TWI619413B - 印刷配線板之製造方法、表面處理銅箔、積層體、印刷配線板、半導體封裝及電子機器 - Google Patents

印刷配線板之製造方法、表面處理銅箔、積層體、印刷配線板、半導體封裝及電子機器 Download PDF

Info

Publication number
TWI619413B
TWI619413B TW105124600A TW105124600A TWI619413B TW I619413 B TWI619413 B TW I619413B TW 105124600 A TW105124600 A TW 105124600A TW 105124600 A TW105124600 A TW 105124600A TW I619413 B TWI619413 B TW I619413B
Authority
TW
Taiwan
Prior art keywords
copper foil
layer
group
resin
release layer
Prior art date
Application number
TW105124600A
Other languages
English (en)
Chinese (zh)
Other versions
TW201709782A (zh
Inventor
Masayuki Takamori
高森雅之
Masafumi Ishii
石井雅史
Original Assignee
Jx Nippon Mining & Metals Corporation
Ｊｘ金屬股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corporation, Ｊｘ金屬股份有限公司 filed Critical Jx Nippon Mining & Metals Corporation
Publication of TW201709782A publication Critical patent/TW201709782A/zh
Application granted granted Critical
Publication of TWI619413B publication Critical patent/TWI619413B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
TW105124600A 2015-08-03 2016-08-03 印刷配線板之製造方法、表面處理銅箔、積層體、印刷配線板、半導體封裝及電子機器 TWI619413B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015153753 2015-08-03
JPJP2015-153753 2015-08-03
JPJP2015-187489 2015-09-24
JP2015187489A JP6438370B2 (ja) 2015-08-03 2015-09-24 プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器

Publications (2)

Publication Number Publication Date
TW201709782A TW201709782A (zh) 2017-03-01
TWI619413B true TWI619413B (zh) 2018-03-21

Family

ID=57988941

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105124600A TWI619413B (zh) 2015-08-03 2016-08-03 印刷配線板之製造方法、表面處理銅箔、積層體、印刷配線板、半導體封裝及電子機器

Country Status (4)

Country Link
JP (1) JP6438370B2 (https=)
KR (1) KR102066362B1 (https=)
CN (1) CN107710890A (https=)
TW (1) TWI619413B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6334034B1 (ja) * 2017-06-09 2018-05-30 Ｊｘ金属株式会社 表面処理銅箔及びその製造方法、並びに銅張積層板
JP7196914B2 (ja) * 2018-05-30 2022-12-27 Ａｇｃ株式会社 樹脂付金属箔、積層体の製造方法、積層体及びプリント基板
CN110691501B (zh) * 2018-07-06 2024-08-20 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法
CN114503789B (zh) 2019-10-25 2025-05-16 纳美仕有限公司 复合铜部件
CN116745462A (zh) * 2021-03-25 2023-09-12 纳美仕有限公司 叠层体的制造方法
CN115413118B (zh) * 2022-09-30 2024-12-13 深圳市米韵科技有限公司 一种hdi线路板基板材料及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201349364A (zh) * 2012-03-27 2013-12-01 奇異電器公司 超薄埋入式晶粒模組及其製造方法
TW201414365A (zh) * 2012-06-04 2014-04-01 Jx Nippon Mining & Metals Corp 附載體金屬箔
TW201511621A (zh) * 2013-07-23 2015-03-16 Jx Nippon Mining & Metals Corp 表面處理銅箔、附載體銅箔、基材、樹脂基材、印刷配線板、覆銅積層板及印刷配線板之製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0647755A (ja) * 1992-07-28 1994-02-22 Matsushita Electric Works Ltd 銅張り積層板の製造方法
JP4740692B2 (ja) 2004-12-14 2011-08-03 三菱瓦斯化学株式会社 プリント配線板の製造法
JP4829647B2 (ja) 2006-03-10 2011-12-07 三菱瓦斯化学株式会社 プリント配線板及びその製造方法
KR101081588B1 (ko) * 2010-08-03 2011-11-08 삼성전기주식회사 도금층 형성방법 및 이를 이용한 회로기판 제조방법
WO2013183606A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 キャリア付金属箔
TWI627876B (zh) * 2012-08-06 2018-06-21 Jx Nippon Mining & Metals Corp Metal foil with carrier
SG11201500934RA (en) * 2012-08-08 2015-03-30 3M Innovative Properties Co Barrier film constructions and methods of making same
WO2014051122A1 (ja) * 2012-09-28 2014-04-03 Jx日鉱日石金属株式会社 キャリア付金属箔
CN104685980B (zh) * 2012-10-04 2018-11-23 Jx日矿日石金属株式会社 多层印刷配线基板的制造方法及基底基材
JP5793720B1 (ja) * 2014-04-11 2015-10-14 パナソニックＩｐマネジメント株式会社 金属箔付き接着シート、金属箔付き積層板、金属箔付き多層基板、回路基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201349364A (zh) * 2012-03-27 2013-12-01 奇異電器公司 超薄埋入式晶粒模組及其製造方法
TW201414365A (zh) * 2012-06-04 2014-04-01 Jx Nippon Mining & Metals Corp 附載體金屬箔
TW201511621A (zh) * 2013-07-23 2015-03-16 Jx Nippon Mining & Metals Corp 表面處理銅箔、附載體銅箔、基材、樹脂基材、印刷配線板、覆銅積層板及印刷配線板之製造方法

Also Published As

Publication number Publication date
KR20180037252A (ko) 2018-04-11
JP2017034216A (ja) 2017-02-09
JP6438370B2 (ja) 2018-12-12
KR102066362B1 (ko) 2020-01-14
CN107710890A (zh) 2018-02-16
TW201709782A (zh) 2017-03-01

Similar Documents

Publication Publication Date Title
TWI660651B (zh) 金屬箔、附脫模層之金屬箔、積層體、印刷配線板、半導體封裝、電子機器及印刷配線板之製造方法
TWI619413B (zh) 印刷配線板之製造方法、表面處理銅箔、積層體、印刷配線板、半導體封裝及電子機器
JP5826322B2 (ja) 表面処理銅箔、銅張積層板、プリント配線板、電子機器、半導体パッケージ用回路形成基板、半導体パッケージ及びプリント配線板の製造方法
TWI660658B (zh) 附脫模層金屬箔、金屬箔、積層體、印刷配線板、半導體封裝、電子機器及印刷配線板的製造方法
JP6605271B2 (ja) 離型層付き電解銅箔、積層体、半導体パッケージの製造方法、電子機器の製造方法及びプリント配線板の製造方法
TWI618814B (zh) Surface treatment metal foil, laminate, printed wiring board, semiconductor package, electronic device, and printed wiring board manufacturing method
JP2018121085A (ja) プリント配線板の製造方法
TWI645959B (zh) 金屬箔、附脫模層之金屬箔、積層體、印刷配線板、半導體封裝、電子機器及印刷配線板之製造方法
TWI625229B (zh) Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device, and printed wiring board manufacturing method
CN108696988A (zh) 附脱模层铜箔、积层体、印刷配线板的制造方法及电子机器的制造方法
JP6031624B2 (ja) 表面処理銅箔、銅張積層板、プリント配線板の製造方法、半導体パッケージの製造方法及び電子機器の製造方法
JP5897755B2 (ja) 表面処理銅箔、銅張積層板、プリント配線板、電子機器、半導体パッケージ、プリント配線板の製造方法、電子機器の製造方法、半導体パッケージの製造方法、樹脂基材の製造方法、銅箔の表面プロファイルを樹脂基材に転写する方法
WO2017022807A1 (ja) プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees