JP3472413B2 - Plasma display device substrate and plasma display device using the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for a plasma display device used in a high precision and inexpensive thin color display device for a large screen and a method for manufacturing the same.

[0002]

2. Description of the Related Art A plasma display device used in a thin large-screen color display device or the like is provided with facing electrodes in a space surrounded by partition walls called minute display cells, and discharge of rare gas or the like in the space. It has a structure in which possible gas is enclosed, and plasma is generated by discharge between the opposing electrodes,
The plasma causes the phosphor to emit light and is used as a light emitting element of the screen.

As shown in FIG. 8, the specific structure is such that a large number of partition walls 11 are formed on one surface of the back plate 10 to form cells 13 between the partition walls 11, and electrodes 12 are provided on the bottom surface of the cells 13. Is a substrate 1. On this substrate 1, a phosphor is applied to the side surface 11a of the partition wall 11 which is the inner wall surface of the cell 13,
On the other hand, the front plate 14 provided with the linear electrodes 15 is bonded onto the partition wall 11 of the substrate 1 and the gas is sealed in the cells 13, so that the plasma display device can be configured.

By the way, when the substrate 1 for the plasma display device is manufactured, a large number of electrodes 1 are previously formed on the back plate 10.
The partition wall 11 is formed between the electrodes 12 after forming the partition wall 2. As a manufacturing method of this partition wall 11, a printing lamination method, a blast method, or the like is known.

In the printing and laminating method, the partition wall 11 having a predetermined pattern is formed by printing on the back plate 10 by a thick film printing method using a paste of a material forming the partition wall 11. Since it is about 10 to 15 μm,
The partition 11 which requires a height of about 100 to 200 μm is formed by repeating printing and drying (see JP-A-2-213020).

In the blasting method, a glass layer having a predetermined thickness is formed on the entire surface of the back plate 10, a resist mask in the shape of the partition wall 11 is formed on this surface, and the portion other than the partition wall 11 is sandblasted. The glass layer is removed (see Japanese Patent Laid-Open No. 4-259728).

[0007]

However, in the conventional substrate 1 for a plasma display device, as shown in FIG.
Since the side surface 11a of the above is a surface vertical to the back plate 10, the applied phosphor is collected in the corner and is wasted,
In addition, since the partition wall 11 itself needs to have a certain width in terms of strength, there is a problem in that it is difficult to increase the opening degree of the cell 13 and it is difficult to increase the luminous intensity.

Moreover, in the above-mentioned printing and laminating method, the printing and drying steps must be repeated many times to form the partition walls 11 having a predetermined height, and the number of steps is extremely large. The yield was very poor because it was necessary to print accurately for each stack. Further, the partition walls 11 are easily deformed due to misalignment during printing, and due to the elongation of the printing plate, the dimensional accuracy of the display cells formed by the partition walls 11 is as follows. The maximum difference between the measured values was about 0.35 mm, which did not satisfy the demand for high definition.

Also in the blast method, since the photoresist is used for forming the mask and the sand blasting is performed, the process is complicated and it is difficult to form the partition wall 11 with high precision. Further, when the abrasive used for the blasting process is collected and repeatedly used, it is difficult to mass-produce it stably because the grinding force is deteriorated due to the abrasion deterioration of the abrasive and the secular change occurs. On the other hand, when the polishing agent is used without being collected, the cost of the polishing agent becomes high, and in this case as well, mass production was difficult.

[0010]

Therefore, the present invention provides a substrate for a plasma display device, wherein a partition wall is formed on a back plate made of ceramics or glass, and a surface plate is bonded onto the partition wall. By narrowing the width of the partition wall from the back plate side to the front plate side, the width of the cells formed between the partition walls is widened from the back plate side to the front plate side. .

Further, the present invention is characterized in that the angle formed between the side surface of the partition wall and the perpendicular of the back plate is 1 to 45 °.

Furthermore, the present invention is characterized in that a chamfer is formed on the top end surface of the partition wall.

Further, in the method for manufacturing a substrate for a plasma display device according to the present invention, a mixture of ceramic or glass powder and a binder containing a solvent and an organic additive is molded to have a tapered recess for a partition wall. The method is characterized by comprising a step of joining the mixture to a back plate made of ceramics or glass and integrating them after filling in a mold.

