TWI622449B - 搭接裝置的焊劑塗布裝置 - Google Patents
搭接裝置的焊劑塗布裝置 Download PDFInfo
- Publication number
- TWI622449B TWI622449B TW105127321A TW105127321A TWI622449B TW I622449 B TWI622449 B TW I622449B TW 105127321 A TW105127321 A TW 105127321A TW 105127321 A TW105127321 A TW 105127321A TW I622449 B TWI622449 B TW I622449B
- Authority
- TW
- Taiwan
- Prior art keywords
- flux
- conductive strip
- coating
- drying
- guide
- Prior art date
Links
- 230000004907 flux Effects 0.000 title claims abstract description 307
- 238000001035 drying Methods 0.000 claims abstract description 101
- 238000000576 coating method Methods 0.000 claims abstract description 97
- 239000011248 coating agent Substances 0.000 claims abstract description 96
- 238000005507 spraying Methods 0.000 claims abstract description 13
- 238000011084 recovery Methods 0.000 claims description 22
- 238000002347 injection Methods 0.000 claims description 11
- 239000007924 injection Substances 0.000 claims description 11
- 239000007921 spray Substances 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 4
- 238000004064 recycling Methods 0.000 claims description 2
- 238000005422 blasting Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 19
- 230000008569 process Effects 0.000 description 15
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000012360 testing method Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- -1 atomic energy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coating Apparatus (AREA)
- Sustainable Energy (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
??10-2015-0120174 | 2015-08-26 | ||
KR1020150120174A KR20170026684A (ko) | 2015-08-26 | 2015-08-26 | 태빙장치의 플럭스 도포장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201707834A TW201707834A (zh) | 2017-03-01 |
TWI622449B true TWI622449B (zh) | 2018-05-01 |
Family
ID=57952787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105127321A TWI622449B (zh) | 2015-08-26 | 2016-08-25 | 搭接裝置的焊劑塗布裝置 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR20170026684A (ko) |
CN (1) | CN205944129U (ko) |
TW (1) | TWI622449B (ko) |
WO (1) | WO2017034327A1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107570915B (zh) * | 2017-09-12 | 2019-01-22 | 重庆科技学院 | 微合金化点焊工艺固定焊点合金粉末涂覆装置 |
KR101993843B1 (ko) * | 2018-11-14 | 2019-06-27 | 주식회사 한화 | 솔라셀 태빙 장치 및 태빙 방법 |
KR102068751B1 (ko) * | 2019-04-30 | 2020-01-21 | (주)제이엔엘테크 | 배터리 플럭스 도포 및 건조장치 |
KR102321182B1 (ko) | 2021-05-28 | 2021-11-03 | 주식회사 메이스 | 태양광 패널 태빙기용 플럭스 제공장치 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005235971A (ja) * | 2004-02-19 | 2005-09-02 | Nisshinbo Ind Inc | フラックス塗布機能を具備した太陽電池用タブリードのハンダ付け装置 |
CN103182580A (zh) * | 2011-12-29 | 2013-07-03 | 日清纺精密机器株式会社 | 太阳能电池用扁平导线软钎焊装置 |
KR101305008B1 (ko) * | 2013-05-06 | 2013-09-09 | 한복우 | 태양광 셀 제작 시스템 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101058399B1 (ko) * | 2009-04-14 | 2011-08-24 | (주)와이에스썸텍 | 태버-스트링거 및 태빙-스트링잉 방법 |
KR101041232B1 (ko) * | 2009-06-25 | 2011-06-14 | 전택종 | 태양 전지용 도체 리본 플럭스 도포 장치 및 제조 방법 |
-
2015
- 2015-08-26 KR KR1020150120174A patent/KR20170026684A/ko unknown
-
2016
- 2016-08-24 CN CN201620937080.8U patent/CN205944129U/zh not_active Expired - Fee Related
- 2016-08-25 TW TW105127321A patent/TWI622449B/zh not_active IP Right Cessation
- 2016-08-25 WO PCT/KR2016/009401 patent/WO2017034327A1/ko active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005235971A (ja) * | 2004-02-19 | 2005-09-02 | Nisshinbo Ind Inc | フラックス塗布機能を具備した太陽電池用タブリードのハンダ付け装置 |
CN103182580A (zh) * | 2011-12-29 | 2013-07-03 | 日清纺精密机器株式会社 | 太阳能电池用扁平导线软钎焊装置 |
TW201343307A (zh) * | 2011-12-29 | 2013-11-01 | Nisshinbo Mechatronics Inc | 太陽能電池用帶狀導線的焊接裝置 |
KR101305008B1 (ko) * | 2013-05-06 | 2013-09-09 | 한복우 | 태양광 셀 제작 시스템 |
Also Published As
Publication number | Publication date |
---|---|
CN205944129U (zh) | 2017-02-08 |
KR20170026684A (ko) | 2017-03-09 |
TW201707834A (zh) | 2017-03-01 |
WO2017034327A1 (ko) | 2017-03-02 |
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MM4A | Annulment or lapse of patent due to non-payment of fees |