating mechanism 112 is connected to the host controller 5, and the host controller 5 moves the first bearing portion 111 in the Z direction by the first elevating mechanism 112 to move the supply roll FR1 to the substrate P. It is possible to set a predetermined position to send out.

The approach angle detection unit 114 detects an approach angle θ1 of the substrate P entering the transport roller 127 of the exposure device U3 described later. The approach angle detection unit 114 is provided around the transport roller 127. Here, the approach angle θ1 is an angle formed by a straight line (parallel to the Z axis) extending in the vertical direction passing through the central axis of the transport roller 127 and the substrate P on the upstream side of the transport roller 127 in the XZ plane. The approach angle detection unit 114 outputs the detection result to the connected upper control device 5.

The host controller 5 controls the first elevating mechanism 112 based on the detection result of the approach angle detector 114. Specifically, the host controller 5 controls the first elevating mechanism 112 so that the approach angle θ1 becomes a predetermined target approach angle. That is, when the amount of the substrate P delivered from the supply roll FR1 increases, the winding diameter of the supply roll FR1 decreases, and the approach angle θ1 with respect to the target approach angle increases. Therefore, the host controller 5 moves the first elevating mechanism 112 downward (downward) in the Z direction to reduce the approach angle θ1 and corrects the approach angle θ1 to the target approach angle. .. In this way, the host controller 5 feedback-controls the first elevating mechanism 112 based on the detection result of the approach angle detector 114 so that the approach angle θ1 becomes the target approach angle. For this reason, the substrate supply device 2 can always supply the substrate P to the transport roller 127 at the target approach angle, so that the influence of the change in the approach angle θ1 on the substrate P can be reduced. Note that the feedback control may be any control such as P control, PI control, PID control, or the like.

<Exposure device (substrate processing device)>
Next, the exposure apparatus U3 shown in FIG. 2 will be described with reference to FIG. The exposure device U3 includes a position adjustment unit 120, an exposure unit 121, a drive unit 122 (see FIG. 3), a pressing mechanism 130, and a vibration isolation table (vibration isolation device) 131. The anti-vibration table 131 is provided on the installation surface E and reduces the transmission of vibrations from the installation surface E (so-called floor vibration) to the exposure unit 121 main body. The position adjustment unit 120 is provided on the installation surface E, and is configured to include the edge position controller EPC3 shown in FIG. The position adjustment unit 120 is provided adjacent to the substrate supply device 2 in the X direction. The exposure unit 121 is provided on the vibration isolation table 131, and is provided on the opposite side of the substrate supply device 2 with the position adjustment unit 120 interposed therebetween in the X direction. The drive unit 122 (see FIG. 3) is provided on the installation surface E and is provided adjacent to the exposure unit 121 in the Y direction. That is, the position adjustment unit 120, the exposure unit 121, and the drive unit 122 are provided at different positions on the installation surface E. Further, the exposure unit 121 and the position adjustment unit 120 and the drive unit 122 (see FIG. 3) are mechanically uncoupled (non-contact independent state).

From the above, the position adjustment unit 120 and the drive unit 122 are provided on the installation surface E, while the exposure unit 121 is provided on the installation surface E via the vibration isolation table 131. Therefore, the exposure unit 121 is in a vibration mode different from that of the position adjustment unit 120 and the drive unit 122. In other words, the exposure unit 121 is provided from the position adjustment unit 120 and the drive unit 122 in a state of being cut off in terms of vibration propagation (a state in which vibrations are hard to propagate to each other, that is, a state in which vibrations are effectively insulated). ..

The exposure apparatus U3 also includes a first substrate detection unit 123 and a second substrate detection unit 124 that detect the position of the substrate P. The first board detection unit 123 and the second board detection unit 124 are connected to the host controller 5. In the exposure apparatus U3 as well, similar to the substrate supply apparatus 2, the host controller 5 functions as a controller (control unit) of the exposure apparatus U3. As a control device for the exposure apparatus U3, a lower-order control apparatus for controlling the exposure apparatus U3 may be provided and the lower-order control apparatus may control the exposure apparatus U3.

<Position adjustment unit>
As shown in FIG. 2, the position adjusting unit 120 includes a base 125, the above-described edge position controller EPC3 (width moving mechanism), and a fixed roller 126. The base 125 is provided on the installation surface E and supports the edge position controller EPC3 and the fixed roller 126. The base 125 may be a vibration isolation table having a vibration isolation function. The base 125 is provided with a base position adjusting mechanism 128 for adjusting the position of the base 125 in the Y direction or the rotation direction around the Z axis. The base position adjusting mechanism 128 is connected to the host controller 5, and the host controller 5 controls the base position adjusting mechanism 128 so that the edge position controller EPC3 and the fixed roller 126 installed on the base 125. The position of can be adjusted together. That is, the base position adjusting mechanism 128 functions as a roller position adjusting mechanism that adjusts the position of the fixed roller 126 in the Y direction with respect to the exposure unit 121.

The edge position controller EPC3 is movable on the base 125 in the width direction (Y direction) of the substrate P. The edge position controller EPC3 has a plurality of rollers including a transport roller 127 provided on the most upstream side in the transport direction in which the substrate P is transported. The transport roller 127 guides the substrate P supplied from the substrate supply device 2 into the position adjusting unit 120. The edge position controller EPC3 is connected to the host controller 5, and is controlled by the host controller 5 based on the detection result of the first substrate detector 123.

The fixed roller 126 guides the substrate P whose position is adjusted in the width direction by the edge position controller EPC3 toward the exposure unit 121. The fixed roller 126 is rotatable and its position with respect to the base 125 is fixed. Therefore, by moving the substrate P in the width direction by the edge position controller EPC3, the position in the width direction of the substrate P entering the fixed roller 126 can be adjusted.

The first substrate detection unit 123 detects the position in the width direction of the substrate P conveyed to the fixed roller 126 from the edge position controller EPC3. The first substrate detection unit 123 is fixed on the base 125. Therefore, the first substrate detection unit 123 is in the same vibration mode as the edge position controller EPC3 and the fixed roller 126. The first substrate detection unit 123 detects the position of the edge of the end portion of the substrate P that is in rolling contact with the fixed roller 126. The first board detection unit 123 outputs the detection result to the connected upper controller 5.

The second substrate detection unit 124 detects the position of the substrate P supplied from the position adjustment unit 120 to the exposure unit 121. The second substrate detection unit 124 is fixed on the vibration isolation table 131 on which the exposure unit 121 is installed. Therefore, the second substrate detection unit 124 is in the same vibration mode as the exposure unit 121. The second substrate detection unit 124 is provided on the introduction side of the exposure unit 121 into which the substrate P is introduced. Specifically, the second substrate detection unit 124 is provided adjacent to the guide roller 28 at a position on the upstream side of the guide roller 28 on the most upstream side in the transport direction provided in the exposure unit 121. The second substrate detection unit 124 detects the position of the substrate P supplied to the exposure unit 121 in the width direction (Y direction) and the vertical direction (Z direction). The second board detection unit 124 outputs the detection result to the connected upper controller 5.

The host controller 5 controls the edge position controller EPC3 based on the detection result of the first substrate detection unit 123. Specifically, the host controller 5 determines the Y direction from the positions of the edges (both edges in the Y direction) of both ends of the substrate P that rolls (enters) the fixed roller 126 detected by the first substrate detection unit 123. Then, the difference between the center position and the first target position (target center position) defined in advance is calculated. Then, the host controller 5 feedback-controls the edge position controller EPC3 so that the difference becomes zero, moves the substrate P in the width direction, and sets the center position of the substrate P with respect to the fixed roller 126 in the width direction to the first position. Correct to the target center position. Therefore, the edge position controller EPC3 can maintain the position of the substrate P in the width direction with respect to the fixed roller 126 at the first target position, and thus can reduce the positional deviation of the substrate P with respect to the fixed roller 126 in the width direction. Also in this case, the feedback control may be any control such as P control, PI control, PID control and the like.

Further, the host controller 5 controls the base position adjusting mechanism 128 based on the detection result of the second substrate detecting unit 124. Specifically, the host controller 5 calculates the difference between the center position obtained from the positions of the two ends of the substrate P in the width direction detected by the second substrate detection unit 124 and the predetermined second target center position. .. Then, the host controller 5 feedback-controls the base position adjusting mechanism 128 so that the difference becomes zero, and adjusts the position of the base 125 by the base position adjusting mechanism 128, so that the guide roller 28 is moved. The position of the fixed roller 126 in the Y direction is adjusted. At this time, the host controller 5 adjusts the position of the fixed roller 126 so that the substrate P is not twisted and displaced in the width direction. For example, the host controller 5 adjusts the position so that the axial direction of the fixed roller 126 is parallel to the axial direction of the guide roller 28. Then, the host controller 5 adjusts the position of the fixed roller 126 in the Y direction or the rotation direction around the Z axis by the base position adjusting mechanism 128, so that the widthwise center of the substrate P supplied to the exposure unit 121. Since the position can be maintained at the second target center position, the twist of the substrate P and the positional deviation in the width direction can be reduced. Also in this case, the feedback control may be any control such as P control, PI control, PID control and the like.

In this way, the position adjustment unit 120 can correct the position in the width direction of the substrate P supplied to the fixed roller 126 to the first target position, and adjust the position of the substrate P supplied to the guide roller 28 of the exposure unit 121 to the first target position. Two target positions can be corrected.

Although the position of the substrate P supplied from the position adjustment unit 120 to the exposure unit 121 is corrected in the first embodiment, the position is not limited to this, and the substrate supply device 2 supplies the position adjustment unit 120 to the position adjustment unit 120, for example. The position of the substrate P to be processed may be corrected. In this case, a substrate detection unit is provided on the upstream side of the transport roller 127 in the transport direction, and a roll position adjustment mechanism that adjusts the position of the supply roll FR1 is provided. Then, the host controller 5 may adjust the supply roll FR1 by controlling the roll position adjustment mechanism based on the detection result of the substrate detection unit. Similarly, the position of the substrate P supplied from the exposure unit 121 to the substrate recovery device 4 may be corrected.

<Exposure unit>
Next, the configuration of the exposure unit 121 of the exposure apparatus U3 according to the first embodiment will be described with reference to FIGS. 2 to 7. 3 is a diagram showing a partial configuration of an exposure apparatus (substrate processing apparatus) U3 according to the first embodiment, and FIG. 4 is a diagram showing a configuration of a drive unit of the substrate support mechanism 12 in FIG. Is. FIG. 5 is a diagram showing the overall configuration of the exposure unit 121 of the first embodiment. FIG. 6 is a diagram showing an arrangement of the illumination area IR and the projection area PA of the exposure unit 121 shown in FIG. FIG. 7 is a diagram showing the configuration of the projection optical system PL of the exposure unit 121 shown in FIG.

The exposure unit 121 shown in FIG. 2 to FIG. 5 is a so-called scanning exposure apparatus, and includes a plurality of guide rollers 28 constituting the substrate support mechanism (substrate transfer mechanism) 12 and a rotatable rotary drum 25 having a cylindrical shape. While transporting P in the transport direction (scanning direction), an image of the mask pattern formed on the planar mask M is projected and exposed on the surface of the substrate P. 3 and 4 are views of the exposure unit 121 viewed from the -X side, and FIGS. 5 and 7 are orthogonal coordinate systems in which the X direction, the Y direction, and the Z direction are orthogonal to each other. It has the same Cartesian coordinate system as 1.

First, the mask M used in the exposure unit 121 will be described. The mask M is formed, for example, as a transmissive plane mask in which a mask pattern is formed on one surface (mask surface P1) of a flat glass plate (mask surface P1) with a light shielding layer together with chromium, and is held on a mask stage 21 described later. It is used as it is. The mask M has a pattern non-formation region in which a mask pattern is not formed, and is mounted on the mask stage 21 in the pattern non-formation region. The mask M can be released onto the mask stage 21.

The mask M may be formed with all or a part of the panel pattern corresponding to one display device, or is a multiple chamfer in which the panel pattern corresponding to a plurality of display devices is formed. May be. Further, a plurality of panel patterns may be repeatedly formed in the mask M in the scanning direction (X direction) of the mask M, or a small panel pattern may be repeatedly formed in the direction (Y direction) orthogonal to the scanning direction. Plural may be formed. Further, the mask M may be formed with a panel pattern for the first display device and a panel pattern for the second display device having a size different from that of the first display device.

As shown in FIGS. 3 and 5, the exposure unit 121 installed on the anti-vibration table 131 has a mask holding mechanism 11 that supports the apparatus frame 132 and the mask stage 21 in addition to the alignment microscopes AM1 and AM2 described above. The substrate support mechanism 12, the projection optical system PL, and the lower-level controller 16 are included. The exposure unit 121 receives the illumination light flux EL1 from the illumination mechanism 13 and transmits the transmitted light (imaging light flux) generated from the mask pattern of the mask M held by the mask holding mechanism 11 to the substrate support mechanism 12. It is projected on the substrate P supported by the rotating drum 25, and a projected image of a part of the mask pattern is formed on the surface of the substrate P.

The lower-level controller 16 controls each unit of the exposure apparatus U3 and causes each unit to execute processing. The lower controller 16 may be a part or all of the upper controller 5 of the device manufacturing system 1. Further, the lower control device 16 is controlled by the upper control device 5 and may be a device different from the upper control device 5. The lower control device 16 includes, for example, a computer.

The vibration isolation table 131 is provided on the installation surface E and supports the device frame 132. Specifically, as shown in FIG. 3, the vibration isolation table 131 includes a first vibration isolation table 131a provided outside in the Y direction and a second vibration isolation table provided inside the first vibration isolation table 131a. 131b is included.

The device frame 132 is provided on the first vibration isolation table 131a and the second vibration isolation table 131b, and supports the mask holding mechanism 11, the substrate support mechanism 12, the illumination mechanism 13, and the projection optical system PL. The apparatus frame 132 has a first frame 132a that supports the mask holding mechanism 11, the illumination mechanism 13, and the projection optical system PL, and a second frame 132b that supports the substrate support mechanism 12. The first frame 132a and the second frame 132b are provided independently of each other, and are arranged so that the first frame 132a covers the second frame 132b. The first frame 132a is provided on the first vibration isolation table 131a, and the second frame 132b is provided on the second vibration isolation table 131b.

The first frame 132a includes a first lower frame 135 provided on the first vibration isolation table 131a, a first upper frame 136 provided above the first lower frame 135 in the Z direction, and a first upper frame 136. And an arm portion 137 that stands upright. The first lower frame 135 has a leg portion 135a standing on the first vibration isolation table 131a, and an upper surface portion 135b supported by the leg portion 135a, and projection optical components are provided on the upper surface portion 135b via a holding member 143. The system PL is supported. When viewed in the XY plane, the holding member 143 is kinematically supported by washer members 145 made of metal balls or the like arranged at three locations on the upper surface portion 135b. The leg portion 135a is arranged at a predetermined portion of the leg portion 135a such that a rotation axis AX2 of the rotary drum 25 described later is inserted in the Y direction.

Similar to the first lower frame 135, the first upper frame 136 also has a leg portion 136a standing on the upper surface portion 135b and an upper surface portion 136b supported by the leg portion 136a, and the upper surface portion 136b holds the mask. The mechanism 11 (mask stage 21) is supported. The arm portion 137 stands on the upper surface portion 136b and supports the illumination mechanism 13 so that the illumination mechanism 13 is located above the mask holding mechanism 11.

The second frame 132b is composed of a lower surface portion 139 provided on the second vibration isolation table 131b and a pair of bearing portions 140 standing upright on the lower surface portion 139 in the Y direction. The pair of bearings 140 is provided with an air bearing 141 that pivotally supports a rotating shaft AX2 that is the center of rotation of the rotating drum 25.

The mask holding mechanism 11 transmits power to a mask stage (mask holding member) 21 that holds the mask M, a moving mechanism (a linear guide, an air bearing, etc.) (not shown) for moving the mask stage 21, and a moving mechanism. And a transmission member 23 for. The mask stage 21 is configured in a frame shape so as to surround the pattern formation region of the mask M, and is driven by a mask side driving unit (driving source such as a motor) 22 provided in the driving unit 122 to form an upper surface portion 136 b of the first upper frame 136. At, in the X direction, which is the scanning direction. The driving force transmitted from the transmission member 23 is used for linearly driving the mask stage 21 by the moving mechanism.

In the present embodiment, since the mask stage 21 linearly moves in the X direction for scanning exposure, the mask side driving unit (driving source) 22 is fixed to the column frame 146 so as to extend in the X direction. The linear motor includes a magnet track (stator), and the transmission member 23 includes a linear motor coil unit (mover) that faces the magnet track with a constant gap. In FIG. 3, the holding member 143 that supports the projection optical system PL on the apparatus frame 132 side corresponds to the exposure position of the projection optical system PL on the outer peripheral surface of the rotating drum 25 (or the surface of the substrate P). A displacement sensor SG1 that measures a change in surface height and a displacement sensor SG2 that measures a position change in the Z direction of the mask M from below the mask stage 21 are provided.

On the other hand, as shown in FIG. 2 and FIG. 3, the rotary drum 25, which winds and supports the substrate P over substantially a half circumference, is a substrate-side drive unit (drive of a rotary motor or the like) provided in the drive unit 122 shown in FIG. Source) 26 to rotate. As shown in FIG. 5, the rotary drum 25 is formed in a cylindrical shape having an outer peripheral surface (circumferential surface) having a radius of curvature Rfa centered on the rotation axis AX2 extending in the Y direction. Here, a plane including the center line of the rotation axis AX2 and parallel to the YZ plane is the center plane CL (see FIG. 5). A part of the circumferential surface of the rotary drum 25 serves as a support surface P2 that supports the substrate P with a predetermined tension. That is, the rotating drum 25 supports the substrate P in a stable cylindrical curved surface shape by winding the substrate P around the supporting surface P2 with a constant tension.

Each air bearing 141 which rotatably supports the rotating shaft AX2 by the bearings 140 on both sides rotatably supports the rotating shaft AX2 in a non-contact state. In this embodiment, the rotary shaft AX2 is supported by the air bearings 141 at both ends of the rotary drum 25, but a normal bearing using balls or needles processed with high precision may be used. As shown in FIGS. 2 and 5, the plurality of guide rollers 28 are provided on the upstream side and the downstream side in the transport direction of the substrate P with the rotary drum 25 interposed therebetween. For example, four guide rollers 28 are provided, two on the upstream side in the transport direction and two on the downstream side in the transport direction.

Therefore, the substrate support mechanism 12 guides the substrate P conveyed from the position adjustment unit 120 to the rotary drum 25 by the two guide rollers 28. The substrate support mechanism 12 rotates the rotary drum 25 via the rotary shaft AX2 by the substrate side drive unit 26 to support the substrate P introduced into the rotary drum 25 on the support surface P2 of the rotary drum 25 while guiding the substrate P. The sheet is conveyed toward the roller 28. The substrate support mechanism 12 guides the substrate P conveyed to the guide roller 28 toward the substrate collecting device 4.

Here, an example of the configuration of the substrate side drive unit 26 will be described with reference to FIG. In FIG. 4, a disk-shaped scale plate 25c having a diameter substantially the same as the radius Rfa of the outer peripheral surface 25a of the rotary drum 25 is fixed to at least one end of the rotary drum 25 around which the substrate P is wound, coaxially with the rotation axis AX2. Has been done. Diffraction gratings are formed on the outer peripheral surface of the scale plate 25c at a constant pitch in the circumferential direction, and the diffraction grating is optically detected by a read head EH for encoder measurement. The amount of movement of the surface 25a of the drum 25 in the circumferential direction is measured. The rotation angle information of the rotary drum 25 measured by the read head EH is also used as a feedback signal for servo control of the motor that rotates the rotary drum 25. In FIG. 4, the displacement sensor SG1 is arranged so as to measure the displacement (radial displacement) at the height position of the surface of the substrate P, but the region on the end side of the rotary drum 25 which is not covered with the substrate P. You may arrange so that the displacement (radial direction displacement) of the height position of the surface of 25b may be measured.

A rotor RT in which a magnet unit MUr of a rotary motor that generates a torque around the rotation axis AX2 is annularly arranged on the end side of the rotation axis AX2 supported by the air bearing 141, and an axial direction of the rotation axis AX2. And a magnet unit MUs for a voice coil motor that provides the thrust of A coil unit CUr arranged to face the magnet unit MUr around the rotor RT and a coil wound so as to surround the magnet unit MUs are provided on the stator side fixed to the support frame 146 in FIG. Units CUs are provided. With such a configuration, the rotary drum 25 (and the scale plate 25c) integrated with the rotary shaft AX2 can be smoothly rotated by the torque applied to the rotor RT.

Further, since the voice coil motors (MUs, CUs) generate thrust in the direction of the rotation axis AX2 (Y direction) even when the rotating drum 25 is rotating, the rotating drum 25 (and the scale plate 25c) is moved to the Y direction. Can be moved slightly in the direction. As a result, it is possible to sequentially correct minute positional deviations of the substrate P in the Y direction during scanning exposure.

In the configuration of FIG. 4, a displacement sensor DT1 that measures the displacement of the end face Tp of the rotation axis AX2 in the Y direction or a displacement sensor DT2 that measures the displacement of the end face of the scale plate 25c in the Y direction is provided, and during scanning exposure. The position change of the rotary drum 25 in the Y direction can be sequentially measured in real time. Therefore, if the voice coil motors (MUs, CUs) are servo-controlled on the basis of the measurement signals from the displacement sensors DT1, DT2, the position of the rotary drum 25 in the Y direction can be precisely positioned. ..

Here, as shown in FIG. 6, the exposure apparatus U3 of the first embodiment is an exposure apparatus assuming a so-called multi-lens method. 6 is a plan view (left side of FIG. 6) of the illumination area IR (IR1 to IR6) on the mask M held by the mask stage 21 as viewed from the −Z side, and is supported by the rotary drum 25. A plan view (right side of FIG. 6) of the projection area PA (PA1 to PA6) on the substrate P viewed from the +Z side is illustrated. Reference numeral Xs in FIG. 6 indicates the scanning direction (rotational direction) of the mask stage 21 and the rotary drum 25. The exposure apparatus U3 of the multi-lens type illuminates a plurality (for example, six in the first embodiment) of illumination areas IR1 to IR6 on the mask M with the illumination light flux EL1, and each illumination light flux EL1 emits each illumination area IR1. To IR6 are projected onto a plurality of (for example, six in the first embodiment) projection areas PA1 to PA6 on the substrate P.

First, the plurality of illumination areas IR1 to IR6 illuminated by the illumination mechanism 13 will be described. As shown in FIG. 6, the plurality of illumination regions IR1 to IR6 are arranged in two rows in the scanning direction of the substrate P with the center plane CL sandwiched therebetween, and the illumination regions IR1, IR3, IR3, and IR3 on the mask M on the upstream side in the scanning direction. And IR5 are arranged, and the illumination regions IR2, IR4, and IR6 are arranged on the mask M on the downstream side in the scanning direction. Each of the illumination regions IR1 to IR6 is an elongated trapezoidal region having parallel short sides and long sides extending in the width direction (Y direction) of the mask M. At this time, each of the trapezoidal illumination regions IR1 to IR6 is a region in which its short side is located on the center plane CL side and its long side is located outside. The odd-numbered illumination areas IR1, IR3, and IR5 are arranged at a predetermined interval in the Y direction. Further, the even-numbered illumination areas IR2, IR4, and IR6 are arranged at a predetermined interval in the Y direction. At this time, the illumination area IR2 is arranged between the illumination area IR1 and the illumination area IR3 in the Y direction. Similarly, the illumination region IR3 is arranged between the illumination region IR2 and the illumination region IR4 in the Y direction. The illumination area IR4 is arranged between the illumination area IR3 and the illumination area IR5 in the Y direction. The illumination area IR5 is arranged between the illumination area IR4 and the illumination area IR6 in the Y direction. The illumination regions IR1 to IR6 are arranged so that the triangular portions of the oblique sides of adjacent trapezoidal illumination regions overlap (overlap) when viewed in the scanning direction of the mask M. Although each of the illumination areas IR1 to IR6 is a trapezoidal area in the first embodiment, it may be a rectangular area.

Further, the mask M has a pattern forming area A3 in which a mask pattern is formed and a pattern non-forming area A4 in which a mask pattern is not formed. The pattern non-formation area A4 is a low reflection area that absorbs the illumination luminous flux EL1, and is arranged so as to surround the pattern formation area A3 in a frame shape. The illumination areas IR1 to IR6 are arranged so as to cover the entire width of the pattern formation area A3 in the Y direction.

The illumination mechanism 13 emits the illumination light flux EL1 with which the mask M is illuminated. The illumination mechanism 13 includes a light source device and an illumination optical system IL. The light source device includes a lamp light source such as a mercury lamp, a laser diode, or a solid-state light source such as a light emitting diode (LED). Illumination light emitted from the light source device is, for example, bright lines (g line, h line, i line) emitted from a lamp light source, far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), ArF excimer laser light. (Wavelength 193 nm) and the like. The illumination light emitted from the light source device has a uniform illuminance distribution and is guided to the illumination optical system IL via a light guide member such as an optical fiber.

The illumination optical system IL is provided with a plurality of (for example, six in the first embodiment) illumination modules IL1 to IL6 according to the plurality of illumination regions IR1 to IR6. The illumination luminous flux EL1 from the light source device is incident on each of the plurality of illumination modules IL1 to IL6. The illumination modules IL1 to IL6 guide the illumination luminous flux EL1 incident from the light source device to the illumination regions IR1 to IR6, respectively. That is, the illumination module IL1 guides the illumination light flux EL1 to the illumination region IR1, and similarly, the illumination modules IL2 to IL6 guide the illumination light flux EL1 to the illumination regions IR2 to IR6. The plurality of illumination modules IL1 to IL6 are arranged in two rows in the scanning direction of the mask M with the center plane CL interposed therebetween. The illumination modules IL1, IL3, and IL5 are arranged on the side where the illumination regions IR1, IR3, and IR5 are arranged (left side in FIG. 5) with respect to the center plane CL. The illumination modules IL1, IL3, and IL5 are arranged at a predetermined interval in the Y direction. The illumination modules IL2, IL4, and IL6 are arranged on the side where the illumination regions IR2, IR4, and IR6 are arranged (on the right side in FIG. 5) with respect to the center plane CL. The illumination modules IL2, IL4, and IL6 are arranged at a predetermined interval in the Y direction. At this time, the illumination module IL2 is arranged between the illumination module IL1 and the illumination module IL3 in the Y direction. Similarly, the illumination module IL3 is arranged between the illumination module IL2 and the illumination module IL4 in the Y direction. The illumination module IL4 is arranged between the illumination module IL3 and the illumination module IL5 in the Y direction. The illumination module IL5 is arranged between the illumination module IL4 and the illumination module IL6 in the Y direction. The illumination modules IL1, IL3, and IL5 and the illumination modules IL2, IL4, and IL6 are arranged symmetrically with respect to the center plane CL when viewed from the Y direction.

Each of the plurality of illumination modules IL1 to IL6 includes a plurality of optical members such as an integrator optical system, a rod lens, and a fly-eye lens, and illuminates each of the illumination regions IR1 to IR6 with an illumination light flux EL1 having a uniform illuminance distribution. In the first embodiment, the plurality of illumination modules IL1 to IL6 are arranged on the upper side of the mask M in the Z direction. Each of the plurality of illumination modules IL1 to IL6 illuminates each illumination region IR of the mask pattern formed on the mask M from above the mask M.

Next, the plurality of projection areas PA1 to PA6 projected and exposed by the projection optical system PL will be described. As shown in FIG. 6, the plurality of projection areas PA1 to PA6 on the substrate P are arranged in correspondence with the plurality of illumination areas IR1 to IR6 on the mask M. That is, the plurality of projection areas PA1 to PA6 on the substrate P are arranged in two rows in the transport direction with the center plane CL interposed therebetween, and the projection areas PA1, PA3, PA3, And PA5 are arranged, and the projection areas PA2, PA4, and PA6 are arranged on the substrate P on the downstream side in the transport direction. Each of the projection areas PA1 to PA6 is an elongated trapezoidal area having a short side and a long side extending in the width direction (Y direction) of the substrate P. At this time, each of the trapezoidal projection areas PA1 to PA6 has a short side located on the center plane CL side and a long side located outside. The projection areas PA1, PA3, and PA5 are arranged at predetermined intervals in the width direction. Further, the projection areas PA2, PA4, and PA6 are arranged at a predetermined interval in the width direction. At this time, the projection area PA2 is arranged between the projection area PA1 and the projection area PA3 in the axial direction of the rotation axis AX2. Similarly, the projection area PA3 is arranged between the projection area PA2 and the projection area PA4 in the axial direction of the rotation axis AX2. The projection area PA4 is arranged between the projection area PA3 and the projection area PA5 in the axial direction of the rotation axis AX2. The projection area PA5 is arranged between the projection area PA4 and the projection area PA6 in the axial direction of the rotation axis AX2. Similar to the illumination areas IR1 to IR6, the projection areas PA1 to PA6 are arranged so that the triangular portions of the hypotenuses of the adjacent trapezoidal projection areas PA are overlapped with each other when viewed from the transport direction of the substrate P (so that they overlap. ) It is arranged. At this time, the projection area PA has a shape such that the exposure amount in the overlapping area of the adjacent projection areas PA is substantially the same as the exposure amount in the non-overlapping area. The projection areas PA1 to PA6 are arranged so as to cover the entire width of the exposure area A7 exposed on the substrate P in the Y direction.

