KR100292467B1 - Manufacturing method of bulkhead for high brightness plasma display panel - Google Patents

Abstract

The present invention relates to a barrier rib manufacturing method for a high brightness plasma display panel for producing a barrier rib having a high definition high aspect ratio.

According to the present invention, a method of manufacturing a partition wall for a high brightness plasma display panel includes forming a slurry, filling a slurry into a mold with a uniform thickness, forming an electrode on an upper part of the molded product, and forming an electrode. Attaching a substrate on top of the formed molding, and after separating the mold, firing the partition wall formed on the substrate.

Accordingly, the method for manufacturing a high brightness plasma display panel partition wall according to the present invention forms a partition having high definition and high aspect ratio. In addition, the process is simplified to improve the production yield. In addition, the manufacturing cost is reduced, and the weight of the product is reduced.

Description

Fabricating Method for Plasma Display Panel with High-Brightness

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat panel display device, and more particularly, to a method for manufacturing a partition wall for a high brightness plasma display panel for manufacturing a partition wall having a high definition high aspect ratio.

Recently, Liquid Crystal Display (hereinafter referred to as "LCD"), Field Emission Display (hereinafter referred to as "FED") and Plasma Display Panel (hereinafter referred to as "PDP") Flat display devices such as PDP have been actively developed. Among them, PDP is easy to manufacture due to its simple structure, high brightness and high luminous efficiency, memory function, and has a wide viewing angle of 160 ° or more, and realizes a large screen of 40 inches or more. It has the advantage of being able to.

Referring to FIG. 1, the PDP according to the related art includes a lower glass plate 14 having an address electrode 2 mounted thereon, a lower dielectric thick film 18 coated on the upper portion of the lower glass plate 14 to a predetermined thickness; On the upper portion of the lower dielectric thick film 18, the partition 8 which divides each discharge cell, the phosphor 6 which is excited and emitted by the light generated by the plasma discharge, and the upper glass plate 16 The transparent electrode 4 formed thereon, the upper dielectric thick film 12 coated with a predetermined thickness on the upper glass plate 16 and the transparent electrode 4, and a protective film coated on the dielectric thick film 12. 10). When a predetermined driving voltage (for example, 200V) is applied to the address electrode 2 and the transparent electrode 4, plasma discharge is caused by electrons emitted from the address electrode 2 inside the discharge cell. In detail, the electrons emitted from the electrode collide with the atoms of the He + Xe gas or the Ne + Xe gas enclosed in the discharge cell to ionize the atoms of the gas, and the emission of the secondary electrons occurs. Repeats collisions with atoms in the gas, ionizing atoms in turn. In other words, they enter the avalanche process, where electrons and ions double. The light generated in the avalanche process is excited to emit red (Red; " R "), green (hereinafter, " G "), and blue (" B ") phosphors. The light of R, G, and B emitted from the phosphor passes through the protective film 10, the upper dielectric thick film 12, and the transparent electrode 4 to the upper glass plate 16 to display characters or graphics. Meanwhile, the partition wall 8 is formed in a stripe shape to divide each discharge cell, and reflect the light emitted from the phosphor 6 toward the upper glass plate 16.

Referring to Figure 2 will be described with respect to the manufacturing method of the partition wall according to the prior art. The partition wall is made of a paste or slurry on a glass substrate on which a dielectric thick film is formed by a screen printer method, a sand blast method and an addition method. The methods will be described with reference to FIGS. 2 (a) to 2 (c). In the screen print method shown in FIG. 2A, the screen 22 is first positioned on the glass substrate 14 on which the dielectric thick film 18 is formed. ) Is applied to a glass substrate with a predetermined thickness, and then dried for a predetermined time. Subsequently, the same method as described above is repeated several times (for example, 10 to 15 times) to form the partition wall 8 having a predetermined thickness (for example, 150 to 200 µm). The screen printing method has the advantages of a simple process and a low manufacturing cost. However, the screen printing method requires a process of repositioning the screen and the substrate, and repeating printing and drying several times, which not only takes a lot of manufacturing time but also screens during repetitive work. Since the position of the substrate is shifted and the shape accuracy of the partition wall is lowered, it is difficult to produce a high resolution partition wall.

