KR20000033861A - Method for manufacturing compartment wall for plasma display device - Google Patents

Abstract

PURPOSE: A method for manufacturing compartment wall for plasma display device is provided to simplify the operation of production, and to make a compartment wall with more accuracy. CONSTITUTION: A method for manufacturing compartment wall for plasma display device includes a first to a third steps. At the first step, a mold(26) with a slot of compartment-shape is supplied. At the second step, a compartment material(34) is accumulated on the mold(26). At the third step, the mold(26) is removed to form a compartment wall. The second step further includes next two steps. The first of two steps is to fill a resin in a first mold(30) with a slot of compartment-shape. The second of the two steps is to remove the first mold(30) to form a second mold with slots of compartment-shape.

Description

Fabricating Method of Barrier Rib for Plasma Display Panel

The present invention relates to a method for manufacturing a partition wall for a plasma display device.

Recently, Liquid Crystal Display (hereinafter referred to as "LCD"), Field Emission Display (hereinafter referred to as "FED") and Plasma Display Panel (hereinafter referred to as "PDP") Flat display devices such as PDP have been actively developed. Among them, PDP is able to realize large screen of 40 inches or more as well as ease of fabrication by simple structure, excellent brightness and luminous efficiency, memory function and wide viewing angle of 160 ° or more. Has the advantage.

Referring to FIG. 1, the PDP according to the related art is coated with a predetermined thickness on the lower glass plate 14 on which the address electrode 2 is mounted, and the upper portion of the lower glass plate 14 to form a wall charge. The dielectric layer 18, the partition wall 8 formed on the dielectric layer 18 to divide each discharge cell, the phosphor 6 excited and emitted by the light generated by the plasma discharge, and the upper glass plate ( A transparent electrode 4 formed on the upper portion of the upper surface 16, a dielectric layer 12 that is formed on the upper glass plate 16 and the transparent electrode 4 with a predetermined thickness to form wall charges, and the dielectric layer 12 The protective film 10 which protects the dielectric layer 12 from sputtering by the discharge apply | coated on the top is provided. When a predetermined driving voltage (for example, 200V) is applied to the address electrode 2 and the transparent electrode 4, plasma discharge is caused by electrons emitted from the address electrode 2 inside the discharge cell. In detail, the electrons emitted from the electrode collide with the atoms of the He + Xe gas or the Ne + Xe gas enclosed in the discharge cell to ionize the atoms of the gas, and the emission of the secondary electrons occurs. Repeats collisions with atoms in the gas, ionizing atoms in turn. In other words, they enter the avalanche process, where electrons and ions double. The light generated in the avalanche process is excited to emit red (Red; " R "), green (hereinafter, " G "), and blue (" B ") phosphors. The light of R, G, and B emitted from the phosphor passes through the protective film 10, the dielectric layer 12, and the transparent electrode 4 to the upper glass plate 16 to display characters or graphics. Meanwhile, the partition wall 8 is formed in a stripe shape to divide each discharge cell, and reflect the light emitted from the phosphor 6 toward the upper glass plate 16.

A method of manufacturing a partition wall according to the prior art will be described with reference to FIGS. 2 to 5. The partition wall is made of a paste or slurry on a glass substrate on which a dielectric layer is formed by a screen printer method, a sand blast method, an addition method and a mold method. Hereinafter, the methods will be described.

Referring to FIG. 2, a barrier rib manufacturing method according to a screen print method is illustrated.

A screen (not shown) is positioned on the glass substrate 14. (First Step) A screen (not shown) is positioned in order to form a pattern on the glass substrate 14 on which the dielectric thick film 18 is formed. The paste 20 is applied to the glass substrate to a predetermined thickness and then dried for a predetermined time. (Second Step) After placing the paste 20 on the upper part of the screen, apply the paste 20 to the upper part of the glass substrate 14 by using a roller (not shown) or the like, and then dry it. . In this case, as shown in Fig. 2A, a paste 20 having a predetermined height is formed. The first and second steps are repeated to form a partition 8 having a predetermined thickness. (Third Step) By repeatedly performing the first and second steps, the height of the partition wall 8 is increased as shown in FIGS. 2B and 2C. Accordingly, as shown in FIG. 2 (d), a partition wall having a predetermined thickness (eg, 150 to 200 μm) is formed. The screen printing method has the advantages of a simple process and a low manufacturing cost. However, the screen printing method requires a process of repositioning the screen and the substrate, and repeating printing and drying several times, which not only takes a lot of manufacturing time but also screens during repetitive work. Since the position of the substrate is shifted and the shape accuracy of the partition wall is lowered, it is difficult to produce a high resolution partition wall.

