TWI616325B - 用於眼用裝置之堆疊集成構件媒介植入物以及形成用於眼用裝置的堆疊集成構件媒介植入物之方法 - Google Patents
用於眼用裝置之堆疊集成構件媒介植入物以及形成用於眼用裝置的堆疊集成構件媒介植入物之方法 Download PDFInfo
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- TWI616325B TWI616325B TW102103007A TW102103007A TWI616325B TW I616325 B TWI616325 B TW I616325B TW 102103007 A TW102103007 A TW 102103007A TW 102103007 A TW102103007 A TW 102103007A TW I616325 B TWI616325 B TW I616325B
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- integrated component
- implant
- stacked integrated
- lens
- substrate layers
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Classifications
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- G—PHYSICS
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- G02C7/00—Optical parts
- G02C7/02—Lenses; Lens systems ; Methods of designing lenses
- G02C7/04—Contact lenses for the eyes
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- G—PHYSICS
- G02—OPTICS
- G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
- G02C7/00—Optical parts
- G02C7/02—Lenses; Lens systems ; Methods of designing lenses
- G02C7/08—Auxiliary lenses; Arrangements for varying focal length
- G02C7/081—Ophthalmic lenses with variable focal length
- G02C7/083—Electrooptic lenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Ophthalmology & Optometry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Eyeglasses (AREA)
- Prostheses (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/358,577 US9914273B2 (en) | 2011-03-18 | 2012-01-26 | Method for using a stacked integrated component media insert in an ophthalmic device |
| US13/358,577 | 2012-01-26 | ||
| US13/358,575 US9889615B2 (en) | 2011-03-18 | 2012-01-26 | Stacked integrated component media insert for an ophthalmic device |
| US13/358,575 | 2012-01-26 | ||
| US13/358,571 | 2012-01-26 | ||
| US13/358,571 US9233513B2 (en) | 2011-03-18 | 2012-01-26 | Apparatus for manufacturing stacked integrated component media inserts for ophthalmic devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201341165A TW201341165A (zh) | 2013-10-16 |
| TWI616325B true TWI616325B (zh) | 2018-03-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102103007A TWI616325B (zh) | 2012-01-26 | 2013-01-25 | 用於眼用裝置之堆疊集成構件媒介植入物以及形成用於眼用裝置的堆疊集成構件媒介植入物之方法 |
Country Status (12)
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102248847B1 (ko) | 2015-06-01 | 2021-05-06 | 삼성전자주식회사 | 에너지 수확부를 구비한 콘택트 렌즈 |
| US20170086676A1 (en) * | 2015-09-24 | 2017-03-30 | Johnson & Johnson Vision Care, Inc. | Quantum-dot spectrometers for use in biomedical devices and methods of use |
| CN108205207A (zh) * | 2016-12-16 | 2018-06-26 | 江苏海伦隐形眼镜有限公司 | 一种智能隐形眼镜的制作方法 |
| CN112135589A (zh) | 2018-05-10 | 2020-12-25 | 奥克塞拉有限公司 | 治疗眼睛屈光不正的方法和装置 |
| EP3830636A4 (en) | 2018-07-30 | 2022-04-13 | Acucela Inc. | OPTICAL DESIGNS OF AN ELECTRONIC CONTACT LENS TO REDUCE MYOPIA PROGRESSION |
| US11209672B1 (en) | 2021-04-06 | 2021-12-28 | Acucela Inc. | Supporting pillars for encapsulating a flexible PCB within a soft hydrogel contact lens |
| US11366341B1 (en) | 2021-05-04 | 2022-06-21 | Acucela Inc. | Electronic case for electronic spectacles |
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| EP1760515A2 (en) * | 2003-10-03 | 2007-03-07 | Invisia Ltd. | Multifocal ophthalmic lens |
| CN102159382A (zh) * | 2008-09-22 | 2011-08-17 | 庄臣及庄臣视力保护公司 | 眼科镜片中的通电组件的粘合剂 |
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| JPH0837190A (ja) * | 1994-07-22 | 1996-02-06 | Nec Corp | 半導体装置 |
