TWI610465B - 發光二極體組件及製作方法 - Google Patents

發光二極體組件及製作方法 Download PDF

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Publication number
TWI610465B
TWI610465B TW102136176A TW102136176A TWI610465B TW I610465 B TWI610465 B TW I610465B TW 102136176 A TW102136176 A TW 102136176A TW 102136176 A TW102136176 A TW 102136176A TW I610465 B TWI610465 B TW I610465B
Authority
TW
Taiwan
Prior art keywords
light
emitting diode
led
phosphor layer
phosphor
Prior art date
Application number
TW102136176A
Other languages
English (en)
Chinese (zh)
Other versions
TW201515279A (zh
Inventor
Tzer Perng Chen
陳澤澎
Tzu Chi Cheng
鄭子淇
Original Assignee
Epistar Corporation
晶元光電股份有限公司
KAISTAR Lighting (Xiamen) Co., Ltd
大陸商開發晶照明（廈門）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epistar Corporation, 晶元光電股份有限公司, KAISTAR Lighting (Xiamen) Co., Ltd, 大陸商開發晶照明（廈門）有限公司 filed Critical Epistar Corporation
Priority to TW102136176A priority Critical patent/TWI610465B/zh
Priority to US14/493,940 priority patent/US9502622B2/en
Priority to CN201811586001.3A priority patent/CN110071205B/zh
Priority to CN201410507440.6A priority patent/CN104517947B/zh
Priority to CN201811583441.3A priority patent/CN110047823A/zh
Priority to JP2014205343A priority patent/JP6581766B2/ja
Publication of TW201515279A publication Critical patent/TW201515279A/zh
Priority to US15/297,554 priority patent/US9947839B2/en
Application granted granted Critical
Publication of TWI610465B publication Critical patent/TWI610465B/zh
Priority to US15/955,652 priority patent/US10319886B2/en
Priority to US16/436,472 priority patent/US10910528B2/en
Priority to JP2019124909A priority patent/JP7015278B2/ja
Priority to US17/164,750 priority patent/US11450791B2/en
Priority to US17/947,948 priority patent/US11949050B2/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
TW102136176A 2013-10-07 2013-10-07 發光二極體組件及製作方法 TWI610465B (zh)

Priority Applications (12)

Application Number Priority Date Filing Date Title
TW102136176A TWI610465B (zh) 2013-10-07 2013-10-07 發光二極體組件及製作方法
US14/493,940 US9502622B2 (en) 2013-10-07 2014-09-23 LED assembly
CN201811586001.3A CN110071205B (zh) 2013-10-07 2014-09-28 发光二极管组件及制作方法
CN201410507440.6A CN104517947B (zh) 2013-10-07 2014-09-28 发光二极管组件及制作方法
CN201811583441.3A CN110047823A (zh) 2013-10-07 2014-09-28 发光二极管组件及制作方法
JP2014205343A JP6581766B2 (ja) 2013-10-07 2014-10-06 発光ダイオードモジュール及びその製造方法
US15/297,554 US9947839B2 (en) 2013-10-07 2016-10-19 LED assembly
US15/955,652 US10319886B2 (en) 2013-10-07 2018-04-17 LED assembly for omnidirectional light appliances
US16/436,472 US10910528B2 (en) 2013-10-07 2019-06-10 LED assembly
JP2019124909A JP7015278B2 (ja) 2013-10-07 2019-07-04 発光ダイオードモジュール及びその製造方法
US17/164,750 US11450791B2 (en) 2013-10-07 2021-02-01 LED assembly for omnidirectional light applications
US17/947,948 US11949050B2 (en) 2013-10-07 2022-09-19 LED assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102136176A TWI610465B (zh) 2013-10-07 2013-10-07 發光二極體組件及製作方法

Publications (2)

Publication Number Publication Date
TW201515279A TW201515279A (zh) 2015-04-16
TWI610465B true TWI610465B (zh) 2018-01-01