Referring to FIG. 3, a method of manufacturing a partition wall according to a sand blast method is illustrated.

The paste 20 and the laminate 24 are sequentially applied to the upper portion of the glass substrate 14 (step 11). As shown in FIG. 3A, a predetermined thickness is applied to the upper portion of the glass substrate 14. For example, the paste 20 is applied at 150-200 mu m). Subsequently, as shown in FIG. 3B, the laminate 24 is laminated on the paste 20. In this case, the laminate means that the organic or inorganic material is added to the photoresist or slurry at a predetermined ratio, and is manufactured in the form of a tape. The laminate has photosensitivity by the composition of the organic or inorganic material. The pattern is formed by photolithography. (Twelfth Step) As shown in FIG. 3C, the pattern 22 is formed after the mast 22 is placed on the top of the laminate 24. Subsequently, unnecessary portions of the pattern by the photolithography method are etched as shown in FIG. An abrasive is sprayed on the pattern to remove the paste 20 in the portion where the pattern is not formed. (Thirteenth Step) As shown in FIG. 3E, the abrasive is sprayed to remove the paste 20 in unnecessary portions. The laminate 24 on top of the paste is removed. (Step 14) As shown in FIG. 3F, the laminate 24 on the paste 20 is removed to form the partition wall 8. The sand blast method has a merit that a partition can be formed on a large-area substrate and can be finely refined. However, since the amount of paste removed by the abrasive is large, manufacturing cost is high and physical impact is applied to the substrate during the manufacturing process. The problem which produces the crack of a board | substrate at the time of baking is derived.

Referring to FIG. 4, a barrier rib manufacturing method according to an additive method is illustrated.

The laminate 24 is laminated on the glass substrate 14. (Step 21) A laminate 24 having a predetermined thickness is laminated on the glass substrate 14 as shown in Fig. 4A. In this case, the laminate means that the organic or inorganic material is added to the photoresist or slurry at a predetermined ratio, and is manufactured in the form of a tape. The laminate has photosensitivity by the composition of the organic or inorganic material. The pattern is formed by photolithography. (Twenty-second Step) A pattern is formed on the upper part of the laminate 24 using the mask 22 as shown in Fig. 4B. Subsequently, unnecessary portions of the pattern formed by the photolithography method are etched as shown in Fig. 4C. After the paste 20 is applied to the portion where the laminate 24 is removed, the laminate 24 adjacent to the paste 20 is removed. (Step 23) As shown in Fig. 4D, the paste 20 is applied to a portion where the laminate 24 is removed to a predetermined thickness. The twenty-first to twenty-third steps are repeated to form the partition 8 having a predetermined thickness (for example, 150 to 200 μm). (Step 24) By repeatedly performing steps 21 through 23, a partition 8 having a predetermined thickness is formed as shown in FIG. 4E. Additive method has the advantage of being able to form a partition of fine shape and suitable for the manufacture of a large area substrate.However, when the pattern of the partition is 100 μm or more, it takes a long time to manufacture and the partition paste and the photosensitive paste. There is a problem in that it is difficult to completely separate the residues. In addition, problems have arisen in that the formed pattern is torn down or cracks are generated in the barrier rib during firing.

Referring to FIG. 5, a method of manufacturing a partition wall using a mold is illustrated.

