JPH10125219A - Manufacture of plasma display panel barrier plate - Google Patents

Manufacture of plasma display panel barrier plate

Info

Publication number
JPH10125219A
JPH10125219A JP27932296A JP27932296A JPH10125219A JP H10125219 A JPH10125219 A JP H10125219A JP 27932296 A JP27932296 A JP 27932296A JP 27932296 A JP27932296 A JP 27932296A JP H10125219 A JPH10125219 A JP H10125219A
Authority
JP
Japan
Prior art keywords
partition
insulating substrate
partition wall
barrier plate
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27932296A
Other languages
Japanese (ja)
Inventor
Kenichi Yoneyama
健一 米山
Masafumi Kato
雅史 加藤
Kiyohiro Sakasegawa
清浩 逆瀬川
Hirobumi Kishimoto
博文 岸本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP27932296A priority Critical patent/JPH10125219A/en
Publication of JPH10125219A publication Critical patent/JPH10125219A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a plasma display panel(PDP) barrier plate which facilitates the enlargement of screen and can realize high definition by a simple manufacturing process wherein the barrier plate constituting a discharge display cell of the PDP can be molded with high precision for a short time. SOLUTION: A molded frame opening part having a barrier plate shaped recessed part is filled with a barrier plate molding composition containing a photo-curing resin. Then, the barrier plate molding composition, with which the molded frame opening part is filled, is firmly adhered to an insulation substrate having translucency. Subsequently, it is exposed from a back face of the insulation substrate through the medium of the insulation substrate, and a photo-curing resin contained in the barrier plate molding composition is cured so that the barrier plate molding composition in the mold is cured. Then, the insulation substrate provided by demolding the mold is integral with a barrier plate molding body to be burned.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、高精度かつ安価な
薄型の大型画面用カラー表示装置等に用いられるプラズ
マディスプレイパネル用隔壁の製造方法に関するもので
ある。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a partition wall for a plasma display panel used for a high-precision, inexpensive, thin, large-screen color display device or the like.

【0002】[0002]

【従来の技術】薄型の大型画面用のカラー表示装置等に
用いられるプラズマディスプレイパネル(以下、PDP
と略記する)は、微小な放電表示セルと呼ばれる隔壁に
囲まれた空間に、対向する電極群を設け、前記空間に希
ガス等の放電可能なガスを封入した気密構造を成してお
り、前記対向する電極間に電圧を選択的に印加し、放電
によりプラズマを発生させ、該プラズマにより放電表示
セル内の蛍光体を発光させて画面の発光素子として利用
するものである。
2. Description of the Related Art A plasma display panel (hereinafter, referred to as a PDP) used for a color display device for a thin large screen is used.
Abbreviated as) has a hermetic structure in which opposing electrode groups are provided in a space surrounded by partition walls called minute discharge display cells, and a dischargeable gas such as a rare gas is sealed in the space. A voltage is selectively applied between the opposing electrodes to generate plasma by discharge, and the plasma causes a phosphor in a discharge display cell to emit light, which is used as a light emitting element of a screen.

【0003】一般に、前記PDPの放電表示セルを構成
する隔壁の製造方法としては印刷積層法やフォトリソグ
ラフィ法、サンドブラスト法等が知られている。
In general, a printing lamination method, a photolithography method, a sand blast method, and the like are known as a method of manufacturing a partition wall constituting the discharge display cell of the PDP.

【0004】前記印刷積層法は、隔壁材料のペーストを
用いて厚膜印刷法により放電表示セルの所定形状をパタ
ーンとして絶縁基板上に印刷形成するもので、1回の印
刷で形成できる膜の厚さが約10〜15μm程度である
ことから、印刷、乾燥を繰り返しながら約100〜20
0μm程度の高さを必要とする放電表示セルの隔壁を形
成するものである。
In the printing lamination method, a predetermined shape of a discharge display cell is printed and formed on an insulating substrate as a pattern by a thick film printing method using a paste of a partition wall material. Is about 10 to 15 μm, so that printing and drying are repeated for about 100 to 20 μm.
This is for forming a partition of a discharge display cell requiring a height of about 0 μm.

【0005】しかしながら、前記印刷積層法では印刷、
乾燥工程を繰り返して積層しなければならず、極めて工
程数が多くなり、その上、積層毎に精度良く印刷するこ
とが困難であり、製造歩留りが悪いという欠点があっ
た。
However, in the printing lamination method, printing,
The drying process has to be repeated and laminated, so that the number of processes is extremely large, and furthermore, it is difficult to print accurately for each lamination, and there is a drawback that the production yield is poor.

【0006】また、前記フォトリソグラフィ法は、絶縁
基板上に設けた感光性樹脂層をパターンマスクを介して
露光後、現像して開口部を形成し、該開口部に絶縁ペー
ストを埋め込み、隔壁を形成するものである。
In the photolithography method, an opening is formed by exposing a photosensitive resin layer provided on an insulating substrate through a pattern mask, and then developing the opening, filling the opening with an insulating paste, and forming a partition. To form.

【0007】従って、フォトリソグラフィ法においても
フォトマスクの位置決めを容易に精度良く行うことは困
難であり、更に、露光後に現像工程を必要とするため量
産性が低いという問題があった。
[0007] Therefore, it is difficult to easily and accurately position the photomask even in the photolithography method, and furthermore, a development step is required after exposure, so that the mass productivity is low.

【0008】一方、サンドブラスト法は絶縁基板上に所
定厚さのガラス層を形成し、この表面をレジストマスク
を介してサンドブラストにて隔壁以外の部分のガラス層
を除去して隔壁を形成するものである。
On the other hand, in the sand blast method, a glass layer having a predetermined thickness is formed on an insulating substrate, and the surface is sandblasted through a resist mask to remove portions of the glass layer other than the partition walls, thereby forming partition walls. is there.

【0009】しかしながら、サンドブラスト法において
も、レジストマスク形成にフォトレジストを用いた後、
サンドブラストを行うことから製造工程が複雑で、しか
も高精度に隔壁を形成することが困難であり、その上、
ブラスト加工に用いる研磨剤を回収し、繰り返して使用
する場合は、研磨剤の摩耗劣化による研削力の低下や経
時変化があり、安定して量産することが困難である等の
問題があった。
However, even in the sandblasting method, after a photoresist is used for forming a resist mask,
Since sand blasting is performed, the manufacturing process is complicated, and it is difficult to form partition walls with high accuracy.
When the abrasive used for the blasting process is collected and used repeatedly, there is a problem that the abrasive force deteriorates due to abrasion deterioration of the abrasive, and there is a change over time, which makes it difficult to stably mass-produce.

【0010】従って、従来周知の製造方法では、いずれ
も高精度で微細なピッチを有するプラズマディスプレイ
パネル用隔壁を容易に製造することは困難であった。
Therefore, it has been difficult to easily manufacture partition walls for a plasma display panel having high precision and fine pitch by any of the conventionally known manufacturing methods.

【0011】そこでかかる問題を解消するために、隔壁
形状の凹部を有する隔壁成形型に隔壁成形用組成物を充
填した後、該組成物を加熱硬化して絶縁基板に隔壁を一
体的に成形するPDP用の隔壁成形方法を先に提案した
(特願平7−340124号)。
[0011] In order to solve such a problem, after filling a partition-forming composition into a partition-forming mold having a partition-shaped recess, the composition is heated and cured to integrally form the partition on an insulating substrate. A method of forming a partition wall for a PDP was previously proposed (Japanese Patent Application No. 7-340124).

【0012】[0012]

【発明が解決しようとする課題】前記提案の隔壁成形方
法は、簡単な製造工程で比較的、精度良く隔壁が成形で
きるものの、隔壁成形用組成物を隔壁成形型に充填して
硬化させる手段として加熱硬化法を用いているため、隔
壁成形型に充填した隔壁成形用組成物が硬化するまでに
時間を要し、量産性に問題がある他、加熱による隔壁成
形型と絶縁基板との熱膨張差のために隔壁の位置にズレ
を生じ、大型画面用のPDPでは高精度の隔壁を再現良
く作製することが困難となるケースがあるという課題が
あった。
The partition wall forming method proposed above can form a partition wall relatively accurately with a simple manufacturing process. However, the partition wall forming composition is filled into a partition wall mold and cured. Since the heat-curing method is used, it takes time for the partition wall molding composition filled in the partition wall mold to harden, and there is a problem in mass productivity, and thermal expansion between the partition wall mold and the insulating substrate due to heating. Due to the difference, the position of the partition wall is displaced, and there has been a problem that it is difficult to produce a high-precision partition wall with good reproducibility in a large-screen PDP.

【0013】[0013]

【発明の目的】本発明は前記課題を解決するために成さ
れたもので、その目的はPDPの放電表示セルを構成す
る隔壁を簡単な製造工程で短時間に高精度に再現性良く
成形することができ、大型画面化が容易で高精細度化が
実現できるPDP用の隔壁を得ることが可能なPDP用
隔壁の製造方法を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to form a partition constituting a discharge display cell of a PDP in a simple manufacturing process in a short time with high accuracy and high reproducibility. It is an object of the present invention to provide a method for manufacturing a partition for a PDP capable of obtaining a partition for a PDP, which can easily realize a large screen and achieve a high definition.

【0014】[0014]

【課題を解決するための手段】本発明者等は前記課題に
鑑み鋭意検討した結果、光硬化性樹脂を含有した隔壁成
形用組成物を用い、透光性を有する絶縁基板の裏面から
該絶縁基板を通して紫外線や可視光線、赤外線、X線あ
るいは電子線により露光して隔壁成形用組成物に含有さ
れる光硬化性樹脂を硬化させることにより短時間で容易
に隔壁を成形できることを見いだした。
Means for Solving the Problems The present inventors have conducted intensive studies in view of the above-mentioned problems, and as a result, using a composition for forming a partition wall containing a photo-curable resin, the insulating substrate having a light-transmitting property was insulated from the back surface. It has been found that a partition can be easily formed in a short time by exposing it to ultraviolet light, visible light, infrared light, X-ray or electron beam through a substrate to cure the photocurable resin contained in the composition for forming a partition.

