KR100295110B1 - Manufacturing method of bulkhead of plasma display panel - Google Patents

Abstract

The present invention relates to a method for manufacturing partition walls of a plasma display panel.

In the method of manufacturing a partition wall of a plasma display panel according to the present invention, a mold having a partition-shaped groove is provided to fill a groove and a mold surface with a resin material for forming the partition wall. In the method for manufacturing a partition wall of the plasma display panel according to the present invention, after attaching a substrate to the resin material for forming the partition wall, the resin material for forming the partition wall is cured, and then the mold is removed.

According to the partition wall manufacturing method of this invention, a high-definition partition can be formed easily.

Description

Fabricating Method of Barrier Rib in Plasma Display Panel

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a flat panel display, and more particularly, to a method of manufacturing a partition of a plasma display panel. In addition, the present invention relates to a glass substrate bonding method of the plasma display panel for bonding the upper substrate and the lower substrate to maintain the airtight structure of the discharge cell.

Recently, flat panel display devices such as liquid crystal displays (LCDs), field emission displays (FEDs), and plasma display panels (hereinafter referred to as "PDPs") have been actively developed. . Among these, the PDP has a simple structure, high brightness and high light emission characteristics, and is suitable for a wide viewing angle of 160 ° or more and a large screen of 40 inches or more. PDPs are roughly classified into direct current (DC) type with large discharges and alternating current (AC) type with surface discharges. The AC plasma display panel is a driving method that has attracted attention because of the advantages of low power consumption and lifetime compared to the DC method. The surface discharge type PDP of the three-electrode alternating current method can be seen in FIG. 1, which consists of an upper plate and a lower plate, and the upper plate is formed on the sustain electrode pair 6 and the sustain electrode pair 6 formed on the upper glass substrate 2. A bus electrode 10 formed side by side, a dielectric layer 14 formed on the surface of the bus electrode 10 and the upper glass substrate 2, and a protective film 16 formed on the dielectric layer 14 are provided. The lower plate includes an address electrode 8 formed on the lower glass substrate 4 so as to be orthogonal to the sustain electrode pairs 6, a dielectric thick film 5 applied on the lower glass substrate 4 and the address electrode 8, and an address. A partition 12 extending vertically from the surface of the thick dielectric film 5 with the electrode 8 interposed therebetween, and a phosphor 18 applied to the partition 12 and the thick dielectric film 5 are provided. When the upper plate and the lower plate are bonded to each other, the discharge cells form an airtight structure, and discharge gas capable of discharging the discharge cells is injected. The bus electrode 10 in parallel contact with the sustain electrode pair 6 serves to lower the discharge voltage by reducing the electrical resistance of the sustain electrode pair 6. The bus electrode 10 is made of Cr / Cu / Cr material and is formed by being deposited or etched side by side on the sustain electrode 6. The dielectric layer 14 serves to protect the sustain electrode pair 6 from discharge, and wall charges are accumulated during discharge. This dielectric layer 14 is generally applied by a screen printing method. The protective layer 16 is made of MgO to serve to protect the dielectric layer 14 from discharge, and is deposited on the dielectric layer 14 by about 2000 Å. The upper and lower glass substrates 2 and 4 are made of soda lime silicate. The address electrode 8 is supplied with the data in synchronization with the scan pulse applied to the sustain electrode 6 so as to face the one discharge electrode 6 to select a discharge cell to be scanned. In the selected discharge cell, an alternating voltage is applied between the sustain electrode pairs 6 to cause surface discharge to generate a plasma, and the ultraviolet light emitted from the plasma excites and emits the phosphor 18. The partition wall 12 maintains a discharge distance between the upper and lower glass substrates 2 and 4 and prevents electrical and optical crosstalk between adjacent discharge cells. The partition 12 is the most important step for display quality and efficiency in the manufacturing process of the PDP, and as the panel is enlarged and fixed in size, various studies on the partition formation technology have been made. The partition wall is formed by a screen print method, a sand blast method, an additive method, a mold method, or the like.

2A to 2D show the method of manufacturing the partition wall by the screen printer method in order. First, after placing a screen (not shown) on the glass substrate 4 on which the dielectric thick film 5 is formed, a paste layer having a predetermined thickness is formed on the glass substrate by including the partition paste 20 on the screen. And dry. This is repeated several times (10 to 15 times) to form the partition wall 12 having a height of 150 to 200㎛. This screen printing method has the advantages of a simple process and low manufacturing cost, but it requires a process of adjusting the position of the screen and the glass substrate 4 and repeating printing and drying several times. Since the screen and the substrate may be displaced during the operation and the partition may be deformed, it is difficult to produce a high resolution partition.

3A to 3F show a method of manufacturing a partition wall by a sand blast method in order. First, the barrier rib paste 20 having a height of 150 to 200 μm is applied to the glass substrate 4 on which the dielectric thick film 5 is formed. Then, the photosensitive resin 22 is applied to the barrier rib paste 20 and then exposed. And the photosensitive resin pattern 24 is formed by the developing step. Sand particles pressurized to the photosensitive resin pattern 24 are sprayed to remove the partition wall paste 20 in a portion where the photosensitive resin pattern 24 is not formed, and then the photosensitive resin pattern 24 is removed. The sand blasting method has the advantage of being able to form partitions on a large-area substrate and make it possible to achieve high definition. However, since the amount of paste removed by the abrasive (sand particles) is large, waste of material and manufacturing cost are not only large, but also during the manufacturing process. Since the physical impact is applied to the substrate, there is a problem of causing cracking of the substrate during firing.

4A to 4E show the partition wall manufacturing method by the addition method in order. First, the photosensitive paste 21 is applied on the glass substrate 4 to which the dielectric thick film 5 is applied, and then the pattern 25 is formed by photolithography. Next, the photosensitive paste 21 of the part in which the pattern 25 is not formed is removed. Subsequently, the partition material paste 20 is applied to the portion where the photosensitive paste 21 is removed, and then the photosensitive paste 21 is removed. This is repeated several times to form a partition wall 12 having a predetermined height. In this case, the photosensitive paste is prepared in the form of a tape by adding an organic or inorganic material to a photoresist or slurry at a predetermined ratio, and has a photosensitivity by the composition of the organic or inorganic material. Additive method has the advantage of being able to form a fine-shaped partition wall and making a large-area substrate. However, a partition wall having a height of 100 µm or more takes a long time to manufacture, and completes the partition paste and the photosensitive paste. Difficult to separate and there is a problem that the residue is left. In addition, a problem arises in that the formed pattern is torn down or a crack is generated in the partition wall during firing.

5A to 5D show the manufacturing method of the partition by the mold method according to the procedure. First, the barrier rib paste 20 or the barrier rib film having a height of approximately 150 to 200 µm is applied to the glass substrate 4 on which the dielectric thick film 5 is formed. Subsequently, after the die 26 is placed in the partition wall paste (or film) 20, a predetermined pressure is applied. Next, when the mold 26 is removed, a partition 12 corresponding to the groove shape of the mold 26 is formed on the dielectric thick film 5. However, the mold method requires a high pressure to press the semi-solidified partition film or the partition wall paste into the large-area mold 26, and moreover, it is difficult to adjust the pressure applied to the mold 26 and the partition 12 The higher the resolution, the more difficult it is to separate the mold 26 and the partition 12.

The method disclosed in Japanese Patent Application Laid-open No. Hei 10-208628 as a method for manufacturing a partition wall is different from that of a mold 27 made of an organic material and formed with a partition wall groove as shown in FIGS. 6A to 6D. After the barrier material 28 is filled into the grooves and then the barrier material 28 is fired together with the mold 27, the mold 27 is removed to remove the barrier 12 from the glass substrate. 4) to form on. This method has a problem that residues of the mold 27 may remain on the partition 12 and the glass substrate 4 during firing, and it is difficult to evenly fill the partition material into the partition-shaped grooves.

In the mold method, a method of forming a partition by injecting a slurry as the partition material is a problem in that the discharge characteristics of the discharge cell can be reduced since the gas generated by the residual solvent component is mixed with the discharge gas after firing and curing the slurry. There is this. This is because the slurry consists of a mixture in which ceramic particles are mixed with a solvent.

On the other hand, the method of joining the lower glass substrate 4 having the partition 12 formed on the upper glass substrate 2 is applied to the edge of the lower glass substrate 4 using frit glass, and then the lower glass substrate. (4) is pressed on the upper glass substrate (2) and then fired. Since the bonding process of the upper and lower glass substrates 2 is performed by a high temperature process, a material capable of withstanding the high temperature of the partition wall and the upper and lower glass substrates 2 should be used. Accordingly, there is a problem in that the selection width of the material constituting the discharge cell is narrowed, and gas by the residual solvent component is generated after firing of the frit glass, thereby lowering the discharge characteristics in the discharge cell.

Accordingly, an object of the present invention is to provide a method for manufacturing a partition wall of a PDP, which facilitates the formation of a high-definition partition wall.

Another object of the present invention is to provide a method of manufacturing a partition wall of a PDP to improve discharge characteristics.

It is still another object of the present invention to provide a method for manufacturing a partition wall of a PDP to improve mass productivity.

Another object of the present invention to provide a glass substrate bonding method of the PDP to be bonded to the glass substrate by a low temperature process.

1 is a perspective view showing the structure of a three-electrode alternating current drive plasma display device;

2A to 2D are process charts illustrating a method for manufacturing partition walls by a screen printer method.

3A to 3F are process drawings showing a method for producing partition walls by a sand blast method.

4A to 4E are process drawings showing a method for producing partition walls by an addition method.

5A to 5D are process drawings showing a method for manufacturing partition walls by a mold method.

6A to 6D are process drawings showing a method for manufacturing partition walls by another conventional mold method.

7A to 7D are flowcharts illustrating a method of manufacturing a partition wall of a plasma display panel according to an exemplary embodiment of the present invention.

8A to 8C are process diagrams showing the glass substrate bonding method of the plasma display panel according to the embodiment of the present invention in order.

<Description of Symbols for Main Parts of Drawings>

2: upper glass substrate 4: lower glass substrate

5: dielectric thick film 6: sustain electrode pair

8 address electrode 10 bus electrode

12,73 partition 14 dielectric layer

16: protective film 18: phosphor

20: partition material paste 21: photosensitive paste

22: photosensitive resin 24: photosensitive resin pattern

25: pattern 26,27,71: mold

28: partition wall material 71a: partition wall groove

72: partition wall material 81: top plate

82: lower plate 83: thermal spray coating

83a: molten glass particles

In order to achieve the above object, the barrier rib manufacturing method of the PDP according to the present invention comprises the steps of providing a mold having a partition-shaped groove, filling the groove and the mold surface with a resin material for forming the partition wall, the resin for forming the partition wall After attaching the substrate to the material, curing the resin material for forming the partition wall, and removing the mold.

PDP bulkhead manufacturing method according to the present invention is a mold in which the partition-shaped grooves are formed, the thermal deformation temperature is 200 degrees Celsius or more and the coefficient of linear expansion with respect to temperature 2 × 10 ^-5 K ^-1 (where K is the temperature constant Filling the groove and mold surface with the partition material having the following characteristics, attaching a substrate to the partition material, curing the partition material, and removing the mold.

The glass substrate bonding method of the PDP according to the present invention comprises the steps of preparing a first substrate and a second substrate, attaching the first substrate and the second substrate, and the molten portion of the first substrate and the second substrate And depositing a glass film (which is cured simultaneously with the film formation).

Other objects and features of the present invention in addition to the above objects will become apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 7 and 8.

7A to 7D are process diagrams illustrating a method of manufacturing a partition wall of a PDP according to an embodiment of the present invention.

7A and 7B, a mold 71 having grooves 71a corresponding to the partition wall shape is prepared. The mold 71 is filled with the partition wall resin material 72 in a liquid state or the solid resin is heated to fill the mold 71 in a liquid state. Here, the partition wall resin material 72 includes a material for absorbing visible light in order to prevent the light generated from the phosphor formed in the later process from affecting the adjacent cell through the partition wall. The material of the partition wall material 72 includes thermosetting resins such as phenol resins, epoxy resins, polyimide resins, and silicone resins containing glass fibers or silica, or glass fibers or silica. Thermoplastic resins such as polyamide and polyesterimide may be used. In addition, the thermal deformation temperature of the partition wall material 72 must be 200 deg. C or higher and the coefficient of linear expansion with respect to the temperature should be 2x10 ^-5 K ^-1 (where K is a temperature constant) or less. Here, the preferred thermal deformation temperature of the partition wall resin material 72 is 400 ° C. or higher, and the linear expansion coefficient with respect to the preferable temperature is a resin material having a value between 0.5 × 10 ⁻⁵ K ⁻¹ and 1 × 10 ⁻⁵ K ^−1. Can be used. In step 7C, the substrate 4 on which the address electrode 8 and the dielectric thick film 5 are formed is attached to the mold 71 so that the dielectric thick film 5 and the spacer resin material 72 face each other and then harden. do. By this curing step, the partition wall material 72 is integrated with the dielectric thick film 5. The hardened partition wall material 72 becomes the partition 73. In FIG. 7D, after the mold 71 is finally separated, the phosphor 18 is applied to the partition 73 to complete the lower plate of the PDP. Here, the coating method of the phosphor 18 may be electrophoretic, that is, a method of ionizing the phosphor and ionizing the phosphor coating portions of the partition 73 and the dielectric thick film 5 with the opposite polarity and applying them with an electrical adsorption force or a low temperature baking method. It is preferable to use the screen printing method used.

8A to 8C are process diagrams illustrating a method of bonding an upper / lower substrate to a PDP according to an embodiment of the present invention.

In FIG. 8A, an upper plate 81 having a sustain electrode pair 6, a bus electrode 10, a dielectric layer 14, and a protective layer 16, which are transparent electrodes, is formed on the upper glass substrate 2, and the lower glass substrate 4. ), The lower plate 82 on which the address electrode 8, the dielectric thick film 5, the partition wall 73, and the phosphor 18 are formed is attached. Here, when the upper substrate 2 and the lower substrate 4 are attached, it is preferable that the lower substrate 4 is made larger than the upper substrate 2 so that the edge portion of the lower substrate 4 can be exposed. 8B, the molten glass particles 83a are sprayed and laminated using the plasma gun 84 on the sidewall of the upper plate 81 and the upper surface of the lower plate 82 in contact with the sidewall of the upper plate 81. The thermal spray coating 83 is formed at the portion where the 81 and the lower plate 82 are in contact with each other. At this time, the lower plate 82 is cooled to an appropriate temperature so that the molten glass particles 83a sprayed on the portion where the upper plate 81 and the lower plate 82 come into contact with each other are quickly cured to form a thermal spray coating easily.

Although not shown, a laser sealing method may be used as another embodiment of the upper and lower substrate bonding methods. That is, after attaching the upper plate 81 and the lower plate 82, as shown in Figure 8a, the upper plate 81 and the lower plate 82 is irradiated with the laser to irradiate the upper plate 81 and the lower plate 82 at the contacting portion. The upper plate 81 and the lower plate 82 are integrated by melting the surface of the upper plate 81. At this time, the glass for bonding is formed in the site | part to which a laser is irradiated.

Like the above-mentioned thermal spray coating method, the laser sealing method integrates the upper plate 81 and the lower plate 82 by a low temperature process.

As described above, the method for manufacturing a partition wall of the PDP according to the present invention fills the partition wall material of the resin material into the partition wall of the mold, joins the substrate, hardens the resin material, and then removes the mold, thereby removing the mold. It can be easily formed. In the method of manufacturing a partition wall of a PDP according to the present invention, by using a resin material as the partition material, gas is not generated from the partition wall material during or after curing, thereby improving discharge characteristics. In addition, it is easy to control the process when manufacturing the partition wall and the waste of materials is reduced, as well as the manufacturing cost is reduced to improve the mass production. The glass substrate bonding method of the PDP according to the present invention enables the low temperature process by joining the upper and lower substrates by spray coating or laser sealing, thereby preventing damage to the device due to high temperature, as well as conventional frit glass. It is possible to prevent deterioration of the discharge characteristic due to the gas generated during or after curing.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (6)

Providing a mold having a partition groove formed therein; Filling a barrier rib-forming resin material into the groove and the mold surface; Attaching a substrate to the resin for forming the partition, and then curing the resin for forming the partition; And removing the mold. The method of claim 1, The barrier rib manufacturing method of claim 1, wherein the barrier rib forming resin includes a material for absorbing or reflecting visible light. The method of claim 1, The barrier rib forming resin material is a barrier rib manufacturing method of a plasma display panel, characterized in that made of a thermosetting resin or a thermoplastic resin containing any one of glass fibers and silica. A mold in which a partition-shaped groove is formed, Filling the grooves and the mold surface with a partition material having a heat deflection temperature of not less than 200 degrees Celsius and having a linear expansion coefficient with respect to temperature of 2 × 10 ⁻⁵ K ⁻¹ (where K is a temperature constant); Attaching a substrate to the barrier material, and then curing the barrier material; And removing the mold. The method of claim 4, wherein The partition material has a heat deflection temperature of more than 400 degrees Celsius and a coefficient of linear expansion with respect to temperature is between 0.5 × 10 ^-5 K ⁻¹ (where K is a temperature constant) to 1 × 10 ^-5 K ^−1. A method of manufacturing partition walls of plasma display panels. Preparing a first substrate and a second substrate, Attaching the first substrate and the second substrate; The glass substrate bonding method of the plasma display panel of claim 1, wherein the glass substrate is formed by depositing a molten glass film by a thermal spraying portion between the first substrate and the second substrate.