TWI607873B - 樹脂與異質材料的複合體的製造方法 - Google Patents

樹脂與異質材料的複合體的製造方法 Download PDF

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TWI607873B
TWI607873B TW102139174A TW102139174A TWI607873B TW I607873 B TWI607873 B TW I607873B TW 102139174 A TW102139174 A TW 102139174A TW 102139174 A TW102139174 A TW 102139174A TW I607873 B TWI607873 B TW I607873B
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resin
heterogeneous material
composite
micropores
heterogeneous
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TW201515843A (zh
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劉咸柱
韓家偉
劉沙沙
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鴻海精密工業股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0078—Measures or configurations for obtaining anchoring effects in the contact areas between layers
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    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
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    • B32—LAYERED PRODUCTS
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    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
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    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/05—Interconnection of layers the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486—Details, accessories and auxiliary operations
    • B29C2045/14868—Pretreatment of the insert, e.g. etching, cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486—Details, accessories and auxiliary operations
    • B29C2045/14868—Pretreatment of the insert, e.g. etching, cleaning
    • B29C2045/14885—Pretreatment of the insert, e.g. etching, cleaning by plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B29K2101/12—Thermoplastic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2398/00—Unspecified macromolecular compounds
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2509/00—Household appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2605/00—Vehicles
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
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Description

樹脂與異質材料的複合體的製造方法
本發明涉及一種樹脂與異質材料的複合體的製造方法。
在實際應用中，常常需要將樹脂與異質材料進行連接形成複合體。
先前的樹脂與異質材料連接方法之一是採用黏接劑進行黏合，但藉由黏接劑黏合的方法無法制得高強度的異質材料與樹脂的複合體。另一種連接方法是先在異質材料件表面成孔，然後將異質材料件放入模具內，注射樹脂與異質材料件結合為一體。在異質材料件表面成孔的方法包括化學蝕刻與聚焦離子束蝕刻等方式。
雖然化學蝕刻能夠快速且大量生產，需要使用大量的化學藥劑，不符合現代環保生產的理念；雖然聚焦離子束蝕刻能夠避免大量化學藥品的使用，且具有優異的納米陣列圖形製作能力，但其製作時必須配合真空環境，因此並不適宜投入量產使用，同時其低加工速度亦不能負荷大面積的加工需求。
有鑒於此，有必要提供一種環保的、適合量產的樹脂與異質材料的複合體的製造方法。
本發明提供一種樹脂與異質材料的複合體的製造方法，包括：提供由異質材料製成的異質材料件，該異質材料件選自金屬、合金、陶瓷、玻璃以及其組合構成的組件；對該異質材料件進行脫脂除油清洗；利用納米壓印在異質材料件表面形成具有多個定位孔的光致抗蝕劑層；利用電漿蝕刻於異質材料件表面蝕刻出多個微孔，同時對該光致抗蝕劑層進行蝕刻並將其移除；將異質材料件置於一成型模具中加熱；將樹脂加熱並加壓注塑與異質材料件的表面接觸，樹脂侵入到異質材料件表面的微孔中以與金屬件結合。
相較於先前技術，上述樹脂與異質材料的複合體的製作方法藉由納米壓印與電漿蝕刻的方法刻蝕出微孔，可有效減少化學藥劑的使用量，降低製作過程的危害性，因而較為環保。同時，利用電漿蝕刻來蝕刻出微孔，可降低加工難度，且不需使用真空設備，更適合量產。
10‧‧‧異質材料與樹脂的複合體
100‧‧‧異質材料件
200‧‧‧光致抗蝕劑層
300‧‧‧樹脂
201‧‧‧定位孔
111‧‧‧微孔
110‧‧‧表面
圖1為本發明提供的樹脂與異質材料的複合體的製造方法的流程圖。
圖2為本發明提供的樹脂與異質材料的複合體的製造方法的示意圖。
圖3為樹脂與異質材料的複合體的剖面圖。
請參閱圖1，本發明較佳實施例的樹脂與異質材料的複合體的製造方法主要包括如下步驟： 步驟S01：請同時參閱圖2(A)，提供一成型的異質材料件100。該異質材料選自金屬、合金、陶瓷、玻璃以及其組合構成的組件，在本實施方式中，該異質材料為金屬，異質材料件100可藉由機械加工、鑄造的方式形成。
步驟S02：對異質材料件100進行脫脂除油清洗。該脫脂除油清洗主要包括將所述異質材料件100浸漬於含脫脂劑的水溶液中。所述脫脂劑可為常見的金屬脫脂劑，該脫脂劑的濃度可為90~150g/L。浸漬時，所述脫脂劑的水溶液的溫度優選在20~30℃之間。該浸漬的時間優選為1~6分鐘。脫脂處理後對所述異質材料件100進行水洗。
步驟S03：請同時參閱圖2(B)，利用納米壓印在異質材料件100的表面110形成具有多個定位孔201的光致抗蝕劑層200。
該步驟具體為：首先，在異質材料件100的表面110上塗覆一層光致抗蝕劑層200，光致抗蝕劑層200可為熱固化形或光固化形光致抗蝕劑。然後，利用一模仁(圖未示)用納米壓印的方法在光致抗蝕劑層200上形成多個定位孔201。優選地，定位孔201呈均勻陣列狀排列。定位孔201可貫穿光致抗蝕劑層200，也可僅位於部分光致抗蝕劑層200中。
步驟S04：請同時參閱圖2(C)，利用電漿蝕刻在異質材料件100的表面110上形成多個微孔111，同時移除光致抗蝕劑層200。
該步驟具體為：在常壓下，利用電漿蝕刻對光致抗蝕劑層200進行大範圍的非等向性蝕刻，使異質材料件100的表面110在對應定位孔201處形成多個微孔111，同時，利用電漿蝕刻移除光致抗蝕 劑層200。其中，電漿源可採用氬氣等一般常見的氣體。由於微孔111位於先前形成的定位孔201的下方，優選地，微孔111亦呈均勻陣列狀排列，以提高異質材料與樹脂之間黏附力的均勻性。
在本實施方式中，微孔111的直徑優選為50nm~500nm，孔徑寬深比優選為1：1~1：10。當然，微孔111的尺寸並不限於此，使用不同的模仁可制得不同尺寸的微孔111。
步驟S05：將異質材料件100嵌入到一成型模具中，並加熱異質材料件100。優選地，異質材料件100被加熱至100~350℃。該加熱的方式可為電磁感應加熱。
步驟S06：請同時參閱圖2(D)與圖3，在所述加熱的模具中注射熔融的樹脂300，樹脂300侵入異質材料件100的表面110的微孔111，冷卻後，樹脂300與異質材料件100結合於一體，即獲得異質材料與樹脂的複合體10。樹脂300採用結晶型熱塑性樹脂，例如聚苯硫醚(PPS)與玻璃纖維的混合物、聚醯胺(PA)、聚對苯二甲酸乙二醇酯(PET)或聚對苯二甲酸丁二醇酯(PBT)。若為聚苯硫醚與玻璃纖維的混合物時，其中玻璃纖維的品質百分含量優選為20~50%。
上述異質材料與樹脂的複合體的製造方法藉由納米壓印與電漿蝕刻的方法刻蝕出微孔，注射樹脂後熔融的樹脂侵入到微孔中而與異質材料件相結合，從而增強了樹脂與異質材料件的結合力。相較於化學蝕刻的方法，該方法有效減少了化學藥劑的使用量，可降低製作過程的危害性，因而較為環保；同時，該方法還適用於多種異質材料，並不限於金屬，技術應用的自由度較高。另外，相較於聚焦離子束的方法，該方法利用電漿蝕刻的方式來蝕刻微 孔，可於常壓下大面積同步蝕刻微孔，適宜進行大面積加工，加工更快速；並且，不需使用真空設備，可降低加工難度，因此，該方法更適合量產。
10‧‧‧異質材料與樹脂的複合體
100‧‧‧異質材料件
200‧‧‧光致抗蝕劑層
300‧‧‧樹脂
201‧‧‧定位孔
111‧‧‧微孔
110‧‧‧表面