Here, the term "integral" means that the mixture is filled in a mold having the above-mentioned recesses, and the mixture is adhered to the back plate and solidified, followed by releasing and firing, or the mold is filled with the mixture and solidified. After that, it includes a step of releasing and then closely adhering to the back plate and firing, a step of filling the molding die with the mixture, solidifying and then releasing and firing, and adhering or thermocompression bonding to the back plate. Besides, it is also possible to use a general glass or ceramics joining method.

[0015]

According to the present invention, since the partition walls of the plasma display device substrate are tapered so that the width becomes narrower from the rear plate side toward the front plate side, the side surfaces of the partition walls are inclined and the light emitting area is reduced. It is possible to increase the luminous intensity by increasing the size, and it is possible to eliminate waste when applying the phosphor.

Further, according to the method for manufacturing a substrate for a plasma display panel of the present invention, since a mixture of ceramic or glass powder and a binder is filled in a mold to obtain a molded body of the partition wall, the surface state of the partition wall is obtained. And the dimensional accuracy of the molding die is directly reflected on the molded body, and a large-sized substrate can be easily manufactured by a simple molding process. Further, by making the concave portion of the forming die thin, it is possible to easily form the thin partition wall and to improve the mold releasing property from the forming die during the manufacturing process.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.

As shown in FIG. 1, a substrate 1 for a plasma display device has a plurality of partition walls 11 made of ceramics or glass on one surface of a back plate 10 made of ceramics or glass.
And the cells 13 are formed between the partition walls 11.

As shown in FIG. 2, the partition wall 1 is provided with an electrode 12 on the bottom surface of the cell 13 and forms the inner wall surface of the cell 13.
After applying a phosphor (not shown) to the side surface 11a of No. 1, the upper end of the partition wall 11 is covered with a transparent front plate 14 having linear electrodes 15, and a gas is sealed in the cell 13 to form a plasma display device. Can be configured. In this state, the electrode 12,
By discharging between 15, the phosphor coated on the side surface 11a of the cell 13 can emit light.

Here, the partition wall 11 has a tapered shape in which the width t ₁ of the apex on the front surface 14 side is smaller than the width t ₂ of the root on the rear plate 10 side, and the side surface 11a is sloped. . Therefore, the width of the cell 13 formed between the partition walls 11 increases from the rear plate 10 toward the front plate 14. Therefore, when the phosphor is applied to the side surface 11a, it is possible to eliminate waste and increase the light emitting area.

For example, as shown in FIG. 3 (b), in the conventional partition wall 11, the side surface 11a is a surface perpendicular to the back plate 10. Therefore, the phosphor 16 applied to this portion flows downward and collects in the corner. Was wasted. On the other hand, FIG.
As shown in (a), when the partition wall 11 is tapered, the side surface 11a becomes an inclined surface.
6 can be prevented from accumulating in the corner. Moreover, cell 13
Since the opening area is increased, the luminous intensity can be increased and a sufficient luminous intensity can be obtained even when viewed from an oblique direction.

The angle θ formed by the side surface 11a of the partition wall 11 and the vertical line of the back plate 10 is preferably 1 to 45 °. This is because if the angle θ is less than 1 °, the above effect is poor, while if it exceeds 45 °, the pitch between the partition walls 11 becomes large and the definition is lowered. More preferably, the range of 2 to 40 ° is preferable. .

Further, as shown in FIG. 4, it is preferable to form a rounded chamfer 11b on the top end surface of the partition wall 11. By doing so, the applied phosphor 16 can also enter the chamfered portion 11b to further increase the light emitting area.

Next, another embodiment of the partition wall 11 will be described.

The partition wall 11 shown in FIG. 5 (a) has a side surface 11a with a concave curved surface, and the partition wall 11 shown in FIG. 5 (b).
Shows the side surface 11a having a convex curved surface shape, as shown in FIG.
The partition wall 11 shown in FIG. 2 has a side surface 11a having a two-step shape of an inclined surface and a vertical surface. In either case, the partition wall 11 has a tapered shape in which the width of the top portion on the front surface plate 14 side is smaller than the width of the root portion on the rear surface plate 10 side.

In any case, the angle θ formed by the side surface 11a and the perpendicular of the back plate 10 is 1 to 45 °, preferably 2
It is within the range of -40 °. When the side surface 11a is not a perfect slope as in these examples, the angle θ with respect to the perpendicular of the back plate 10 may be within the above range at either the root portion or the top portion of the side surface 11a.

Regarding the shape of the chamfer 11b provided on the top end surface of the partition wall 11, the curved chamfer 11b as shown in FIG. 6A, the stepped chamfer 11b as shown in FIG. Chamfer 1 with a concave curved surface as shown in 6 (c)
1b, a stepped chamfer 11b having a large depth as shown in FIG. 6 (d), and a chamfered chamfer 11 as shown in FIG. 6 (e).
b and so on. In addition, these chamfers 11
The width d ₁ of b is preferably 1/3 or less of the width d ₂ of the top of the partition wall 11. This is because if the width of the chamfer 11b is larger than 1/3 of the width of the top, the top is too narrow and the adhesion to the surface plate 14 is deteriorated, and the strength of the top is reduced.

Next, a method for manufacturing the substrate 1 will be described.

First, as shown in FIG. 7A, the partition wall 11
Forming die 2 having a tapered recess 20a conforming to the shape of
0 is prepared, and the partition wall 11 is placed in the recess 20a of the molding die 20.
A mixture 21 of ceramics or glass powder and a solvent and a binder of an organic additive is filled as a material forming

On the other hand, a back plate 10 made of ceramics or glass is prepared separately, and the mixture 2 is added to the back plate 10.
The molded body of No. 1 is joined and integrated to form the partition wall 11. Specifically, it is manufactured as follows.

First, the mixture 2 filled in the molding die 20.
The back plate 10 is pressed against the surface of No. 1 and pressure-bonded, and the mixture 21 is cured by reaction or dried to solidify. After that, as shown in FIG.
By separating from, the partition wall 11 made of a molded body of the mixture 21 is transferred onto the back plate 10. Finally, after the whole is debindered, the substrate 1 for the plasma display device shown in FIG. 1 can be manufactured by co-firing and unifying.

As another method, after the mixture 21 filled in the molding die 20 is reaction-cured or dried and solidified, it is released from the molding die, and the molded body of the mixture 21 is bonded to the back plate 10. Finally, the substrate 1 for the plasma display device can also be obtained by subjecting the whole to a binder removal treatment and then simultaneously firing and integrating them.

As still another method, the mixture 21 filled in the molding die 20 is cured by reaction or dried and solidified, then released from the molding die, debindered, and then adhered to the back plate 10. . Finally, the substrate 1 for the plasma display device can also be obtained by co-firing the whole body and integrating them.

Alternatively, the mixture 2 filled in the mold 20
After 1 is cured by reaction or dried and solidified, it is released from the mold,
The substrate 1 for a plasma display device can also be obtained by adhering this sintered body to the back plate 10 and then bonding it by thermocompression bonding or simultaneous firing after debinding and firing.

That is, the molded body of the mixture 21 may be bonded to the back plate 10 at any stage of the members such as a green body, a binder-free state and a sintered body.

According to the manufacturing method of the present invention as described above, since the partition wall 11 can be easily formed, the manufacturing process can be extremely simplified. Moreover, since the shape of the concave portion 20a of the molding die 20 is transferred to the partition wall 11, the concave portion 20a is covered with the partition wall 11 described above.
If the taper shape conforms to the above condition, the taper-shaped partition wall 11 can be easily formed, and the mold release property from the molding die 20 can be improved.

With respect to this point, it is extremely difficult to form the thin partition wall 11 by the conventional thick film printing method or blast method, and the transfer method using the molding die 20 as in the present invention is performed. By manufacturing, the thin partition wall 11 can be easily formed.

Further, according to the above-mentioned manufacturing method of the present invention, the fine shape can be formed with high precision, and as a result, the maximum difference between the measured values when the size of 1000 display cells is measured in 45 columns is 0.05.
High accuracy can be achieved so as to be less than or equal to mm.

The electrode 12 provided on the bottom surface of the cell 13 may be provided on the surface of the back plate 10 in advance before joining the partition wall 11. Alternatively, the electrode material may be applied in advance to the convex portions of the mold 20, and the electrodes 12 may be formed simultaneously with the formation of the partition walls 11.

Here, as the ceramic powder forming the partition wall 11, alumina (Al ₂ O ₃ ), zirconia (Zr
Oxide-based ceramics such as O ₂ ) and silicon nitride (Si ₃
N ₄ ), aluminum nitride (AlN), silicon carbide (Si
Any of non-oxide ceramics such as C) or apatite (Ca ₅ (PO ₄ ) ₃ (F, Cl, OH)) can be used, and various sintering aids can be used for these ceramic powders. A desired amount of the agent can be added.

As the above-mentioned sintering aid, silica (SiO ₂ ), calcia (CaO), yttria (Y ₂ O ₃ ) and magnesia (MgO) are used for the alumina powder, and yttria (Y ₂ O) is used for the zirconia powder. ₃ ) and cerium (C
e), dysprosium (Dy), ytterbium (Y
b) and other rare earth element oxides, silicon nitride powders such as yttria (Y ₂ O ₃ ) and alumina (Al ₂ O ₃ ), and aluminum nitride powders such as Group 3a element oxides of the periodic table ( RE ₂ O ₃ ) and the like, and boron (B) and carbon (C) and the like in desired amounts can be added to the silicon carbide powder.

The glass powder forming the partition wall 11 contains silicate as a main component and contains lead (Pb), sulfur (S),
Various glasses containing one or more of selenium (Se), alum and the like can be used.

The ceramic or glass powder having a particle size of several tens of microns to submicrons can be preferably used, specifically, 0.2 to 10 μm, preferably 0.2 to 5 μm. Good in the range.

Further, organic additives added to these ceramic or glass powders include urea resin, melamine resin, phenol resin, epoxy resin, unsaturated polyester resin, alkyd resin, urethane resin, ebonite, polysiloxy silicate. Etc. And as a means for reacting and curing these organic additives,
There are heat curing, ultraviolet irradiation curing, X-ray irradiation curing and the like. From the point of view of work, the heat curing is optimal from the viewpoint of the apparatus, and the unsaturated polyester resin is particularly preferable from the viewpoint of pot life. The content of the organic additive, in order to maintain the fluidity and moldability of the mixture of the ceramic or glass powder and the sintering aid, it is necessary to keep the viscosity high, while It is desirable to have sufficient shape-retaining property during curing. From this point,
The content of the organic additive is preferably 0.5 parts by weight or more with respect to 100 parts by weight of the ceramic or glass powder, and 35 parts by weight or less is more preferable from the viewpoint of shrinkage of the molded body due to curing. Considering shrinkage during firing,
Most preferred is 15 parts by weight.

The solvent added to the mixture 21 is not particularly limited as long as it is compatible with the organic additives, and examples thereof include aromatic compounds such as toluene, xylene, benzene and phthalic acid ester. Solvents, higher alcohols such as hexanol, octanol, decanol, and oxyalcohol, or esters such as acetic acid ester and glyceride can be used.

Above all, the phthalic acid ester, oxyalcohol and the like can be preferably used, and in addition, two or more kinds of the above solvents can be used in combination in order to slowly volatilize the solvent. Is required to be 0.1 parts by weight or more based on 100 parts by weight of the ceramic or glass powder in order to maintain the shape retention of the formed body in terms of formability.
On the other hand, since it is desirable to lower the viscosity of the mixture of the ceramic or glass powder and the organic additive, it is more preferably 35 parts by weight or less, and is 1 to 15 parts by weight in consideration of shrinkage during drying and firing. Is most desirable.

The molding die 20 in the present invention may be any material as long as it does not interfere with the curing of the organic additive, and the material is not particularly limited. For example, metal, resin, rubber or the like can be used. For example, surface treatment such as surface coating may be performed to improve releasability and prevent wear.

The back plate 10 is an unsintered green sheet or a sintered body, and its material is not particularly limited.
For example, various ceramic green sheets, various glass substrates, porcelain substrates, and the like are desired to have a material similar to that of the partition wall 11 in thermal expansion coefficient. As the glass substrate, relatively inexpensive glass such as soda lime glass or a material in which an inorganic filler is dispersed to improve its strain point can be used.

Further, in order to improve the adhesiveness when the mixture 21 and the back plate 10 are pressure-bonded, various coupling agents such as a silane coupling agent, a titanate coupling agent, and an aluminate coupling agent are used. A silane coupling agent is preferable because of its high reactivity.