Here, in FIG. 5, when viewed in the XZ plane, the length from the center point of the illumination region IR1 (and IR3, IR5) on the mask M to the center point of the illumination region IR2 (and IR4, IR6) is The circumference from the center point of the projection area PA1 (and PA3, PA5) on the substrate P along the support surface P2 to the center point of the projection area PA2 (and PA4, PA6) is set to be substantially equal.

Further, as shown in FIG. 5, the projection optical system PL is provided with a plurality of (for example, six in the first embodiment) projection modules PL1 to PL6 corresponding to the plurality of projection regions PA1 to PA6. The plurality of projection light beams EL2 from the plurality of illumination regions IR1 to IR6 are incident on the plurality of projection modules PL1 to PL6, respectively. The projection modules PL1 to PL6 guide the projection light fluxes EL2 from the mask M to the projection areas PA1 to PA6, respectively. That is, the projection module PL1 guides the projection light flux EL2 from the illumination area IR1 to the projection area PA1. Lead. The plurality of projection modules PL1 to PL6 are arranged in two rows in the scanning direction of the mask M with the center plane CL interposed therebetween. The projection modules PL1, PL3, and PL5 are arranged on the side where the projection areas PA1, PA3, and PA5 are arranged (left side in FIG. 5) with respect to the center plane CL. The projection modules PL1, PL3, and PL5 are arranged at a predetermined interval in the Y direction. The projection modules PL2, PL4, and PL6 are arranged on the side where the projection areas PA2, PA4, and PA6 are arranged (on the right side in FIG. 5) with respect to the center plane CL. The projection modules PL2, PL4, and PL6 are arranged at a predetermined interval in the Y direction. At this time, the projection module PL2 is arranged between the projection module PL1 and the projection module PL3 in the axial direction of the rotation axis AX2. Similarly, the projection module PL3 is arranged between the projection module PL2 and the projection module PL4 in the axial direction of the rotation axis AX2. The projection module PL4 is arranged between the projection module PL3 and the projection module PL5 in the axial direction of the rotation axis AX2. The projection module PL5 is arranged between the projection module PL4 and the projection module PL6 in the axial direction of the rotation axis AX2. Further, the projection modules PL1, PL3, PL5 and the projection modules PL2, PL4, PL6 are arranged symmetrically with respect to the center plane CL as viewed from the Y direction.

The plurality of projection modules PL1 to PL6 are provided corresponding to the plurality of illumination modules IL1 to IL6. That is, the projection module PL1 projects the image of the mask pattern of the illumination area IR1 illuminated by the illumination module IL1 onto the projection area PA1 on the substrate P. Similarly, the projection modules PL2 to PL6 project images of the mask patterns of the illumination regions IR2 to IR6 illuminated by the illumination modules IL2 to IL6 onto the projection regions PA2 to PA6 on the substrate P.

Next, the projection modules PL1 to PL6 will be described with reference to FIG. Since the projection modules PL1 to PL6 have the same configuration, the projection module PL1 will be described as an example.

The projection module PL1 projects the image of the mask pattern in the illumination area IR (illumination area IR1) on the mask M onto the projection area PA on the substrate P. As shown in FIG. 7, the projection module PL1 includes at least one of the first optical system 61 that forms an image of the mask pattern in the illumination region IR on the intermediate image plane P7 and the intermediate image formed by the first optical system 61. A second optical system 62 for re-forming an image on the projection area PA of the substrate P, and a projection field stop 63 arranged on an intermediate image plane P7 where an intermediate image is formed. The projection module PL1 also includes a focus correction optical member 64, an image shift optical member 65, a magnification correction optical member 66, and a rotation correction mechanism 67.

The first optical system 61 and the second optical system 62 are, for example, telecentric catadioptric systems obtained by modifying a Dyson system. The optical axis of the first optical system 61 (hereinafter referred to as the second optical axis BX2) is substantially orthogonal to the center plane CL. The first optical system 61 includes a first deflecting member 70, a first lens group 71, and a first concave mirror 72. The first deflecting member 70 is a triangular prism having a first reflecting surface P3 and a second reflecting surface P4. The first reflection surface P3 is a surface that reflects the projection light flux EL2 from the mask M and allows the reflected projection light flux EL2 to enter the first concave mirror 72 through the first lens group 71. The second reflection surface P4 is a surface on which the projection light beam EL2 reflected by the first concave mirror 72 enters through the first lens group 71 and reflects the incident projection light beam EL2 toward the projection field stop 63. .. The first lens group 71 includes various lenses, and the optical axes of the various lenses are arranged on the second optical axis BX2. The first concave mirror 72 is arranged on the pupil plane where a large number of point light sources generated by the fly-eye lens are imaged by various lenses from the fly-eye lens to the first concave mirror 72 via the illumination field stop.

The projection light flux EL2 from the mask M passes through the focus correction optical member 64 and the image shifting optical member 65, is reflected by the first reflecting surface P3 of the first deflecting member 70, and is in the upper half field of the first lens group 71. The light enters the first concave mirror 72 through the area. The projection light flux EL2 that has entered the first concave mirror 72 is reflected by the first concave mirror 72, passes through the field area of the lower half of the first lens group 71, and enters the second reflecting surface P4 of the first deflecting member 70. The projection light beam EL2 that has entered the second reflection surface P4 is reflected by the second reflection surface P4 and enters the projection field stop 63.

The projection field stop 63 has an opening that defines the shape of the projection area PA. That is, the shape of the opening of the projection field stop 63 defines the shape of the projection area PA.

The second optical system 62 has the same configuration as the first optical system 61, and is provided symmetrically with the first optical system 61 with the intermediate image plane P7 interposed therebetween. The optical axis of the second optical system 62 (hereinafter referred to as the third optical axis BX3) is substantially orthogonal to the center plane CL and is parallel to the second optical axis BX2. The second optical system 62 includes a second deflecting member 80, a second lens group 81, and a second concave mirror 82. The second deflecting member 80 has a third reflecting surface P5 and a fourth reflecting surface P6. The third reflecting surface P5 is a surface that reflects the projection light flux EL2 from the projection field stop 63 and allows the reflected projection light flux EL2 to pass through the second lens group 81 and enter the second concave mirror 82. The fourth reflection surface P6 is a surface on which the projection light flux EL2 reflected by the second concave mirror 82 enters through the second lens group 81 and reflects the incident projection light flux EL2 toward the projection area PA. The second lens group 81 includes various lenses, and the optical axes of the various lenses are arranged on the third optical axis BX3. The second concave mirror 82 is arranged on a pupil plane where various point light source images formed by the first concave mirror 72 are formed by various lenses from the first concave mirror 72 to the second concave mirror 82 via the projection field stop 63. ing.

The projection light flux EL2 from the projection field stop 63 is reflected by the third reflecting surface P5 of the second deflecting member 80, and enters the second concave mirror 82 through the field area of the upper half of the second lens group 81. The projection light flux EL2 that has entered the second concave mirror 82 is reflected by the second concave mirror 82, passes through the field area of the lower half of the second lens group 81, and enters the fourth reflecting surface P6 of the second deflecting member 80. The projection light flux EL2 that has entered the fourth reflection surface P6 is reflected by the fourth reflection surface P6, passes through the magnification correction optical member 66, and is projected onto the projection area PA. As a result, the image of the mask pattern in the illumination area IR is projected on the projection area PA at the same size (×1).

The focus correction optical member 64 is arranged between the mask M and the first optical system 61. The focus correction optical member 64 adjusts the focus state of the image of the mask pattern projected on the substrate P. The focus correction optical member 64 is, for example, a structure in which two wedge-shaped prisms are reversed (opposite to the X direction in FIG. 7) and overlapped so as to form a transparent parallel flat plate as a whole. The thickness of the parallel plate is made variable by sliding the pair of prisms in the direction of the slope without changing the distance between the surfaces facing each other. Thereby, the effective optical path length of the first optical system 61 is finely adjusted, and the focus state of the image of the mask pattern formed on the intermediate image plane P7 and the projection area PA is finely adjusted.

The image shifting optical member 65 is arranged between the mask M and the first optical system 61. The image shifting optical member 65 adjusts the image of the mask pattern projected on the substrate P so as to be movable in the image plane. The image shifting optical member 65 is composed of a transparent parallel flat plate glass that can be tilted in the XZ plane of FIG. 6 and a transparent parallel flat glass plate that can be tilted in the YZ plane of FIG. 7. By adjusting the respective inclination amounts of the two parallel flat plate glasses, the image of the mask pattern formed on the intermediate image plane P7 and the projection area PA can be minutely shifted in the X direction and the Y direction.

The magnification correction optical member 66 is arranged between the second deflecting member 80 and the substrate P. As the magnification correction optical member 66, for example, three lenses of a concave lens, a convex lens, and a concave lens are coaxially arranged at a predetermined interval, the front and rear concave lenses are fixed, and the convex lens between them is moved in the optical axis (principal ray) direction. It is configured to. As a result, the image of the mask pattern formed in the projection area PA is isotropically enlarged or reduced by a very small amount while maintaining a telecentric image formation state. The optical axes of the three lens groups forming the magnification correcting optical member 66 are tilted in the XZ plane so as to be parallel to the principal ray of the projection light beam EL2.

The rotation correction mechanism 67, for example, uses an actuator (not shown) to slightly rotate the first deflection member 70 around an axis perpendicular to the second optical axis BX2. By rotating the first deflecting member 70, the rotation correction mechanism 67 can slightly rotate the image of the mask pattern formed on the intermediate image plane P7 within the plane P7.

In the thus configured projection modules PL1 to PL6, the projection light flux EL2 from the mask M is emitted from the illumination region IR in the direction normal to the mask surface P1 and is incident on the first optical system 61. The projection light flux EL2 that has entered the first optical system 61 passes through the focus correction optical member 64 and the image shifting optical member 65, and then the first reflecting surface (flat mirror) P3 of the first deflecting member 70 of the first optical system 61. And is reflected by the first concave mirror 72 through the first lens group 71. The projection light beam EL2 reflected by the first concave mirror 72 passes through the first lens group 71 again, is reflected by the second reflecting surface (flat mirror) P4 of the first deflecting member 70, and enters the projection field stop 63. The projection light flux EL2 that has passed through the projection field stop 63 is reflected by the third reflecting surface (flat mirror) P5 of the second deflecting member 80 of the second optical system 62, passes through the second lens group 81, and is reflected by the second concave mirror 82. To be done. The projection light flux EL2 reflected by the second concave mirror 82 passes through the second lens group 81 again, is reflected by the fourth reflecting surface (flat mirror) P6 of the second deflecting member 80, and enters the magnification correcting optical member 66. .. The projection light beam EL2 emitted from the magnification correction optical member 66 is incident on the projection area PA on the substrate P, and the image of the mask pattern appearing in the illumination area IR is projected on the projection area PA at the same magnification (×1). ..

<Control of drive unit>
Next, the control of the drive unit 122 will be described with reference to FIG. The drive unit 122 is configured to include the mask-side drive unit 22 attached to the support frame 146 installed on the installation surface E and the substrate-side drive unit 26.

As described above, the mask-side driving unit 22 includes the magnet track (stator) of the linear motor fixed to the support frame 146 so as to extend in the X direction and the transmission member 23 coupled to the mask stage 21. It is composed of a coil unit (movable element) of a linear motor that is fixed and faces the magnet track with a constant gap. In addition, as shown in FIG. 4, the board-side driving unit 26 includes a coil unit CUr fixed as a stator on the support frame 146 side, and a mover for the rotor RT on the rotation axis AX2 side of the rotary drum 25. And a voice coil motor (MUs, CUs) for applying a thrust force from the support frame 146 side to the rotary drum 25 in the direction of the rotation axis AX2 (Y direction). Including. As described above, the mask-side drive unit 22 and the substrate-side drive unit 26 have a configuration (direct drive system) capable of directly transmitting power to the transmission member 23 and the rotation axis AX2 in a non-contact manner. Not exclusively. For example, the board-side drive unit 26 has an electric motor and a magnetic gear, the electric motor is fixed to the support frame 146 side, and the magnetic gear is provided between the output shaft of the electric motor and the rotating shaft AX2. Good.

In the configuration of the drive unit 122 as described above, the subordinate control device 16 shown in FIG. 5 moves the mask stage 21 and the rotary drum 25 in synchronization with each other. Therefore, the image of the mask pattern formed on the mask surface P1 of the mask M is curved following the surface (circumferential surface) of the substrate P wound around the support surface P2 (25a in FIG. 4) of the rotating drum 25. Surface) is continuously and repeatedly projected and exposed. In the exposure apparatus U3 of the first embodiment, an operation (rewinding) of returning the mask M to the initial position in the −X direction is required after performing scanning exposure by the synchronous movement of the mask M in the +X direction. Therefore, when the rotary drum 25 is continuously rotated at a constant speed and the substrate P is continuously fed at a constant speed, pattern exposure is not performed on the substrate P during the rewinding operation of the mask M, and the panel in the transport direction of the substrate P is used. The work patterns are formed in a scattered manner (spaced apart). However, in practice, the speed of the substrate P (here, the peripheral speed) and the speed of the mask M during scanning exposure are assumed to be 50 mm/s to 100 mm/s. Therefore, when rewinding the mask M, the mask stage is used. By driving 21 at the maximum speed of, for example, 500 mm/s, it is possible to narrow the margin in the carrying direction between the panel patterns formed on the substrate P.

In the present embodiment, the movement position and speed of the mask stage 21 in the X direction are precisely measured by a laser interferometer or a linear encoder, and the movement position and speed of the outer peripheral surface of the rotary drum 25 are scale plate 25c in FIG. By precisely measuring with the read head EH, it is possible to accurately secure positional synchronization and speed synchronization of the mask M and the substrate P in the scanning exposure direction.

<Pressing mechanism>
Next, the pressing mechanism 130 will be described with reference to FIG. The pressing mechanism 130 is provided between the position adjustment unit 120 and the exposure unit 121. The pressing mechanism 130 presses the substrate P supplied from the position adjusting unit 120 to the exposure unit 121 so that tension is applied to the substrate P. The pressing mechanism 130 has a pressing member 151 and an elevating mechanism 152 for elevating the pressing member 151. The pressing member 151 presses the substrate P in contact or non-contact with the substrate P. As the pressing member 151, for example, an air turn bar having an air ejection port and an air intake port for making a non-contact state with the substrate P, a friction roller contacting the substrate P, or the like is used. The elevating mechanism 152 elevates and lowers the pressing member 151 in a direction in which it is pressed from one surface (back surface) of the substrate P to the other surface (front surface), that is, the Z direction. The elevating mechanism 152 is connected to the host controller 5, and is controlled by the host controller 5 based on the detection result of the second substrate detector 124.

