JP3340011B2 - Method of manufacturing substrate for plasma display device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for a plasma display device used for a high-precision and inexpensive thin color display device for a large screen and the like, and a method for manufacturing the same.

[0002]

2. Description of the Related Art In a plasma display device used for a thin large-screen color display device or the like, opposed electrodes are provided in a space surrounded by partition walls called minute display cells, and discharge of rare gas or the like is performed in the space. It has a structure in which possible gas is sealed, and generates plasma by discharging between facing electrodes,
The phosphor emits light by the plasma and is used as a light emitting element of a screen.

As shown in FIG. 3, a specific structure is shown in which a large number of partitions 11 are formed on one surface of a back plate 10 to form cells 13 between the partitions 11, and an electrode 12 is provided on the bottom surface of the cells 13. Is a substrate 1. The substrate 1 is coated with a phosphor on the inner wall surface 13a of the cell 13, and a front plate 14 provided with one electrode 15 is joined on the partition 11 of the substrate 1 to form a cell 13
By filling a gas into the plasma display device, a plasma display device can be configured.

When the substrate 1 for the plasma display device is manufactured, a large number of electrodes 1 are formed on the back plate 10 in advance.
After the formation of the barrier ribs 2, the barrier ribs 11 are formed between the respective electrodes 12. As a method of manufacturing the barrier ribs 11, a printing lamination method, a blast method, or the like is known.

In the printing lamination method, a partition 11 having a predetermined pattern is formed on the back plate 10 by printing using a paste of a material forming the partition 11 by a thick film printing method. Since it is about 10-15 μm,
While repeating printing and drying, the partition wall 11 having a height of about 100 to 200 μm is formed (see Japanese Patent Application Laid-Open No. 2-213020).

In the blast method, a glass layer having a predetermined thickness is formed on the entire surface of the back plate 10, a resist mask having a shape of the partition 11 is formed on the surface thereof, and portions other than the partition 11 are sandblasted. The glass layer is removed (see JP-A-4-259728).

[0007]

However, in the above-described printing and laminating method, the printing and drying steps must be repeated many times in order to form the partition walls 11 having a predetermined height, and the number of steps is extremely small. In addition, the yield must be extremely low because printing must be performed with high accuracy for each lamination.
Furthermore, the partition 11 is easily deformed due to positional deviation at the time of printing, and the dimensional accuracy of the display cells formed by the partition 11 is measured when 45 columns of dimensions for 1000 cells are measured due to elongation of printing plate making. The maximum difference between the measured values is 0.3
It was about 5 mm, which did not satisfy the demand for higher definition.

In the above blasting method, since sandblasting is performed after using a photoresist for forming a mask, the process is complicated, and it is difficult to form the partition 11 with high accuracy. Furthermore, when the abrasive used for the blasting process is collected and used repeatedly, there is a decrease in grinding force due to abrasion deterioration of the abrasive and a change with time, and it has been difficult to stably mass-produce. On the other hand, if the polishing agent is used without being collected, the cost of the polishing agent is high, and mass production is also difficult in this case.

Therefore, it is difficult to manufacture the large-sized plasma display device substrate 1 having a high precision and a fine pitch in a simple process at a low cost by any of the above manufacturing methods.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to produce a substrate for a plasma display device in one simple molding step with good yield and to have a smooth surface without deformation. A substrate for a plasma display device capable of obtaining high-precision partition walls at a predetermined height, easily realizing a large screen of 40 inches or more, and realizing high-definition display cells having a pitch of less than 0.25 mm, and manufacturing thereof It is to provide a method.

[0011]

[0012]

[0013]

According to the present invention, there is provided a method of manufacturing a substrate for a plasma display device, comprising the steps of: preparing a ceramic or glass powder having a particle size of 0.2 to 10 μm; A mixture of a solvent and a binder made of an organic additive is filled in a mold having an inverted trapezoid-shaped concave portion for a partition wall, and the mixture is joined to a back plate made of ceramics or glass to form a mold. After the mold is released from the mold, it is fired and integrated to form a display cell with a plurality of trapezoidal partitions on the back plate.

[0014]

According to the plasma display panel substrate and the method of manufacturing the same of the present invention, a mixture of ceramics or glass powder and a binder is filled into a mold to obtain a molded body of the partition wall, so that the surface condition of the partition wall is reduced. Good and the dimensional accuracy of the mold is directly reflected on the molded body, and a large-sized substrate can be easily manufactured in one molding step.

