HK1204680A1 - Stacked integrated component media insert for an ophthalmic device - Google Patents

Stacked integrated component media insert for an ophthalmic device Download PDF

Info

Publication number
HK1204680A1
HK1204680A1 HK15105049.3A HK15105049A HK1204680A1 HK 1204680 A1 HK1204680 A1 HK 1204680A1 HK 15105049 A HK15105049 A HK 15105049A HK 1204680 A1 HK1204680 A1 HK 1204680A1
Authority
HK
Hong Kong
Prior art keywords
integrated component
stacked integrated
ophthalmic device
media insert
stacked
Prior art date
Application number
HK15105049.3A
Other languages
English (en)
Chinese (zh)
Inventor
Randall B. Pugh
Frederick A. Flitsch
Daniel B. Otts
James Daniel Riall
Adam Toner
Original Assignee
Johnson & Johnson Vision Care Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/358,575 external-priority patent/US9889615B2/en
Application filed by Johnson & Johnson Vision Care Inc. filed Critical Johnson & Johnson Vision Care Inc.
Publication of HK1204680A1 publication Critical patent/HK1204680A1/xx

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/04—Contact lenses for the eyes
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/08—Auxiliary lenses; Arrangements for varying focal length
    • G02C7/081—Ophthalmic lenses with variable focal length
    • G02C7/083—Electrooptic lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Eyeglasses (AREA)
  • Prostheses (AREA)
HK15105049.3A 2012-01-26 2013-01-25 Stacked integrated component media insert for an ophthalmic device HK1204680A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201213358575 2012-01-26
US13/358,575 US9889615B2 (en) 2011-03-18 2012-01-26 Stacked integrated component media insert for an ophthalmic device
US201213358577 2012-01-26
US13/358,577 US9914273B2 (en) 2011-03-18 2012-01-26 Method for using a stacked integrated component media insert in an ophthalmic device
US13/358,571 US9233513B2 (en) 2011-03-18 2012-01-26 Apparatus for manufacturing stacked integrated component media inserts for ophthalmic devices
US201213358571 2012-01-26
PCT/US2013/023182 WO2013112862A1 (en) 2012-01-26 2013-01-25 Stacked integrated component media insert for an ophthalmic device

Publications (1)

Publication Number Publication Date
HK1204680A1 true HK1204680A1 (en) 2015-11-27

Family

ID=47741261

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15105049.3A HK1204680A1 (en) 2012-01-26 2013-01-25 Stacked integrated component media insert for an ophthalmic device

Country Status (12)

Country Link
EP (1) EP2807518A1 (enrdf_load_stackoverflow)
JP (1) JP6312605B2 (enrdf_load_stackoverflow)
KR (1) KR20140117618A (enrdf_load_stackoverflow)
CN (1) CN104204914B (enrdf_load_stackoverflow)
AU (1) AU2013211968B2 (enrdf_load_stackoverflow)
BR (1) BR112014018456A8 (enrdf_load_stackoverflow)
CA (1) CA2862666A1 (enrdf_load_stackoverflow)
HK (1) HK1204680A1 (enrdf_load_stackoverflow)
RU (1) RU2629902C2 (enrdf_load_stackoverflow)
SG (1) SG11201404174SA (enrdf_load_stackoverflow)
TW (1) TWI616325B (enrdf_load_stackoverflow)
WO (1) WO2013112862A1 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102248847B1 (ko) 2015-06-01 2021-05-06 삼성전자주식회사 에너지 수확부를 구비한 콘택트 렌즈
US20170086676A1 (en) * 2015-09-24 2017-03-30 Johnson & Johnson Vision Care, Inc. Quantum-dot spectrometers for use in biomedical devices and methods of use
CN108205207A (zh) * 2016-12-16 2018-06-26 江苏海伦隐形眼镜有限公司 一种智能隐形眼镜的制作方法
EP3799562A4 (en) 2018-05-10 2022-05-18 Acucela Inc. Method and apparatus for treating refractive error of the eye
US11402662B2 (en) 2018-07-30 2022-08-02 Acucela Inc. Optical designs of electronic contact lens to decrease myopia progression
US11209672B1 (en) 2021-04-06 2021-12-28 Acucela Inc. Supporting pillars for encapsulating a flexible PCB within a soft hydrogel contact lens
US11366341B1 (en) 2021-05-04 2022-06-21 Acucela Inc. Electronic case for electronic spectacles

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0837190A (ja) * 1994-07-22 1996-02-06 Nec Corp 半導体装置
US6217171B1 (en) * 1998-05-26 2001-04-17 Novartis Ag Composite ophthamic lens
JP4172566B2 (ja) * 2000-09-21 2008-10-29 Ｔｄｋ株式会社 セラミック多層基板の表面電極構造及び表面電極の製造方法
EP1947501B1 (en) * 2002-08-09 2012-04-25 E-Vision, LLC Electro-active contact lens system
EP1760515A3 (en) * 2003-10-03 2011-08-31 Invisia Ltd. Multifocal ophthalmic lens
US20070090869A1 (en) * 2005-10-26 2007-04-26 Motorola, Inc. Combined power source and printed transistor circuit apparatus and method
CN101395520A (zh) * 2006-01-10 2009-03-25 E-视觉有限公司 包含可机械弯曲集成插件的电激活眼镜镜片的改进制造装置和方法
JP5011820B2 (ja) * 2006-05-24 2012-08-29 オムロン株式会社 積層デバイス、およびその製造方法
AR064985A1 (es) * 2007-01-22 2009-05-06 E Vision Llc Lente electroactivo flexible
BRPI0807560A2 (pt) * 2007-02-23 2014-07-01 Pixeloptics Inc Abertura oftálmica dinâmica
US9296158B2 (en) * 2008-09-22 2016-03-29 Johnson & Johnson Vision Care, Inc. Binder of energized components in an ophthalmic lens
US20100076553A1 (en) * 2008-09-22 2010-03-25 Pugh Randall B Energized ophthalmic lens
US8348424B2 (en) * 2008-09-30 2013-01-08 Johnson & Johnson Vision Care, Inc. Variable focus ophthalmic device
US9427920B2 (en) * 2008-09-30 2016-08-30 Johnson & Johnson Vision Care, Inc. Energized media for an ophthalmic device
US9375886B2 (en) * 2008-10-31 2016-06-28 Johnson & Johnson Vision Care Inc. Ophthalmic device with embedded microcontroller
WO2010082993A2 (en) * 2008-12-11 2010-07-22 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8137148B2 (en) * 2009-09-30 2012-03-20 General Electric Company Method of manufacturing monolithic parallel interconnect structure
SG186762A1 (en) * 2010-06-20 2013-02-28 Elenza Inc Ophthalmic devices and methods with application specific integrated circuits

Also Published As

Publication number Publication date
BR112014018456A2 (enrdf_load_stackoverflow) 2017-06-20
KR20140117618A (ko) 2014-10-07
SG11201404174SA (en) 2014-10-30
CN104204914A (zh) 2014-12-10
AU2013211968B2 (en) 2016-09-29
AU2013211968A1 (en) 2014-09-11
CA2862666A1 (en) 2013-08-01
RU2014134722A (ru) 2016-03-20
CN104204914B (zh) 2018-06-15
RU2629902C2 (ru) 2017-09-04
TW201341165A (zh) 2013-10-16
TWI616325B (zh) 2018-03-01
WO2013112862A1 (en) 2013-08-01
JP6312605B2 (ja) 2018-04-18
EP2807518A1 (en) 2014-12-03
JP2015510143A (ja) 2015-04-02
BR112014018456A8 (pt) 2017-07-11

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