The host controller 5 controls the pressing mechanism 130 based on the detection result of the second substrate detection unit 124. Specifically, the host controller 5 calculates the displacement amount of the position of the substrate P per unit time (for example, several milliseconds) from the position of the substrate P detected by the second substrate detection unit 124. The host controller 5 adjusts the movement amount of the pressing member 151 in the Z direction according to the calculated displacement amount. That is, if the calculated displacement amount is large, the host controller 5 determines that the vibration of the substrate P is large and controls the elevating mechanism 152 to raise the pressing member 151 in the Z direction. The host controller 5 raises the pressing member 151 in the Z direction to apply tension to the substrate P and the vibration of the substrate P is damped by the pressing member 151.

<Substrate collection device>
Next, referring again to FIG. 2, the substrate recovery device 4 will be described. The substrate recovery device 4 includes a position adjustment unit 160, a second bearing portion 161 on which the recovery roll FR2 is mounted, and a second elevating mechanism 162 that elevates and lowers the second bearing portion 161. Further, the substrate recovery device 4 has a discharge angle detection unit 164 and a third substrate detection unit 165, and the discharge angle detection unit 164 and the third substrate detection unit 165 are connected to the host controller 5. There is. Here, in the first embodiment, the host controller 5 functions as a controller (control unit) of the substrate recovery device 4, like the substrate supply device 2. As a control device of the substrate recovery device 4, a lower control device for controlling the substrate recovery device 4 may be provided, and the lower control device may control the substrate recovery device 4.

The position adjustment unit 160 is configured to include the above-mentioned edge position controller EPC2 shown in FIG. The position adjustment unit 160 has substantially the same configuration as the position adjustment unit 120 of the exposure apparatus U3, and includes a base 170 and an edge position controller EPC2. The base 170 is provided on the installation surface E and supports the edge position controller EPC2. The base 170 may be a vibration isolation table having a vibration isolation function.

The edge position controller EPC2 is movable on the base 170 in the width direction (Y direction) of the substrate P. The edge position controller EPC2 has a plurality of rollers including a transport roller 167 provided on the most downstream side in the transport direction of the substrate P. The transport roller 167 guides the substrate P discharged from the position adjustment unit 160 to the recovery roll FR2. The edge position controller EPC2 is connected to the host controller 5, and is controlled by the host controller 5 based on the detection result of the third substrate detector 165.

The third substrate detection unit 165 detects the position in the width direction of the substrate P collected by the collection roll FR2 from the edge position controller EPC2. The third substrate detection unit 165 is fixed on the second elevating mechanism 162. Therefore, the third substrate detection unit 165 is in the same vibration mode as the recovery roll FR2. The third substrate detection unit 165 detects the position of the edge of the end portion of the substrate P collected by the collection roll FR2. The third board detection unit 165 outputs the detection result to the connected upper controller 5.

The host controller 5 controls the edge position controller EPC2 based on the detection result of the third substrate detection unit 165. Specifically, the host controller 5 determines the difference between the position of the edge of the end portion of the substrate P collected by the collecting roll FR2 detected by the third substrate detection unit 165 and the predetermined third target position. To calculate. Then, the host controller 5 feedback-controls the edge position controller EPC2 so that the difference becomes zero, moves the substrate P in the width direction, and sets the position of the substrate P with respect to the recovery roll FR2 in the width direction to the third position. Set to the target position. Therefore, the edge position controller EPC2 can maintain the position in the width direction of the substrate P with respect to the recovery roll FR2 at the third target position. Therefore, since the position in the width direction of the substrate P with respect to the recovery roll FR2 can be made constant, the end faces in the axial direction of the recovery roll FR2 can be aligned. Also in this case, the feedback control may be any control such as P control, PI control, PID control and the like.

The second bearing portion 161 rotatably supports the recovery roll FR2. When the substrate P is recovered, the recovery roll FR2 pivotally supported by the second bearing portion 161 increases the winding diameter of the recovery roll FR2 by the amount of the recovery of the substrate P. Therefore, the position at which the substrate P is recovered on the recovery roll FR2 changes depending on the recovery amount of the substrate P.

The second lifting mechanism 162 is provided between the installation surface E and the second bearing portion 161. The second lifting mechanism 162 moves the second bearing portion 161 together with the recovery roll FR2 in the Z direction (vertical direction). The second elevating mechanism 162 is connected to the host controller 5, and the host controller 5 moves the second bearing portion 161 in the Z direction by the second elevating mechanism 162, so that the substrate P is collected by the recovery roll FR2. The position where the is collected can be set to a predetermined position.

The ejection angle detection unit 164 detects the ejection angle θ2 of the substrate P ejected from the transport roller 167 of the edge position controller EPC2. The discharge angle detection unit 164 is provided around the transport roller 167. Here, the discharge angle θ2 is an angle formed by a straight line extending in the vertical direction passing through the central axis of the transport roller 167 and the substrate P on the downstream side of the transport roller 167 in the XZ plane. The discharge angle detection unit 164 outputs the detection result to the connected upper controller 5.

The host controller 5 controls the second elevating mechanism 162 based on the detection result of the discharge angle detection unit 164. Specifically, the host controller 5 controls the second elevating mechanism 162 so that the discharge angle θ2 becomes a predetermined target discharge angle. That is, when the recovery amount of the substrate P on the recovery roll FR2 increases, the winding diameter of the recovery roll FR2 increases and the discharge angle θ2 with respect to the target discharge angle decreases. Therefore, the host controller 5 moves (raises) the second lifting mechanism 162 upward in the Z direction to increase the discharge angle θ2 and correct the discharge angle θ2 to the target discharge angle. .. In this way, the host controller 5 feedback-controls the second elevating mechanism 162 based on the detection result of the discharge angle detection unit 164 so that the discharge angle θ2 becomes the target discharge angle. For this reason, the substrate recovery device 4 can always eject the substrate P from the transport roller 167 at the target ejection angle, so that the influence of the change in the ejection angle θ2 on the substrate P can be reduced. Also in this case, the feedback control may be any control such as P control, PI control, PID control and the like.

<Device manufacturing method>
Next, a device manufacturing method will be described with reference to FIG. FIG. 8 is a flowchart showing the device manufacturing method according to the first embodiment.

In the device manufacturing method shown in FIG. 8, first, a function/performance design of a display panel using a self-luminous element such as an organic EL is performed, and necessary circuit patterns and wiring patterns are designed by CAD or the like (step S201). Next, the mask M for the necessary layers is manufactured based on the pattern for each layer designed by CAD or the like (step S202). Further, a supply roll FR1 around which a flexible substrate P (resin film, metal foil film, plastic, etc.) serving as a base material of the display panel is wound is prepared (step S203). The roll-shaped substrate P prepared in step S203 has its surface modified as necessary, an underlayer (for example, fine irregularities formed by an imprint method) preformed, and photosensitivity. The functional film or transparent film (insulating material) may be laminated in advance.

Next, a backplane layer composed of electrodes, wirings, insulating films, TFTs (thin film semiconductors), etc. that form the display panel device is formed on the substrate P, and organic EL or the like is formed so as to be laminated on the backplane. A light emitting layer (display pixel portion) is formed by the self-luminous element (step S204). This step S204 also includes a conventional photolithography process of exposing the photoresist layer using the exposure apparatus U3 described in each of the above embodiments, but a photosensitive silane coupling agent is used instead of the photoresist. An exposure step of pattern-exposing the coated substrate P to form a pattern having hydrophilicity/repellency on the surface, and a pattern exposure of a photosensitive catalyst layer to form a pattern of metal film (wiring, electrodes, etc.) by electroless plating. Wet process or printing process for drawing a pattern with conductive ink containing conductive material such as silver nanoparticles, ink containing insulating material, ink containing semiconductor material (pentacene, semiconductor nanorods, etc.), etc. Processing by is also included.

Next, the substrate P is diced for each display panel device continuously manufactured on the long substrate P by the roll method, and a protective film (environmental barrier layer) or a color filter is provided on the surface of each display panel device. A device or the like is assembled by sticking sheets or the like (step S205). Next, an inspection process is performed to determine whether the display panel device functions normally or satisfies the desired performance and characteristics (step S206). A display panel (flexible display) can be manufactured as described above.

As described above, in the first embodiment, the exposure unit 121 is installed on the installation surface E via the vibration isolation table 131, and the exposure unit 121, the position adjustment unit 120, and the drive unit 122 are provided in an independent state. You can That is, in the first embodiment, the exposure unit 121 and the position adjustment unit 120 and the drive unit 122 can be cut off by the vibration isolation table 131, that is, different vibration modes can be set. Therefore, the exposure unit 121 can reduce the vibration from the position adjustment unit 120 and the drive unit 122 by the vibration isolation table 131.

Further, in the first embodiment, the position in the width direction of the substrate P with respect to the fixed roller 126 can be maintained at the first target position. Therefore, since the substrate P is supplied to the fixed roller 126 at the same position, the position of the substrate P supplied from the fixed roller 126 in the width direction can be made constant. As a result, in the first embodiment, the position in the width direction of the substrate P sent from the fixed roller 126 can be made constant, so that the influence of vibration or the like given to the substrate P due to the change in the position in the width direction of the substrate P. It can be reduced.

In addition, in the first embodiment, the position of the substrate P with respect to the transport roller 127 can be maintained at the second target position. Therefore, in the first embodiment, the position of the substrate P supplied to the exposure unit 121 can be made constant. As a result, in the first embodiment, the position of the substrate P supplied to the transport roller 127 can be made constant, so that it is possible to reduce the influence of vibration or the like given to the substrate P due to the variation of the position of the substrate P. ..

Further, in the first embodiment, by pressing the substrate P by the pressing mechanism 130, it is possible to further reduce the vibration of the substrate P supplied from the position adjustment unit 120 to the exposure unit 121.

Further, in the first embodiment, the device frame 132 is separated into a first frame 132a and a second frame 132b, the mask stage 21 is supported by the first frame 132a, and the rotary drum 25 is supported by the second frame 132b. Can be supported. Therefore, the first frame 132a and the second frame 132b can be provided in an independent state. That is, the first frame 132a and the second frame 132b can be cut off, that is, in different vibration modes. Therefore, it is possible to reduce the transmission of mutual vibrations of the first frame 132a and the second frame 132b.

Further, in the first embodiment, the entrance angle θ1 of the substrate P, which is supplied from the supply roll FR1 to the transport roller 127 of the position adjustment unit 120 of the exposure apparatus U3, with respect to the transport roller 127 can be made constant. Therefore, the influence of the displacement of the approach angle θ1 on the substrate P can be reduced.

Further, in the first embodiment, the discharge angle θ2 of the substrate P supplied from the transport roller 167 of the position adjusting unit 160 of the substrate recovery device 4 to the recovery roll FR2 with respect to the transport roller 167 can be made constant. Therefore, it is possible to reduce the influence of the displacement of the discharge angle θ2 on the substrate P (such as uneven winding of the substrate P on the recovery roll FR2).

[Second Embodiment]
Next, the exposure apparatus U3 of the second embodiment will be described with reference to FIG. In addition, in the second embodiment, in order to avoid duplicated description, only parts different from the first embodiment will be described, and components similar to those of the first embodiment will be described in the first embodiment. The same reference numerals as those of the embodiment are given and described. FIG. 9 is a diagram showing a partial configuration of an exposure apparatus (substrate processing apparatus) U3 according to the second embodiment. In the exposure unit 121 of the exposure apparatus U3 of the first embodiment, the apparatus frame 132 is separated into the first frame 132a and the second frame 132b, but the exposure unit of the exposure apparatus U3 of the second embodiment. 121a is a single device frame 180.

In the exposure unit 121a according to the second embodiment, the apparatus frame 180 is provided on the vibration isolation table 131 and holds the transmission-type cylindrical mask MA, the mask holding mechanism 11, the substrate support mechanism 12, the illumination mechanism 13, and the projection. Supports the optical system PL. The device frame 180 includes a lower surface portion 181, which is provided on the vibration isolation table 131, a pair of bearing portions 182 standing on the lower surface portion 181, an intermediate portion 183 supported on the pair of bearing portions 182, and an intermediate portion. It is composed of a leg portion 184 standing on the portion 183, an upper surface portion 185 supported by the leg portion 184, and an arm portion 186 standing on the upper surface portion 185.

The pair of bearings 182 are provided with air bearings 141 that pivotally support the rotation axis AX2 of the rotary drum 25 of the substrate support mechanism 12. Each air bearing 141 rotatably supports the rotating shaft AX2 in a non-contact state. The projection optical system PL is installed in the intermediate portion 183 via the holding member 143. Washer members 145 are provided at three positions between the holding member 143 and the intermediate portion 183. The holding member 143 is kinematically supported on the intermediate portion 183 by three washer members 145. The upper surface portion 185 is provided with a drive roller (capstan roller) 94 for supporting the mask holding mechanism 11 (hollow cylindrical body) and rotationally driving the cylindrical mask MA around the rotation center line AX1. .. The illumination mechanism 13 is arranged inside the mask holding mechanism 11 and illuminates the illumination areas IR (IR1 to IR6) on the cylindrical mask MA from the inside in an arrangement as shown in the left diagram of FIG.

Further, the upper surface portion 185 is provided with a bearing 187 for rotatably supporting the rotation shaft of the drive roller 94, and the mask side drive portion 22 for rotationally driving the drive roller 94 is shown in FIG. The board-side driving unit 26 has the same configuration. Although not shown, a scale (diffraction grating) or scale plate 25c for encoder measurement similar to that shown in FIG. 4 is provided at both ends of the cylindrical mask holding mechanism 11 in the rotation center line AX1 direction. The position of the cylindrical mask MA in the circumferential direction is precisely measured by the read head EH arranged so as to face it.

As described above, in the second embodiment, the mask holding mechanism 11, the substrate support mechanism 12, the illumination mechanism 13, and the projection optical system PL can be supported by the single device frame 180. Therefore, in the second embodiment, since the positional relationship between the mask holding mechanism 11, the substrate supporting mechanism 12, the illumination mechanism 13 and the projection optical system PL can be fixed, the positional relationship can be easily adjusted without significantly adjusting them. Can be installed in

Next, the exposure apparatus U3 (exposure unit 121a) of the second embodiment shown in FIG. 9 will be described in further detail with reference to FIG. In the exposure unit 121a of FIG. 10, the mask holding mechanism 11 includes a mask holding drum 21a that holds the transmissive mask MA in a cylindrical shape, a guide roller 93 that supports the mask holding drum 21a, and a center line of the mask holding drum 21a. A drive roller 94 that drives around AX1 and a mask side drive unit 22 are provided.