An electrode pattern 28 ′ is formed on the lower substrate 14. (Step 31) An electrode pattern 28 'is formed on the lower substrate 14 as shown in FIG. In this case, the electrode pattern 28 ′ is disposed below the discharge space. A mold 26 having a partition-shaped groove is bonded to an upper portion of the lower substrate 14. (Step 32) The bonding layer 27 is attached to the upper portion of the lower substrate 14 as shown in FIG. Subsequently, the mold 26 is positioned on the bonding layer 27 and then attached to the bonding layer 27. Accordingly, the mold 26 is tightly fixed to the lower substrate 14. The partition wall material is filled into the partition wall groove of the mold 26. (Step 33) By depositing the mold 26 to which the lower substrate 14 is attached to the partition wall 20 ', the partition wall 20' is filled in the partition wall groove of the mold 26. . After the mold 26 is removed, the partition wall is formed. (Step 34) The mold 26 and the partition wall material 20 'are baked at a predetermined temperature so that the mold 26 can be removed. At this time, since the mold 26 and the lower substrate 14 are separated, the partition 8 is formed. In the mold method, when the partition wall material is filled into the mold, the partition wall material is difficult to be uniformly filled in the mold, and a problem that residues of the mold remain on the partition wall and the lower substrate during firing is derived.

Accordingly, an object of the present invention is to provide a method for manufacturing a partition wall for a plasma display device which simplifies the process and manufactures a high definition partition wall.

1 is a perspective view showing the structure of a conventional plasma display device.

Figure 2 is a view showing a partition wall manufacturing method by the screen printing method in accordance with the procedure.

3 is a view illustrating a method of manufacturing a partition wall by a sand blasting method according to a procedure.

Figure 4 is a view showing a partition wall manufacturing method by the addition method in accordance with the procedure.

5 is a view showing a partition wall manufacturing method by a mold method according to a procedure;

6 is a view illustrating a method of manufacturing a partition wall for a plasma display device according to the present invention according to a procedure;

FIG. 7 is an enlarged view of a portion A of FIG. 6. FIG.

<Description of the code | symbol about the principal part of drawing>

2,28: address electrode 4: transparent electrode

6: phosphor 8,38: partition wall

10: protective layer 12, 18: dielectric layer

14: lower glass plate 16: upper glass plate

20: paste 22: mask

24: laminate 26: mold

28 electrode 30 first mold

32: second mold 34: partition material

36: substrate

In order to achieve the above object, a method for manufacturing a partition wall for a plasma display device according to the present invention includes the steps of providing a mold having a partition-shaped groove, filling a partition material into the mold, and removing the mold to form the partition wall. It includes.

Other objects and features of the present invention other than the above object will become apparent from the description of the embodiments with reference to the accompanying drawings.

6 to 7, a preferred embodiment of the present invention will be described.

Referring to FIG. 6, a method of manufacturing a partition wall for a plasma display device according to the present invention is illustrated according to a procedure.

A second mold 32 having a partition-shaped groove is formed. (Step 41) First, as shown in FIG. 6A, a release material is applied to a first mold 30 having a partition shape, and then a liquid resin is filled. Liquid resins are thermoplastic resins such as epoxy and polypropylene. At this time, the first mold 30 and the liquid resin 32 'are preferably cured by cooling to a predetermined temperature. In addition, thermosetting resins such as epoxy, polypropylene, and nylon resin may be used as the liquid resin according to the intention of the designer. At this time, it is preferable to cure using a suitable curing method such as heat or ultraviolet rays. As shown in (b) of FIG. 6, before the liquid resin 32 'is cured, an appropriate plate is attached to the upper portion of the liquid resin 32' to prevent the cured liquid resin 32 'from being deformed. It is preferable. Next, as shown in FIG. 6C, the second mold 32 is formed by transferring the shape of the first mold 30 by separating the first mold 30 and the cured liquid resin. That is, the partition 32 groove | channel 32a is formed in the 2nd mold 32. As shown in FIG. At this time, the first mold 30 and the second mold 32 are eluted by the release material applied to the first mold 30.

The partition material paste 34 is filled into the second mold 32 and then dried. (Step 42) The partition material paste 34 is filled in the second mold 32 in which the partition-shaped grooves 32a are formed, as shown in FIG. 6D, and then dried for a predetermined time.

