HK1204680A1 - Stacked integrated component media insert for an ophthalmic device - Google Patents
Stacked integrated component media insert for an ophthalmic device Download PDFInfo
- Publication number
- HK1204680A1 HK1204680A1 HK15105049.3A HK15105049A HK1204680A1 HK 1204680 A1 HK1204680 A1 HK 1204680A1 HK 15105049 A HK15105049 A HK 15105049A HK 1204680 A1 HK1204680 A1 HK 1204680A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- integrated component
- stacked integrated
- ophthalmic device
- media insert
- stacked
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
- G02C7/00—Optical parts
- G02C7/02—Lenses; Lens systems ; Methods of designing lenses
- G02C7/04—Contact lenses for the eyes
-
- G—PHYSICS
- G02—OPTICS
- G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
- G02C7/00—Optical parts
- G02C7/02—Lenses; Lens systems ; Methods of designing lenses
- G02C7/08—Auxiliary lenses; Arrangements for varying focal length
- G02C7/081—Ophthalmic lenses with variable focal length
- G02C7/083—Electrooptic lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Ophthalmology & Optometry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Eyeglasses (AREA)
- Prostheses (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/358,571 US9233513B2 (en) | 2011-03-18 | 2012-01-26 | Apparatus for manufacturing stacked integrated component media inserts for ophthalmic devices |
| US201213358575 | 2012-01-26 | ||
| US13/358,577 US9914273B2 (en) | 2011-03-18 | 2012-01-26 | Method for using a stacked integrated component media insert in an ophthalmic device |
| US13/358,575 US9889615B2 (en) | 2011-03-18 | 2012-01-26 | Stacked integrated component media insert for an ophthalmic device |
| US201213358571 | 2012-01-26 | ||
| US201213358577 | 2012-01-26 | ||
| PCT/US2013/023182 WO2013112862A1 (en) | 2012-01-26 | 2013-01-25 | Stacked integrated component media insert for an ophthalmic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HK1204680A1 true HK1204680A1 (en) | 2015-11-27 |
Family
ID=47741261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HK15105049.3A HK1204680A1 (en) | 2012-01-26 | 2013-01-25 | Stacked integrated component media insert for an ophthalmic device |
Country Status (12)
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102248847B1 (ko) | 2015-06-01 | 2021-05-06 | 삼성전자주식회사 | 에너지 수확부를 구비한 콘택트 렌즈 |
| US20170086676A1 (en) * | 2015-09-24 | 2017-03-30 | Johnson & Johnson Vision Care, Inc. | Quantum-dot spectrometers for use in biomedical devices and methods of use |
| CN108205207A (zh) * | 2016-12-16 | 2018-06-26 | 江苏海伦隐形眼镜有限公司 | 一种智能隐形眼镜的制作方法 |
| KR102805850B1 (ko) | 2018-05-10 | 2025-05-09 | 어큐셀라 인코포레이티드 | 눈의 굴절 이상을 치료하기 위한 방법 및 장치 |
| US11402662B2 (en) | 2018-07-30 | 2022-08-02 | Acucela Inc. | Optical designs of electronic contact lens to decrease myopia progression |
| CN114502120A (zh) | 2019-07-31 | 2022-05-13 | 奥克塞拉有限公司 | 用于将图像投射到视网膜上的设备 |
| US11209672B1 (en) | 2021-04-06 | 2021-12-28 | Acucela Inc. | Supporting pillars for encapsulating a flexible PCB within a soft hydrogel contact lens |
| US11366341B1 (en) | 2021-05-04 | 2022-06-21 | Acucela Inc. | Electronic case for electronic spectacles |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0837190A (ja) * | 1994-07-22 | 1996-02-06 | Nec Corp | 半導体装置 |
| US6217171B1 (en) * | 1998-05-26 | 2001-04-17 | Novartis Ag | Composite ophthamic lens |