| US6217171B1 (en) * | 1998-05-26 | 2001-04-17 | Novartis Ag | Composite ophthamic lens |
| JP4172566B2 (ja) * | 2000-09-21 | 2008-10-29 | Ｔｄｋ株式会社 | セラミック多層基板の表面電極構造及び表面電極の製造方法 |
| CA2494934A1 (en) * | 2002-08-09 | 2004-02-19 | E-Vision, Llc | Electro-active contact lens system |
| US20070090869A1 (en) * | 2005-10-26 | 2007-04-26 | Motorola, Inc. | Combined power source and printed transistor circuit apparatus and method |
| CN101395520A (zh) * | 2006-01-10 | 2009-03-25 | E-视觉有限公司 | 包含可机械弯曲集成插件的电激活眼镜镜片的改进制造装置和方法 |
| JP5011820B2 (ja) * | 2006-05-24 | 2012-08-29 | オムロン株式会社 | 積層デバイス、およびその製造方法 |
| AR064985A1 (es) * | 2007-01-22 | 2009-05-06 | E Vision Llc | Lente electroactivo flexible |
| CN101669059B (zh) * | 2007-02-23 | 2013-09-11 | 像素光学公司 | 眼科动态光圈 |
| US20100076553A1 (en) * | 2008-09-22 | 2010-03-25 | Pugh Randall B | Energized ophthalmic lens |
| US9427920B2 (en) * | 2008-09-30 | 2016-08-30 | Johnson & Johnson Vision Care, Inc. | Energized media for an ophthalmic device |
| US8348424B2 (en) * | 2008-09-30 | 2013-01-08 | Johnson & Johnson Vision Care, Inc. | Variable focus ophthalmic device |
| US9375886B2 (en) * | 2008-10-31 | 2016-06-28 | Johnson & Johnson Vision Care Inc. | Ophthalmic device with embedded microcontroller |
| JP5694947B2 (ja) * | 2008-12-11 | 2015-04-01 | エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． | 医療用途のための伸張性電子部品を使用する装置 |
| US8137148B2 (en) * | 2009-09-30 | 2012-03-20 | General Electric Company | Method of manufacturing monolithic parallel interconnect structure |
| CN103037790A (zh) * | 2010-06-20 | 2013-04-10 | 伊兰扎公司 | 具有专用集成电路的眼科装置和方法 |
-
2013
- 2013-01-25 WO PCT/US2013/023182 patent/WO2013112862A1/en active Application Filing
- 2013-01-25 HK HK15105049.3A patent/HK1204680A1/xx unknown
- 2013-01-25 BR BR112014018456A patent/BR112014018456A8/pt not_active IP Right Cessation
- 2013-01-25 CA CA2862666A patent/CA2862666A1/en not_active Abandoned
- 2013-01-25 CN CN201380016979.5A patent/CN104204914B/zh not_active Expired - Fee Related
- 2013-01-25 EP EP13705295.7A patent/EP2807518A1/en not_active Withdrawn
- 2013-01-25 KR KR1020147023652A patent/KR20140117618A/ko not_active Ceased
- 2013-01-25 TW TW102103007A patent/TWI616325B/zh not_active IP Right Cessation
- 2013-01-25 SG SG11201404174SA patent/SG11201404174SA/en unknown
- 2013-01-25 JP JP2014554864A patent/JP6312605B2/ja active Active
- 2013-01-25 RU RU2014134722A patent/RU2629902C2/ru not_active IP Right Cessation
- 2013-01-25 AU AU2013211968A patent/AU2013211968B2/en not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1760515A2 (en) * | 2003-10-03 | 2007-03-07 | Invisia Ltd. | Multifocal ophthalmic lens |
| CN102159382A (zh) * | 2008-09-22 | 2011-08-17 | 庄臣及庄臣视力保护公司 | 眼科镜片中的通电组件的粘合剂 |
Also Published As
| Publication number | Publication date |
|---|---|
| BR112014018456A2 (enrdf_load_stackoverflow) | 2017-06-20 |
| JP2015510143A (ja) | 2015-04-02 |
| SG11201404174SA (en) | 2014-10-30 |
| AU2013211968B2 (en) | 2016-09-29 |
| CA2862666A1 (en) | 2013-08-01 |
| EP2807518A1 (en) | 2014-12-03 |
| CN104204914B (zh) | 2018-06-15 |
| AU2013211968A1 (en) | 2014-09-11 |
| WO2013112862A1 (en) | 2013-08-01 |
| HK1204680A1 (en) | 2015-11-27 |
| BR112014018456A8 (pt) | 2017-07-11 |
| KR20140117618A (ko) | 2014-10-07 |
| RU2629902C2 (ru) | 2017-09-04 |
| JP6312605B2 (ja) | 2018-04-18 |
| CN104204914A (zh) | 2014-12-10 |
| RU2014134722A (ru) | 2016-03-20 |
| TW201341165A (zh) | 2013-10-16 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |