TWI626090B - 基板保持旋轉裝置及具備其之基板處理裝置、暨基板處理方法 - Google Patents
基板保持旋轉裝置及具備其之基板處理裝置、暨基板處理方法 Download PDFInfo
- Publication number
- TWI626090B TWI626090B TW105131017A TW105131017A TWI626090B TW I626090 B TWI626090 B TW I626090B TW 105131017 A TW105131017 A TW 105131017A TW 105131017 A TW105131017 A TW 105131017A TW I626090 B TWI626090 B TW I626090B
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015192155 | 2015-09-29 | ||
JP2015-192155 | 2015-09-29 | ||
JP2016030154A JP6674679B2 (ja) | 2015-09-29 | 2016-02-19 | 基板保持回転装置およびそれを備えた基板処理装置、ならびに基板処理方法 |
JP2016-030154 | 2016-02-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201720542A TW201720542A (zh) | 2017-06-16 |
TWI626090B true TWI626090B (zh) | 2018-06-11 |
Family
ID=58495269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105131017A TWI626090B (zh) | 2015-09-29 | 2016-09-26 | 基板保持旋轉裝置及具備其之基板處理裝置、暨基板處理方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6674679B2 (ja) |
KR (1) | KR101911145B1 (ja) |
CN (1) | CN107017180B (ja) |
TW (1) | TWI626090B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6899703B2 (ja) * | 2017-05-29 | 2021-07-07 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP7055720B2 (ja) * | 2018-08-10 | 2022-04-18 | 株式会社荏原製作所 | 基板回転装置、基板洗浄装置および基板処理装置ならびに基板回転装置の制御方法 |
JP7282494B2 (ja) * | 2018-09-18 | 2023-05-29 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
CN111063652B (zh) * | 2018-10-16 | 2022-08-30 | 沈阳芯源微电子设备股份有限公司 | 一种基板夹持承载台 |
US11312611B2 (en) | 2019-05-13 | 2022-04-26 | Lg Electronics Inc. | Hydrogen water generator |
JP7386700B2 (ja) * | 2019-12-27 | 2023-11-27 | 株式会社Screenホールディングス | 基板処理方法 |
CN111776280B (zh) * | 2020-06-04 | 2021-12-03 | 三峡大学 | 一种适用于十字捆绑的旋转台及使用方法 |
JP7558043B2 (ja) * | 2020-11-30 | 2024-09-30 | 株式会社Screenホールディングス | 基板処理装置及び基板処理方法 |
CN112864013B (zh) * | 2021-01-18 | 2023-10-03 | 长鑫存储技术有限公司 | 半导体器件处理方法 |
CN114653660B (zh) * | 2022-05-20 | 2022-09-16 | 智程半导体设备科技(昆山)有限公司 | 一种磁性夹块及半导体基材清洗装置 |
KR102676174B1 (ko) * | 2023-04-04 | 2024-06-17 | 김태경 | 반도체 웨이퍼 척 |
CN117123567B (zh) * | 2023-07-25 | 2024-09-20 | 温州科菱环保科技有限公司 | 智能真空等离子清洗机 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090090467A1 (en) * | 2007-10-05 | 2009-04-09 | Semes Co., Ltd. | Spin head |
US20100126539A1 (en) * | 2008-11-26 | 2010-05-27 | Semes Co., Ltd. | Spin head, apparatus for treating substrate, and method for treating substrate |
TW201330143A (zh) * | 2011-12-19 | 2013-07-16 | Dainippon Screen Mfg | 基板保持旋轉裝置及具備其之基板處理裝置,暨基板處理方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4724297B2 (ja) * | 2000-12-26 | 2011-07-13 | キヤノン株式会社 | 露光装置、デバイス製造方法 |
KR100865941B1 (ko) | 2006-11-28 | 2008-10-30 | 세메스 주식회사 | 스핀헤드 및 상기 스핀헤드의 기판 척킹/언척킹방법,그리고 상기 스핀헤드를 구비하는 기판 처리 장치 |
KR101017654B1 (ko) * | 2008-11-26 | 2011-02-25 | 세메스 주식회사 | 기판 척킹 부재, 이를 갖는 기판 처리 장치 및 이를 이용한기판 처리 방법 |
WO2011126892A2 (en) * | 2010-03-30 | 2011-10-13 | Advanced Liquid Logic, Inc. | Droplet operations platform |
JP5616205B2 (ja) * | 2010-11-29 | 2014-10-29 | 東京エレクトロン株式会社 | 基板処理システム、基板処理方法、プログラム及びコンピュータ記憶媒体 |
JP5975563B2 (ja) * | 2012-03-30 | 2016-08-23 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP6270268B2 (ja) * | 2014-02-27 | 2018-01-31 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
-
2016
- 2016-02-19 JP JP2016030154A patent/JP6674679B2/ja active Active
- 2016-09-26 TW TW105131017A patent/TWI626090B/zh active
- 2016-09-28 KR KR1020160124794A patent/KR101911145B1/ko active IP Right Grant
- 2016-09-29 CN CN201610865262.3A patent/CN107017180B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090090467A1 (en) * | 2007-10-05 | 2009-04-09 | Semes Co., Ltd. | Spin head |
US20100126539A1 (en) * | 2008-11-26 | 2010-05-27 | Semes Co., Ltd. | Spin head, apparatus for treating substrate, and method for treating substrate |
TW201330143A (zh) * | 2011-12-19 | 2013-07-16 | Dainippon Screen Mfg | 基板保持旋轉裝置及具備其之基板處理裝置,暨基板處理方法 |
Also Published As
Publication number | Publication date |
---|---|
CN107017180A (zh) | 2017-08-04 |
KR20170038171A (ko) | 2017-04-06 |
JP6674679B2 (ja) | 2020-04-01 |
KR101911145B1 (ko) | 2018-10-23 |
TW201720542A (zh) | 2017-06-16 |
JP2017069531A (ja) | 2017-04-06 |
CN107017180B (zh) | 2021-02-23 |
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