Family

ID=52776260

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102136176A TWI610465B (zh) 2013-10-07 2013-10-07 發光二極體組件及製作方法

Country Status (4)

Country Link
US (6) US9502622B2 (https=)
JP (2) JP6581766B2 (https=)
CN (3) CN110071205B (https=)
TW (1) TWI610465B (https=)

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US11085591B2 (en) 2014-09-28 2021-08-10 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11073248B2 (en) 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11997768B2 (en) * 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11421827B2 (en) 2015-06-19 2022-08-23 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US20220078892A1 (en) * 2014-09-28 2022-03-10 Zhejiang Super Lighting Electric Appliance Co.,Ltd Led filament and led light bulb
US12313227B2 (en) 2014-09-28 2025-05-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11525547B2 (en) 2014-09-28 2022-12-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11543083B2 (en) * 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US12007077B2 (en) 2014-09-28 2024-06-11 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
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TWI568038B (zh) * 2015-07-17 2017-01-21 開發晶照明（廈門）有限公司 發光裝置複合基板及具有該發光裝置複合基板的led模組
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DE102017112642A1 (de) * 2017-06-08 2018-12-13 Osram Opto Semiconductors Gmbh Led-filament
KR20190101787A (ko) 2018-02-23 2019-09-02 서울반도체 주식회사 개선된 연색성을 갖는 led 조명 장치 및 led 필라멘트
US10982048B2 (en) 2018-04-17 2021-04-20 Jiaxing Super Lighting Electric Appliance Co., Ltd Organosilicon-modified polyimide resin composition and use thereof
US10828962B2 (en) * 2018-07-13 2020-11-10 Simpson Performance Products, Inc. Compact cooling system for vehicle operators
CN109148402B (zh) * 2018-08-29 2020-09-15 开发晶照明（厦门）有限公司 发光二极管封装结构及其制造方法
CN110335931B (zh) * 2019-07-05 2020-12-01 开发晶照明（厦门）有限公司 光电器件及其制作方法
TWI712188B (zh) * 2019-11-13 2020-12-01 隆達電子股份有限公司 發光封裝結構及其製造方法
EP4146979B1 (en) * 2020-05-07 2023-08-30 Signify Holding B.V. An led filament and a lamp
JP1701505S (https=) 2021-01-20 2021-12-06
JP1712335S (ja) 2021-01-20 2022-04-12 発光素子モジュール
JP1701619S (https=) * 2021-01-20 2021-12-06
USD1089808S1 (en) 2021-01-20 2025-08-19 Hamamatsu Photonics K.K. Light-emitting element module
USD1083850S1 (en) 2021-01-20 2025-07-15 Hamamatsu Photonics K.K. Light-emitting element module
TWI801122B (zh) * 2022-01-28 2023-05-01 友達光電股份有限公司 封裝結構及其製造方法

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Also Published As

Publication number Publication date
US20170040504A1 (en) 2017-02-09
CN110071205A (zh) 2019-07-30
US10910528B2 (en) 2021-02-02
JP6581766B2 (ja) 2019-09-25
US10319886B2 (en) 2019-06-11
US20230012204A1 (en) 2023-01-12
TW201515279A (zh) 2015-04-16
US11949050B2 (en) 2024-04-02
CN104517947B (zh) 2019-01-18
JP2019197906A (ja) 2019-11-14
US20180233635A1 (en) 2018-08-16
US9947839B2 (en) 2018-04-17
US20150097199A1 (en) 2015-04-09
US20190296198A1 (en) 2019-09-26
CN104517947A (zh) 2015-04-15
JP7015278B2 (ja) 2022-02-02
CN110047823A (zh) 2019-07-23
JP2015076612A (ja) 2015-04-20
US11450791B2 (en) 2022-09-20
CN110071205B (zh) 2022-04-26
US20210151640A1 (en) 2021-05-20
US9502622B2 (en) 2016-11-22

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