【0015】即ち、本発明のPDP用隔壁の製造方法
は、光硬化性樹脂を含有した隔壁成形用組成物を隔壁形
状の凹部を有する成形型の開口部に充填した後、該成形
型の開口部に充填した隔壁成形用組成物を透光性を有す
る絶縁基板に密着させ、次いで絶縁基板の裏面から該絶
縁基板を通して露光し、隔壁成形用組成物中の光硬化性
樹脂を硬化させることにより成形型内の隔壁成形用組成
物を硬化させるか、あるいは前記同様に露光し、絶縁基
板との密着面近傍の隔壁成形用組成物を先ず硬化させて
から別途加熱して成形型内の隔壁成形用組成物全体を硬
化させた後、成形型を脱型して得た絶縁基板と一体化し
た隔壁成形体を焼成するものである。
That is, according to the method for producing a partition for a PDP of the present invention, the composition for forming a partition containing a photocurable resin is filled into the opening of a mold having a recess having a partition shape, and then the opening of the mold is opened. By contacting the partition-forming composition filled in the portion with an insulating substrate having a light-transmitting property, and then exposing through the insulating substrate from the back surface of the insulating substrate, and curing the photocurable resin in the partition-forming composition. The partition wall molding composition in the mold is cured or exposed in the same manner as described above, and the partition wall molding composition in the vicinity of the close contact surface with the insulating substrate is first cured and then separately heated to form the partition wall in the mold. After the entire composition for use is cured, the molded partition wall integrated with the insulating substrate obtained by removing the mold is fired.

【0016】[0016]

【作用】本発明のPDP用隔壁の製造方法によれば、隔
壁形状の凹部を有する隔壁成形型に充填した光硬化性樹
脂を含有した隔壁成形用組成物に、該隔壁成形用組成物
と密着した透光性を有する絶縁基板の裏面から該絶縁基
板を通して露光して前記隔壁成形用組成物中の光硬化性
樹脂を硬化させることから、絶縁基板との密着面近傍の
隔壁成形用組成物が先ず短時間で硬化され、隔壁の位置
が正確に設定されて電極群との位置合わせが容易にな
り、しかも隔壁成形型を用いて硬化処理するだけで所望
の形状の隔壁を得ることができ、製造工程が格段に低減
でき、製造コストの大幅な削減が可能となる。
According to the method for producing a partition wall for a PDP of the present invention, the partition wall molding composition containing a photocurable resin filled in a partition wall mold having a partition wall-shaped recess is adhered to the partition wall molding composition. Exposure is performed through the insulating substrate from the back side of the insulating substrate having a light-transmitting property to cure the photocurable resin in the composition for forming a partition, so that the composition for forming a partition in the vicinity of a close contact surface with the insulating substrate is used. First, it is cured in a short time, the position of the partition is accurately set, the alignment with the electrode group becomes easy, and the partition having a desired shape can be obtained only by performing a curing treatment using a partition forming mold, The manufacturing process can be significantly reduced, and the manufacturing cost can be significantly reduced.

【0017】[0017]

【発明の実施の形態】本発明のPDP用隔壁の製造方法
では、隔壁形状の凹部を開口した隔壁成形型の材質とし
ては、具体的には紫外線や可視光線、赤外線、X線ある
いは電子線等により露光しても、少なくとも露光中に変
形しないものであればいずれでも良く、例えば金属やセ
ラミック、樹脂、ゴム等が好適であり、それらを用いて
隔壁の高さ、ピッチ、形状に対応する任意の形状の凹部
を有する成形型を使用することができるが、とりわけゴ
ム型が最適である。
BEST MODE FOR CARRYING OUT THE INVENTION In the method for manufacturing a partition wall for a PDP of the present invention, the material of the partition wall mold having an opening formed in the partition wall is, specifically, an ultraviolet ray, a visible light ray, an infrared ray, an X-ray or an electron beam. Any exposure may be used as long as it does not deform at least during the exposure. For example, metal, ceramic, resin, rubber, and the like are preferable, and any of them can be used corresponding to the height, pitch, and shape of the partition wall. Although a molding die having a concave portion having the following shape can be used, a rubber die is most suitable.

【0018】また、必要に応じて離型性向上や摩耗防止
のために、離型剤や表面被覆等の表面処理を行っても良
い。
If necessary, a surface treatment such as a release agent or a surface coating may be carried out to improve the releasability and prevent abrasion.

【0019】一方、隔壁成形用組成物として用いるバイ
ンダー成分には、光硬化性樹脂を主成分にして熱可塑性
樹脂や溶媒、可塑剤、分散剤等の各種添加剤を使用する
ことができる。
On the other hand, as the binder component used as the partition wall forming composition, various additives such as a thermoplastic resin, a solvent, a plasticizer, and a dispersant can be used with a photocurable resin as a main component.