The mask holding drum 21a forms a mask surface P1 on which the illumination area IR on the mask MA is arranged. In the present embodiment, the mask surface P1 includes a surface (hereinafter referred to as a cylindrical surface) obtained by rotating a line segment (bus line) around an axis parallel to the line segment (a central axis of a cylindrical shape). The cylindrical surface is, for example, an outer peripheral surface of a cylinder or an outer peripheral surface of a cylinder. The mask holding drum 21a is made of, for example, glass, quartz, or the like, has a cylindrical shape having a constant thickness, and its outer peripheral surface (cylindrical surface) forms the mask surface P1. That is, in the present embodiment, the illumination area IR on the mask MA is curved into a cylindrical surface having a constant radius Rm from the first axis AX1. A portion of the mask holding drum 21a that overlaps with the mask pattern of the mask MA when viewed in the radial direction of the mask holding drum 21a, for example, a central portion other than both ends in the Y direction of the mask holding drum 21a is transparent to the illumination light beam EL1. It has a light property.

The mask MA is created as a transmissive flat sheet mask in which a pattern is formed on one surface of an ultrathin glass plate having a good flatness (for example, a thickness of 100 to 500 μm) with a light shielding layer such as chrome, for example, The mask holding drum 21a is used by being curved along the outer peripheral surface of the mask holding drum 21a and wound (attached) on the outer peripheral surface. The mask MA has a pattern non-forming area A4 in which no pattern is formed, and is attached to the mask holding drum 21a in the pattern non-forming area A4. The mask MA can be released to the mask holding drum 21a. Instead of winding the mask MA around the mask holding drum 21a made of a transparent cylindrical base material, the mask MA may be directly formed on the outer peripheral surface of the mask holding drum 21a made of a transparent cylindrical base material by drawing and forming a mask pattern of a light shielding layer such as chrome. .. In this case as well, the mask holding drum 21a functions as a support member for the mask MA.

The guide roller 93 and the drive roller 94 extend in the Y direction parallel to the central axis of the mask holding drum 21a. The guide roller 93 and the driving roller 94 are rotatably provided around an axis parallel to the central axis. Each of the guide roller 93 and the drive roller 94 has an outer diameter at the end in the axial direction larger than the outer diameters of the other parts, and the end is in contact with the mask holding drum 21a. In this way, the guide roller 93 and the drive roller 94 are provided so as not to come into contact with the mask MA held by the mask holding drum 21a. The drive roller 94 is connected to the mask side drive unit 22. The drive roller 94 rotates the mask holding drum 21a around the central axis AX1 by transmitting the power from the mask side driving unit 22 to the mask holding drum 21a.

The mask holding mechanism 11 includes one guide roller 93, but the number is not limited and may be two or more. Similarly, the mask holding mechanism 11 includes one driving roller 94, but the number is not limited and may be two or more. At least one of the guide roller 93 and the driving roller 94 is disposed inside the mask holding drum 21a and may be inscribed in the mask holding drum 21a. Further, of the mask holding drum 21a, the portions (both ends in the Y direction) that do not overlap the mask pattern of the mask MA when viewed in the radial direction of the mask holding drum 21a have translucency with respect to the illumination light flux EL1. Or may not have translucency. Further, one or both of the guide roller 93 and the drive roller 94 may have, for example, a truncated cone shape, and the central axis (rotational axis) thereof may be nonparallel to the central axis AX1.

The illumination mechanism 13 is configured similarly to the first embodiment, and the plurality of illumination modules ILa1 to ILa6 of the illumination mechanism 13 are arranged inside the mask holding drum 21a. Each of the plurality of illumination modules ILa1 to ILa6 guides the illumination light flux EL1 emitted from the light source, and irradiates the guided illumination light flux EL1 onto the mask MA from the inside of the mask holding drum 21a. The illumination mechanism 13 illuminates the illumination area IR of the mask MA held by the mask holding mechanism 11 with uniform brightness by the illumination light flux EL1. The light source may be arranged inside the mask holding drum 21a or may be arranged outside the mask holding drum 21a. The light source may be a device (external device) different from the exposure device U3.

As described above, in the second embodiment, even if the mask MA of the exposure unit 121a is a cylindrical transmissive mask, the exposure unit 121a, the position adjustment unit 120, and the drive unit 122 are in independent states. (Vibration transmission is insulated). Therefore, the exposure unit 121a can reduce the vibrations from the position adjustment unit 120 and the drive unit 122 by the vibration isolation table 131, and can obtain the same effect as that of the first embodiment.

[Third Embodiment]
Next, with reference to FIG. 11, an exposure apparatus U3 of the third embodiment will be described. In addition, also in the third embodiment, in order to avoid redundant description, only parts different from the first embodiment and the second embodiment will be described, and the first embodiment and the second embodiment will be described. Constituent elements similar to those in the embodiment will be described with the same reference numerals as those in the first or second embodiment. FIG. 11 shows the overall configuration of the exposure unit 121b according to the third embodiment, which uses a cylindrical reflective mask MB and supports the substrate P in a planar manner.

First, the mask MB used in the exposure apparatus U3 of the third embodiment will be described. The mask MB is a reflective mask that uses, for example, a metal cylindrical body. The mask MB is formed into a cylindrical body having an outer peripheral surface (circumferential surface) having a radius of curvature Rm centered on the first axis AX1 extending in the Y direction, and has a constant radial thickness. The circumferential surface of the mask MB is a mask surface P1 on which a predetermined mask pattern is formed. The mask surface P1 includes a high reflection part that reflects a light beam in a predetermined direction with high efficiency, and a reflection suppressing part that does not reflect the light beam in a predetermined direction or reflects it with low efficiency. The mask pattern has a high reflection part and a reflection suppression part. Is formed by a section. Since such a mask MB is a metal cylindrical body, it can be manufactured at low cost.

Note that the mask MB is not limited to the shape of the cylindrical body as long as it has a circumferential surface with a radius of curvature Rm centered on the first axis AX1. For example, the mask MB may be an arc-shaped plate material having a circumferential surface. Further, the mask MB may have a thin plate shape, or the thin plate mask MB may be curved to have a circumferential surface.

The mask holding mechanism 11 has a mask holding drum 21b that holds the mask MB. The mask holding drum 21b holds the mask MB so that the first axis AX1 of the mask M becomes the center of rotation. The mask-side drive unit 22 is connected to the lower-level control device 16 and rotates the mask holding drum 21b about the first axis AX1 as a rotation center.

Although the mask holding mechanism 11 holds the cylindrical mask M on the mask holding drum 21b, the mask holding mechanism 11 is not limited to this configuration. The mask holding mechanism 11 may wind and hold the thin plate-shaped mask MB along the outer peripheral surface of the mask holding drum 21b. The mask holding mechanism 11 may hold the mask MB, which is an arc-shaped plate material, on the outer peripheral surface of the mask holding drum 21b.

The substrate support mechanism 12 includes a pair of drive rollers 196 on which the substrate P is stretched, an air stage 197 that supports the substrate P in a planar shape, and a plurality of guide rollers 28. The pair of drive rollers 196 is rotated by the substrate side drive unit 26 and moves the substrate P in the scanning direction. The air stage 197 is provided between the pair of drive rollers 196, is provided on the back surface side of the substrate P that is stretched between the pair of drive rollers 196 with a certain tension, and is in a non-contact state or a low friction state. The substrate P is planarly supported by. The plurality of guide rollers 28 are provided on the upstream side and the downstream side in the transport direction of the substrate P, with the pair of drive rollers 196 interposed therebetween. For example, four guide rollers 28 are provided, two on the upstream side in the transport direction and two on the downstream side in the transport direction.

Therefore, the substrate support mechanism 12 guides the substrate P conveyed from the position adjustment unit 120 to the one drive roller 196 by the two guide rollers 28. The substrate P guided by the one driving roller 196 is guided by the other driving roller 196, and is thus stretched around the pair of driving rollers 196 with a constant tension. The substrate support mechanism 12 rotates the pair of drive rollers 196 by the substrate-side drive unit 26 to direct the substrate P, which is stretched over the pair of drive rollers 196, to the guide rollers 28 while being supported by the air stage 197. To transport. The substrate support mechanism 12 guides the substrate P conveyed to the guide roller 28 toward the substrate collecting device 4.

When the cylindrical reflective mask MB is used, the illumination mechanism 13 illuminates the illumination light flux EL1 from the outer peripheral side of the mask holding drum 21b. That is, in the illumination mechanism 13, the light source device and the illumination optical system IL are provided on the outer periphery of the mask holding drum 21b. The illumination optical system IL is an epi-illumination system using a polarization beam splitter PBS. A polarization beam splitter PBS and a quarter-wave plate 198 are provided between each of the illumination modules IL1 to IL6 of the illumination optical system IL and the mask MB. That is, the illumination modules IL1 to IL6, the polarization beam splitter PBS, and the quarter-wave plate 198 are sequentially provided from the incident side of the illumination luminous flux EL1 from the light source device.

Here, the illumination luminous flux EL1 emitted from the light source device passes through the illumination modules IL1 to IL6 and enters the polarization beam splitter PBS. The illumination light beam EL1 that has entered the polarization beam splitter PBS is reflected by the polarization beam splitter PBS, passes through the quarter-wave plate 198, and is illuminated in the illumination region IR. The projection light flux EL2 reflected from the illumination region IR passes through the quarter-wave plate 198 again and is converted into a light flux that is transmitted through the polarization beam splitter PBS. The projection light beam EL2 that has passed through the quarter-wave plate 198 passes through the polarization beam splitter PBS and enters the projection optical system PL.

As described above, in the third embodiment, even if the mask MB of the exposure unit 121b is a cylindrical reflective mask and the substrate P is supported in a planar shape, the exposure unit 121b and the position adjustment are performed. The unit 120 and the drive unit 122 can be provided in an independent state (state in which vibration transmission is insulated). Therefore, the exposure unit 121b can reduce the vibrations from the position adjustment unit 120 and the drive unit 122 by the vibration isolation table 131, and can obtain the same effect as that of the second embodiment.

[Fourth Embodiment]
Next, an exposure apparatus (pattern forming apparatus) U3 according to the fourth embodiment will be described. In addition, also in the fourth embodiment, in order to avoid redundant description, only parts different from those in the first to third embodiments will be described, and regarding components similar to those in the first to third embodiments, , The same reference numerals as those in the first to third embodiments are given, and the description thereof is omitted.

FIG. 12 is a diagram showing a configuration of an exposure apparatus U3 according to the fourth embodiment, and FIG. 13 is a view of a substrate P transported in the exposure apparatus U3 shown in FIG. 12 when viewed from above (+Z direction) side. It is a figure. 14 is a diagram when the substrate P transported between the last roller 126 on the side of the position adjustment unit 120a and the first roller AR1 on the side of the exposure unit 121c shown in FIG. 13 is viewed from the −Y direction side, FIG. 15 is a view of the substrate P transported by the rotary drum 25 shown in FIG. 12 when viewed from the −X direction side. The exposure apparatus (processing apparatus) U3 includes a position adjustment unit 120a and an exposure unit 121c provided on the downstream side (+X direction side) of the position adjustment unit 120a in the transport direction of the substrate P. The position adjustment unit 120a and the exposure unit 121c are provided as separate bodies. That is, the position adjustment unit 120a and the exposure unit 121c are in a non-contact independent state, or the transfer path of the substrate P between the position adjustment unit 120a and the exposure unit 121c or the transfer path of the substrate P after the exposure unit 121c. Although they may be in contact with each other via a bellows type dust-proof cover 121d that covers them, in a state where the vibration component generated in the position adjustment unit 120a is not directly transmitted to the exposure unit 121c (a state in which vibration transmission is suppressed). It is provided. The exposure unit 121c is provided on the installation surface (base surface) E via a passive or active vibration isolation table (vibration isolation device, vibration isolation device) 131. The position adjustment unit 120a is provided on the installation surface E via the base 200. As a result, the vibrations from the other processing devices U1, U2, U4 to Un and the vibrations from the position adjustment unit 120a are not transmitted to the exposure unit 121c via the installation surface E. That is, the vibration propagation between the exposure unit 121c and the position adjustment unit 120a and other processing devices U and the like can be cut off (insulated). In other words, the vibration of the position adjusting unit 120a and the other processing apparatus U and the like and the vibration of the exposure unit 121c are insulated from each other. The base 200 may be an anti-vibration table (anti-vibration device, anti-vibration device) having anti-vibration/anti-vibration functions.

The position adjustment unit (position adjustment device) 120a includes an edge position controller EPC3a, a fixed roller (guide roller) 126, a first substrate detection unit 202, and a lower control device 204. The edge position controller EPC3a, the fixed roller 126, and the first substrate detection unit 202 are provided in this order from the upstream side (−X direction side) in the transport direction of the substrate P. The edge position controller EPC3a adjusts the width direction of the substrate P so that the position in the width direction of the substrate P transported with a predetermined tension (for example, a constant value in the range of 20 to 200N) in the length direction becomes the target position. Adjust (correct) the position at. The edge position controller EPC3a can move in the width direction (Y direction) of the substrate P in the position adjustment unit 120a. The edge position controller EPC3a moves in the Y direction when the actuator 206 (see FIG. 13) is driven, and adjusts the position of the substrate P in the width direction. The edge position controller EPC3a has guide rollers Rs1 and Rs2 and a drive roller NR for conveying the substrate P toward the fixed roller 126. The guide rollers Rs1 and Rs2 guide the conveyed substrate P, and the drive roller NR rotates while nipping both front and back surfaces of the substrate P to convey the substrate P. Reference numeral 207a in FIG. 13 is a support member (frame of the edge position controller EPC3a) that rotatably supports the guide rollers Rs1 and Rs2 and the drive roller NR. Further, reference numeral 207b is a supporting member (main body frame of the position adjusting unit 120a) that supports the first substrate detection unit 202 and rotatably supports the fixed roller 126, and an edge position on the main body frame 207b. A frame 207a of the controller EPC3a is mounted so as to be movable in the Y direction.

The fixed roller 126 guides the substrate P whose position is adjusted in the width direction by the edge position controller EPC3a toward the exposure unit 121c. The substrate P is bent in the longitudinal direction and guided and conveyed by the guide rollers Rs1 and Rs2, the driving roller NR, and the fixed roller 126. The first substrate detection unit (substrate error measurement unit, change measurement unit) 202 detects the position in the width direction of the substrate P conveyed from the fixed roller 126 toward the exposure unit 121c. Specifically, as shown in FIG. 13, the first substrate detection unit 202 includes a detection unit 202a that detects the Y-direction position of the edge portion Ea on the −Y side in the width direction of the substrate P, and an edge portion on the +Y side. The detection unit 202b detects the position of Eb in the Y direction, and measures the position change in the width direction of the substrate P based on the detection signals from both detection units 202a and 202b. Further, the first substrate detection unit 202 (202a, 202b) detects changes in the posture of the substrate P (a slight inclination), deformation of the substrate P (expansion and contraction in the width direction), and the like in addition to the position detection of the substrate P in the width direction. A sensor configuration that detects (measures) information may be used. The position of the substrate P in the width direction and the change information of the substrate P detected by the first substrate detection unit 202 are sent to the lower-level controller 204. The first substrate detection unit 202 may detect the position in the width direction of the substrate P conveyed from the edge position controller EPC3a toward the fixed roller 126.