The substrate 36 is attached to the dried partition wall paste 34. (Step 43) The substrate 36 is attached to the upper portion of the partition wall paste 34 as shown in Fig. 6E. In this case, the substrate may be made of glass or glass-ceramic material, or may be a metal substrate according to the designer's intention. In addition, the substrate 36 may be formed with an electrode or a dielectric layer in advance.

After removing the second mold 32, the substrate 36 is baked at a predetermined temperature to form a partition wall. (Step 44) It is preferable to use the following four methods to remove the second mold. First, as shown in FIG. 7, the widths of the upper and lower portions of the partition-shaped grooves 32a formed in the second mold 32 are not uniform, and the width of the lower portion is wider than the upper portion. Subsequently, after performing the second to third steps, the substrate 36 is dried in an inverted state. In this case, since the partition paste filled in the second mold 32 is contracted in the drying process, the second mold 32 and the dried partition wall paste are separated from each other. At this time, since the thickness of the partition wall is reduced during the shrinkage of the partition wall paste, the depth of the partition groove 32a of the actual mold is preferably set to be within 150 to 400 μm. In this case, the height of the partition wall 38 may be unevenly formed due to different shrinkages of the partition wall paste 34 in the drying process, but this may make the height of the partition wall 38 uniform by mechanical polishing. will be. Second, when the material of the second mold 32 is an olefin resin or a thermoplastic resin such as polyethylene or polypropylene, the second mold 32 is removed by heating the second mold 32 to remove the second mold 32. Accordingly, the second mold 32 and the partition 38 are separated. Third, when the material of the second mold 32 is an acrylic resin, a sutyrene resin, or the like, the second mold 32 is removed using a solvent such as ketone, ester, and hydrocarbon. Accordingly, the second mold 32 and the partition 38 are separated. Fourth, when the material of the second mold 34 is a thermosetting resin, the second mold 32 is removed using a suitable solvent such as acetone.

The method for manufacturing a partition wall for plasma display device according to the present invention facilitates separation of the partition wall and the mold by using a predetermined method, thereby forming a high-definition partition wall and simplifying the process. In addition, the manufacturing method of the partition wall for plasma display device according to the present invention is to reduce the partition wall manufacturing cost compared to the case of using a conventional photosensitive paste.

As described above, the method of manufacturing the partition wall for plasma display device according to the present invention has the advantage of simplifying the process and reducing the cost.

In addition, the manufacturing method of the partition wall for plasma display device according to the present invention has the advantage that can be formed high-definition partition wall.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (9)

Providing a mold having a partition-shaped groove; Filling a partition material into the mold; Forming a barrier rib by removing the mold, the barrier rib manufacturing method of claim 1, further comprising forming the barrier rib. The method of claim 1, Providing a mold having the partition-shaped groove, Filling the first mold with a partition-shaped protrusion and curing the resin; And removing the first mold to form a second mold having a barrier rib-shaped groove. The method of claim 2, A method of manufacturing a partition for a plasma display device, characterized in that the material of the resin is a thermoplastic resin. The method of claim 3, wherein When the resin is filled in the mold, the barrier rib manufacturing method for a plasma display device, characterized in that it is heated, cooled to a predetermined temperature and cured. The method of claim 2, A method of manufacturing a partition for a plasma display device, characterized in that the material of the resin is any one of a thermosetting resin and an ultraviolet curable resin. The method of claim 2, And a plate attached to an upper portion of the second mold to prevent deformation of the second mold having the partition-shaped grooves. The method of claim 1, Removing the mold, And partitioning the mold and the partition wall by shrinking a predetermined amount during the drying of the partition material filled in the mold. The method of claim 1, Removing the mold, And when the material of the mold is a thermoplastic resin such as an olefin resin or an acrylic resin, the mold and the partition wall are melted by heating to separate the mold and the partition wall. The method of claim 1, Removing the mold, When the material of the mold is a resin that is soluble in a solvent, such as a water-based resin, the barrier rib manufacturing method for a plasma display device, characterized in that it is dissolved in a solvent to separate the mold and the partition wall.