Further, for the pressure bonding of the mixture 21 and the back plate 10, it is desirable to use a hydrostatic device from the viewpoint of applying a uniform pressure, and the pressurizing condition is a pressure range that does not deform the molding die 20. , The pressure range is the mold 20
Although it depends on the strength, the pressure is preferably about 100 g / cm ² when using a mold 20 made of silicon rubber.

In order to improve the dispersibility of the ceramic or glass powder in the mixture 21, for example, polyethylene glycol ether, argyl sulfonate,
A surfactant such as a polycarboxylic acid salt or an alkylammonium salt may be added, and the content of the surfactant is 0.1% based on 100 parts by weight of the ceramic or glass powder from the viewpoint of improving dispersibility and thermal decomposability. 05 to 5 parts by weight is desirable.

Furthermore, a curing catalyst called a curing reaction accelerator or a polymerization initiator may be added to the binder in the mixture 21. As the curing catalyst, an organic peroxide or an azo compound can be used, and examples thereof include ketone peroxide, diacyl peroxide, peroxyketal, peroxyester, hydroperoxide, peroxycarbonate, t-butylperoxide. Examples thereof include organic peroxides such as oxy-2-ethylhexanoate, bis (4-t-butylcyclohexyl) peroxydicarbonate and dicumyl peroxide, and azo compounds such as azobis and isobutyronitrile.

[0053]

EXAMPLES Example 1 In order to evaluate the substrate for a plasma display device and the manufacturing method thereof according to the present invention, alumina (Al ₂ O ₃ ) having an average particle size of 0.2 to 5 μm, zirconia (ZrO ₂ ), nitriding A mixture of silicon (Si ₃ N ₄ ) and aluminum nitride (AlN) as main components, to which the above-mentioned known sintering aids were added and mixed, if necessary, was used as a ceramic powder, and 100 parts by weight of the ceramic powder was used. No. of Table 1 A binder 21 was prepared by adding and mixing the binder compositions as shown in 1 to 7 and mixing them with a stir mixer to adjust the viscosity.
The types of the binder composition shown in Table 1 are the same as the substance names shown in Table 2.

[0054]

[Table 1]

[0055]

[Table 2]

The mixture 21 thus obtained was degassed by a vacuum device, and then injected and filled in the recess 20a of the mold 20 made of silicon resin by using a doctor blade in the same manner as sheet molding. The recess 20a is formed by the partition wall 11 of FIGS.
The shape of the inverted trapezoidal taper is the same as that of the above, and the size of the partition wall 11 after sintering is 220 μm in cell pitch size, the width t ₂ of the root portion of the partition wall 11 is 110 μm, and the width t _{1 of the} top portion is 50 μm.
m, cell top opening size 170 μm, cell bottom size 5
It is designed to have a cell height of 0 μm and a cell height of 100 μm. In addition, the defoaming treatment was performed by adding the mixture 2 to the molding die 20.
It may be performed after filling 1.

Then, the back plate 10 made of a ceramic sintered body of the same type as the mixture 21 is placed on the surface of the mixture 21 filled in the forming die 20, and the flat plate is placed together with the forming die 20 at a pressure of 100 g / cm ² . It was housed in a heating furnace or the like while being pressurized, and was held at a temperature of 100 ° C. for 45 minutes to be heat-cured.

After the curing is completed, the molding die 20 is removed from the back plate 1.
The molded body of the mixture 21 that was in close contact with 0 was released from the mold, the molded body was dried at a temperature of 120 ° C. for 5 hours, and then kept at a temperature of 250 ° C. for 3 hours in a nitrogen atmosphere, and then 500 ° C.
The temperature was raised to and held at that temperature for 12 hours to remove the binder. After that, those whose main component is alumina are 1
Hold at a temperature of 600 ° C. for 2 hours, in the case of zirconia in air, at a temperature of 1450 ° C. for 2 hours, in the case of silicon nitride in a nitrogen atmosphere, at a temperature of 1650 ° C. for 10 hours, in the case of aluminum nitride In a nitrogen atmosphere, the temperature was kept at 1800 ° C. for 3 hours to perform firing and integration to obtain a substrate 1 for a plasma display device of the present invention.

On the other hand, as a comparative example, No. 1 in Table 1 was added to the same ceramic powder containing alumina as the main component as described above. As shown in 8, using a printing paste in which methylcellulose and α-terpineol were added and kneaded, printing was repeated by a thick film printing method to fabricate a substrate 1 for a plasma display device having partition walls 11 having the same specifications as described above.

Using the thus obtained substrate 1 for a plasma display device of the embodiment of the present invention and the comparative example, the dimension accuracy of the partition wall 11 is 1000 micrometer in length of 4 cells.
Five rows were measured and evaluated by the maximum difference between the measured values. The results are shown in Table 3.

[0061]

[Table 3]

From this result, No. 11 having the partition wall 11 formed by the thick film printing method which is a comparative example. In No. 8, the dimensional accuracy of the partition wall 11 is as large as 0.35 mm in the maximum difference between the measured values, and the shape of the display cell is partially collapsed.

On the other hand, No. 1 according to the embodiment of the present invention.
In Nos. 1 to 7, no matter what ceramic powder was used, the maximum difference between the measured values of the partition wall 11 was 0.05 mm or less, which was excellent in dimensional accuracy, and no collapse was observed in the shape of the display cell.

It should be noted that the present invention is not limited to the above-mentioned embodiment, but apatite (Ca ₅ (PO ₄ ) ₃ (F, Cl, OH)) or glass (Na ₂ O) is used as the main component of the ceramic powder. It was confirmed that the same effect can be obtained by using CaO.5SiO ₂ ).

Further, the shape of the molding die 20 for forming the partition wall 11 which constitutes the display cell in the present invention has been described with reference to the inverted trapezoidal recess 20a corresponding to the partition wall 11 in FIGS. It is not limited to.

Embodiment 2 Next, among the above-mentioned embodiments of the present invention, No. Mixture 1 and 6 2
1 using the same molding die as in Example 1
Was molded and joined to the back plate 10.

At this time, the mixture 21 forming the partition wall 11 was joined in the unfired state or the fired state, and three kinds of the unfired ceramic plate, the fired ceramic plate and the glass plate were used as the back plate 10. . Table 4 shows the results of examining the presence or absence of peeling and cracks when the materials were integrated by firing.

From this result, when the mixture 21 made of ceramic powder was joined to the glass back plate 10 in an unfired state, cracks occurred because the firing temperature was different. On the other hand, a mixture 21 made of ceramic powder
If it was fired in advance, it was possible to join and integrate it with the glass back plate 10.

[0069]

[Table 4]

Example 3 As the mixture 21 forming the partition wall 11, as shown in Table 5, the average particle size is 0.2 to 10 μm (preferably 0.2 to 5 μm).
A slurry is prepared by adding the above-mentioned glass powder, various solvents, an organic additive and a small amount of a dispersant, and mixing this mixture 21 with the molding die 2
It was filled in the concave portion 20a of 0 and defoamed.

The rear plate 10 made of glass was placed on this surface, pressed and dried, and after confirming that the mixture 21 was solidified and bonded to the rear plate 10, the mold 20 was released. After that, the whole was baked at 500 to 700 ° C. to manufacture the substrate 1 for plasma display device.

[0072]

[Table 5]

On the other hand, as a comparative example, screen printing and drying were repeated 10 times to form the partition wall 11 on the glass back plate 10 by the conventional printing method, and then 500 to 7
The substrate for a plasma display device 1 was manufactured by firing at 00 ° C. (No. 7).

No. 1 obtained as described above. Table 6 shows the results of observing the shape of the partition wall 11 and the presence or absence of cracks of the samples 1 to 7 with a binocular microscope.

From this result, No. which is a comparative example is shown. In No. 7, the shape of the partition wall 11 was unclear. On the other hand, in No. 1 to No. 6 of the present invention, In No. 6, although the partition wall 11 was slightly crushed due to the large amount of solvent, the shape of the partition wall 11 was generally good and no crack was generated. Therefore, it was found that the substrate 1 for plasma display device can be manufactured well even when glass is used for the back plate 10 and the partition wall 11.

[0076]

[Table 6]

Example 4 No. shown in Example 3 In addition to 1 to 7, as a comparative example, a substrate 1 having a partition 11 formed by a sandblast method was manufactured. That is, after applying a glass agent to be a partition on the glass back plate 10 and baking it, a resist mask is attached,
The unnecessary portions were removed by sandblasting, and the partition wall 11 was produced. (No. 8) No. which is an example of the present invention. Regarding 1 to 6, the angle θ formed between the side surface 11a of the partition wall 11 and the perpendicular of the back plate 10 was set to 0 °, 2 °, 15 °, 40 °, 45 °. It should be noted that those having an angle θ of more than 45 ° are not suitable from the viewpoint of definition and are excluded. The height of the partition wall 11 is 20
The width t _{1 of the} top was 50 μm.

The amount used when the phosphor 16 was applied and the definition of the partition wall 11 were evaluated. The definition is superior as the partition wall pitch and the partition wall width are smaller.

As shown in Table 7, the angle θ is 1 to 45 °, preferably 2 to 40, in order to obtain high definition and reduce the amount of the phosphor 16 used to reduce the cost.
It can be seen that the range is °.

[0080]

[Table 7]

Fifth Embodiment Next, among the fourth embodiment, No. 4 will be described. 3 having an angle θ of 15 °, various chamfers 11b shown in FIG. 6 are formed on the top end surface of the partition wall 11, and the electrode 12 and the phosphor 1 are respectively formed.
6 was applied and a light emission test was conducted.

As a result, it was confirmed that good results were obtained as compared with the conventional one having the vertical partition walls 11 as shown in FIG.

[0083]

As described above, according to the present invention, a partition wall is formed on a back plate made of ceramics or glass, and a surface plate is bonded onto the partition wall. By widening the width of the cells formed between the partition walls from the rear plate side toward the front plate side,
It is possible to increase the light emitting area to increase the light emitting degree and to reduce the amount of the applied phosphor used.

According to the method for producing a substrate for a plasma display device of the present invention, a molded body obtained by filling a mixture of ceramics or glass powder and a binder in a molding die,
Since the back plate made of ceramics or glass is joined and integrated, it can be manufactured by a simple molding process, and since the dimensional accuracy of the molding die is directly transferred to the molded body, a partition wall with a good surface condition can be obtained. The size can be easily increased.

As a result, it is possible to provide a substrate for a plasma display device and a method for manufacturing the same, which can realize shortening and simplification of the manufacturing process, high product yield, and high definition.

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view showing a substrate for a plasma display device of the present invention.

FIG. 2 is a cross-sectional view showing the structure of a plasma generator using the plasma display substrate of the present invention.

3 (a) and 3 (b) are views for comparing cell shapes of a plasma generation substrate of the present invention and a conventional example.

4 is an enlarged cross-sectional view near the top of the partition wall in FIG.

5A to 5C are cross-sectional views showing another embodiment of the partition wall shape of the present invention.

6A to 6E are cross-sectional views showing another embodiment of the partition wall shape of the present invention.

7A and 7B are views for explaining a method of manufacturing a substrate for a plasma display device of the present invention.

FIG. 8 is a cross-sectional view showing a conventional substrate for a plasma display device.

[Explanation of symbols]

1: substrate 10: Back plate 11: Partition wall 11a: side surface 11b: Chamfer 12: Electrode 13: cell 14: Front plate 15: Electrode 20: Mold 21: Mixture

Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01J 17/16 H01J 9/02

Claims (4)

(57) [Claims] 1. A substrate for a plasma display device, wherein a partition wall is formed on a back plate made of ceramics or glass, and a front plate is bonded onto the partition wall.
From mix or glass powders and solvents and organic additives
With a binder consisting of tapered recesses for the partition walls
The width of the cells formed between the partition walls is widened from the back plate side to the front plate side, and at the top end face of the partition wall, the width of the top part is
And a chamfer having a width of 1/3 or less is formed . 2. The substrate for a plasma display device according to claim 1, wherein an angle θ formed by a side surface of the partition wall and a vertical line of the back plate is 1 to 45 °. 3. 1000 cells formed between the barrier ribs.
The maximum difference in the measured values when measuring 45 columns of cell dimensions is
It is 0.05 mm or less, 1 or
2. The substrate for plasma display device according to 2. 4. The plasma according to any one of claims 1 to 3.
An electrode is provided on the bottom surface of the cell of the display device substrate.
In addition, the inner wall surface of the cell is coated with phosphor and equipped with linear electrodes.
A plasma display device in which a front plate is joined to the partition wall.
Place