The first substrate detection unit 202 changes the posture of the substrate P, and in particular, a slight inclination around the X axis (within the YZ plane) of the substrate P in the transport path parallel to the horizontal plane (XY plane) from the fixed roller 126 to the exposure unit 121c. 14, the Z position of each of the edge portions Ea and Eb of the substrate P (height position in the direction normal to the surface of the substrate P) Ze1 is detected by each of the detection units 202a and 202b. , A Z sensor capable of measuring changes in Ze2 is incorporated. When the exposure unit 121c side (roller AR1) is slightly inclined with respect to the fixed roller 126 with respect to the XY plane because the detection units 202a and 202b are arranged at a certain distance from the fixed roller 126 in the transport direction of the substrate P. The difference value between the Z position Ze1 detected by the detection unit 202a and the Z position Ze2 detected by the detection unit 202b changes according to the tilt amount. By thus obtaining the difference value, the relative position change ΔZs in the Z direction between the fixed roller 126 (position adjustment unit 120a) and the exposure unit 121c (roller AR1) is offset, and the detection units 202a and 202b are arranged. The slight inclination (around the X axis) of the substrate P at the determined position can be accurately obtained.

The actual inclination amount (angle Δψ) of the substrate P can be calculated by tan Δψ=(Ze1−Ze2)/Lz, where the distance in the Y direction between the Z sensor units of the detection units 202a and 202b is Lz (constant value). As described above, the change in the minute inclination of the substrate P measured by the Z sensor incorporated in the detection units 202a and 202b is caused by the relative inclination of the fixed roller 126, that is, the position adjusting unit 120a and the exposure unit 121c about the Z axis. It also responds to changes. As the Z sensor, an optical or capacitance non-contact type gap sensor or the like can be used. Further, the substrate P between the fixed roller 126 of FIG. 14 and the first roller (AR1) on the exposure unit 121c side is also given a constant tension in the longitudinal direction. Therefore, the substrate P is unlikely to bend during that time, but when the tension is low, the substrate P may bend, which may cause an error in the measurement by the Z sensor. Therefore, it is preferable that the detection units 202a and 202b (Z sensor unit) are arranged at positions close to the first roller (AR1) on the exposure unit 121c side in the lengthwise direction (conveyance direction) of the substrate P.

As shown in FIG. 14, when the substrate P is conveyed while the exposure unit 121c (first roller AR1) is tilted in the YZ plane when viewed from the fixed roller 126, the substrate P is bent by the roller AR1. In the transport direction (-Z direction) of the substrate P, the parallelism with the XZ plane is impaired, and the substrate P is gradually displaced to one side in the width direction (+Y direction or -Y direction) by the action of tension. As a result, the substrate P supported by the rotary drum 25 is also gradually displaced in the Y direction. The position adjusting unit 120a (edge position controller EPC3a) functions to correct such a displacement of the substrate P in the Y direction, but the substrate adjusting unit 214 including the roller AR1 provided on the exposure unit 121c side (specifically, the position adjusting unit EPC3a). It can also be corrected by (described later). Therefore, by controlling one or both of the position adjustment unit 120a and the substrate adjustment unit 214 based on the change information regarding the slight inclination (around the X axis) of the substrate P detected by the detection units 202a and 202b, The position in the Y direction of the substrate P supported by the rotating drum 25 can be maintained with high accuracy. Further, regarding the position adjustment of the substrate P in the width direction until it reaches the rotary drum 25, the position adjustment unit 120a can be used as a rough adjustment and the substrate adjustment unit 214 can be used as a fine adjustment.

The lower-level controller 204 controls the edge position controller EPC3a of the position adjusting unit 120a, the board adjusting unit 214, or the like to control the position of the board P in the width direction. The lower control device 204 may be a part or all of the upper control device 5, or may be a computer controlled by the upper control device 5 and different from the upper control device 5.

The exposure unit (patterning device) 121c includes a substrate support mechanism 12a, a second substrate detection unit 208, an illumination mechanism 13a, an exposure head (pattern formation unit) 210, and a lower control device 212. The exposure unit 121c is stored in the temperature control chamber ECV. This temperature control chamber ECV suppresses a change in shape of the substrate P transferred inside due to the temperature by keeping the inside at a predetermined temperature. The temperature control chamber ECV is arranged on the installation surface E via a passive or active vibration isolation table 131.

The substrate support mechanism (transport unit) 12a transports the substrate P sent from the position adjustment unit 120a to the downstream side (+X direction) while supporting the substrate P, and the substrate P upstream side (-X direction). In order from the direction side), it has a substrate adjusting unit 214, a guide roller Rs3, a tension roller RT1, a rotary drum 25, a tension roller RT2, and drive rollers R5 and R6.

The substrate adjusting unit 214 has a plurality of rollers (AR1, RT3, AR2) and adjusts the position of the substrate P in the width direction to correct the twist and wrinkles occurring in the substrate P while the substrate P is being corrected. Transport in the transport direction (+X direction). The configuration of the board adjusting unit 214 will be described later. The guide roller Rs3 conveys the substrate P whose position in the width direction is adjusted by the substrate adjusting unit 214 to the rotating drum 25. The rotating drum 25 conveys the substrate P to the drive rollers R5 and R6 while holding the portion of the substrate P where a predetermined pattern is exposed on the circumferential surface while rotating. The functions of the drive rollers R5 and R6 are as described in the first embodiment. The tension rollers RT1 and RT2 apply a predetermined tension to the substrate P wound and supported by the rotary drum 25. Note that reference numeral 215 in FIG. 13 indicates a support member that rotatably supports the plurality of rollers of the substrate adjusting unit 214, the guide roller Rs3, the tension roller RT1, the rotary drum 25, the tension roller RT2, and the drive rollers R5 and R6. (Main body frame of the exposure unit 121c).

FIG. 16 is a diagram showing the configuration of the board adjusting unit 214. The substrate adjustment unit 214 includes adjustment rollers AR1 and AR2 and a tension roller RT3. The adjusting roller AR1, the tension roller RT3, and the adjusting roller AR2 are provided in this order from the upstream side (−X direction side) in the transport direction of the substrate P. The adjusting rollers AR1 and AR2 are arranged so as to bend the conveyance path of the substrate P in a state where a predetermined tension is applied. Specifically, by providing the tension roller RT3 below the adjustment rollers AR1 and AR2 (on the side of the −Z direction), the conveyance path is bent while a predetermined tension is applied by the adjustment rollers AR1 and AR2. As a result, the substrate P conveyed in the +X direction from the position adjusting unit 120a is bent downward (-Z direction) by the adjusting roller AR1 in a state where a predetermined tension is applied, is guided to the tension roller RT3, and the tension roller RT3. The substrate P conveyed upward from (+Z direction) is bent in the +X direction by the adjusting roller AR2 and guided to the guide roller Rs3 with a predetermined tension applied. The tension roller RT3 is axially supported at both ends in the Y direction so as to be movable in parallel in the Z direction, and while the substrate P is being conveyed, a predetermined biasing force is generated in the −Z direction to tension the substrate P. give.

The adjustment roller AR1 is rotatable with respect to the rotation axis AX3a by a bearing 214a, and the adjustment roller AR2 is similarly rotatable with respect to the rotation axis AX3b by a bearing 214b. The rotation axes AX3a and AX3b are provided in parallel along the Y direction. The adjusting rollers AR1 and AR2 can be tilted with respect to parallel axes along the Y direction. That is, one end side (−Y direction side) of the rotation axis AX3a of the adjustment roller AR1 can be slightly moved in the Z direction and the X direction with the other end side (+Y direction side) as the fulcrum. Similarly, the adjustment roller AR2 is also movable in the X and Z directions on one end side (−Y direction side) of the rotation axis AX3b with the other end side (+Y direction side) as a fulcrum. The minute movement of the rotary shafts AX3a and AX3b on one end side (−Y direction side) is driven by an actuator such as a piezo element (not shown). By slightly inclining the adjusting rollers AR1 and AR2, the position of the substrate P in the width direction can be finely adjusted as the substrate P is conveyed in the lengthwise direction, and a slight twist generated on the substrate P or the substrate P can be adjusted. It is possible to correct a slight in-plane deformation (or wrinkle) due to the internal stress of P. Although the two adjusting rollers AR1 and AR2 are slightly tilted in the XY plane or the YZ plane in FIG. 16, the tension roller RT1 may be tiltable without tilting the adjusting rollers AR1 and AR2. .. Further, the adjusting roller AR2 and the tension roller RT1 may be tiltable without tilting the adjusting roller AR1.

The second substrate detection unit (substrate error measurement unit, change measurement unit) 208 detects the position in the width direction of the substrate P conveyed in the +Z direction from the tension roller RT1 toward the rotary drum 25. Specifically, as shown in FIG. 15, the second substrate detection units 208 are provided on both ends of the substrate P in the width direction, and detect the edges of both ends of the substrate P in the width direction. 17A is a diagram showing the configuration of the second substrate detection unit 208, FIG. 17B is a diagram showing the beam light Bm irradiated on the substrate P by the second substrate detection unit 208, and FIG. 17C is a second substrate detection unit 208. It is a figure which shows the beam light Bm received by. The second substrate detection unit 208 includes an irradiation system 216 that irradiates the beam light Bm and a light receiving system 218 that receives the beam light Bm. The irradiation system 216 includes a light projecting unit 220, a cylindrical lens 222, and a reflecting mirror 224, and the light receiving system 218 includes a reflecting mirror 226, an imaging optical system 228, and an image sensor 230. The light projecting unit 220 includes a light source that emits the beam light Bm, and emits the emitted beam light Bm toward the substrate P. The beam light Bm emitted by the light projecting unit 220 is emitted onto the substrate P via the cylindrical lens 222 and the reflection mirror 224. As shown in FIG. 17B, the cylindrical lens 222 converges the incident beam light Bm in the Z direction so that the beam light Bm has a slit shape parallel to the Y direction of the substrate P on the substrate P. The length of the beam light Bm irradiated toward the substrate P is Lbm. At least a part of the beam light Bm radiated toward the substrate P side is reflected by the substrate P, and the remaining beam light Bm that does not hit the substrate P is not reflected by the substrate P and goes straight on.

The slit-shaped beam light Bm reflected on the substrate P enters the imaging optical system 228 via the reflection mirror 226. The imaging optical system 228 forms an image of the beam light Bm reflected by the reflection mirror 226 on the image sensor 230, and the image sensor 230 images the incident beam light Bm. The length of the beam light Bm imaged by the image pickup device 230 is the length Lbm1 of the beam light Bm reflected on the substrate P as shown in FIG. 17C. Therefore, by measuring the length of this Lbm1 The position of the edge of P can be detected. With such a configuration, the second substrate detection unit 208 can highly accurately detect the position in the width direction of the substrate P conveyed in the +Z direction from the tension roller RT1 toward the rotary drum 25. Further, the second substrate detection unit 208 detects (measures) change information regarding a position change of the substrate P in the width direction, deformation of the substrate P (expansion and contraction in the width direction), and the like by detecting the position of the substrate P. You can The position in the width direction of the substrate P and the change information of the substrate P detected by the second substrate detection unit 208 are sent to the lower control device 204. Reference numeral 230a indicates an image pickup area of the image pickup element 230. The configuration of the first substrate detection unit 202 may be similar to that of the second substrate detection unit 208.

A plurality of alignment microscopes (substrate error measuring unit, change measuring unit) AM1 and AM2 of the exposure unit 121c are provided along the width direction of the substrate P, and the alignment formed on the substrate P as shown in FIG. The mark Ks is detected. In the example shown in FIG. 15, the alignment marks Ks are formed on both ends of the substrate P at regular intervals along the lengthwise direction of the substrate P, and the exposure regions A7 arranged on the substrate P in the lengthwise direction. And the exposure area A7 are provided along the width direction of the substrate P at regular intervals. Therefore, five alignment microscopes AM1 (see FIG. 19) and AM2 are provided at regular intervals along the width direction of the substrate P so that the alignment mark Ks formed on the substrate P can be detected. By the alignment microscopes AM1 and AM2 detecting the alignment mark Ks, the position in the width direction of the substrate P being transported while being supported by the rotating drum 25 can be detected with high accuracy. In addition, the alignment microscopes AM1 and AM2 can detect (measure) change information regarding a position change in the width direction of the substrate P, a posture change, a deformation of the substrate P, and the like by detecting the position of the alignment mark Ks.

The position information of the alignment marks Ks detected by the alignment microscopes AM1 and AM2 in each of the lengthwise direction (conveyance direction) and the width direction is sent to the lower controller 212. The lower-level controller 212 generates correction information for correcting the pattern formation position based on the acquired position information of the alignment mark Ks and sends the correction information to the exposure head (pattern formation unit) 210, and in the width direction of the substrate P. The position and the change information of the substrate P are calculated and sent to the lower controller 204. Reference numeral 232 in FIG. 15 indicates a detection region (detection field of view) of each alignment microscope AM1, and the positions of the five detection regions 232 in the transport direction of the substrate P (Z direction in FIG. 15) are such that the substrate P rotates. The position is set so as to be in stable contact with the outer peripheral surface of the drum 25. The size of the detection region 232 on the substrate P is set according to the size of the alignment mark Ks and the alignment accuracy (position measurement accuracy), but is about 100 to 500 μm square.

By the way, as shown in FIG. 12, between the position adjustment unit 120a and the exposure unit 121c, a relative position for detecting (measuring) change information regarding the relative position and position change between the position adjustment unit 120a and the exposure unit 121c. A position detection unit (position error measurement unit, change measurement unit) 234 is provided. FIG. 18 is a diagram showing the configuration of the relative position detector 234. The relative position detection unit 234 is provided between the position adjustment unit 120a and the exposure unit 121c and on the end side in the −Y direction and the end side in the +Y direction, respectively. The relative position detection unit 234 detects the relative position change between the position adjustment unit 120a and the exposure unit 121c on the YZ plane, and the relative position detection unit 120a and the exposure unit 121c on the XZ plane. Second detection unit 238 that detects a change in position. Accordingly, the relative position detection unit 234 can detect the relative position and change information of the position adjustment unit 120a and the exposure unit 121c in three dimensions (XYZ space).

