JP6581766B2 - 発光ダイオードモジュール及びその製造方法 - Google Patents

発光ダイオードモジュール及びその製造方法 Download PDF

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Publication number
JP6581766B2
JP6581766B2 JP2014205343A JP2014205343A JP6581766B2 JP 6581766 B2 JP6581766 B2 JP 6581766B2 JP 2014205343 A JP2014205343 A JP 2014205343A JP 2014205343 A JP2014205343 A JP 2014205343A JP 6581766 B2 JP6581766 B2 JP 6581766B2
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emitting diode
fluorescent powder
light emitting
light
powder layer
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Japanese (ja)
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JP2015076612A5 (https=
JP2015076612A (ja
Inventor
パーン，チェン ジャー
パーン，チェン ジャー
チ，チョン ジュ
チ，チョン ジュ
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Epistar Corp
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Epistar Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

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  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
JP2014205343A 2013-10-07 2014-10-06 発光ダイオードモジュール及びその製造方法 Active JP6581766B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW102136176 2013-10-07
TW102136176A TWI610465B (zh) 2013-10-07 2013-10-07 發光二極體組件及製作方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019124909A Division JP7015278B2 (ja) 2013-10-07 2019-07-04 発光ダイオードモジュール及びその製造方法

Publications (3)

Publication Number Publication Date
JP2015076612A JP2015076612A (ja) 2015-04-20
JP2015076612A5 JP2015076612A5 (https=) 2017-11-16
JP6581766B2 true JP6581766B2 (ja) 2019-09-25

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Family Applications (2)

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JP2014205343A Active JP6581766B2 (ja) 2013-10-07 2014-10-06 発光ダイオードモジュール及びその製造方法
JP2019124909A Active JP7015278B2 (ja) 2013-10-07 2019-07-04 発光ダイオードモジュール及びその製造方法

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JP2019124909A Active JP7015278B2 (ja) 2013-10-07 2019-07-04 発光ダイオードモジュール及びその製造方法

Country Status (4)

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US (6) US9502622B2 (https=)
JP (2) JP6581766B2 (https=)
CN (3) CN110071205B (https=)
TW (1) TWI610465B (https=)

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Also Published As

Publication number Publication date
US20170040504A1 (en) 2017-02-09
CN110071205A (zh) 2019-07-30
US10910528B2 (en) 2021-02-02
TWI610465B (zh) 2018-01-01
US10319886B2 (en) 2019-06-11
US20230012204A1 (en) 2023-01-12
TW201515279A (zh) 2015-04-16
US11949050B2 (en) 2024-04-02
CN104517947B (zh) 2019-01-18
JP2019197906A (ja) 2019-11-14
US20180233635A1 (en) 2018-08-16
US9947839B2 (en) 2018-04-17
US20150097199A1 (en) 2015-04-09
US20190296198A1 (en) 2019-09-26
CN104517947A (zh) 2015-04-15
JP7015278B2 (ja) 2022-02-02
CN110047823A (zh) 2019-07-23
JP2015076612A (ja) 2015-04-20
US11450791B2 (en) 2022-09-20
CN110071205B (zh) 2022-04-26
US20210151640A1 (en) 2021-05-20
US9502622B2 (en) 2016-11-22

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