In the sand blasting method shown in FIG. 2B, first, a paste 20 having a predetermined thickness (for example, 150 to 200 μm) is formed on an upper portion of the glass substrate 14 on which the dielectric thick film 18 is formed. ) Is coated on the top of the paste, and then a pattern is formed by photolithography. Next, an abrasive (for example, sand) is sprayed on the pattern to remove the paste 20 in the portion where the pattern is not formed, and then the laminate 24 on the paste is removed. In this case, the laminate means that the organic or inorganic material is added to the photoresist or slurry at a predetermined ratio, and is manufactured in the form of a tape. The laminate has photosensitivity by the composition of the organic or inorganic material. The sand blast method has a merit that a partition can be formed on a large-area substrate and can be finely refined. However, since the amount of paste removed by the abrasive is large, manufacturing cost is high and physical impact is applied to the substrate during the manufacturing process. The problem which produces the crack of a board | substrate at the time of baking is derived.

In the additive method illustrated in FIG. 2C, a laminate 24 having a predetermined thickness is coated on the glass substrate on which the dielectric thick film is applied, and then a pattern is formed by photolithography. Next, the laminate 24 of the part where a pattern is not formed is removed. Subsequently, the paste 20 is applied to the portion where the laminate is removed, and then the laminate 24 adjacent to the paste 20 is removed. Subsequently, the same method as described above is repeated several times (for example, ten times) to form the partition 8 having a predetermined thickness (for example, 150 to 200 µm). In this case, the laminate means that the organic or inorganic material is added to the photoresist or slurry at a predetermined ratio, and is manufactured in the form of a tape. The laminate has photosensitivity by the composition of the organic or inorganic material. The additive method is advantageous in that it is possible to form a partition having a fine shape and is suitable for manufacturing a large area substrate. However, when the pattern of the partition has a height of 100 μm or more, the manufacturing time is not only long, but also the partition paste and the photosensitive property. There is a problem in that it is difficult to completely separate the paste, leaving residue. In addition, problems have arisen in that the formed pattern is torn down or cracks are generated in the barrier rib during firing.

Accordingly, an object of the present invention is to provide a method of manufacturing a partition for a high brightness plasma display panel for manufacturing a partition having a high definition high aspect ratio.

1 is a perspective view showing the structure of a plasma display panel according to the prior art.

Figure 2 is a view showing for explaining a partition wall manufacturing method according to the prior art.

3 is a view illustrating a procedure of manufacturing a partition wall for a high brightness plasma display panel according to the present invention;

<Description of Symbols for Main Parts of Drawings>

2: address electrode 4: transparent electrode

6: phosphor 8,42: partition wall

10: protective layer 12, 18: dielectric layer

14: lower glass plate 16: upper glass plate

20: paste 22: mask

24 laminate 28 slurry

30: mold transfer part 32: mold

34: blade 36: electrode

38: substrate 40: roller

In order to achieve the above object, a method of manufacturing a partition wall for a high brightness plasma display panel according to the present invention includes the steps of forming a slurry, filling the slurry into a mold with a uniform thickness, and forming an electrode on top of the cured molding. And attaching a substrate to the upper part of the formed article on which the electrode is formed, and firing the partition wall formed on the substrate after separating the mold.

Other objects and features of the present invention other than the above object will become apparent from the description of the embodiments with reference to the accompanying drawings.

Referring to Figure 3 will be described a preferred embodiment of the present invention.

Referring to FIG. 3, a procedure of a method of manufacturing a partition wall for a high brightness plasma display panel according to the present invention is illustrated.

A slurry is formed. (Step 51) A slurry is formed by mixing an organic substance with a predetermined ratio in glass powder. In this case, the organic substance means a binder for maintaining the viscosity of the glass powder, a plasticizer for preventing the curing of the slurry to have a predetermined flexibility, a solvent for dissolving the binder and the plasticizer, and a predetermined amount of additives. The slurry is used for tape casting while maintaining a liquid state.