The first detection unit 236 includes a light projecting unit 240a that emits laser light in the +X direction and a light receiving unit 242a that receives the laser light emitted by the light projecting unit 240a. The second detection unit 238 includes a light projecting unit 240b that irradiates the laser light in the +Y direction and a light receiving unit 242b that receives the laser light radiated by the light projecting unit 240b. The light projecting section 240a of the first detecting section 236 and the light projecting section 240b of the second detecting section 238 are provided on the surface side (+X direction side) of the position adjusting unit 120a facing the exposure unit 121c. Further, the light receiving section 242b of the first detecting section 236 and the light receiving section 242b of the second detecting section 238 are provided on the surface side (−X direction side) facing the position adjustment unit 120a of the exposure unit 121c.

The light receiving portions 242a and 242b are each configured by a 4-division sensor. That is, the light receiving sections 242a and 242b have four photodiodes (photoelectric conversion elements) 244, and the difference in the amount of light received by each of the four photodiodes 244 (difference in signal level) is used to generate the laser light. The position change in the plane perpendicular to the beam center is detected. Since the laser light incident on the light receiving unit 242a is light that travels in the +X direction, the light receiving unit 242a detects the position of the center of the laser light on the YZ plane perpendicular to the X direction or the position change. Further, since the laser light incident on the light receiving unit 242b is light that travels in the +Y direction, the light receiving unit 242b detects the position of the center of the laser light or the position change in the XZ plane perpendicular to the Y direction. This makes it possible to three-dimensionally detect (measure) change information regarding the relative position and position change between the position adjustment unit 120a and the exposure unit 121c. In particular, the relative rotation error about the X axis between the position adjustment unit 120a and the exposure unit 121c (relative tilt in the YZ plane) is calculated by the difference or average of the detection information of the pair of first detection units 236 separated in the Y direction. ) And the relative position error in the Y direction can be measured in real time. Further, the relative rotation error (relative inclination in the XY plane) about the Z axis between the position adjustment unit 120a and the exposure unit 121c is caused by the difference between the detection information of the pair of second detection units 238 separated in the Y direction. It can be measured in real time.

Returning to the description of FIG. 12, the illumination mechanism 13a has a laser light source and emits laser light (exposure beam) LB used for exposure. The laser light LB may be ultraviolet light having a peak wavelength in the wavelength band of 370 nm or less. The laser light LB may be pulsed light emitted at the oscillation frequency Fs. The laser light LB emitted from the illumination mechanism 13a enters the exposure head 210.

The exposure head 210 includes a plurality of drawing units DU (DU1 to DU5) to which the laser light LB from the illumination mechanism 13a respectively enters. That is, the laser light LB from the illumination mechanism 13a is guided to the light introduction optical system 250 having a reflection mirror, a beam splitter, and the like, and is incident on the plurality of drawing units DU (DU1 to DU5). The exposure head 210 draws a pattern by a plurality of drawing units DU (DU1 to DU5) on a part of the substrate P that is conveyed by the substrate support mechanism 12a and is supported by the circumferential surface of the rotating drum 25. The exposure head 210 is a so-called multi-beam type exposure head 210 by including a plurality of drawing units DU (DU1 to DU5) having the same configuration. The drawing units DU1, DU3, DU5 are arranged on the upstream side (−X direction side) in the transport direction of the substrate P with respect to the rotation axis AX2 of the rotary drum 25, and the drawing units DU2, DU4 are the rotation axes of the rotary drum 25. It is arranged on the downstream side (+X direction side) in the transport direction of the substrate P with respect to AX2.

Each drawing unit DU converges the incident laser light LB on the substrate P to form spot light, and scans the spot light at high speed along a scanning line by a rotating polygon mirror or the like. As shown in FIG. 19, the scanning lines L of the drawing units DU are set so as to be connected to each other in the Y direction (width direction of the substrate P) without being separated from each other. In FIG. 19, the scanning line L of the drawing unit DU1 is represented by L1, and the scanning line L of the drawing unit DU2 is represented by L2. Similarly, the scanning lines L of the drawing units DU3, DU4, DU5 are represented by L3, L4, L5. In this way, each drawing unit DU shares the scanning area so that all of the drawing units DU1 to DU5 cover the entire width of the exposure area A7. For example, assuming that the drawing width (length of the scanning line L) in the Y direction by one drawing unit DU is about 20 to 50 mm, three drawing units DU1, DU3, and DU5 having an odd number and an even number drawing are performed. By disposing a total of five drawing units DU including the units DU2 and DU4 in the Y direction, the drawable width in the Y direction is expanded to about 100 to 250 mm. The alignment microscopes AM1 and AM2 are provided on the upstream side (−X direction side) in the transport direction of the substrate P with respect to the scanning lines L1, L3, and L5, and are closely supported by the circumferential surface of the rotary drum 25. While detecting the alignment mark Ks formed on the substrate being conveyed.

This drawing unit DU is a known technique as disclosed in International Publication No. 2013/146184 pamphlet (see FIG. 36), but the drawing unit DU will be briefly described with reference to FIG. Since each drawing unit DU (DU1 to DU5) has the same configuration, only the drawing unit DU2 will be described, and description of the other drawing units DU will be omitted.

As shown in FIG. 20, the drawing unit DU2 includes, for example, a condenser lens 252, a drawing optical element (light modulator) 254, an absorber 256, a collimator lens 258, a reflection mirror 260, a cylindrical lens 262, a focus lens 264, and It has a reflection mirror 266, a polygon mirror (optical scanning member) 268, a reflection mirror 270, an f-θ lens 272, and a cylindrical lens 274.

The laser light LB entering the drawing unit DU2 travels from the upper side to the lower side (−Z direction) in the vertical direction, and enters the drawing optical element 254 via the condenser lens 252. The condenser lens 252 condenses (converges) the laser light LB that is incident on the drawing optical element 254 so as to form a beam waist in the drawing optical element 254. The drawing optical element 254 is transparent to the laser light LB, and for example, an acousto-optic modulator (AOM) is used.

When the drive signal (high-frequency signal) from the lower control device 212 is in the off state, the drawing optical element 254 transmits the incident laser beam LB to the absorber 256 side, and the drive signal from the lower control device 212 ( When the high frequency signal) is in the on state, the incident laser beam LB is diffracted and directed toward the reflection mirror 260. The absorber 256 is an optical trap that absorbs the laser light LB in order to suppress the leakage of the laser light LB to the outside. In this way, by turning on/off the drawing drive signal (ultrasonic wave frequency) to be applied to the drawing optical element 254 at high speed according to the pattern data (black and white), the laser light LB is reflected on the reflection mirror 260. It is switched whether to go to the absorber 256 or to the absorber 256. This means that when viewed on the substrate P, the intensity of the laser light LB (spot light SP) reaching the photosensitive surface is rapidly modulated to either a high level or a low level (for example, zero level) according to the pattern data. Means to be done.

The collimator lens 258 collimates the laser light LB traveling from the drawing optical element 254 to the reflection mirror 260. The reflection mirror 260 reflects the incident laser light LB in the −X direction and irradiates the reflection mirror 266 via the cylindrical lens 262 and the focus lens 264. The reflecting mirror 266 irradiates the polygon mirror 268 with the incident laser beam LB. The polygon mirror (rotary polygon mirror) 268 continuously changes the reflection angle of the laser light LB by rotating, and the position of the laser light LB irradiated on the substrate P is in the scanning direction (width direction of the substrate P). To scan. The polygon mirror 268 is rotated at a constant speed (for example, 10,000 rotations/minute) by a rotary drive source (not shown) (for example, a motor or a speed reduction mechanism).

The cylindrical lens 262 provided between the reflection mirror 260 and the reflection mirror 266 cooperates with the focus lens 264 to apply the laser beam LB to the polygon mirror 268 in the non-scanning direction (Z direction) orthogonal to the scanning direction. Focus (converge) on the reflecting surface. Even if there is a case where the reflecting surface is inclined with respect to the Z direction (inclination from the equilibrium state between the normal line of the XY plane and the reflecting surface), the influence of the cylindrical lens 262 can be suppressed. , The irradiation position of the laser beam LB irradiated on the substrate P is prevented from shifting in the X direction.

The laser light LB reflected by the polygon mirror 268 is reflected in the −Z direction by the reflection mirror 270 and enters the f-θ lens 272 having the optical axis AXu parallel to the Z axis. The f-θ lens 272 is a telecentric system in which the principal ray of the laser beam LB projected on the substrate P is always the normal line to the surface of the substrate P during scanning, whereby the laser beam LB is directed in the Y direction. Therefore, it becomes possible to perform scanning accurately at a constant speed. The laser light LB emitted from the f-θ lens 272 becomes a minute circular spot light SP having a diameter of about several μm on the substrate P via a cylindrical lens 274 having a generatrix parallel to the Y direction. Is irradiated. The spot light (scanning spot light) SP is one-dimensionally scanned in one direction by the polygon mirror 268 along the scanning line L2 extending in the Y direction.

The lower-level controller 212 controls the illumination mechanism 13a, the exposure head 210, and the like to apply the pattern to the substrate P. That is, the lower-level control device 212 controls the illumination mechanism 13a to irradiate the laser beam LB, and based on the position of the alignment mark Ks detected by the alignment microscope AM1, the drawing unit DU of the exposure head 210 has a drawing unit. By controlling the optical element 254, a pattern is drawn and exposed at a predetermined position on the substrate P, that is, in the exposure area A7. The lower control device 212 may be a part or all of the upper control device 5, or may be a computer controlled by the higher control device 5 and different from the upper control device 5.

Here, the lengthwise direction of the substrate P is orthogonal to the rotation axis AX2 of the rotary drum 25, and the substrate P is conveyed to the rotary drum 25 in a state where the substrate P is not twisted or wrinkled. The exposure accuracy of the pattern is improved. Therefore, the rollers (Rs1 to Rs3, NR, 126, AR1, AR2, RT1 to RT3, R5, and R6) for carrying the substrate of the exposure apparatus U3 and the rotary shaft of the rotary drum 25 are arranged parallel to each other along the Y direction. However, it is desirable to convey the substrate P so that the longitudinal direction of the substrate P is orthogonal to the rotation axis of each of these rollers and the rotary drum 25.

However, in reality, the rotation axes of the rollers (Rs1 to Rs3, NR, 126, AR1, AR2, RT1 to RT3, R5, and R6) are slightly deviated from each other, and the rotation axes of the rollers are not parallel to each other. There are cases. In addition, the positions of the position adjustment unit 120a and the exposure unit 121c change relative to each other due to vibrations and the like, so that the rotation axis of the roller of the position adjustment unit 120a and the rotation axis of the roller of the exposure unit 121c may not be parallel to each other. .. As a result, slight stress disturbances, twists, wrinkles, etc. occur inside the substrate P, and the substrate P is wound in a state in which the longitudinal direction of the substrate P is slightly inclined with respect to the rotation axis AX2 of the rotating drum 25, or the substrate P is It is supported by the rotating drum 25 in a state of being largely deformed (in-plane strain deformation) as compared with the line width dimension of the pattern to be drawn.

Therefore, in the fourth embodiment, the lower-level controller 204, based on the detection results of the first substrate detection unit 202, the second substrate detection unit 208, the alignment microscopes AM1 and AM2, and the relative position detection unit 234, The edge position controller EPC3a and the board adjusting unit 214 are controlled.

Specifically, the lower-level controller 204 controls the actuator (driving mechanism) 206 of the edge position controller EPC3a based on the position in the width direction of the substrate P detected by the first substrate detection unit 202 and the change information of the substrate P. , The position of the substrate P in the width direction is adjusted. For example, the lower-level controller 204 calculates the difference between the center position in the Y direction obtained from the positions of the edges of both ends of the substrate P detected by the first substrate detection unit 202 and the target position, and the calculated difference is zero. The substrate 206 is moved in the Y direction by feedback-controlling the actuator 206 so that it becomes (0). Thereby, the position in the width direction of the substrate P conveyed from the position adjustment unit 120a can be set to the target position, and it is possible to prevent the substrate P from being slightly twisted or wrinkled. As a result, the position of the substrate P wound around the rotary drum 25 in the Y direction can be made uniform with high accuracy, and the plurality of alignment marks Ks arranged in the longitudinal direction of the substrate P are detected in the detection areas of the respective alignment microscopes AM1. It is possible to reliably continue capturing within the (detection visual field) 232.

Further, the subordinate control device 204 controls the actuator 206 of the edge position controller EPC3a using the change information regarding the relative position and position change between the position adjustment unit 120a and the exposure unit 121c detected by the relative position detection unit 234. As a result, it is possible to quickly correct a position change in the width direction of the substrate P (shift in the width direction of the substrate P due to a change in the tilt state). Further, the subordinate control device 204 adjusts the inclination angles of the adjusting rollers AR1 and AR2 of the substrate adjusting unit 214 based on the information on the relative position and the position change detected by the relative position detecting unit 234, and thus the substrate P Adjust the position in the width direction. The adjustment of the inclination angles of the adjusting rollers AR1 and AR2 can be performed by driving an actuator (driving unit) such as the piezo element. As a result, even if the relative position between the position adjustment unit 120a and the exposure unit 121c changes, the position in the width direction of the substrate P conveyed to the rotary drum 25 can be adjusted with high accuracy and high responsiveness. Can be continuously set to, and it is possible to suppress the generation of minute twists, wrinkles, and the like on the substrate P.

Also, the position of the alignment mark Ks detected by the alignment microscopes AM1 and AM2 allows the position in the width direction of the substrate P and the change information regarding the posture change and the deformation of the substrate P such as minute twists and wrinkles of the substrate P to be known. Therefore, the lower-level control device 204 controls the edge position controller EPC3a (actuator 206) and the substrate adjusting unit 214 (actuator such as the piezo element) based on the detected position of the alignment mark Ks, so that the substrate Adjust the position of P in the width direction. As a result, the position in the width direction of the substrate P conveyed to the rotary drum 25 can be set to the target position with high accuracy and high responsiveness, and it is possible to prevent the substrate P from being slightly twisted or wrinkled. it can.

Further, the lower-level controller 204 determines whether the position in the width direction of the substrate P is the target position based on the position in the width direction of the substrate P immediately before being conveyed to the rotary drum 25 detected by the second substrate detection unit 208. Whether or not the substrate P is twisted (tilted) is checked. In the detection of the twist (tilt) of the substrate P, the incident angle of the beam light Bm to the substrate P by the detection system described in FIG. 17A is increased, and the substrate P is shifted in the normal direction of the surface (X direction in FIG. 17A). In this case, the fact that the reflected image Bm of the beam Bm shifts in the Z direction within the image pickup area 230a of the image pickup element 230 may be used. The second substrate detection unit 208 is also provided corresponding to each of the edge portions Ea and Eb on both sides of the substrate P, and thus the shift amount of the image of the reflected beam Bm in the image pickup area 230a in the Z direction is compared. By obtaining the difference value, it is possible to obtain a minute amount of inclination of the substrate P in the width direction.

Then, when the position in the width direction of the substrate P is not at the target position, the lower-level controller 204 determines the edge position based on the position in the width direction of the substrate P detected by the second substrate detection unit 208 and the change information of the substrate P. The position of the substrate P in the width direction is adjusted by controlling the controller EPC3a (actuator 206) and the substrate adjusting unit 214 (actuator such as the piezo element). As a result, the position in the width direction of the substrate P transported to the rotary drum 25 can be set to the target position.

However, since the second substrate detection unit 208 is arranged at a position immediately before the substrate P is wound around the rotary drum 25, a large change in the width direction of the substrate P suddenly occurs at this position, for example, in the alignment microscope AM1. When a large displacement error occurs such that the alignment mark Ks is displaced from the detection area 232, it becomes difficult to accurately position the pattern to be formed in the exposure area A7. In such a case, until the alignment mark Ks is captured in the detection region 232, the pattern formation for the exposure region A7 is stopped and skipped, or the substrate P is temporarily reversed by a certain length, and the sequence is repeated. An error sequence (retry operation or the like) such as re-detection of the alignment mark Ks by the alignment microscope AM1 while being conveyed in the direction is executed.

As described above, also in the fourth embodiment, the exposure unit 121c and the position adjustment unit 120a can be provided in an independent state (a state in which vibration transmission is insulated). Therefore, the exposure unit 121c can reduce the vibration from the position adjustment unit 120a by the vibration isolation table 131, and can obtain the same effect as that of the first embodiment. Furthermore, in the fourth embodiment, the lower-level controller 204 uses the edge position controller EPC3a and the edge position controller EPC3a based on the detection results of the first substrate detection unit 202, the second substrate detection unit 208, and the alignment microscopes AM1 and AM2. The board adjusting unit 214 is controlled. Thereby, the exposure accuracy of the pattern on the substrate P by the exposure head 210 can be improved. The lower-level control device 204 controls the edge position controller EPC3a and the board adjustment unit 214 based on the detection result of the relative position detection unit 234. Thereby, even when the relative positions of the position adjustment unit 120a and the exposure unit 121c change, the exposure accuracy of the pattern onto the substrate P by the exposure head 210 can be improved.

Although the position adjustment unit 120a and the exposure unit 121c are provided in the exposure apparatus U3 in the fourth embodiment, the exposure unit 121c is provided immediately after the position adjustment unit 120a when viewed from the substrate P transport direction. May be installed. Therefore, it is not necessary to provide the position adjustment unit 120a in the exposure apparatus U3. In this case, the position adjustment unit 120a may be provided on the side of the processing apparatus U (U2) arranged immediately in front of the exposure apparatus U3 as shown in FIG. 1 when viewed from the transport direction of the substrate P. Alternatively, when the substrate supply device 2 is provided immediately before the exposure device U3, the function of the position adjustment unit 120a may be provided in the substrate supply device 2.

The step immediately before the photo-patterning step by the exposure apparatus U3, the exposure units 121, 121c, etc. (second processing unit) is a step of forming (coating) a liquid photosensitive layer on the surface of the substrate P, and the photosensitive layer The process of drying (baking) is a set. However, when a dry film is used as the photosensitive layer, a step of transferring the photosensitive layer on the dry film onto the surface of the substrate P to be exposed by pressure bonding using a pressure transfer device such as a laminator (of the photosensitive layer In some cases, the drying step becomes unnecessary, which is the forming step). Therefore, as a pretreatment device (first treatment unit) that controls the process immediately before the photo-patterning process, a photosensitive layer forming device for forming a photosensitive layer on the surface of the substrate P or a drying (heating) device for drying the substrate P is used. The function of the position adjustment unit 120a can be provided on the downstream side (substrate unloading portion) of the substrate transport path in the pretreatment device or between the pretreatment device and the optical patterning device.

When a printing machine is used as the patterning step, the step immediately before that is to modify the entire surface of the substrate P or only the portion to be patterned to enhance the adhesion of the ink to the surface of the substrate P. A quality treatment process (a liquid-repellent/lyophilic selective application process or the like) is performed. Such a surface modification treatment step is also performed by a single pretreatment device or a plurality of pretreatment devices. Therefore, the downstream side (substrate unloading part) of the substrate conveyance path in the pretreatment device installed immediately before the printing machine or its The function of the position adjustment unit 120a can be provided between the pretreatment device and the printing machine.

In the fourth embodiment, the position adjustment unit 120a is provided with the first substrate detection unit 202 and the exposure unit 121c is provided with the second substrate detection unit 208. However, the first substrate detection unit 202 and the second substrate detection unit are provided. Only one of 208 may be provided. Further, both the first substrate detection unit 202 and the second substrate detection unit 208 need not be provided. This is because the position and the like in the width direction of the substrate P can be detected by the alignment microscopes AM1 and AM2 without the first substrate detection unit 202 and the second substrate detection unit 208.

Although the processing apparatus U3 is described as the exposure apparatus in the fourth embodiment, any pattern forming apparatus that applies a pattern to the substrate P may be used. Examples of the pattern forming device include, in addition to the exposure device, an inkjet printer that applies a pattern to the substrate P by applying ink. In this case, the exposure head 210 is replaced with a nozzle head section (pattern forming section) having a large number of nozzles for drawing a pattern on the substrate P by selectively applying ink material as droplets, and the exposure unit 121 is used. , 121a to 121c are replaced with a patterning device having a pattern forming unit. Further, similarly in the first to third embodiments, the processing apparatus U3 may be a pattern forming apparatus that applies a pattern to the substrate P.

As described in each of the above embodiments, in a patterning device such as an exposure device or an inkjet printer that forms a fine pattern for an electronic device on the substrate P, the pattern can be precisely positioned and formed on the substrate P. is important. Vibration, which is one of the disturbance factors that lowers the positioning accuracy, is generated from a pneumatic compressor, a liquid compressor, a pump, etc. built into a processing device installed nearby, and through the factory floor, It is transmitted to a supporting member such as the exposure head (pattern forming unit) 210 and the rotating drum 25 that supports the substrate P. In order to insulate the path of the vibration transmission, it is effective to provide the patterning device with a vibration isolation device (vibration isolation table 131 or the like). Further, it is preferable that the floor (foundation) of the factory is constructed as strong as possible and the resonance frequency is lowered. However, in the above-mentioned respective embodiments, even if the floor condition is not so severe, the substrate P can be precisely High-precision patterning is possible by transporting to.

For example, when the manufacturing line is constructed, the rollers in the patterning device and the processing device on the upstream side of the patterning device (position adjustment so that the substrate P passing through the patterning device (exposure unit 121, 121a to 121c) does not shift in the width direction). When the floor is partially dented and tilted due to the influence of the device load or the like with the passage of time after performing parallel processing with the rollers in the units 120 and 120a) and starting the processing of the substrate P There is. Even in such a case, the first substrate detection unit 202 (202a, 202b) and the relative position detection unit 234 cause positional displacement or deformation in the width direction when the substrate P is carried into the patterning apparatus (a slight inclination due to twisting). Can be measured and corrected by the substrate adjusting unit 214 (rollers AR1, RT3, AR2).

Further, in the case of the fourth embodiment, the substrate adjusting unit 214 configured by a plurality of rollers (at least one of which can be inclined) as shown in FIG. 16 has an exposure unit 121c as shown in FIG. Although it is provided on the side main body frame 215, it may be provided on the main body frame 207b in the position adjusting unit 120a. In that case, in the position adjustment unit 120a (first processing device) and the exposure unit 121c (second processing device) which are separated from each other in order to insulate or suppress vibration transmission, the second unit provided on the exposure unit 121c side. The substrate detection unit 208 is provided near the guide roller Rs3 or the tension roller RT1 similarly to the second substrate detection unit 124 shown in FIG. Furthermore, the substrate adjusting unit 214 may be provided as a single unit on the installation surface E independently of both the position adjustment unit 120a (first processing apparatus) and the exposure unit 121c (second processing apparatus).

The position adjustment unit 120a or the first substrate is provided between the exposure units 121, 121c and the like (second processing unit) that perform the optical patterning step and the preprocessing apparatus (first processing unit) that controls the step immediately before the optical patterning step. When the detection unit 202 is provided, the first substrate detection unit 202 can detect the positional change of the substrate P transported from the first processing unit to the second processing unit. Further, when the position adjustment unit 120a or the first substrate detection unit 202 is provided on the downstream side in the transport direction of the substrate P in the first processing unit, the first substrate detection unit 202 causes the first processing unit to the second processing unit. The position change of the substrate P conveyed to the substrate may be detected, or the position of the substrate P detected by the first substrate detection unit 202 and the substrate P detected by the second substrate detection unit 208 or the alignment microscopes AM1 and AM2. The position change of the substrate P transported from the first processing unit to the second processing unit may be detected from the position of. In addition, the relative position detection unit 234 detects the relative position and the positional change between the position adjustment unit 120a and the exposure unit 121c, so that the positional change of the substrate P transferred from the first processing unit to the second processing unit is detected. It may be detected.

DESCRIPTION OF SYMBOLS 1... Device manufacturing system 2... Substrate supply device 4... Substrate collection device 5... Upper control device 11... Mask holding mechanism 12, 12a... Substrate support mechanism 13, 13a... Illumination mechanism 16, 204, 212... Lower control device 21... Mask Stage 22... Mask side drive unit 23... Transmission member 25... Rotating drum 26... Substrate side drive unit 61... First optical system 62... Second optical system 63... Projection field stop 64... Focus correction optical member 65... Image shifting optics Member 66... Magnification correction optical member 67... Rotation correction mechanism 70... First deflection member 71... First lens group 72... First concave mirror 80... Second deflection member 81... Second lens group 82... Second concave mirror 111... 1 bearing part 112... 1st raising/lowering mechanism 114... Approach angle detection part 120, 120a, 160... Position adjustment unit 121, 121a-121c... Exposure unit 123, 202... 1st board|substrate detection part 124, 208... 2nd board|substrate detection part 126... Fixed roller 130... Pressing mechanism 131... Vibration isolation table 132... Device frame 151... Pressing member 152... Elevating mechanism 206... Actuator 210... Exposure head 214... Substrate adjusting section 216... Irradiation system 218... Light receiving system 234... Relative position detection Section 236... First detection section 238... Second detection section A7... Exposure area CL... Center plane DU... Drawing unit E... Installation surface EL1... Illumination luminous flux EL2... Projection luminous flux EPC1, EPC2, EPC3, EPC3a... Edge position controller FR1... Supply roll FR2... Recovery roll IL... Illumination optical systems IL1 to IL6, ILa1 to ILa6... Illumination modules IR1 to IR6... Illumination areas L1 to L5... Scan lines M, MA, MB... Mask P... Substrate P1... Mask surface P2 ... Support surface P7... Intermediate image plane PA1-PA6... Projection area PBS... Polarization beam splitter PL... Projection optical system PL1-PL6... Projection module Rfa... Curvature radius Rm... Curvature radius SP... Spot light U1-Un... Processing device U3... Exposure equipment (substrate processing equipment)
θ1… Entry angle θ2… Discharge angle

Claims (6)

A device manufacturing system for conveying a long substrate having flexibility in a long direction to form a device on the substrate,
An exposure unit that is provided on a vibration isolation table installed on the installation surface and that performs an exposure process on the supplied substrate,
In order to adjust the position of the substrate in the width direction and supply it to the exposure unit, a base installed on the installation surface in an independent state that is not in contact with the exposure unit, and provided on the base. A width moving mechanism for moving the substrate in the width direction with respect to the base, and a fixed position with respect to the base, and the substrate after the position adjustment by the width moving mechanism to the exposure unit. A position adjusting unit having a fixed roller for guiding toward
A substrate supply device that supplies the substrate toward the position adjustment unit to supply the substrate to the exposure unit ,
A substrate collecting device that collects the substrate that has been exposed by the exposure unit ;
Equipped with
The substrate supply device,
A first elevating mechanism that elevates and lowers a first bearing portion that rotatably supports a supply roll having the substrate wound in a roll shape;
A first roller around which the substrate sent from the supply roll is wound ;
An approach angle detector that detects an approach angle of the substrate with respect to the first roller ;
A control unit that controls the first elevating mechanism based on a detection result of the approach angle detection unit and corrects the approach angle to a target approach angle;
A device manufacturing system including. The device manufacturing system according to claim 1, wherein
The substrate recovery device is
A second elevating mechanism that elevates and lowers a second bearing portion that rotatably supports the recovery roll around which the substrate processed after being processed by the exposure unit is wound;
A second roller around which the substrate sent to the recovery roll is wound ;
A discharge angle detection unit that detects a discharge angle of the substrate with respect to the second roller ;
A control unit that controls the second elevating mechanism based on the detection result of the discharge angle detection unit and corrects the discharge angle to a target discharge angle;
A device manufacturing system having : The device manufacturing system according to claim 1 or 2 , wherein
Wherein in order to detect the position in the width direction of the substrate to be supplied to the fixing roller, the first substrate detecting portion provided fixed on the base, further comprising,
The control unit of the substrate supply device ,
The first controls the width moving mechanism based on a detection result of the substrate detection unit, corrects the position in the width direction of the substrate to be supplied to the fixing roller in the first target position, the device production system. The device manufacturing system according to any one of claims 1 to 3 ,
The position adjustment unit,
Further comprising a roller position adjusting mechanism for adjusting the position of the fixed roller with respect to the exposure unit,
A second substrate detection unit fixedly provided on the vibration isolation table for detecting the position of the substrate supplied to the exposure unit;
The control unit of the substrate supply device,
A device manufacturing system that controls the roller position adjusting mechanism based on a detection result of the second substrate detection unit to correct the position of the substrate supplied to the exposure unit to a second target position. The device manufacturing system according to claim 4 , wherein
The substrate supplied from the position adjusting unit to the exposure unit further has a pressing mechanism for pressing so as to apply tension,
The device manufacturing system, wherein the control unit of the substrate supply device controls the pressing mechanism based on a detection result of the second substrate detection unit to adjust a pressing amount to the substrate. A device manufacturing method for forming a device on a long sheet substrate having flexibility ,
The first bearing portion of the substrate feeding device according to any one of 請 Motomeko 1-5, wherein the supply roll sheet substrate elongated photosensitive functional layer is formed on the surface is wound Attaching the sheet substrate, conveying the sheet substrate to the exposure unit through the position adjustment unit, and exposing the photosensitive functional layer of the sheet substrate a pattern corresponding to the device,
Forming a pattern of the device through the photosensitive functional layer by wet-processing the exposed sheet substrate;
And a device manufacturing method.

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