SG11201404174SA - Stacked integrated component media insert for an ophthalmic device - Google Patents

Stacked integrated component media insert for an ophthalmic device

Info

Publication number
SG11201404174SA
SG11201404174SA SG11201404174SA SG11201404174SA SG11201404174SA SG 11201404174S A SG11201404174S A SG 11201404174SA SG 11201404174S A SG11201404174S A SG 11201404174SA SG 11201404174S A SG11201404174S A SG 11201404174SA SG 11201404174S A SG11201404174S A SG 11201404174SA
Authority
SG
Singapore
Prior art keywords
ophthalmic device
integrated component
media insert
stacked integrated
component media
Prior art date
Application number
SG11201404174SA
Other languages
English (en)
Inventor
Randall B Pugh
Frederick A Flitsch
Daniel B Otts
James Daniel Riall
Adam Toner
Original Assignee
Johnson & Johnson Vision Care
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/358,575 external-priority patent/US9889615B2/en
Application filed by Johnson & Johnson Vision Care filed Critical Johnson & Johnson Vision Care
Publication of SG11201404174SA publication Critical patent/SG11201404174SA/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/04—Contact lenses for the eyes
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/08—Auxiliary lenses; Arrangements for varying focal length
    • G02C7/081—Ophthalmic lenses with variable focal length
    • G02C7/083—Electrooptic lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Eyeglasses (AREA)
  • Prostheses (AREA)
SG11201404174SA 2012-01-26 2013-01-25 Stacked integrated component media insert for an ophthalmic device SG11201404174SA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US13/358,575 US9889615B2 (en) 2011-03-18 2012-01-26 Stacked integrated component media insert for an ophthalmic device
US13/358,577 US9914273B2 (en) 2011-03-18 2012-01-26 Method for using a stacked integrated component media insert in an ophthalmic device
US13/358,571 US9233513B2 (en) 2011-03-18 2012-01-26 Apparatus for manufacturing stacked integrated component media inserts for ophthalmic devices
PCT/US2013/023182 WO2013112862A1 (en) 2012-01-26 2013-01-25 Stacked integrated component media insert for an ophthalmic device

Publications (1)

Publication Number Publication Date
SG11201404174SA true SG11201404174SA (en) 2014-10-30

Family

ID=47741261

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201404174SA SG11201404174SA (en) 2012-01-26 2013-01-25 Stacked integrated component media insert for an ophthalmic device

Country Status (12)

Country Link
EP (1) EP2807518A1 (enrdf_load_stackoverflow)
JP (1) JP6312605B2 (enrdf_load_stackoverflow)
KR (1) KR20140117618A (enrdf_load_stackoverflow)
CN (1) CN104204914B (enrdf_load_stackoverflow)
AU (1) AU2013211968B2 (enrdf_load_stackoverflow)
BR (1) BR112014018456A8 (enrdf_load_stackoverflow)
CA (1) CA2862666A1 (enrdf_load_stackoverflow)
HK (1) HK1204680A1 (enrdf_load_stackoverflow)
RU (1) RU2629902C2 (enrdf_load_stackoverflow)
SG (1) SG11201404174SA (enrdf_load_stackoverflow)
TW (1) TWI616325B (enrdf_load_stackoverflow)
WO (1) WO2013112862A1 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102248847B1 (ko) 2015-06-01 2021-05-06 삼성전자주식회사 에너지 수확부를 구비한 콘택트 렌즈
US20170086676A1 (en) * 2015-09-24 2017-03-30 Johnson & Johnson Vision Care, Inc. Quantum-dot spectrometers for use in biomedical devices and methods of use
CN108205207A (zh) * 2016-12-16 2018-06-26 江苏海伦隐形眼镜有限公司 一种智能隐形眼镜的制作方法
EP3799562A4 (en) 2018-05-10 2022-05-18 Acucela Inc. Method and apparatus for treating refractive error of the eye
US11402662B2 (en) 2018-07-30 2022-08-02 Acucela Inc. Optical designs of electronic contact lens to decrease myopia progression
US11209672B1 (en) 2021-04-06 2021-12-28 Acucela Inc. Supporting pillars for encapsulating a flexible PCB within a soft hydrogel contact lens
US11366341B1 (en) 2021-05-04 2022-06-21 Acucela Inc. Electronic case for electronic spectacles

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0837190A (ja) * 1994-07-22 1996-02-06 Nec Corp 半導体装置
US6217171B1 (en) * 1998-05-26 2001-04-17 Novartis Ag Composite ophthamic lens
JP4172566B2 (ja) * 2000-09-21 2008-10-29 Ｔｄｋ株式会社 セラミック多層基板の表面電極構造及び表面電極の製造方法
EP1947501B1 (en) * 2002-08-09 2012-04-25 E-Vision, LLC Electro-active contact lens system
EP1760515A3 (en) * 2003-10-03 2011-08-31 Invisia Ltd. Multifocal ophthalmic lens
US20070090869A1 (en) * 2005-10-26 2007-04-26 Motorola, Inc. Combined power source and printed transistor circuit apparatus and method
CN101395520A (zh) * 2006-01-10 2009-03-25 E-视觉有限公司 包含可机械弯曲集成插件的电激活眼镜镜片的改进制造装置和方法
JP5011820B2 (ja) * 2006-05-24 2012-08-29 オムロン株式会社 積層デバイス、およびその製造方法
AR064985A1 (es) * 2007-01-22 2009-05-06 E Vision Llc Lente electroactivo flexible
BRPI0807560A2 (pt) * 2007-02-23 2014-07-01 Pixeloptics Inc Abertura oftálmica dinâmica
US9296158B2 (en) * 2008-09-22 2016-03-29 Johnson & Johnson Vision Care, Inc. Binder of energized components in an ophthalmic lens
US20100076553A1 (en) * 2008-09-22 2010-03-25 Pugh Randall B Energized ophthalmic lens
US8348424B2 (en) * 2008-09-30 2013-01-08 Johnson & Johnson Vision Care, Inc. Variable focus ophthalmic device
US9427920B2 (en) * 2008-09-30 2016-08-30 Johnson & Johnson Vision Care, Inc. Energized media for an ophthalmic device
US9375886B2 (en) * 2008-10-31 2016-06-28 Johnson & Johnson Vision Care Inc. Ophthalmic device with embedded microcontroller
WO2010082993A2 (en) * 2008-12-11 2010-07-22 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8137148B2 (en) * 2009-09-30 2012-03-20 General Electric Company Method of manufacturing monolithic parallel interconnect structure
SG186762A1 (en) * 2010-06-20 2013-02-28 Elenza Inc Ophthalmic devices and methods with application specific integrated circuits

Also Published As

Publication number Publication date
BR112014018456A2 (enrdf_load_stackoverflow) 2017-06-20
KR20140117618A (ko) 2014-10-07
CN104204914A (zh) 2014-12-10
AU2013211968B2 (en) 2016-09-29
HK1204680A1 (en) 2015-11-27
AU2013211968A1 (en) 2014-09-11
CA2862666A1 (en) 2013-08-01
RU2014134722A (ru) 2016-03-20
CN104204914B (zh) 2018-06-15
RU2629902C2 (ru) 2017-09-04
TW201341165A (zh) 2013-10-16
TWI616325B (zh) 2018-03-01
WO2013112862A1 (en) 2013-08-01
JP6312605B2 (ja) 2018-04-18
EP2807518A1 (en) 2014-12-03
JP2015510143A (ja) 2015-04-02
BR112014018456A8 (pt) 2017-07-11

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