| JP4172566B2 (ja) * | 2000-09-21 | 2008-10-29 | Ｔｄｋ株式会社 | セラミック多層基板の表面電極構造及び表面電極の製造方法 |
| WO2004015460A2 (en) * | 2002-08-09 | 2004-02-19 | E-Vision, Llc | Electro-active contact lens system |
| EP1760515A3 (en) * | 2003-10-03 | 2011-08-31 | Invisia Ltd. | Multifocal ophthalmic lens |
| US20070090869A1 (en) * | 2005-10-26 | 2007-04-26 | Motorola, Inc. | Combined power source and printed transistor circuit apparatus and method |
| CN101395520A (zh) * | 2006-01-10 | 2009-03-25 | E-视觉有限公司 | 包含可机械弯曲集成插件的电激活眼镜镜片的改进制造装置和方法 |
| JP5011820B2 (ja) * | 2006-05-24 | 2012-08-29 | オムロン株式会社 | 積層デバイス、およびその製造方法 |
| AR064985A1 (es) * | 2007-01-22 | 2009-05-06 | E Vision Llc | Lente electroactivo flexible |
| WO2008103906A2 (en) * | 2007-02-23 | 2008-08-28 | Pixeloptics, Inc. | Ophthalmic dynamic aperture |
| US9296158B2 (en) * | 2008-09-22 | 2016-03-29 | Johnson & Johnson Vision Care, Inc. | Binder of energized components in an ophthalmic lens |
| US20100076553A1 (en) * | 2008-09-22 | 2010-03-25 | Pugh Randall B | Energized ophthalmic lens |
| US9427920B2 (en) * | 2008-09-30 | 2016-08-30 | Johnson & Johnson Vision Care, Inc. | Energized media for an ophthalmic device |
| US8348424B2 (en) * | 2008-09-30 | 2013-01-08 | Johnson & Johnson Vision Care, Inc. | Variable focus ophthalmic device |
| US9375886B2 (en) * | 2008-10-31 | 2016-06-28 | Johnson & Johnson Vision Care Inc. | Ophthalmic device with embedded microcontroller |
| EP2378956A4 (en) * | 2008-12-11 | 2017-12-27 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
| US8137148B2 (en) * | 2009-09-30 | 2012-03-20 | General Electric Company | Method of manufacturing monolithic parallel interconnect structure |
| EP2582313A4 (en) * | 2010-06-20 | 2017-07-12 | Elenza, Inc. | Ophthalmic devices and methods with application specific integrated circuits |
-
2013
- 2013-01-25 SG SG11201404174SA patent/SG11201404174SA/en unknown
- 2013-01-25 AU AU2013211968A patent/AU2013211968B2/en not_active Ceased
- 2013-01-25 RU RU2014134722A patent/RU2629902C2/ru not_active IP Right Cessation
- 2013-01-25 WO PCT/US2013/023182 patent/WO2013112862A1/en active Application Filing
- 2013-01-25 JP JP2014554864A patent/JP6312605B2/ja active Active
- 2013-01-25 CA CA2862666A patent/CA2862666A1/en not_active Abandoned
- 2013-01-25 TW TW102103007A patent/TWI616325B/zh not_active IP Right Cessation
- 2013-01-25 BR BR112014018456A patent/BR112014018456A8/pt not_active IP Right Cessation
- 2013-01-25 HK HK15105049.3A patent/HK1204680A1/xx unknown
- 2013-01-25 EP EP13705295.7A patent/EP2807518A1/en not_active Withdrawn
- 2013-01-25 KR KR1020147023652A patent/KR20140117618A/ko not_active Ceased
- 2013-01-25 CN CN201380016979.5A patent/CN104204914B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013112862A1 (en) | 2013-08-01 |
| TW201341165A (zh) | 2013-10-16 |
| SG11201404174SA (en) | 2014-10-30 |
| KR20140117618A (ko) | 2014-10-07 |
| CN104204914B (zh) | 2018-06-15 |
| CA2862666A1 (en) | 2013-08-01 |
| AU2013211968A1 (en) | 2014-09-11 |
| RU2629902C2 (ru) | 2017-09-04 |
| CN104204914A (zh) | 2014-12-10 |
| EP2807518A1 (en) | 2014-12-03 |
| JP2015510143A (ja) | 2015-04-02 |
| BR112014018456A8 (pt) | 2017-07-11 |
| RU2014134722A (ru) | 2016-03-20 |
| TWI616325B (zh) | 2018-03-01 |
| JP6312605B2 (ja) | 2018-04-18 |
| BR112014018456A2 (enrdf_load_stackoverflow) | 2017-06-20 |
| AU2013211968B2 (en) | 2016-09-29 |
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