【0020】前記光硬化性樹脂は、紫外線や可視光線、
赤外線、X線あるいは電子線等により硬化する樹脂であ
ればいずれでも良いが、例えばラジカル重合型のアクリ
ル系紫外線硬化性樹脂やカチオン重合型のエポキシ系あ
るいはアゾ系紫外線硬化性樹脂、チオール・エン付加型
の紫外線硬化性樹脂等が挙げられ、なかでもアクリル系
の紫外線硬化性樹脂が好適に使用できる。
The photo-curable resin is selected from the group consisting of ultraviolet light, visible light,
Any resin that can be cured by infrared rays, X-rays, electron beams, or the like may be used. For example, a radical polymerization type acrylic ultraviolet curing resin, a cation polymerization type epoxy or azo ultraviolet curing resin, or thiol-ene addition UV-curable resin, etc., among which acrylic UV-curable resin can be suitably used.

【0021】次に、光硬化性樹脂の添加量は、隔壁成形
用組成物中の無機成分100重量部に対して1重量部未
満では硬化物の強度が低く隔壁が破損する恐れがあり、
また20重量部を越えると焼成時に残渣を生じる恐れが
あるため、1〜20重量部がより望ましい。
If the amount of the photocurable resin is less than 1 part by weight based on 100 parts by weight of the inorganic component in the partition wall forming composition, the strength of the cured product is low and the partition walls may be damaged.
If the amount exceeds 20 parts by weight, a residue may be generated at the time of firing, so 1 to 20 parts by weight is more preferable.

【0022】また、光硬化性樹脂として好適な紫外線硬
化性樹脂には、硬化触媒としてアセトフェノン類やベン
ゾフェノン類、有機過酸化物、アゾ化合物、チオキサン
トン類を含有させることができる。
The ultraviolet-curable resin suitable as a photo-curable resin may contain acetophenones, benzophenones, organic peroxides, azo compounds, and thioxanthone as a curing catalyst.

【0023】一方、バインダー成分として使用すること
ができる熱可塑性樹脂としては、メチルセルロースやエ
チルセルロース等が挙げられる。
On the other hand, examples of the thermoplastic resin that can be used as a binder component include methyl cellulose and ethyl cellulose.

【0024】尚、前記光硬化性樹脂を主成分にするバイ
ンダー成分の熱可塑性樹脂の添加量は、隔壁成形用組成
物中の無機成分100重量部に対して、20重量部以下
であることがより好ましく、それを越える添加量では焼
成時に残渣を生じる恐れがあり望ましくない。
The amount of the thermoplastic resin as a binder component containing the photocurable resin as a main component may be 20 parts by weight or less based on 100 parts by weight of the inorganic component in the partition wall forming composition. It is more preferable. If the amount exceeds the range, a residue may be generated during firing, which is not desirable.

【0025】更に、前記溶媒及び可塑剤は、前記光硬化
性樹脂と相溶するものであれば特に限定するものではな
く、例えば、トルエン、キシレン、ベンゼン、フタル酸
エステル等の芳香族溶剤や、ヘキサノール、オクタノー
ル、デカノール、オキシアルコール等の高級アルコール
類、あるいは酢酸エステル、グリセライド等のエステル
類が挙げられる。
Further, the solvent and the plasticizer are not particularly limited as long as they are compatible with the photocurable resin. For example, aromatic solvents such as toluene, xylene, benzene and phthalic acid ester; Examples include higher alcohols such as hexanol, octanol, decanol, and oxyalcohol, and esters such as acetate and glyceride.

【0026】特に、前記フタル酸エステルやオキシアル
コール等は好適に使用でき、更に溶媒及び可塑剤を緩や
かに揮発させるために、前記溶媒及び可塑剤を2種類以
上併用することも可能である。
In particular, the above-mentioned phthalic acid esters and oxyalcohols can be suitably used, and it is also possible to use two or more of the above-mentioned solvents and plasticizers in order to slowly volatilize the solvent and the plasticizer.

【0027】また、前記溶媒及び可塑剤の含有量は、乾
燥時と焼成時の収縮を考慮すると隔壁成形用組成物中の
無機成分100重量部に対して、15重量部以下である
ことがより好ましい。
The content of the solvent and the plasticizer is preferably 15 parts by weight or less based on 100 parts by weight of the inorganic component in the composition for forming a partition wall in consideration of shrinkage during drying and firing. preferable.

【0028】更に、前記分散剤としては、隔壁成形用組
成物中の無機成分の分散性を向上させることができるも
のであれば特に限定するものではないが、ノニオン系や
アニオン系、カチオン系、ベタイン系の各種界面活性剤
が使用でき、例えば、ポリエチレングリコールアルキル
エーテルやアルキルスルホン酸塩、ポリカルボン酸塩、
アルキルアンモニウム塩等を好適に用いることができ、
2種類以上を併用することも可能である。
Further, the dispersant is not particularly limited as long as it can improve the dispersibility of the inorganic component in the composition for forming a partition wall, but nonionic, anionic, cationic, and the like. Various betaine surfactants can be used, for example, polyethylene glycol alkyl ethers and alkyl sulfonates, polycarboxylates,
Alkyl ammonium salts and the like can be suitably used,
It is also possible to use two or more kinds in combination.

【0029】また、前記分散剤の含有量としては、分散
性の向上及び熱分解の点からは隔壁成形用組成物中の無
機成分100重量部に対して0.05〜5重量部以下で
あることが望ましい。
The content of the dispersant is 0.05 to 5 parts by weight or less based on 100 parts by weight of the inorganic component in the partition wall forming composition from the viewpoint of improving dispersibility and thermal decomposition. It is desirable.

【0030】次に隔壁成形用組成物の無機原料として
は、ソーダライムガラスや低ソーダガラス、鉛アルカリ
ケイ酸ガラス、ホウケイ酸塩ガラス等の公知のガラス粉
末は勿論のこと、該ガラス粉末とセラミック粉末や着色
用の各種金属酸化物粉末、例えばアルミナ(Al
2 3 )、ジルコニア(ZrO2 )等の酸化物系セラミ
ックスや、窒化珪素(Si3 4 )等の非酸化物系セラ
ミックスをはじめ、希土類元素の酸化物や周期律表第3
a族元素の酸化物等を添加混合して使用することもでき
る。
As the inorganic raw material of the composition for forming a partition wall, not only known glass powders such as soda lime glass, low soda glass, lead alkali silicate glass, borosilicate glass, etc. Powders and various metal oxide powders for coloring, for example, alumina (Al
Oxide ceramics such as 2 O 3 ) and zirconia (ZrO 2 ), non-oxide ceramics such as silicon nitride (Si 3 N 4 ), oxides of rare earth elements, and the third part of the periodic table.
An oxide of a group a element or the like may be added and mixed for use.

【0031】また、絶縁基板としてはソーダライムガラ
スや低ソーダガラス、鉛アルカリケイ酸ガラス、ホウケ
イ酸塩ガラス等の一般の透光性のガラス基板を用いるこ
とができる。
As the insulating substrate, a general light-transmitting glass substrate such as soda lime glass, low soda glass, lead alkali silicate glass, borosilicate glass and the like can be used.

【0032】尚、前記絶縁基板にはストライプ状の電極
群を形成したものを用いることもできる。
It is to be noted that the insulating substrate may be formed by forming a stripe-shaped electrode group.

【0033】次に、隔壁成形型に充填した前記隔壁成形
用組成物を硬化させる方法には、先ず隔壁成形型と絶縁
基板を位置決めして圧着し、隔壁成形用組成物を絶縁基
板に密着させた後、絶縁基板の裏面から該絶縁基板を通
して紫外線や可視光線、赤外線等、X線あるいは電子線
により露光して隔壁成形用組成物を硬化させたり、ある
いは絶縁基板との密着面近傍の隔壁成形用組成物に露光
して先ず前記密着面近傍を硬化させ、更に加熱硬化させ
る等、種々の硬化方法が適用できる。
Next, in order to cure the above-mentioned partition wall forming composition filled in the partition wall forming die, first, the partition wall forming die and the insulating substrate are positioned and pressure-bonded, and the partition wall forming composition is brought into close contact with the insulating substrate. After that, from the back surface of the insulating substrate, through the insulating substrate, is exposed to X-rays or electron beams such as ultraviolet rays, visible rays, infrared rays, etc. to cure the partition wall forming composition, or to form the partition walls near the contact surface with the insulating substrate. Various curing methods can be applied, for example, exposing the composition for use to cure the vicinity of the contact surface first, and then heating and curing.

【0034】また、焼成は使用する隔壁成形用組成物中
の無機材料が緻密化し、かつ絶縁基板と密着すれば良
く、焼成温度としては隔壁成形用組成物の軟化点以上で
絶縁基板の軟化点以下の温度が良く、具体的には500
〜600℃の温度範囲が好ましい。
The baking may be carried out as long as the inorganic material in the composition for forming a partition used is densified and adheres to an insulating substrate. The baking temperature is not lower than the softening point of the composition for forming a partition and the softening point of the insulating substrate. The following temperatures are good, specifically 500
A temperature range of -600 ° C is preferred.

【0035】[0035]

【実施例】次に、本発明のPDP用隔壁の製造方法につ
いて以下のようにして評価した。 (実施例1)先ず、最終的に隔壁の中心間距離が150
μmピッチで、高さが150μm、幅が30μmとなる
ように型取りされ、開口した凹部を有する26インチサ
イズ画面相当のゴム製の隔壁成形型を用い、前記開口部
に低融点ガラス粉末100重量部に対してアクリル系紫
外線硬化性樹脂を15重量部と溶媒としてブチルセルソ
ルブアセテートを5重量部、分散剤としてポリカルボン
酸塩を3重量部、紫外線硬化触媒としてアセトフェノン
類を0.3重量部から成る隔壁成形用組成物を充填す
る。
EXAMPLES Next, the method for producing a partition wall for a PDP of the present invention was evaluated as follows. (Embodiment 1) First, the distance between the centers of the partition walls is 150
Using a rubber-made partition wall mold having a pitch of 26 μm equivalent to a 26-inch screen having a 150 μm height and a width of 30 μm, and having an open recess, 100 wt. 15 parts by weight of an acrylic ultraviolet curable resin, 5 parts by weight of butyl cellosolve acetate as a solvent, 3 parts by weight of a polycarboxylate as a dispersant, and 0.3 parts by weight of acetophenones as an ultraviolet curing catalyst Is filled.

【0036】その後、幅が40μmの電極を150μm
ピッチでストライプ状に形成した厚さが2mmで26イ
ンチサイズ画面相当の高歪点低ソーダガラスから成る絶
縁基板と、前記隔壁成形用組成物を充填した隔壁成形型
を位置決めして圧着し、隔壁成形用組成物を絶縁基板に
密着させる。
Thereafter, an electrode having a width of 40 μm is
An insulating substrate made of high-strain-point, low-soda glass having a thickness of 2 mm and a screen equivalent to a 26-inch screen formed in a stripe shape at a pitch, and a partition wall mold filled with the partition wall-forming composition are positioned and pressure-bonded. The molding composition is brought into close contact with the insulating substrate.

【0037】次いで、紫外線照射装置を用いてその上面
に前記隔壁成形型を圧着した絶縁基板の裏面から、該絶
縁基板を通して160W/cmの紫外線を照射せしめ、
紫外線照射装置の照射部を1分で通過して露光させて前
記隔壁成形用組成物を硬化させた。
Next, ultraviolet light of 160 W / cm was irradiated through the insulating substrate from the back surface of the insulating substrate having the above-mentioned partition mold pressed thereon using an ultraviolet irradiation device,
The composition was cured by passing through an irradiation section of an ultraviolet irradiation apparatus for 1 minute and exposing the composition.

【0038】充分に硬化させた後、隔壁成形型を離型
し、絶縁基板に密着した隔壁成形体を得、次いで最高温
度が580℃で1時間の焼成を行って絶縁基板と一体化
したPDP用隔壁を作製した。
After being sufficiently cured, the partition wall mold was released from the mold to obtain a partition wall molded body in close contact with the insulating substrate, and then baked at a maximum temperature of 580 ° C. for 1 hour to integrate the PDP with the insulating substrate. A partition wall was prepared.

【0039】かくして得られた焼成前の絶縁基板に密着
した隔壁成形体を実体顕微鏡で目視検査し、隔壁のピッ
チと絶縁基板に形成した電極のピッチのズレを観察した
ところ、いずれの隔壁と電極にも重なるところは認めら
れず、更に絶縁基板と一体化した焼成後のPDP用隔壁
でも異常のないことを確認した。
The thus obtained partition wall molded body in close contact with the insulating substrate before firing was visually inspected with a stereoscopic microscope, and the deviation between the partition wall pitch and the electrode pitch formed on the insulating substrate was observed. No overlap was observed, and it was further confirmed that there was no abnormality in the fired PDP partition wall integrated with the insulating substrate.

【0040】(実施例2)実施例1と同様にして作製し
た隔壁成形用組成物を絶縁基板に密着させた後、該絶縁
基板の裏面から、該絶縁基板を通して120W/cmの
紫外線を照射せしめ、紫外線照射装置の照射部を1分で
通過して露光させて前記隔壁成形用組成物の絶縁基板と
の密着面近傍を硬化させた後、100℃の温度で10分
間加熱して残部を充分に硬化した後、以降は実施例1と
同様にして絶縁基板と一体化したPDP用隔壁を作製し
た。
(Example 2) After the partition wall forming composition produced in the same manner as in Example 1 was brought into close contact with an insulating substrate, ultraviolet rays of 120 W / cm were irradiated from the back surface of the insulating substrate through the insulating substrate. After passing through an irradiation part of an ultraviolet irradiation device for one minute and exposing to cure the vicinity of the contact surface of the composition for forming a partition with an insulating substrate, the composition is heated at a temperature of 100 ° C. for 10 minutes to sufficiently cure the remainder. After that, a PDP partition wall integrated with the insulating substrate was manufactured in the same manner as in Example 1.

【0041】かくして得られた絶縁基板に密着した隔壁
成形体及び絶縁基板と一体化した焼成後のPDP用隔壁
について、実施例1の評価方法と同様にして観察した
が、いずれも隔壁と電極との重なりは認められず、異常
は認められなかった。
The thus-obtained partition wall molded body in close contact with the insulating substrate and the fired PDP partition wall integrated with the insulating substrate were observed in the same manner as in the evaluation method of Example 1. No overlap was observed, and no abnormality was observed.

【0042】(比較例)実施例1に用いた隔壁成形型を
用い、前記開口部に低融点ガラス粉末100重量部に対
して熱硬化性樹脂として不飽和ポリエステルを15重量
部と溶媒としてポリオキシアルコールを5重量部、分散
剤としてポリエチレングリコールアルキルエーテルを3
重量部、加熱硬化触媒として有機過酸化物を0.3重量
部から成る隔壁成形用組成物を充填する。
(Comparative Example) Using the partition wall mold used in Example 1, 15 parts by weight of an unsaturated polyester as a thermosetting resin and 100 parts by weight of a low melting glass powder in the opening, and polyoxy as a solvent were used. 5 parts by weight of alcohol, 3 parts of polyethylene glycol alkyl ether as dispersant
A partition wall molding composition comprising 0.3 parts by weight of an organic peroxide as a heat curing catalyst is charged.

【0043】次いで、実施例1と同様の絶縁基板を用い
て前記隔壁成形用組成物を密着させた後、100℃の温
度に加熱した乾燥機内に1時間保持して前記隔壁成形用
組成物を硬化した後、以降は実施例1と同様にして絶縁
基板と一体化したPDP用隔壁を作製した。
Then, the above-mentioned composition for forming a partition was brought into close contact with the same insulating substrate as in Example 1, and then kept for 1 hour in a dryer heated to a temperature of 100 ° C. to prepare the composition for forming a partition. After curing, a PDP partition wall integrated with the insulating substrate was manufactured in the same manner as in Example 1.

【0044】かくして得られた絶縁基板に密着した隔壁
成形体及び絶縁基板と一体化した焼成後のPDP用隔壁
について、実施例1の評価方法と同様にして観察したと
ころ、本来、電極間に隔壁が形成されるべきであるが、
電極上に隔壁が重なって形成されてしまうピッチずれが
生じており、隔壁の位置精度が不良であることが確認さ
れた。
Observation of the obtained partition wall molded body in close contact with the insulating substrate and the fired PDP partition wall integrated with the insulating substrate in the same manner as in the evaluation method of Example 1 showed that the partition wall was originally located between the electrodes. Should be formed,
A pitch shift in which the partition walls were formed overlapping the electrodes occurred, and it was confirmed that the positional accuracy of the partition walls was poor.

【0045】即ち、比較例では焼成前の絶縁基板と隔壁
成形用組成物を充填した成形型の開口部とを硬化処理す
る前に圧着したにも関わらず、隔壁成形用組成物が硬化
するのに長時間を要するため、加熱によって生じる絶縁
基板と開口部を有する型の熱膨張差により、絶縁基板上
の電極形成位置と隔壁成形位置がずれてしまい、その位
置がずれた状態で硬化反応が開始するため、隔壁と電極
のピッチが一致しないということになったものである。
That is, in the comparative example, although the insulating substrate before firing and the opening of the mold filled with the composition for forming a partition were pressed before curing, the composition for forming a partition hardened. Takes a long time, the difference between the thermal expansion of the insulating substrate and the mold having the opening caused by the heating causes the electrode forming position and the partition wall forming position on the insulating substrate to be displaced from each other. In order to start, the pitch between the partition and the electrode does not match.

【0046】尚、本発明は前記詳述した実施例に何等限
定されるものではない。
The present invention is not limited to the above-described embodiment.

【0047】[0047]

【発明の効果】本発明のPDP用隔壁の製造方法によれ
ば、光硬化性樹脂を含有した隔壁成形用組成物を用い、
透光性を有する絶縁基板の裏面から該絶縁基板を通して
露光して隔壁成形用組成物に含有される光硬化性樹脂を
硬化させることから、隔壁成形型が絶縁基板に位置決め
された所定位置で隔壁成形用組成物が容易に短時間で硬
化することから、絶縁基板に設けられた電極と絶縁基板
上に成形された隔壁のピッチの位置ズレがなく、隔壁を
高精度な寸法で成形することができるとともに、1回の
露光工程と必要に応じて追加の加熱工程だけの極めて少
ない製造工程数によって隔壁を成形することができるこ
とから、製造コストを低減することができ、大型画面化
が容易で高精細度化が実現できるPDP用の隔壁を得る
ことが可能となる。
According to the method for producing a partition for a PDP of the present invention, a composition for forming a partition containing a photocurable resin is used.
Since the photocurable resin contained in the partition wall molding composition is cured by exposing through the insulating substrate from the back surface of the insulating substrate having a light-transmitting property, the partition wall is formed at a predetermined position where the partition wall mold is positioned on the insulating substrate. Since the molding composition is easily cured in a short time, there is no displacement of the pitch between the electrode provided on the insulating substrate and the partition formed on the insulating substrate, and the partition can be formed with high precision dimensions. In addition, the partition wall can be formed by a very small number of manufacturing steps including only one exposure step and, if necessary, an additional heating step, so that the manufacturing cost can be reduced and a large screen can be easily formed. It is possible to obtain a partition wall for a PDP that can realize high definition.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 岸本 博文 鹿児島県国分市山下町1番1号 京セラ株 式会社鹿児島国分工場内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hirofumi Kishimoto 1-1-1, Yamashita-cho, Kokubu-shi, Kagoshima Inside the Kyocera Corporation's Kagoshima Kokubu Plant

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】隔壁成形型の空所に光硬化性樹脂を含有し
た隔壁成形用組成物を充填した後、該隔壁成形型の開口
部に充填された前記隔壁成形用組成物を絶縁基板と密着
させ、次いで該絶縁基板を通して前記隔壁成形用組成物
に露光して硬化させてから隔壁成形型を脱型し、前記絶
縁基板に接着したプラズマディスプレイパネルの放電表
示セルを構成する隔壁成形体を得た後、該隔壁成形体を
絶縁基板と共に焼成一体化することを特徴とするプラズ
マディスプレイパネル用隔壁の製造方法。
1. A method for filling a partition-forming composition containing a photocurable resin into a space of a partition-forming mold, and then filling the partition-forming composition filled in an opening of the partition-forming mold with an insulating substrate. The partition wall molded body constituting a discharge display cell of the plasma display panel adhered to the insulating substrate is then released from the partition wall molding die after being exposed and cured to the composition for partition wall molding through the insulating substrate and cured. A method of manufacturing a partition for a plasma display panel, comprising: obtaining the formed partition and firing and integrating the same with an insulating substrate.
【請求項2】隔壁成形型の空所に光硬化性樹脂を含有し
た隔壁成形用組成物を充填した後、該隔壁成形型の開口
部に充填された前記隔壁成形用組成物を絶縁基板と密着
させ、次いで該絶縁基板を通して前記隔壁成形用組成物
に露光して絶縁基板との密着面近傍の隔壁成形用組成物
を硬化させ、次いで加熱して隔壁成形用組成物全体を硬
化させてから前記隔壁成形型を脱型し、前記絶縁基板に
接着したプラズマディスプレイパネルの放電表示セルを
構成する隔壁成形体を得た後、該隔壁成形体を絶縁基板
と共に焼成一体化することを特徴とするプラズマディス
プレイパネル用隔壁の製造方法。
2. A method for filling a partition-forming composition containing a photocurable resin into a space of a partition-forming mold, and then filling the partition-forming composition filled in an opening of the partition-forming mold with an insulating substrate. Then, the partition wall molding composition is exposed to light through the insulating substrate to cure the partition wall molding composition near the contact surface with the insulating substrate, and then heated to cure the entire partition molding composition. After removing the partition mold, obtaining a partition molded body constituting a discharge display cell of the plasma display panel adhered to the insulating substrate, firing and integrating the partition molded body with the insulating substrate. A method for manufacturing a partition for a plasma display panel.
JP27932296A 1996-10-22 1996-10-22 Manufacture of plasma display panel barrier plate Pending JPH10125219A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27932296A JPH10125219A (en) 1996-10-22 1996-10-22 Manufacture of plasma display panel barrier plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27932296A JPH10125219A (en) 1996-10-22 1996-10-22 Manufacture of plasma display panel barrier plate

Publications (1)

Publication Number Publication Date
JPH10125219A true JPH10125219A (en) 1998-05-15

Family

ID=17609564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27932296A Pending JPH10125219A (en) 1996-10-22 1996-10-22 Manufacture of plasma display panel barrier plate

Country Status (1)

Country Link
JP (1) JPH10125219A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6333142B1 (en) * 1998-06-24 2001-12-25 Fujitsu Limited Master for barrier rib transfer mold, and method for forming barrier ribs of plasma display panel using the same
US6583549B2 (en) 2000-03-23 2003-06-24 Kabushiki Kaisha Toshiba Spacer assembly for flat panel display apparatus, method of manufacturing spacer assembly, method of manufacturing flat panel display apparatus, flat panel display apparatus, and mold used in manufacture of spacer assembly
KR100721728B1 (en) * 1999-03-25 2007-05-28 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 Method of producing substrate for plasma display panel and mold used in the method
KR100721730B1 (en) * 1999-09-13 2007-06-04 쓰리엠 이노베이티브 프로퍼티즈 캄파니 Barrier rib formation on substrate for plasma display panels and mold therefor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6333142B1 (en) * 1998-06-24 2001-12-25 Fujitsu Limited Master for barrier rib transfer mold, and method for forming barrier ribs of plasma display panel using the same
KR100721728B1 (en) * 1999-03-25 2007-05-28 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 Method of producing substrate for plasma display panel and mold used in the method
KR100721730B1 (en) * 1999-09-13 2007-06-04 쓰리엠 이노베이티브 프로퍼티즈 캄파니 Barrier rib formation on substrate for plasma display panels and mold therefor
US6583549B2 (en) 2000-03-23 2003-06-24 Kabushiki Kaisha Toshiba Spacer assembly for flat panel display apparatus, method of manufacturing spacer assembly, method of manufacturing flat panel display apparatus, flat panel display apparatus, and mold used in manufacture of spacer assembly
US6672927B2 (en) 2000-03-23 2004-01-06 Kabushiki Kaisha Toshiba Laminated mold for spacer assembly of a flat panel display

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