Claims (7)

  1. 一種樹脂與異質材料的複合體的製造方法，其包括如下步驟：提供一成型的異質材料件，該異質材料件選自金屬、合金、陶瓷、玻璃以及其組合構成的組件；對該異質材料件進行脫脂除油清洗；利用納米壓印在異質材料件的表面形成具有多個定位孔的光致抗蝕劑層；利用電漿蝕刻於異質材料件的表面蝕刻出多個微孔，同時對該光致抗蝕劑層進行蝕刻並將該光致抗蝕劑層移除；將異質材料件置於一成型模具中加熱；將樹脂加熱並加壓注塑與異質材料件的表面接觸，樹脂侵入到異質材料件的表面的微孔中以與異質材料件結合。
  2. 如請求項第1項所述的樹脂與異質材料的複合體的製造方法，其中該樹脂為結晶型熱塑性樹脂。
  3. 如請求項第1項所述的樹脂與異質材料的複合體的製造方法，其中該微孔的直徑為50nm~500nm，孔徑寬深比為1：1~1：10。
  4. 如請求項第1項所述的樹脂與異質材料的複合體的製造方法，其中該微孔呈均勻陣列狀排列。
  5. 如請求項第1項所述的樹脂與異質材料的複合體的製造方法，其中該電漿蝕刻步驟是在常壓下進行的非等向性蝕刻。
  6. 如請求項第1項所述的樹脂與異質材料的複合體的製造方法，其中該納米壓印步驟包括：先在異質材料件的表面塗覆一層光致抗蝕劑層，再利用納米壓印在光致抗蝕劑層中形成多個定位孔。
  7. 如請求項第6項所述的樹脂與異質材料的複合體的製造方法，其中該定位孔呈均勻陣列狀排列。
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