[0015]

Embodiments of the present invention will be described below.

As shown in FIG. 1, a substrate 1 for a plasma display device has a plurality of partitions 11 made of ceramics or glass on one surface of a back plate 10 made of ceramics or glass.
And a cell 13 is formed between the partition walls 11.

An electrode 12 is provided on the bottom surface of the cell 13, and after a phosphor is applied to an inner wall surface 13a of the cell 13, a front plate 14 having an electrode 15 as shown in FIG.
By covering the upper end of the partition 11 with a gas and filling the cell 13 with gas, a plasma display device can be configured. Then, by discharging between the electrodes 12 and 15, the cell 13 is discharged.
The phosphor applied to the inner wall surface 13a can emit light.

Next, a method of manufacturing the substrate 1 will be described.

First, as shown in FIG.
A mold 20 having a concave portion 20a conforming to the shape of the above is prepared, and the concave portion 20a of the mold 20 is filled with a mixture 21 of ceramics or glass powder as a material forming the partition wall 11 and a solvent and a binder of an organic additive. I do.

On the other hand, a back plate 10 made of ceramics or glass is separately prepared.
The molded body of No. 1 is joined and integrated to form the partition wall 11. Specifically, it is manufactured as follows.

First, the mixture 2 filled in the molding die 20
The back plate 10 is pressed against the surface of the substrate 1 and adhered under pressure, and the mixture 21 is cured by reaction or dried and solidified. Thereafter, as shown in FIG.
Is released from the mold to transfer the partition walls 11 made of the molded body of the mixture 21 onto the back plate 10. Finally, after the whole is debindered, it is fired and integrated to obtain the plasma display device substrate 1 shown in FIG.

As another method, after the mixture 21 filled in the mold 20 is cured or dried and solidified, the mixture 21 is released from the mold, and the molded body of the mixture 21 is adhered to the back plate 10. Finally, after the whole is debindered, the substrate for plasma display device 1
Can be obtained.

As still another method, after the mixture 21 filled in the molding die 20 is cured or dried and solidified, it is released from the molding die, and after debinding, the molded body is adhered to the back plate 10. . Finally, the substrate 1 for a plasma display device can also be obtained by simultaneously firing and integrating the whole.

Alternatively, the mixture 2 filled in the mold 20
After reaction hardening or drying and solidifying 1, release from the mold,
The substrate 1 for a plasma display device can also be obtained by bonding the sintered body to the back plate 10 by bonding, thermocompression bonding, or simultaneous firing after the binder has been removed and fired.

That is, the molded body of the mixture 21 may be joined to the back plate 10 at any stage of the unfired body, the binderless state, and the sintered body.

According to such a manufacturing method of the present invention, since the partition walls 11 can be formed at one time, the manufacturing process can be extremely simplified. Moreover, since the shape of the concave portion 20a of the mold 20 is transferred to the partition 11, a fine shape can be formed with high precision. As a result, in the manufacturing method of the present invention, the display cell 100
High accuracy can be achieved so that the maximum difference between the measured values when measuring 45 rows of dimensions for 0 cells is 0.05 mm or less.

The electrode 12 provided on the bottom surface of the cell 13 may be provided on the surface of the back plate 10 before the partition 11 is joined.

Here, as the ceramic powder forming the partition 11, alumina (Al ₂ O ₃ ), zirconia (Zr
Oxide ceramics such as O ₂ ) and silicon nitride (Si ₃
N ₄ ), aluminum nitride (AlN), silicon carbide (Si
Non-oxide ceramics such as C.) or apatite (Ca ₅ (PO ₄ ) ₃ (F, Cl, OH)) can be used. The desired amount of the agent can be added.

As the sintering aid, silica (SiO ₂ ), calcia (CaO), yttria (Y ₂ O ₃ ) and magnesia (MgO) are used for alumina powder, and yttria (Y ₂ O) is used for zirconia powder. ₃ ) and cerium (C
e), dysprosium (Dy), ytterbium (Y
b) or the like, an oxide of a rare earth element such as b), yttria (Y ₂ O ₃ ) and alumina (Al ₂ O ₃ ) for silicon nitride powder, and an oxide of a group 3a element of the periodic table in aluminum nitride powder ( RE ₂ O ₃ ) and the like, and boron (B) and carbon (C) can be added to the silicon carbide powder in desired amounts.

The glass powder forming the partition walls 11 is mainly composed of silicate, and contains lead (Pb), sulfur (S),
Various glasses containing one or more of selenium (Se), alum, and the like can be used.

The particle size of these ceramics or glass powders is preferably in the range of several tens of microns to submicron, specifically, 0.2 to 10 μm, preferably 0.2 to 5 μm. Good things in the range.

Further, organic additives to be added to these ceramic or glass powders include urea resin, melamine resin, phenol resin, epoxy resin, unsaturated polyester resin, alkyd resin, urethane resin, ebonite, polysiloxysilicate. And the like. And as a means for reacting and curing these organic additives,
There are heat curing, ultraviolet irradiation curing, X-ray irradiation curing and the like. In terms of work, heat curing is most suitable from the viewpoint of the apparatus, and unsaturated polyester resin is particularly preferable from the viewpoint of pot life. The content of the organic additive, in order to maintain the fluidity and moldability of a mixture of ceramics or glass powder and a sintering aid, etc., it is necessary to prevent the viscosity from increasing, It is desirable to have sufficient shape retention during curing. From these points,
The content of the organic additive is preferably 0.5 part by weight or more based on 100 parts by weight of the ceramic or glass powder, and 35 parts by weight or less from the viewpoint of shrinkage of the molded article due to curing. Considering shrinkage during firing,
15 parts by weight are most preferred.

The solvent added to the mixture 21 is not particularly limited as long as it is compatible with the organic additive. For example, aromatic solvents such as toluene, xylene, benzene and phthalic acid ester can be used. Solvents, higher alcohols such as hexanol, octanol, decanol and oxyalcohol, and esters such as acetic acid ester and glyceride can be used.

In particular, the above-mentioned phthalic acid esters, oxyalcohols and the like can be suitably used. Further, in order to volatilize the solvent slowly, it is possible to use two or more of the above-mentioned solvents in combination. From the viewpoint of moldability, in order to maintain the shape retention of the molded body, 0.1 parts by weight or more is required for 100 parts by weight of ceramic or glass powder,
On the other hand, since it is desirable to lower the viscosity of the mixture of the ceramic or glass powder and the organic additive, it is more preferably 35 parts by weight or less, and from 1 to 15 parts by weight in consideration of shrinkage during drying and firing. Is most desirable.

The molding tool 20 in the present invention is not particularly limited as long as it does not hinder the curing of the organic additive. The material is not particularly limited. For example, metal, resin, rubber, or the like can be used. For example, a surface treatment such as surface coating may be performed to improve the releasability and prevent abrasion.

The back plate 10 is an unfired green sheet or sintered body, and the material is not particularly limited.
For example, it is desirable that the material of the partition 11 and the coefficient of thermal expansion of various ceramic green sheets, various glass substrates, and porcelain substrates are similar. In addition, as the glass substrate, for example, relatively inexpensive glass such as soda lime glass and a material in which an inorganic filler is dispersed to improve its strain point can be used.

In order to improve the adhesion when the mixture 21 and the back plate 10 are pressed, various coupling agents such as a silane coupling agent, a titanate coupling agent, and an aluminate coupling agent are used. Silane coupling agents are preferred because of their high reactivity.

Further, it is desirable to use a hydrostatic device in order to uniformly apply pressure to the mixture 21 and the back plate 10, and the pressing condition is a pressure range where the mold 20 is not deformed. , The pressure range is the mold 20
Although it depends on the strength of the mold, for example, when a molding die 20 made of silicon rubber is used, it is desirable to carry out under a pressure condition of about 100 g / cm ² .

In the mixture 21, for improving the dispersibility of the ceramic or glass powder, for example, polyethylene glycol ether, argyl sulfonate,
A surfactant such as a polycarboxylate or an alkylammonium salt may be added. The content of the surfactant is preferably 0.1 to 100 parts by weight of the ceramic or glass powder from the viewpoint of improving dispersibility and thermal decomposability. It is preferably from 0.5 to 5 parts by weight.

Further, a curing catalyst called a curing reaction accelerator or a polymerization initiator can be added to the binder in the mixture 21. As the curing catalyst, an organic peroxide or an azo compound can be used, for example, ketone peroxide, diacyl peroxide, peroxyketal, peroxyester, hydroperoxide, peroxycarbonate, t-butyl peroxide. Organic peroxides such as oxy-2-ethylhexanoate, bis (4-t-butylcyclohexyl) peroxydicarbonate and dicumyl peroxide, and azo compounds such as azobis and isobutyronitrile are included. 1 and 2, the trapezoidal partition 11 is shown, but the present invention is not limited to this example.

[0041]

EXAMPLE 1 In order to evaluate a substrate for a plasma display device of the present invention and a method of manufacturing the same, alumina (Al ₂ O ₃ ), zirconia (ZrO ₂ ), and nitride having an average particle size of 0.2 to 5 μm were used. A mixture of silicon (Si ₃ N ₄ ) and aluminum nitride (AlN) as main components and the above-mentioned known sintering aids added and mixed as necessary to obtain a ceramics powder, based on 100 parts by weight of the ceramic powder No. of Table 1 Mixtures 21 were prepared by adding and mixing the binder compositions as shown in Nos. 1 to 7 and mixing with a stirring mixer to adjust the viscosity.
In addition, the kind of the binder composition shown in Table 1 is as the substance name shown in Table 2.

[0042]

[Table 1]

[0043]

[Table 2]

After the mixture 21 thus obtained was defoamed by a vacuum device, it was injected and filled into the recess 20a of the mold 20 made of silicone resin by using a doctor blade in the manner of sheet molding. The concave portion 20a has an inverted trapezoidal shape, and the size of the partition wall 11 after sintering is 0.22 mm in cell pitch size.
The width of the partition 11 is 0.05 mm, and the opening size of the cell upper surface is 0.1 mm.
It is designed such that the cell bottom dimension is 17 mm, the cell bottom dimension is 0.05 mm, and the cell height is 0.10 mm. The defoaming treatment may be performed after filling the mixture 21 into the mold 20.

Thereafter, a back plate 10 made of a ceramic sintered body similar to the mixture 21 is placed on the surface of the mixture 21 filled in the molding die 20, and the flat plate is put together with the molding die 20 at a pressure of 100 g / cm ² . It was housed in a heating furnace or the like while applying pressure, and was held at a temperature of 100 ° C. for 45 minutes to be heated and cured.

After the curing is completed, the back plate 1
The molded body of the mixture 21 in close contact with 0 was released from the mold, the molded body was dried at a temperature of 120 ° C. for 5 hours, and then kept in a nitrogen atmosphere at a temperature of 250 ° C. for 3 hours, and then 500 ° C.
, And kept at that temperature for 12 hours to remove the binder. After that, those containing alumina as the main component
Hold at a temperature of 600 ° C. for 2 hours, in the case of zirconia, in the air, at a temperature of 1450 ° C. for 2 hours, in the case of silicon nitride, in a nitrogen atmosphere, at a temperature of 1650 ° C. for 10 hours, in the case of aluminum nitride The substrate was held at a temperature of 1800 ° C. for 3 hours in a nitrogen atmosphere and fired and integrated to obtain a substrate 1 for a plasma display device of the present invention.

On the other hand, as a comparative example, the same ceramic powder mainly containing alumina as described above As shown in 8, using a printing paste obtained by adding and kneading methylcellulose and α-terpineol, printing was repeated by a thick film printing method to produce a plasma display device substrate 1 having partition walls 11 having the same specifications as above.

Using the thus obtained plasma display device substrates 1 of the present invention and the comparative example, the surface roughness of the partition walls 11 was measured using a contact type surface roughness meter (Surfcoder SE-230).
0), and the dimensional accuracy of the partition 11 is 1000
The length between cells was measured in 45 rows with a micrometer, and evaluated by the maximum difference between the measured values. Table 3 shows the results.

[0049]

[Table 3]

From these results, it is found that No. 1 having the partition wall 11 formed by the thick film printing method as a comparative example. In No. 8, the surface roughness of the partition wall 11 is as rough as Rmax of 6.7 μm, the dimensional accuracy is 0.35 mm, the maximum difference between the measured values, and the shape of the display cell is partially collapsed.

On the other hand, in the embodiment of the present invention, No.
In Nos. 1 to 7, the surface roughness of the partition walls 11 is as small as 1.8 μm or less in Rmax, and the maximum difference between the measured values is 0.05 mm or less, which is excellent in dimensional accuracy. No collapse was found in the shape of the display cell.

The present invention is not limited to the above-described embodiment, but includes apatite (Ca ₅ (PO ₄ ) ₃ (F, Cl, OH)) and glass (Na ₂ O) as main components of the ceramic powder. It has been confirmed that the same effect can be obtained even when CaO.5SiO ₂ ) is used.

The shape of the molding die 20 for forming the partition wall 11 constituting the display cell according to the present invention has been described in the above embodiment with the concave portion 20a having an inverted trapezoidal cross section, but is not limited to this shape. Not something.

Embodiment 2 Next, in the embodiment of the present invention described above, Mixture 2 of 1, 6
1 and a partition 11 using a molding die in the same manner as in Example 1.
And bonded to the back plate 10.

At this time, the mixture 21 forming the partition walls 11 was joined in an unfired state or a fired state, respectively, and three types of unfired ceramic plate, fired ceramic plate, and glass plate were used as the back plate 10. . The presence or absence of peeling or cracking upon firing and integration was examined, as shown in Table 4.

As a result, when the mixture 21 composed of the ceramic powder was joined to the glass back plate 10 in an unfired state, cracks occurred due to the different firing temperatures. On the other hand, the mixture 21 composed of ceramic powder
Was previously fired, it was possible to join and integrate with the back plate 10 made of glass.

[0057]

[Table 4]

Example 3 As a mixture 21 constituting the partition walls 11, as shown in Table 5, the average particle size was 0.2 to 10 μm (preferably 0.2 to 5 μm).
Of glass powder, various solvents, organic additives, and a small amount of a dispersing agent were prepared.
0 was filled in the recess 20a and defoamed.

The back plate 10 made of glass was placed on this surface, and after pressing and drying, it was confirmed that the mixture 21 was solidified and joined to the back plate 10, and then the mold 20 was released. Thereafter, the whole was baked at 500 to 700 ° C. to produce a substrate 1 for a plasma display device.

[0060]

[Table 5]

On the other hand, as a comparative example, screen printing and drying were repeated 10 times by a conventional printing method to form a partition 11 on a glass back plate 10, and then 500 to 7 times.
By firing at 00 ° C., a substrate 1 for a plasma display device was manufactured (No. 7).

No. obtained as described above. Table 6 shows the results of observing the shape of the partition wall 11 and the presence or absence of cracks of the samples 1 to 7 with a binocular microscope.

From the results, it was found that the comparative examples No. In No. 7, the shape of the partition wall 11 was unclear. On the other hand, in the examples of the present invention (Nos. 1 to 6), In No. 6, although the partition wall 11 was slightly crushed due to the large amount of the solvent, the partition wall 11 was generally good in shape and no crack was generated. Therefore, it was found that the plasma display device substrate 1 could be manufactured favorably even when glass was used for the back plate 10 and the partition 11.

[0064]

[Table 6]

[0065]

As described above, the substrate for a plasma display device and the method of manufacturing the same according to the present invention provide a molded article obtained by filling a mixture of a ceramic or a glass powder and a binder into a molding die, a ceramic or a ceramic. Since the back plate made of glass is joined and integrated, it can be manufactured in one molding step, and the dimensional accuracy of the mold is transferred to the molded body as it is, so that a partition wall with a good surface condition can be formed. Thus, the size can be easily increased. As a result, it is possible to provide a plasma display device substrate and a method for manufacturing the same capable of realizing a high definition with a shortened and simplified manufacturing process and a high product yield.

[Brief description of the drawings]

FIG. 1 is a partially broken perspective view showing a substrate for a plasma display device of the present invention.

FIGS. 2A and 2B are views for explaining a method of manufacturing a substrate for a plasma display device according to the present invention.

FIG. 3 is a cross-sectional view showing a conventional substrate for a plasma display device.

[Explanation of symbols]

 1: Substrate 10: Back plate 11: Partition wall 12: Electrode 13: Cell 14: Electrode 15: Front plate 20: Mold 21: Mixture

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-53-28373 (JP, A) JP-A-3-254857 (JP, A) JP-A-1-137534 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H01J 17/16 H01J 9/02 H01J 9/24

Claims (1)

(57) [Claims] 1. A ceramic or glass powder having a particle size of 0.2 to 10 μm and a solvent in an amount of 1 to 15 parts by weight based on the powder.
When a mixture of a binder made of an organic additive, reverse
Filled into a mold having a trapezoidal concave portion for partition,
After releasing the mold by joining these mixtures to the back plate made of ceramic or glass, firing integrated
By providing a plurality of trapezoidal partitions on the back plate
A method for manufacturing a substrate for a plasma display device , comprising the steps of: