1259827 九、發明說明： 【發明戶斤屬之技術領域3 發明背景 1 ·發明領域： 5 本發明係與形成一凹凸圖案的方法與利用該方法之凹 凸圖案形成裝置有關。 【先前技術3 2·相關技藝的描述： 運用曝光照相微影術製程已經被應用於微機械加工 1〇同度整合積體電路裝置和光學裝置、高記錄密度記錄媒 體、以及其等之類似物。照相微影術技術雖然一次可以微 機械加工一很大面積，但其在利用光時會因為其等無法達 到比光的波長更低的解析力，而在製造例如1〇〇 nm或更 小之微小結構方面會遇上困難。雖然例如電子束微影術與 15聚焦離子微影術等之技術，可被用來機器加工100 nm或 更小的結構，其等需要較長的時間才能機器加工一較大的 面積’因而造成一較低的產能。 因此 種叫做”奈米壓印”機械加工技術係被計劃 用來在高產能下製造一具有比光的波長更小之微小結構 2〇|參見日本專利申請案帛2咖-284136號）。該奈米壓印技 *匕括先藉著電子束微影術或其之類似技術，在一主板上 形成一預定的微小凹凸圖案，然後將該主板與一塗覆以光 阻或其之類似物的基材接觸’以將在該主板上的凹凸圖案 轉印到該光阻薄膜上。 、 1259827 傳統的奈米壓印製程 2〇〇〇 2841^ ^ ^ > π曰本專利申請案第 例36勸㈣—™。首先，-，口二魏鈦複合材料溶液㈣㈣被旋轉 化矽製成的基材上，接著形， . 由三氧化鈦複合材料所構 成的轉印溥膜。然後，一形忐古 ^ 形成有凹凸圖案的主板係被壓印 至4轉印薄膜内，因而一包 匕3有该轉印薄膜的材料係被導 入在主板上的凹槽内。鈇接， ”、、4该轉印薄膜係被熱處理以將 该轉印薄膜凝結並舆主板分貼 ^ ，、主扳刀開。則述的製程會提供形成有 10 15 -微小凹凸圖案之係為二維結構之光子晶體。 當上述的製程被用來製造-具有微小凹凸圖案之結 構的時候，會出現下列各項問題。 當-主板與-基材擠遂接觸的時候，該主板必須要以 較高壓力均勾一致地壓在一轉印薄膜上。換句話說，如果 壓力未被均勾地施加於該主板時或僅是施加一較低的壓力 時’該轉印薄膜將無法被推擠至主板上的一些凹槽中，而 造成該圖案中的一些區域沒被轉印。 同樣地，§ 一主板2如第1圖所示的在一般環境下 與β基材1擠壓接觸的時候，由於大氣的—個基材工進 入壓力之内被帶接觸的時候，空氣5會侷限在轉印薄膜3 牙主板2之間，也就是，在主板2上的一凹槽4中而阻 止光阻或其等之類似物被導入凹槽4之内，因而無法形 成一所需的凹凸圖案並造成一轉印缺陷。 此外，其必須要將該主板和基材處理成具有平坦表 面，並將該基材的主要表面以平行於該主板的主要表面來 20 1259827 施壓。明確地說，如果該主板的主要表面係如第i圖中所 示的傾斜地壓在該基材的主要表面上，該主板和基材變形 而產生一會致使δ玄主板和基材碎裂的應力。 除此之外’因為欲被轉印的圖案係非常微小，該主板 5的一微幅變形都將致使該轉印圖案變形。在上述的 法中，因為該主板係以較高壓力壓印在基材上，該主板必 須要以能夠抵抗應力誘發的形變之材料所製成。 本發明提供一種用於解決上述問題的方案。1259827 IX. Description of the Invention: [Technical Field of Invention] 3 BACKGROUND OF THE INVENTION 1. Field of the Invention: The present invention relates to a method of forming a concave-convex pattern and a concave-convex pattern forming apparatus using the same. [Previous Technology 3 2 Description of Related Art: The use of the exposure photographic lithography process has been applied to micromachining, isotactic integrated integrated circuit devices and optical devices, high recording density recording media, and the like. . Although photographic micro-machining technology can micro-machine a large area at a time, when it uses light, it cannot achieve a resolution lower than the wavelength of light, and is manufactured at, for example, 1 〇〇 nm or less. Small structures will encounter difficulties. Although techniques such as electron beam lithography and 15 focused ion lithography can be used to machine structures of 100 nm or less, it takes a long time to machine a larger area' A lower capacity. Therefore, the so-called "nano embossing" machining technology is planned to produce a minute structure having a wavelength smaller than that of light at a high productivity. 2 〇 Japanese Patent Application Laid-Open No. Hei No. 284136. The nanoimprint technique includes first forming a predetermined micro concave-convex pattern on a main board by electron beam lithography or the like, and then coating the main board with a photoresist or the like. The substrate of the object contacts 'to transfer the relief pattern on the main board to the photoresist film. 1259827 Traditional nanoimprinting process 2〇〇〇 2841^ ^ ^ > π曰 Patent application Example 36 persuasion (4)-TM. First, -, the di-Wu titanium composite solution (4) (4) is rotated on the substrate made of ruthenium, followed by the shape, the transfer ruthenium film composed of the titanium oxide composite material. Then, the main board formed with the concave-convex pattern is imprinted into the 4 transfer film, so that a material of the transfer film 3 is guided into the groove on the main board.鈇,,,, 4, the transfer film is heat treated to condense the transfer film and affix the main board to the main board, and the main process is provided. A photonic crystal of a two-dimensional structure. When the above process is used to fabricate a structure having a fine concave-convex pattern, the following problems occur. When the motherboard is in contact with the substrate, the motherboard must be Pressing at a higher pressure uniformly on a transfer film. In other words, if the pressure is not uniformly applied to the main board or only a lower pressure is applied, the transfer film will not be Pushing into some of the grooves on the main board, causing some areas of the pattern not to be transferred. Similarly, a main board 2 is pressed into contact with the β substrate 1 in a general environment as shown in Fig. 1. At the time, since the atmosphere-based substrate worker is brought into contact with the pressure, the air 5 is confined between the transfer film 3 teeth main board 2, that is, in a groove 4 on the main board 2 Preventing the photoresist or the like from being introduced into the recess 4, Therefore, a desired concavo-convex pattern cannot be formed and a transfer defect is caused. Further, it is necessary to process the main board and the substrate to have a flat surface, and the main surface of the substrate is parallel to the main surface of the main board. 20 1259827 Pressure. Specifically, if the main surface of the main board is pressed obliquely on the main surface of the substrate as shown in Fig. i, the main board and the substrate are deformed to cause a δ 玄 motherboard and The stress of the substrate is broken. In addition, because the pattern to be transferred is very small, a slight deformation of the main board 5 will cause the transfer pattern to be deformed. In the above method, because the main board is Imprinted on the substrate at a relatively high pressure, the main board must be made of a material capable of resisting stress-induced deformation. The present invention provides a solution for solving the above problems.
C 明内J 10 發明摘要 15 依據本發明的一第一特徵之凹凸圖案形成方法之特 徵在於其包含有以下步驟，提供一基材與在—主要表面上 -有凹凸圖案之主板’以—結構層形成該主板的主要表 面’該結構層係由具有對該基材之黏著力係大於對該主板 =著力的材料所製成，將該主板的主要表面與該基材的 主要表面緊密接觸，並將該主板自該基材分離。 徵在；:：本發明的另一特徵之複層結構形成方法的特 政在於其包含有重複包括有 Α ^ W又主夕兩次，提供一 土材與在-主要表面上具有_ 層形成該主板的主要^ ^ 板’以一結構 孜的主要表面，該結構層係由具有對 = 力的材_成，_板 該基材分離Γ 要表刚接觸，並將該主板自 20 1259827 依據本發明的—進—步特徵之凹凸圖 特徵在於其包含有以下構件 乂衣的 表面上具有一凹凸圖宰之 材與在一主要 ㈡累之主板的構件，用於 5 10 成該主板的主要表面，、，。構層形 之為^^ 該結構層係由具有對該基材 兮係大於對該主板之黏著力的材料所製成，用於將 从 要表面緊密接觸之附著構 ’以及用於將該主板自該基材分離的分離構件。 圖式簡要說明 第1圖是顯示-傳統奈米壓印方法之部份放大剖面 圖； 第2A〜2C圖是顯示一依昭太恭aa λα + 很照本發明的方法之凹凸圖案 形成方法的部份放大剖面圖； 第3圖是用於依照本發明的凹凸圖案形成方法之主 板的部份放大剖面圖； L5 帛4較用於依照本發明的凹凸圖案形成方法之主 板的部份放大剖面圖； 第5A 5C圖顯示對於依照本發明的凹凸圖案形成方 法之典型的修改之部份放大剖面圖； 第6圖顯不對於依照本發明的凹凸圖案形成方法之 20典型的修改之部份放大剖面圖； 第7A〜7C圖顯示對於依照本發明的凹凸圖案形成方 法之典型的修改之部份放大剖面圖； 第8 A〜8E圖顯示對於依照本發明的凹凸圖案形成方 法之典型的修改之部份放大剖面圖； 1259827 凹凸圖案形成方 的凹凸圖案形成 第9A〜9F目顯示對於依照本發明的 法之典型的修改之部份放大剖面圖； 第10A〜10D目蒸員示對於依照本發明 方法之典型的修改之部份放大剖面圖；且 第11A〜11F圖顯示利用/ 依々本發明的凹凸圖案形成 方法之-磁性記錄碟的製造之部份放大剖面圖。 【實施方式;J 發明詳述C 明内 J 10 SUMMARY OF THE INVENTION The concave-convex pattern forming method according to a first feature of the present invention is characterized in that it comprises the steps of providing a substrate and a main board having a concave-convex pattern on the main surface The layer forms a major surface of the main board. The structural layer is made of a material having a bonding force to the substrate greater than that of the main board, and the main surface of the main board is in close contact with the main surface of the substrate. And separating the motherboard from the substrate. The special rule of the method for forming a multi-layer structure according to another feature of the present invention is that it comprises a repeat comprising Α ^ W and a main eve twice, providing a soil material and having a _ layer formation on the main surface The main board of the main board is a main surface of a structure, the structure layer is made of a material having a pair of force_, the board is separated from the substrate, and the board is just in contact with the board, and the board is based on 20 1259827. The embossing feature of the progressive feature of the present invention is characterized in that it comprises a embossed material on the surface of the following component and a component of a main (two) tired motherboard for the main component of the motherboard. surface,,,. The structural layer is formed by a material having a bonding force to the substrate that is greater than the adhesion to the main plate, and is used for attaching the structure to be in close contact with the surface and for the motherboard A separating member separated from the substrate. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial enlarged cross-sectional view showing a conventional nanoimprint method; FIGS. 2A to 2C are diagrams showing a method for forming a concave-convex pattern according to the method of the present invention. Partially enlarged cross-sectional view; Fig. 3 is a partially enlarged cross-sectional view of a main board for a concave-convex pattern forming method according to the present invention; L5 帛4 is a partially enlarged cross-section of a main board for a concave-convex pattern forming method according to the present invention Figure 5A is a partially enlarged cross-sectional view showing a modification of the concave-convex pattern forming method according to the present invention; Figure 6 is a partial enlarged view of a typical modification of the concave-convex pattern forming method according to the present invention. FIG. 7A to 7C are partial enlarged cross-sectional views showing a modification of the concave-convex pattern forming method according to the present invention; FIGS. 8A to 8E are diagrams showing a typical modification of the concave-convex pattern forming method according to the present invention. Partially enlarged cross-sectional view; 1259827 concave-convex pattern forming concave-convex pattern forming 9A-9F showing partial enlarged sectional view of a typical modification of the method according to the present invention 10A to 10D are partially enlarged cross-sectional views showing typical modifications of the method according to the present invention; and FIGS. 11A to 11F are views showing the manufacture of a magnetic recording disk using the concave-convex pattern forming method of the present invention. Partially enlarged section view. [Embodiment; J invention details
一依照本發明的凹凸圖牵 口茶I成方法的具體例以及一 10 利用其之凹凸圖案形成梦罟，收人& 衷置將會參照隨附的圖式而被詳 細地描述 如第2圖所示’―結構層7係被形成於—主板6的 主要表面上，該主板6在其之主要表面上具有-凹凸圖案 (第2A圖）。 15 4主板6純佳地是由—化學穩定的材料所製成， 牛例來Λ例如氧切、氧化銘和其等之類似物的金屬氧 物口金i鋼石、陶究、石英玻璃、碳酸納玻璃和其 等犧物的玻璃材料、樹脂材料，以及其等之類似物。 同日守主板6係較佳地具有_適當的機械強度。如在稍後 20將要々田述的，當該主板6係被加以自分離一結構層時，該 主板6係較佳地具有耐熱性和_低熱膨脹係數。該 主板可 以具有透光性，也就是，光透明性質。藉著例示說明的方 式，该主板6係被形成為具有寬度小於100 rim層級的凹 1259827 避免由於在主板上的凹槽中空氣未被完全以該材料替換而 導致形成有缺陷圖案。 ^同樣的，該主板可以在該結構層形成時被加熱。舉例 來祝’當該結構層係藉由_旋轉塗敷方法而沈積時，加熱 ^主板可以減少形該結構層材料的黏性，因而有助於該材 料填充於該主板上的凹槽。 队丄议％风…人叫工双〇的主要 表面係與違基# 8的主要表面接觸，因而使得該結構層7 10 15 與基材/接觸，如第2Β圖所示。絲材8係由諸如氧 化石夕、氧化㈣其等之類似物之金屬氧化物、合金、陶究、 破璃、例如丙稀酸酯、聚碳酸醋、聚酯之樹脂材料或其等 之類似物等等材料所製成。 η俅吧，琢暴材 、 W料戶斤衣 成，更佳地係由一具有大的機械強度之材料所製成。除此 之外，該基材8可以是光學透明的。並且，該主板6係 較佳地在真空下與該基# 8緊密接觸。這是因為其之避免 來自於位被移除並維持在該主板 ^ 双〇和该基材8之間的空 氣所造成之該主板6與基材8之τ — ¥ * 土何s之不完美黏附現象之能 力0 在該主板6與該基材8維持緊密接觸—段時間，以 將結構層7黏附至該基材8之後，該主板6係自該基材 8分離。因為該結 7所具有之對於該基材的黏著力係 大於對於該主板6_著力，該結構層7餘主板6分 20 1259827 離並置放於該基材8上，而使得凹凸圖案形成在基材$ 上（弟2C圖）。 上述具體例會利用該結構層所具有之大於對於該主 板的黏著力之對於該基材的黏著力，而不是如同傳統所運 5用之將該主板與該基材擠壓接觸以使得在該主板上的圖案 壓入轉印薄膜内以轉印該圖案。換句話說，因為該主板係 與該基材緊密接觸以將形成於該主板上的該結構層轉印至 该基材上，在該主板上的該結構層只需與該基材是緊密地 接觸’而不需在其間施加強大的壓力。 10 因為一較小的壓力係如上所述的越過該基材和主板 而施加該主板係可避免壓力誘發的變形，因而在該圖案形 成期間在主板上的凹槽形狀會被維持，而一所需的形狀的 一圖案可以高重現性來形成。同時，該主板的有效期限會 因為避免了該主板因為該變形現象所造成的損害而可以延 15 長。 當該主板與該基材擠壓接觸而使得該主板係完全地 與該基材緊密接觸的時候，該結構層即使在比起傳統的轉 印式奈米壓印技術所需的壓力下，仍可以被置放在該基材 上。同樣地，依照前述的形成凹凸圖案的方法之具體例， 20因為一較小的壓力係越過該主板和基材而施加，對於該主 板與基材的該表面所需的平坦度，可以比那些以一較高壓 力而將其等彼此接觸者所需要的來的更低。 12 1259827 明確地說，相較於該傳統轉印方法 和該基材的該表面甚至不需為平行的， ，該主板的該表面 一微小凹凸圖案能 可以在不損及基材或主板下就被形成。 並且，因為該主板被未在較高壓力 T與一基材接觸 用於該主板的該材料並不 料。 限於那些具有高機械強度的材 依照上述的形成凹凸圖案之方法，其可以使用一形成 衫同職的凹槽之主板。舉例來說，如第3圖所示，-' #有不同高度的突起之結構層可以藉著利用具有不同的深 * 10丨之凹槽9a的主板來形成該結構層而在該基材上形成。 在傳.先的方法中’也就疋’將一主板與一轉印薄膜擠壓薄 膜以將-凹凸圖案轉印至轉印薄脈上的方法，當一所使用 的主板具有如上所述之不同深度的凹槽時，該基材必須被 施加-夠高的壓力以將該轉印薄膜導入最深凹槽内。結 15果，該主板更容易變形而具有較短的使用期限。然而，依 • 訂述的形成凹凸圖案的方法，一具有不同高度之突起的 結構層’即使在利用一越過於該主板和基材而施加之較小 的壓力下，仍可以被形成在該基材上。 該凹槽在截面形狀上並不限於一矩形，但是如第4 2〇圖所示其可以是例如梯形孙。或者，該凹槽可能是I形、 階梯形、半球形以及這些形狀的一組合。對於轉印示奈米 轉印技術來說，為了要完全地將轉印薄膜導入係為這些截 面形狀之凹槽斷’轉印薄膜的厚度一定要考量該等凹槽的 合積同抑，該材料的導入可能會因為該等形狀而變得困 13 1259827 難，並且在主板的圖案容易導致轉印失敗。明確地說，當 圖案利用-形成有混合許多種形狀的凹槽之主板來進行轉 印的時候，就有可能發生一有缺陷的轉印作用。相對地， …、上述的凹凸圖案形成方法’因為包含—結構層的材料 5可以在黏附之前被預先填入凹槽，因此其可以在不需對基 材或主板施加一較高的壓力就形成一完美的圖案。 在所述的具體例中，^然該±板係與該基材在壓力下 接觸以將该結構層附著到基材，本發明並不限制於此一方 法而σ亥結構層可以藉由例如以光輻射照射該結構層而附 10 著到該基材。 牛例來°兒，在一結構層7如第5 Α圖所示的以實質 上類似上述的製程而被形成於該主板6之後，該主板6 、要表面係與一以光學上透明的材料所製成的基材8 之β主要表面緊密接觸（第5B圖）。在該主板6和該基 15材以緊密接觸時，光從—被設置於基材8的附近之光 源發出士，而以該光輻射照射結構層7 (未顯示）。該以光照 。構層7會改變其之黏附特性，增加其與該基材的黏 附^而允终結構層7對基材8具有-大於對主板6之 黏著力的黏著力。結果，#該主板6與該基材8分離的 2〇時候，如第5C圖所示結構層7便會從主板6釋放並形 成於基材8。 構層7可以用—種具有在以光照射時可以誘發 光學收縮性的材料來製成，在這種情況中這些特性會有助 14 1259827 於從該主板6將該結構層7剝落。舉例來說，_紫外線 的硬化材料可被用來作為該結構層的材料。 從該光源發出的光係較佳地具有一種會使得結構層 7和基材8之間的黏附性增加的波長，或係為一種會使得 5該結構層7誘發光學收縮性之波長。同樣地，以光來輻^ 照射該結構層並不限於從該基材側邊所發出的光，而且光 源（未顯示）可以例如第6圖所示的被安裝在主板6的 附近’以使得該結構層7可以在主板6附近的光來照射。 如上述的以光照射該結構層的步驟的替代步驟，一步 10驟可被導入以在该主板在和基材維持於緊密接觸時將該結 構層加熱。舉例來說，一用於加熱該結構層之加熱方法; 以是用於加熱該基材或主板的加熱器，以使得來自加熱器 的係被傳送到該結構層以進行加熱。該結構層係被加孰以 增加在該結構層和基材之間的黏著力，或在該結構中誘發 15熱收縮性以將該結構層自該主板分離。除了這個步驟以 外，剩餘的步驟可以與上述的圖案成形方法中的步驟係為 實質上類似的步驟。 典型修改可以加人—對該主板和基材施加震動而使 其脫離緊密接觸的步驟。舉例來說，一振動器可被安裝在 〇 »亥基材或主板的附近，以使得來自振動器的振動被傳送到 該結構層以自該主板分離結構層。該振動器可以例如是— 超音波產生器。 上述用於輔助分離的方式已經個別的使用光賴射、加 熱或是震動來施加至該結構層，但是這些方式並不限於 15 1259827 此’且這些方式可 同時以光照射。 以組合運用。舉例來說 振動可被施加 ” 5L的修改可以在該基材的主要表面提供 一黏附層，以增加在該結構層和基材之間的_性，接著 將該基材的主板緊宓的垃自 ^ 緊在的接觸。舉例來說，在-黏附層10如A specific example of the method for forming a concave-convex drawing tea according to the present invention and a 10 forming a nightmare using the concave-convex pattern thereof, and the recipient & will be described in detail with reference to the accompanying drawings. The structure layer 7 is formed on the main surface of the main board 6, which has a concave-convex pattern on its main surface (Fig. 2A). 15 4 Motherboard 6 is purely made of chemically stable materials, such as oxygen-cutting, oxidizing, and the like, such as oxygen, gold, steel, quartz, carbonic acid A glass material, a resin material, and the like of nano glass and its like. The same day motherboard 6 system preferably has an appropriate mechanical strength. As will be described later at 20, when the main board 6 is attached to separate a structural layer, the main board 6 preferably has heat resistance and a low thermal expansion coefficient. The motherboard can be light transmissive, that is, optically transparent. By way of illustration, the main board 6 is formed to have a recess 1259827 having a width of less than 100 rim level to avoid the formation of a defective pattern due to the air not being completely replaced by the material in the grooves on the main board. ^ Similarly, the motherboard can be heated while the structural layer is being formed. For example, when the structural layer is deposited by the _ spin coating method, heating the motherboard can reduce the viscosity of the material of the structural layer, thereby facilitating the filling of the material into the grooves on the main board. The team spoke of the % wind... The main surface of the man-made scorpion was in contact with the main surface of the deficiencies #8, thus bringing the structural layer 7 10 15 into contact with the substrate, as shown in Figure 2. The wire 8 is made of a metal oxide such as oxidized oxidized stone, oxidized (four), or the like, an alloy, a ceramic, a glass, a resin material such as acrylate, polycarbonate, polyester, or the like. Made of materials and other materials. η俅吧, 琢 材 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , In addition to this, the substrate 8 can be optically transparent. Also, the main board 6 is preferably in close contact with the base #8 under vacuum. This is because it avoids the τ of the main board 6 and the substrate 8 caused by the air being removed and maintained between the main board and the substrate 8, which is not perfect. The ability to adhere to the substrate 0 is maintained in close contact with the substrate 8 for a period of time to adhere the structural layer 7 to the substrate 8 after the substrate 6 is separated from the substrate 8. Since the adhesion of the substrate 7 to the substrate is greater than that for the motherboard, the structural layer 7 is separated from the substrate 6 by 20 1259827, and the concave and convex pattern is formed on the substrate. Material $ on (different 2C figure). The above specific example utilizes the adhesion of the structural layer to the substrate greater than the adhesion to the motherboard, rather than pressing the motherboard with the substrate as in the conventional operation to make the motherboard The upper pattern is pressed into the transfer film to transfer the pattern. In other words, since the main board is in close contact with the substrate to transfer the structural layer formed on the main board to the substrate, the structural layer on the main board only needs to be closely related to the substrate. Contact 'without putting strong pressure on it. 10 because a small pressure is applied to the motherboard and the main board as described above to avoid pressure-induced deformation, so that the shape of the groove on the main board during the pattern formation is maintained, and one A pattern of the desired shape can be formed with high reproducibility. At the same time, the validity period of the motherboard can be extended by avoiding the damage caused by the deformation of the motherboard. When the main board is in press contact with the substrate such that the main board is in close contact with the substrate, the structural layer is even under the pressure required by the conventional transfer type nanoimprint technology. It can be placed on the substrate. Similarly, in accordance with the foregoing specific example of the method of forming the concavo-convex pattern, 20 because a smaller pressure system is applied across the main board and the substrate, the flatness required for the surface of the main board and the substrate can be compared to those of The need to contact them with each other at a higher pressure is lower. 12 1259827 In particular, the surface of the main board of the main board can be made without damaging the substrate or the main board, as compared with the conventional transfer method and the surface of the substrate. Was formed. Also, since the main board is not in contact with a substrate at a relatively high pressure T, the material for the main board is not expected. Restricted to those having high mechanical strength In accordance with the above-described method of forming a concave-convex pattern, it is possible to use a main plate which forms a groove of the same position. For example, as shown in FIG. 3, the structure layer of the protrusions having different heights can be formed on the substrate by using a main board having grooves 9a of different depths*. form. In the prior method, a method of pressing a film onto a transfer film to transfer a concave-convex pattern onto a transfer thin pulse is used in a method of using a motherboard as described above. For grooves of different depths, the substrate must be applied - high enough pressure to introduce the transfer film into the deepest grooves. In conclusion, the motherboard is more susceptible to deformation and has a shorter life span. However, according to the method of forming the concavo-convex pattern, a structural layer having protrusions of different heights can be formed on the base even under a small pressure applied more than the main board and the substrate. On the material. The groove is not limited to a rectangle in cross-sectional shape, but may be, for example, a trapezoidal grandchild as shown in Fig. 22 . Alternatively, the groove may be I-shaped, stepped, hemispherical, and a combination of these shapes. For the transfer nano transfer technology, in order to completely introduce the transfer film into the groove shape of these cross-sectional shapes, the thickness of the transfer film must be considered in consideration of the combination of the grooves. The introduction of the material may become difficult due to the shape of the 13 1259827, and the pattern on the main board is liable to cause transfer failure. Specifically, when the pattern is transferred using a main board formed with grooves of a plurality of shapes, a defective transfer effect may occur. In contrast, the above-described concave-convex pattern forming method 'because the material 5 containing the structural layer can be pre-filled into the groove before being adhered, so that it can be formed without applying a high pressure to the substrate or the main plate. A perfect pattern. In the specific example, the ± plate system is in contact with the substrate under pressure to adhere the structural layer to the substrate, and the present invention is not limited to the method. The structural layer is irradiated with light radiation and attached to the substrate. In the case of a structural layer 7 as shown in FIG. 5, after substantially similar to the above-described process, the main board 6 is to be surface-mounted with an optically transparent material. The β main surface of the resulting substrate 8 is in close contact (Fig. 5B). When the main board 6 and the substrate 15 are in close contact, light is emitted from a light source disposed in the vicinity of the substrate 8, and the structural layer 7 (not shown) is irradiated with the light. It should be illuminated. The layer 7 changes its adhesion characteristics and increases its adhesion to the substrate, and the final structure layer 7 has an adhesion to the substrate 8 that is greater than the adhesion to the main board 6. As a result, when the main board 6 is separated from the substrate 8, the structural layer 7 is released from the main board 6 and formed on the substrate 8 as shown in Fig. 5C. The layer 7 can be made of a material which can induce optical shrinkage upon irradiation with light, in which case these characteristics will help to detach the structural layer 7 from the main board 6. For example, a hardening material of ultraviolet light can be used as the material of the structural layer. The light emitted from the light source preferably has a wavelength which causes an increase in adhesion between the structural layer 7 and the substrate 8, or a wavelength which causes the structural layer 7 to induce optical contractility. Similarly, illuminating the structural layer with light is not limited to light emitted from the side of the substrate, and a light source (not shown) may be mounted in the vicinity of the main board 6 as shown in Fig. 6 to make The structural layer 7 can be illuminated by light in the vicinity of the main board 6. As an alternative to the step of illuminating the structural layer with light as described above, a step 10 can be introduced to heat the structural layer while the main board is in intimate contact with the substrate. For example, a heating method for heating the structural layer; a heater for heating the substrate or the main plate such that a system from the heater is transferred to the structural layer for heating. The structural layer is twisted to increase the adhesion between the structural layer and the substrate, or 15 heat shrinkage is induced in the structure to separate the structural layer from the motherboard. In addition to this step, the remaining steps may be substantially similar steps to the steps in the pattern forming method described above. A typical modification can be added to the step of applying vibration to the motherboard and substrate to bring them out of intimate contact. For example, a vibrator can be mounted adjacent to the substrate or the motherboard such that vibrations from the vibrator are transmitted to the structural layer to separate the structural layers from the motherboard. The vibrator can be, for example, an ultrasonic generator. The above-described means for assisting the separation have been applied to the structural layer individually using light ray, heat or vibration, but these are not limited to 15 1259827 and these modes can be simultaneously irradiated with light. Used in combination. For example, vibration can be applied. A 5L modification can provide an adhesion layer on the major surface of the substrate to increase the symmetry between the structural layer and the substrate, and then the substrate of the substrate is next to the substrate. Contact from the ^. For example, in the - adhesion layer 10
10 弟7Α圖所顯不在基材8的主要表面上形成之後，該與該 結構層7-起形成的主板6係、與該黏附層iq形成緊密 接觸以將錢構層7與該黏附層W黏附（第π圖）。 因為在該結構層7與黏附層1〇之間的該黏附力，係 大於在該結構層7和主板6之間_附力更大，該從該 基材8分離的該主板6會使得該結構層7從主板6釋 放並設置於該黏_ 1〇上，如第％圖所示。 該黏附層可以藉著將其以光輕射或是藉由將其加熱 來增加與結構層的黏附力。結果，光或熱可以由主板側邊 15或基材側邊施加，同時該主板係與該基材維持緊密接觸。 在一進-步的典型修改中，該形成結構層的步驟可以 包含在主板的主要表面形成該剝落層的步驟，與在該剝落 層上形成該結構層的步驟。舉例來說，一剝落層Η係如 第8A圖所示的被形成在主板6的主要表面上。舉例來 20說，該剝落㉟u彳以在一預定的溶劑中溶解，並且可以 用一種比起與該結構層的黏附力具有與該主板之較小的黏 附力之材料所製成，其將在之後被描述。該剝落層n的 形成係利用一沈積裝置，運用一例如旋轉塗敷方法、濺散 方法或其等之類似方法的沈積方法來進行。 16 1259827 在遠剝洛層11被形成之後，該結構層7係利用一 旋轉塗敷方法、-機散方法或其等之類似方法來形成，如 第8B圖所示。該結構層7係較佳地由—種不會溶解於上 述的溶劑中之材料所製成。 、 在結構層7被形成之後，該主板6的主要表面係盘 该基材8❹要表面成為—緊密的接觸’以將該基材8 附著至該結構層7(第圖）。在該結構層7係被附著於 °亥基材8之後’該主板6係從該基材8分離，使得剝落 10 15 20 層11留在遠結構層7上而將該結構層7設置在 8上（第8D圖）。 該基材8係被浸在-溶劑中，其中該剝落層η係 可被溶解以移除該剝落㉟η，以將該形成有凹凸圖案之結 構留在該基材8上（第8Ε圖）。 該剝落層可以構成—第二結構層，而不需進行該剝落 層的移除作用。換句話說，如第8D圖所示，在該剝落層η 係被留在該結構層7上的狀態中，該結構層7係構成一 苐一結構層，而該剝落層u係構成一第二結構層。依照 這種結構，移除剝落層的步驟是不必要的。 該剝落層可以由對該主板之所具有黏著力係大於對 該結構層之黏著力的材料所製成，以使得該結構層可以在 口亥主板從違基材移除的時候從該剝落層分離。在這個結果 二板上的剝落層可以在該主板被再次使用之 前以一溶劑自該基材移除。 17 1259827 將該基材由主板分離的步驟可以包含—減少在該主 板或該結構層與剝落層之間的黏附力之步驟。舉例來★兒， =基材從該主板移㈣步驟可以包含―以輻射照射該 、备層的步驟或是一加熱該剝落層的步驟。舉例來說，藉 著以絲射照射關落層的步驟，該«層會收縮而減少 在该主板和該剝落層之間的黏附力。藉此，該結構層可被 完全地設置在基材上。 10 同樣地，分離該主板的步驟也可以包含對該剝落層施 加振動的步驟，以使得此—步驟可以有助於移除作用。施 加振動的步驟可以與以光輻射照射該剝落層的步驟以及加 熱該剝落層的步驟一起進行。 在-進-步的典型修改中，該凹凸圖案的形成方法可 以包含-將該剝落層從維持在緊密接觸的主板和基材移除 的步驟。舉例來說，該剝落層U係如第9A圖所示利用 種例如旋轉塗敷方法、_散方法或其等之類似方法之沈 積方法而形成於-主板6。在形成該m η之後，該 結構層7係如第9Β圖所示利用一種例如旋轉塗敷方 法、濺散方法或其等之類似方法之沈積方法而形成。在該 、、、口構層7被形成之後，該主板6的主要表面係與該基材 2〇 8的主要表面形成緊密接觸，以將該之結構層j附著至該 基材8 (第9C圖）。藉著將該主板6和該基材8維持在 緊密接觸下，該產物係被浸潰在充滿一可以溶解該剝落層 11的溶劑12之溶解器13中（第9D圖）。藉著浸潰作 用’該剝落層11會在該溶劑12 (第9E圖）中溶解，以 18 1259827 自該主板分離該基材而將該結構層7自該主板者分離，以 在該基材上產生一形成有凹凸圖案的結構（第9F圖）。 該剝落層的移除作用並不限於溶解在一溶劑中，但是 該剝落層可以例如利用一分解劑來分解該剝落層以被分解 而加以排除。該分解劑係較佳地不會與該主板、結構層或 基材反應，但係較佳地會與該剝落層反應。進一步而言， 該剝落層的移除並不限制於液體的使用，而是例如可以分 解剝落層之氧化氣體都可被運用。 或者，在該基材和該主板維持於緊密接觸下而浸潰於 -溶劑之前，該㈣層可以—光照射或加熱以降解該剝落 層而溶解於-溶射、被分解劑所分解或是被反應性氣體 分解。 在浸潰於該溶劑的時候，可以將振動傳送到維持於緊 密接觸的-體化基材與主板中。舉例來說，_超音波振動 器可以被設置在充滿-溶劑分解器，以使得該超音波由該 超音波振動器經由該分解器和溶㈣送至該_體附著產物 上因而促使，亥剝落層溶解。該振動也可以促使該主板從 基材排除。 20 刖述的凹凸圖案形成方法可以在相同的基材上重複 地鈿仃’以形成具有數個結構層的複層結構。舉例來說， 士第10圖所不形成於第_主板6上之第—結構層 7a’係利用—例如旋轉塗敷方法、《方法或其等之類似 方法’來將該第—結構層7a與該基# 8黏附而與一基材 8形成緊密接觸（第圖)。該第-結構層7係自該第 19 1259827 一主板6a釋放，以形成在該基材8上帶有該第一結構層 7的結構（第10B圖）。 一形成有一第二結構層7b之第二主板6b係與該結 構形成緊密接觸（第10C圖）。在該第二結構層7^被黏 5附至該第一結構層7a之後，藉由移除該第二主板6b該 第一結構層7b可被形成於該結構上，以形成一具有該二 結構層之二層結構（第10D圖）。 依照前述的方法，一具有微小凹凸圖案的多層結構可 以在不需要將該主板在一高壓下與基材壓擠接觸下就形 1〇成。明確地說，當該主板在一高壓下與該基材壓擠接觸的 時候，預先在該結構上形成的一凹凸圖案就會被擠壓而變 形或損壞，然而前述發明的方法可以在不破壞在下層的結 構下就形成一多層結構。 该第一結構層可藉由一傳統的方法來形成，也就是， 利用將沈積在一基材上的轉印薄膜與該主板擠壓接觸之該 轉印成形方法。 依照上述的該形成一多層結構的方法，可以利用先前 已經祂述的用於該凹凸圖案形成方法中之該黏附層和剝落 層。 20 使用利用依照上面描述的凹凸圖案形成方法的具體 例，將在下述中被描述。 (具體例1) 如第Π圖所示，在利用電子束微影術方法製造於以 二氧化矽製成的主板基板上具有一預定圖案的主板6之 20 1259827 10 15 20 後，一由非磁性材料所製成的結構層7係被沈積在該主板 6的主要表面上（第UA圖）。該主板6係與一由玻璃或 鋁合金（第11B圖）所製成的基材8成緊密接觸，並且 該主板6係被分離以在該基材8上設置該結構層7 (第 11C圖）。一磁性材料薄膜14係被沈積在結構層7的一 微小凹凸圖案上，以將該磁性材料填充在形成於該結構層 7中之凹槽（第11D圖）。在沈積該磁性材料薄膜14之 後，該磁性材料薄膜14係被化學機械研磨（CMp)以暴露 一具有相對於由該結構層7所形成之圖案的具有磁性區 域之表面（第Π E圖），一潤滑層15係被形成在表面上 (第11F圖）。藉由前述的步驟，其可以製造一帶著具有微 小圖案的磁性區域之磁性記錄碟。 (具體例2) 一具有一預定圖案的主板係利用一電子束微影術方 法’而在一由二氧化矽或類似物所製成的主板之基板上製 造。一由光學材料所製成的結構層係被沈積在主板的主要 表面上。一由玻璃或其等之類似物所製成的基材係與該主 板形成緊密接觸，而該主板係被分離以將該結構層設置於 該基材上。該結構層係被用來作為波導器或一設置於該波 導器周圍的夾具’藉此使其可以形成一具有波導結構的光 學裝置。 (具體例3) 一具有預定圖案的主板係利用一電子束微影術方法 而在一係為二氧化矽所製成的主板基板上製造，而且一光 21 1259827 阻係被塗覆於該主板的主要表面上以沈積該結構層。該主 反係/、包3例如石夕之半導體材料的基材形成緊密接觸， 且该主板係被移除以在該基材上設置該結構層。結構層係 被用來作為一用於蝕刻該基材以形成一佈線圖案之光阻， 5因而使其可以形成一半導體設備。 依照本發明之形成凹凸圖案的方法，其之特徵在於提 么、基材以及在一主要表面上具有一凹凸圖案的主板，以After the formation of the substrate 8 is not apparent on the main surface of the substrate 8, the main board 6 formed with the structural layer 7 is in close contact with the adhesion layer iq to bond the texture layer 7 and the adhesion layer W. Adhesion (pig π). Since the adhesion between the structural layer 7 and the adhesive layer 1 is greater than the adhesion between the structural layer 7 and the main plate 6, the main board 6 separated from the substrate 8 causes the The structural layer 7 is released from the main board 6 and disposed on the adhesive sheet as shown in the % diagram. The adhesive layer can increase adhesion to the structural layer by lightly illuminating it or by heating it. As a result, light or heat can be applied by the side edges 15 of the main board or the sides of the substrate while the main board is in intimate contact with the substrate. In a typical modification of the advance step, the step of forming the structural layer may include the step of forming the peeling layer on the main surface of the main board, and the step of forming the structural layer on the peeling layer. For example, a peeling layer is formed on the main surface of the main board 6 as shown in Fig. 8A. By way of example 20, the flaking 35u is dissolved in a predetermined solvent and may be made of a material having a lower adhesion to the motherboard than the adhesion to the structural layer, which will be It is described later. The formation of the peeling layer n is carried out by a deposition apparatus using a deposition method such as a spin coating method, a sputtering method, or the like. 16 1259827 After the far-deposited layer 11 is formed, the structural layer 7 is formed by a spin coating method, a dispersion method, or the like, as shown in Fig. 8B. The structural layer 7 is preferably made of a material which does not dissolve in the above solvent. After the structural layer 7 is formed, the main surface of the main board 6 is tethered to the surface of the substrate 8 to be in close contact with each other to attach the substrate 8 to the structural layer 7 (Fig. After the structural layer 7 is attached to the substrate 8, the main board 6 is separated from the substrate 8 such that the peeling 10 15 20 layer 11 remains on the far structural layer 7 and the structural layer 7 is placed at 8. On (8D picture). The substrate 8 is immersed in a solvent, wherein the peeling layer η can be dissolved to remove the flaking 35n to leave the structure in which the uneven pattern is formed on the substrate 8 (Fig. 8). The exfoliation layer can constitute a second structural layer without the need to remove the exfoliation layer. In other words, as shown in Fig. 8D, in a state where the peeling layer η is left on the structural layer 7, the structural layer 7 constitutes a one-dimensional structural layer, and the peeling layer u constitutes a first Two structural layers. According to this configuration, the step of removing the peeling layer is unnecessary. The peeling layer may be made of a material having an adhesive force to the main board that is greater than an adhesive force to the structural layer, so that the structural layer can be peeled off from the peeling layer when the main board is removed from the substrate. Separation. The peeling layer on the second board can be removed from the substrate with a solvent before the board is reused. 17 1259827 The step of separating the substrate from the main plate may comprise the step of reducing the adhesion between the main plate or the structural layer and the peeling layer. For example, the step of moving the substrate from the main board (4) may include the step of irradiating the substrate with radiation or the step of heating the peeling layer. For example, by the step of irradiating the falling layer with a silk, the layer will shrink to reduce the adhesion between the main plate and the peeling layer. Thereby, the structural layer can be completely disposed on the substrate. 10 Similarly, the step of separating the motherboard may also include the step of applying vibration to the spalling layer such that this step may aid in removal. The step of applying vibration may be performed together with the step of irradiating the peeling layer with light radiation and the step of heating the peeling layer. In a typical modification of the advance step, the method of forming the relief pattern may include the step of removing the peeling layer from the main board and the substrate maintained in close contact. For example, the peeling layer U is formed on the main board 6 by a deposition method such as a spin coating method, a scatter method, or the like as shown in Fig. 9A. After the formation of the m η , the structural layer 7 is formed by a deposition method such as a spin coating method, a sputtering method, or the like as shown in Fig. 9 . After the mouth layer 7 is formed, the main surface of the main board 6 is brought into close contact with the main surface of the substrate 2〇8 to adhere the structural layer j to the substrate 8 (9C) Figure). By maintaining the main plate 6 and the substrate 8 in intimate contact, the product is impregnated in a dissolver 13 filled with a solvent 12 which can dissolve the exfoliation layer 11 (Fig. 9D). By the impregnation action, the exfoliation layer 11 is dissolved in the solvent 12 (Fig. 9E), and the substrate layer is separated from the main board by 18 1259827 to separate the structural layer 7 from the main board to be on the substrate. A structure in which a concavo-convex pattern is formed is produced (Fig. 9F). The removal of the peeling layer is not limited to being dissolved in a solvent, but the peeling layer can be decomposed and removed by, for example, using a decomposing agent to decompose the peeling layer. Preferably, the decomposing agent does not react with the main board, structural layer or substrate, but preferably reacts with the exfoliation layer. Further, the removal of the peeling layer is not limited to the use of the liquid, but for example, an oxidizing gas which can decompose the peeling layer can be used. Alternatively, the (four) layer may be light-irradiated or heated to degrade the exfoliation layer to dissolve in the -solubilization, decomposed by the decomposing agent, or be immersed in the intimate contact of the substrate and the main plate. The reactive gas decomposes. When immersed in the solvent, the vibration can be transmitted to the body-formed substrate and the main board maintained in close contact. For example, the _ ultrasonic vibrator may be disposed in the full-solvent resolver such that the ultrasonic wave is sent by the ultrasonic vibrator via the resolver and the solution (4) to the _ body attachment product, thereby causing the ultrasonic wave to peel off The layer dissolves. This vibration can also cause the motherboard to be removed from the substrate. The concavo-convex pattern forming method described above may be repeatedly performed on the same substrate to form a multi-layer structure having a plurality of structural layers. For example, the first structural layer 7a' which is not formed on the first main plate 6 in FIG. 10 uses the first structural layer 7a by, for example, a spin coating method, a method or the like. Adhered to the base #8 and brought into close contact with a substrate 8 (Fig.). The first structural layer 7 is released from the main board 6a of the 191259827 to form a structure having the first structural layer 7 on the substrate 8 (Fig. 10B). A second main plate 6b formed with a second structural layer 7b is in close contact with the structure (Fig. 10C). After the second structural layer 7 is adhered to the first structural layer 7a, the first structural layer 7b can be formed on the structure by removing the second main board 6b to form a The two-layer structure of the structural layer (Fig. 10D). According to the foregoing method, a multilayer structure having a fine concavo-convex pattern can be formed without pressing the main plate under pressure at a high pressure. Specifically, when the main board is pressed into contact with the substrate under a high pressure, a concave-convex pattern formed on the structure in advance may be deformed or damaged by the pressing, but the method of the foregoing invention may not be destroyed. A multilayer structure is formed under the structure of the lower layer. The first structural layer can be formed by a conventional method, that is, a transfer forming method in which a transfer film deposited on a substrate is pressed into contact with the main plate. According to the above-described method of forming a multilayer structure, the adhesion layer and the peeling layer which have been previously described in the method for forming the concave-convex pattern can be utilized. 20 Using a specific example using the concavo-convex pattern forming method according to the above, will be described below. (Specific Example 1) As shown in the figure, after the electron beam lithography method is used to manufacture the main board 6 having a predetermined pattern on the main board substrate made of ruthenium dioxide, 20 1259827 10 15 20 A structural layer 7 made of a magnetic material is deposited on the main surface of the main board 6 (Fig. UA). The main board 6 is in close contact with a substrate 8 made of glass or aluminum alloy (Fig. 11B), and the main board 6 is separated to provide the structural layer 7 on the substrate 8 (Fig. 11C) ). A magnetic material film 14 is deposited on a minute concave-convex pattern of the structural layer 7 to fill the magnetic material in a groove formed in the structural layer 7 (Fig. 11D). After depositing the magnetic material film 14, the magnetic material film 14 is chemically mechanically polished (CMp) to expose a surface having a magnetic region with respect to the pattern formed by the structural layer 7, (Fig. E). A lubricating layer 15 is formed on the surface (Fig. 11F). By the foregoing steps, it is possible to manufacture a magnetic recording disk carrying a magnetic region having a micro pattern. (Specific Example 2) A main board having a predetermined pattern was fabricated on a substrate of a main board made of ceria or the like by an electron beam lithography method. A structural layer made of an optical material is deposited on the main surface of the main board. A substrate made of glass or the like is brought into close contact with the main plate, and the main plate is separated to dispose the structural layer on the substrate. The structural layer is used as a waveguide or a jig disposed around the waveguide to thereby form an optical device having a waveguide structure. (Specific Example 3) A main board having a predetermined pattern is fabricated on a main board substrate made of erbium oxide by an electron beam lithography method, and a light 21 1259827 resist is applied to the main board. The main surface is deposited to deposit the structural layer. The substrate of the main counter/, package 3, such as Shixia's semiconductor material, is in intimate contact, and the main board is removed to provide the structural layer on the substrate. The structural layer is used as a photoresist for etching the substrate to form a wiring pattern, thereby making it possible to form a semiconductor device. A method of forming a concavo-convex pattern according to the present invention, characterized by a substrate, a substrate, and a main plate having a concave-convex pattern on a main surface
一對於該基材具有比對該主板之黏附力更大的黏附力之材 Μ料所製成的結構層來形成該主板的主要表面，將該基材的 10主要表面與該主板的主要表面形成緊密接觸，並將該主板 自絲材刀離的步驟，因為該主板可以在形成—對應於形 成在該主板上的凹凸圖案之結構層後，黏附至該基材以在 该基材上形成黏附層，該結構層的材料可以被完全填充於 ^該主板上的凹槽内，而不需越過該主板和該基材施加一 藉此使其可以形成包含有沒有形成缺陷圖案之凹凸 圖案的結構。 20 a 〈照本發明的—多層結構形成方法，其包至少重複兩 次凹凸圖案形成製程，該製程包含提供—基材以及在_主 要表面上具有—凹凸圖案的主板，以一對於該基材具有比 、十：主板之黏附力更大的黏附力之材料所製成的結構層來 形成該主板的主要表面’將該基材的主要表面與該主板的 主要表面形成緊密接觸’並將該主板自該基材分離的步 驟’因為該結構層可以被設置於該結構上，而不需施加高 22 1259827 不需要先破壞該預先 壓以達成擠壓接觸，該結構層可以在 形成於該結構上之結構而形成。a structural layer made of a material having a greater adhesion to the substrate than the adhesion to the motherboard to form a major surface of the substrate, the main surface of the substrate and the main surface of the substrate Forming a step of intimately contacting the main board from the wire, since the main board can be adhered to the substrate to form on the substrate after forming a structural layer corresponding to the concave-convex pattern formed on the main board An adhesive layer, the material of the structural layer can be completely filled in the groove on the main board, without applying a coating over the main board and the substrate, thereby making it possible to form a concave-convex pattern containing a defect pattern. structure. 20 a according to the present invention - a method for forming a multilayer structure, which comprises repeating at least two concave-convex pattern forming processes, the process comprising providing a substrate and a main plate having a concave-convex pattern on the main surface, for the substrate a structural layer made of a material having a greater adhesion than the adhesion of the motherboard to form a main surface of the main board 'the main surface of the substrate is in close contact with the main surface of the main board' and The step of separating the main board from the substrate 'because the structural layer can be placed on the structure without applying a high 22 1259827 without first breaking the pre-compression to achieve a press contact, the structural layer can be formed in the structure Formed on the structure.
1010
依照本發明的―凹凸圖案形成裝置，其之特徵在於且 7有用於提供一基材以及在一主要表面上具有一凹凸圖 案的主板之構件m對於該基材具有㈣該主板之 黏附力更大的黏附力之材料所製成的結構層來形成該主板 的主要表面的構件，用於將該基材的主要表面與該主板的 女主要表面形«密制之構件，以將魅板自該基材分 、構件t匕起利用一曝光過程而藉由一微影術來形成 細微圖案’可以在—比起—利用電子束為基礎之方法 的緣製方法之圖案形成方法更短的時間内形成。 這個申請案係以一曰本專利申請案第2004-82189號 為基礎，其係在此被併入以供參考。 【圏式簡單說明】 第1圖是顯示一傳統奈米壓印方法之部份放大剖面 圖； 第2A〜2C圖是顯示一依照本發明的方法之凹凸圖案 开> 成方法的部份放大剖面圖； 第3圖是用於依照本發明的凹凸圖案形成方法之主 〇板的部份放大剖面圖； 第4圖是用於依照本發明的凹凸圖案形成方法之主 板的部份放大剖面圖； 第5A〜5C圖顯示對於依照本發明的凹凸圖案形成方 去之典型的修改之部份放大剖面圖； 23 1259827 第6圖顯示對於依照本發明的凹 典型的修改之部份放大剖面圖； 凸圖案形成方法之 第7 A〜7C圖顯示對於依照本發明 法之典型的修改之部份放大剖面圖； 的凹凸圖案形成方 第8A〜8E圖顯示對於依照本發明 的凹凸圖案形成方 法之典型的修改之部份放大剖面圖； 第9A〜9F圖顯示對於依照本發明 的凹凸圖案形成方 法之典型的修改之部份放大剖面圖；The embossed pattern forming apparatus according to the present invention is characterized in that: 7 has a member for providing a substrate and a main plate having a concave-convex pattern on a main surface, and has a greater adhesion to the substrate (4). a structural layer made of a material of adhesion to form a main surface member of the main board, for the main surface of the substrate and the main surface of the main body of the main body to form a dense member The substrate part and the member t are used to form a fine pattern by a lithography process by using an exposure process, and the pattern forming method of the edge method using the electron beam-based method can be used in a shorter time. form. This application is based on a patent application No. 2004-82189, which is incorporated herein by reference. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partially enlarged cross-sectional view showing a conventional nanoimprint method; FIGS. 2A to 2C are partial enlarged views showing a concave-convex pattern opening method according to the method of the present invention. 3 is a partially enlarged cross-sectional view of a main slab for a concave-convex pattern forming method according to the present invention; and FIG. 4 is a partially enlarged cross-sectional view of a main board for forming a concave-convex pattern according to the present invention; 5A to 5C are partial enlarged cross-sectional views showing a typical modification of the concave-convex pattern forming method according to the present invention; 23 1259827 FIG. 6 is a partially enlarged cross-sectional view showing a modification of a concave shape according to the present invention; 7A to 7C of the convex pattern forming method show a partially enlarged cross-sectional view of a typical modification of the method according to the present invention; the concave-convex pattern forming side 8A to 8E shows a typical example of the concave-convex pattern forming method according to the present invention. A modified partial cross-sectional view; FIGS. 9A to 9F are partial enlarged cross-sectional views showing a modification of the concave-convex pattern forming method according to the present invention;
第10A〜10D目顯示對於依照本發明的凹凸圖案形成 10方法之典型的修改之部份放大剖面圖；且 第11A〜11F圖顯示利用依照本發明的凹凸圖案形成 方法之一磁性記錄碟的製造之部份放大剖面圖。【主要元件符號說明】10A to 10D are partial enlarged cross-sectional views showing a typical modification of the concave-convex pattern forming method according to the present invention; and FIGS. 11A to 11F are views showing the manufacture of a magnetic recording disk using one of the concave-convex pattern forming methods according to the present invention. Part of the enlarged cross-sectional view. [Main component symbol description]
1 基材 7b 第二結構 2 主板 8 基材 3 轉印薄膜 9a 凹槽 4 凹槽 9b 梯形 5 空氣 10 黏附層 6 主板 11 剝落層 6a 第一主板 12 溶劑 6b 第二主板 13 溶解器 7 結構層 15 潤滑層 7a 第一結構層 241 Substrate 7b Second structure 2 Main board 8 Substrate 3 Transfer film 9a Groove 4 Groove 9b Trapezoidal 5 Air 10 Adhesive layer 6 Main board 11 Stripping layer 6a First main board 12 Solvent 6b Second main board 13 Dissolver 7 Structural layer 15 lubricating layer 7a first structural layer 24