HK1204680A1 - Stacked integrated component media insert for an ophthalmic device - Google Patents
Stacked integrated component media insert for an ophthalmic deviceInfo
- Publication number
- HK1204680A1 HK1204680A1 HK15105049.3A HK15105049A HK1204680A1 HK 1204680 A1 HK1204680 A1 HK 1204680A1 HK 15105049 A HK15105049 A HK 15105049A HK 1204680 A1 HK1204680 A1 HK 1204680A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- ophthalmic device
- integrated component
- media insert
- stacked integrated
- component media
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
- G02C7/00—Optical parts
- G02C7/02—Lenses; Lens systems ; Methods of designing lenses
- G02C7/04—Contact lenses for the eyes
-
- G—PHYSICS
- G02—OPTICS
- G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
- G02C7/00—Optical parts
- G02C7/02—Lenses; Lens systems ; Methods of designing lenses
- G02C7/08—Auxiliary lenses; Arrangements for varying focal length
- G02C7/081—Ophthalmic lenses with variable focal length
- G02C7/083—Electrooptic lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Ophthalmology & Optometry (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Eyeglasses (AREA)
- Prostheses (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/358,571 US9233513B2 (en) | 2011-03-18 | 2012-01-26 | Apparatus for manufacturing stacked integrated component media inserts for ophthalmic devices |
US13/358,577 US9914273B2 (en) | 2011-03-18 | 2012-01-26 | Method for using a stacked integrated component media insert in an ophthalmic device |
US13/358,575 US9889615B2 (en) | 2011-03-18 | 2012-01-26 | Stacked integrated component media insert for an ophthalmic device |
PCT/US2013/023182 WO2013112862A1 (en) | 2012-01-26 | 2013-01-25 | Stacked integrated component media insert for an ophthalmic device |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1204680A1 true HK1204680A1 (en) | 2015-11-27 |
Family
ID=47741261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK15105049.3A HK1204680A1 (en) | 2012-01-26 | 2015-05-28 | Stacked integrated component media insert for an ophthalmic device |
Country Status (12)
Country | Link |
---|---|
EP (1) | EP2807518A1 (en) |
JP (1) | JP6312605B2 (en) |
KR (1) | KR20140117618A (en) |
CN (1) | CN104204914B (en) |
AU (1) | AU2013211968B2 (en) |
BR (1) | BR112014018456A8 (en) |
CA (1) | CA2862666A1 (en) |
HK (1) | HK1204680A1 (en) |
RU (1) | RU2629902C2 (en) |
SG (1) | SG11201404174SA (en) |
TW (1) | TWI616325B (en) |
WO (1) | WO2013112862A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102248847B1 (en) * | 2015-06-01 | 2021-05-06 | 삼성전자주식회사 | Contact lens with an energy harvesting unit |
US20170086676A1 (en) * | 2015-09-24 | 2017-03-30 | Johnson & Johnson Vision Care, Inc. | Quantum-dot spectrometers for use in biomedical devices and methods of use |
CN108205207A (en) * | 2016-12-16 | 2018-06-26 | 江苏海伦隐形眼镜有限公司 | A kind of production method of intelligent invisible glasses |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0837190A (en) * | 1994-07-22 | 1996-02-06 | Nec Corp | Semiconductor device |
US6217171B1 (en) * | 1998-05-26 | 2001-04-17 | Novartis Ag | Composite ophthamic lens |
JP4172566B2 (en) * | 2000-09-21 | 2008-10-29 | Tdk株式会社 | Surface electrode structure of ceramic multilayer substrate and method of manufacturing surface electrode |
EP1546787A4 (en) * | 2002-08-09 | 2006-02-08 | E Vision Llc | Electro-active contact lens system |
EP1760515A3 (en) * | 2003-10-03 | 2011-08-31 | Invisia Ltd. | Multifocal ophthalmic lens |
US20070090869A1 (en) * | 2005-10-26 | 2007-04-26 | Motorola, Inc. | Combined power source and printed transistor circuit apparatus and method |
CN101395520A (en) * | 2006-01-10 | 2009-03-25 | E-视觉有限公司 | An improved device and method for manufacturing an electro-active spectacle lens involving a mechanically flexible integration insert |
JP5011820B2 (en) * | 2006-05-24 | 2012-08-29 | オムロン株式会社 | Multilayer device and manufacturing method thereof |
AR064985A1 (en) * | 2007-01-22 | 2009-05-06 | E Vision Llc | FLEXIBLE ELECTROACTIVE LENS |
AU2008218240B2 (en) * | 2007-02-23 | 2014-01-30 | E-Vision Smart Optics, Inc. | Ophthalmic dynamic aperture |
US20100076553A1 (en) * | 2008-09-22 | 2010-03-25 | Pugh Randall B | Energized ophthalmic lens |
US9296158B2 (en) * | 2008-09-22 | 2016-03-29 | Johnson & Johnson Vision Care, Inc. | Binder of energized components in an ophthalmic lens |
US9427920B2 (en) * | 2008-09-30 | 2016-08-30 | Johnson & Johnson Vision Care, Inc. | Energized media for an ophthalmic device |
US8348424B2 (en) * | 2008-09-30 | 2013-01-08 | Johnson & Johnson Vision Care, Inc. | Variable focus ophthalmic device |
US9375886B2 (en) * | 2008-10-31 | 2016-06-28 | Johnson & Johnson Vision Care Inc. | Ophthalmic device with embedded microcontroller |
EP2378956A4 (en) * | 2008-12-11 | 2017-12-27 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
US8137148B2 (en) * | 2009-09-30 | 2012-03-20 | General Electric Company | Method of manufacturing monolithic parallel interconnect structure |
CN103037790A (en) * | 2010-06-20 | 2013-04-10 | 伊兰扎公司 | Ophthalmic devices and methods with application specific integrated circuits |
-
2013
- 2013-01-25 RU RU2014134722A patent/RU2629902C2/en not_active IP Right Cessation
- 2013-01-25 SG SG11201404174SA patent/SG11201404174SA/en unknown
- 2013-01-25 AU AU2013211968A patent/AU2013211968B2/en not_active Ceased
- 2013-01-25 TW TW102103007A patent/TWI616325B/en not_active IP Right Cessation
- 2013-01-25 BR BR112014018456A patent/BR112014018456A8/en not_active IP Right Cessation
- 2013-01-25 CA CA2862666A patent/CA2862666A1/en not_active Abandoned
- 2013-01-25 JP JP2014554864A patent/JP6312605B2/en active Active
- 2013-01-25 WO PCT/US2013/023182 patent/WO2013112862A1/en active Application Filing
- 2013-01-25 CN CN201380016979.5A patent/CN104204914B/en not_active Expired - Fee Related
- 2013-01-25 KR KR1020147023652A patent/KR20140117618A/en not_active Application Discontinuation
- 2013-01-25 EP EP13705295.7A patent/EP2807518A1/en not_active Withdrawn
-
2015
- 2015-05-28 HK HK15105049.3A patent/HK1204680A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP2807518A1 (en) | 2014-12-03 |
BR112014018456A2 (en) | 2017-06-20 |
JP6312605B2 (en) | 2018-04-18 |
BR112014018456A8 (en) | 2017-07-11 |
TW201341165A (en) | 2013-10-16 |
SG11201404174SA (en) | 2014-10-30 |
AU2013211968B2 (en) | 2016-09-29 |
CN104204914A (en) | 2014-12-10 |
CA2862666A1 (en) | 2013-08-01 |
AU2013211968A1 (en) | 2014-09-11 |
WO2013112862A1 (en) | 2013-08-01 |
TWI616325B (en) | 2018-03-01 |
KR20140117618A (en) | 2014-10-07 |
RU2629902C2 (en) | 2017-09-04 |
CN104204914B (en) | 2018-06-15 |
JP2015510143A (en) | 2015-04-02 |
RU2014134722A (en) | 2016-03-20 |
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