The slurry 28 is filled to a uniform thickness inside the mold 32. (52th Step) In the mold 32, grooves having a width of 100 µm and a height of 2-3 mm are formed in a partition wall shape, and are formed of a material such as Teflon or plastic metal. In this case, the high-definition bulkhead may be formed by adjusting the gap of the partition-shaped groove according to the manufacturer's intention. At this time, a release material is applied to the groove of the mold 32 to facilitate separation of the mold 32 and the partition wall 42 described later to prevent the partition wall 42 from being attached to the mold 32. As shown in FIG. 3A, the mold 32 is moved in the direction of the arrow at a predetermined speed by the mold transfer part 30. When the slurry 28 is supplied to the blade 34, the mold 32 is moved and the slurry 28 is filled to a uniform thickness in the mold 32. At this time, the thickness of the slurry applied to the upper portion of the mold 32 by adjusting the height (for example, 1-2mm) of the blade 34 according to the manufacturer's intention can be adjusted. Subsequently, by drying the slurry 28 filled in the mold 32 for a predetermined time, the surface of the slurry 28 is hardened to form a molding 29.

The electrode 36 is formed on the molding 29. (Step 53) The molding 29 and the mold 32 are put into a printing machine (not shown) to form an electrode by printing. At this time, the electrode 36 formed on the upper part of the molding 29 is shown in FIG.

The substrate is attached to the upper part of the molding 29 on which the electrode is formed. (Step 54) After placing the substrate 36 on which the adhesive layer is formed on the molded article 29 on which the electrode is formed, the molded article 29 on which the electrode is formed is formed by using a roller 40 or a press (not shown). ) Will be attached. At this time, the substrate 38 is formed to a predetermined thickness (for example, 0.5mm) and the material of the substrate is glass, glass-ceramic, ceramic, metal and the like. Especially in the case of metal materials, titanium (Titanium) of 0.5-1㎜ thickness is mainly used. At this time, the substrate 38 attached to the molding 29 is shown in Fig. 3C. In addition, after separating the substrate 38 to which the molding 29 is attached from the mold 32, the partition wall 42 is formed as shown in FIG. 3 (d) by firing.

As described above, the method for manufacturing a high brightness plasma display panel partition wall according to the present invention can form a partition wall having high definition and high aspect ratio, such as a high-definition television (HDTV) and a work station (Work Station). It can be applied to high resolution PDP. In addition, compared to the conventional bulkhead manufacturing method, the process is simplified to improve the remanufacturing yield, and there is no consumption of the bulkhead material, thereby reducing the manufacturing cost. In addition, since the substrate uses a metal plate of 0.5 mm or less, the product can be lighter than the conventional glass substrate.

As described above, the manufacturing method of the high brightness PDP partition wall according to the present invention has the advantage of forming a partition having a high definition, high aspect ratio (High-Ratio).

In addition, the manufacturing method of the high brightness PDP partition wall according to the present invention has the advantage of simplifying the process to improve the remanufacturing yield, and reduce the manufacturing cost.

In addition, the manufacturing method of the high brightness PDP partition wall according to the present invention has the advantage that the product can be reduced in weight.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (4)

Forming a slurry, Filling the slurry into a mold with a uniform thickness; Forming an electrode on top of the cured molding of the slurry; Attaching a substrate to an upper portion of a molding on which the electrode is formed; And separating the mold, and then firing a partition wall formed on the substrate. The method of claim 1, And a release material is coated on the mold to facilitate separation of the partition and the mold. The method of claim 1, Filling the mold with slurry, The method of claim 1, wherein the slurry is filled with a uniform thickness while the mold is moved. The method of claim 1, Attaching a substrate on top of the molding, Positioning the substrate on which the adhesive layer is formed on top of the molding; And attaching the substrate by applying a predetermined pressure to the substrate and the molded product.