CN107710890A - 印刷配线板的制造方法、表面处理铜箔、积层体、印刷配线板、半导体封装及电子机器 - Google Patents

印刷配线板的制造方法、表面处理铜箔、积层体、印刷配线板、半导体封装及电子机器 Download PDF

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Publication number
CN107710890A
CN107710890A CN201680038794.8A CN201680038794A CN107710890A CN 107710890 A CN107710890 A CN 107710890A CN 201680038794 A CN201680038794 A CN 201680038794A CN 107710890 A CN107710890 A CN 107710890A
Authority
CN
China
Prior art keywords
copper foil
layer
resin
base material
release layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680038794.8A
Other languages
English (en)
Chinese (zh)
Inventor
高森雅之
石井雅史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority claimed from PCT/JP2016/072848 external-priority patent/WO2017022807A1/ja
Publication of CN107710890A publication Critical patent/CN107710890A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
CN201680038794.8A 2015-08-03 2016-08-03 印刷配线板的制造方法、表面处理铜箔、积层体、印刷配线板、半导体封装及电子机器 Pending CN107710890A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2015153753 2015-08-03
JP2015-153753 2015-08-03
JP2015-187489 2015-09-24
JP2015187489A JP6438370B2 (ja) 2015-08-03 2015-09-24 プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器
PCT/JP2016/072848 WO2017022807A1 (ja) 2015-08-03 2016-08-03 プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器

Publications (1)

Publication Number Publication Date
CN107710890A true CN107710890A (zh) 2018-02-16

Family

ID=57988941

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680038794.8A Pending CN107710890A (zh) 2015-08-03 2016-08-03 印刷配线板的制造方法、表面处理铜箔、积层体、印刷配线板、半导体封装及电子机器

Country Status (4)

Country Link
JP (1) JP6438370B2 (https=)
KR (1) KR102066362B1 (https=)
CN (1) CN107710890A (https=)
TW (1) TWI619413B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115413118A (zh) * 2022-09-30 2022-11-29 深圳市米韵科技有限公司 一种hdi线路板基板材料及其制备方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6334034B1 (ja) * 2017-06-09 2018-05-30 Ｊｘ金属株式会社 表面処理銅箔及びその製造方法、並びに銅張積層板
JP7196914B2 (ja) * 2018-05-30 2022-12-27 Ａｇｃ株式会社 樹脂付金属箔、積層体の製造方法、積層体及びプリント基板
CN110691501B (zh) * 2018-07-06 2024-08-20 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法
CN114503789B (zh) 2019-10-25 2025-05-16 纳美仕有限公司 复合铜部件
CN116745462A (zh) * 2021-03-25 2023-09-12 纳美仕有限公司 叠层体的制造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0647755A (ja) * 1992-07-28 1994-02-22 Matsushita Electric Works Ltd 銅張り積層板の製造方法
CN103367169A (zh) * 2012-03-27 2013-10-23 通用电气公司 超薄包埋模模块及其制造方法
TW201427497A (zh) * 2012-08-06 2014-07-01 Jx Nippon Mining & Metals Corp 附有載體之金屬箔
WO2015012327A1 (ja) * 2013-07-23 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
CN104334345A (zh) * 2012-06-04 2015-02-04 Jx日矿日石金属株式会社 附载体金属箔
CN104334346A (zh) * 2012-06-04 2015-02-04 Jx日矿日石金属株式会社 附载体金属箔
CN104684727A (zh) * 2012-08-08 2015-06-03 3M创新有限公司 阻隔膜构造及其制造方法
CN104685980A (zh) * 2012-10-04 2015-06-03 Jx日矿日石金属株式会社 多层印刷配线基板的制造方法及基底基材

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4740692B2 (ja) 2004-12-14 2011-08-03 三菱瓦斯化学株式会社 プリント配線板の製造法
JP4829647B2 (ja) 2006-03-10 2011-12-07 三菱瓦斯化学株式会社 プリント配線板及びその製造方法
KR101081588B1 (ko) * 2010-08-03 2011-11-08 삼성전기주식회사 도금층 형성방법 및 이를 이용한 회로기판 제조방법
WO2014051122A1 (ja) * 2012-09-28 2014-04-03 Jx日鉱日石金属株式会社 キャリア付金属箔
JP5793720B1 (ja) * 2014-04-11 2015-10-14 パナソニックＩｐマネジメント株式会社 金属箔付き接着シート、金属箔付き積層板、金属箔付き多層基板、回路基板の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0647755A (ja) * 1992-07-28 1994-02-22 Matsushita Electric Works Ltd 銅張り積層板の製造方法
CN103367169A (zh) * 2012-03-27 2013-10-23 通用电气公司 超薄包埋模模块及其制造方法
CN104334345A (zh) * 2012-06-04 2015-02-04 Jx日矿日石金属株式会社 附载体金属箔
CN104334346A (zh) * 2012-06-04 2015-02-04 Jx日矿日石金属株式会社 附载体金属箔
TW201427497A (zh) * 2012-08-06 2014-07-01 Jx Nippon Mining & Metals Corp 附有載體之金屬箔
CN104684727A (zh) * 2012-08-08 2015-06-03 3M创新有限公司 阻隔膜构造及其制造方法
CN104685980A (zh) * 2012-10-04 2015-06-03 Jx日矿日石金属株式会社 多层印刷配线基板的制造方法及基底基材
WO2015012327A1 (ja) * 2013-07-23 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115413118A (zh) * 2022-09-30 2022-11-29 深圳市米韵科技有限公司 一种hdi线路板基板材料及其制备方法
CN115413118B (zh) * 2022-09-30 2024-12-13 深圳市米韵科技有限公司 一种hdi线路板基板材料及其制备方法

Also Published As

Publication number Publication date
KR20180037252A (ko) 2018-04-11
JP2017034216A (ja) 2017-02-09
TWI619413B (zh) 2018-03-21
JP6438370B2 (ja) 2018-12-12
KR102066362B1 (ko) 2020-01-14
TW201709782A (zh) 2017-03-01

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Application publication date: 20180216