KR100672294B1 - Method of Fabricating Barrier Rib for Plasma Display Panel - Google Patents

Abstract

The present invention relates to a method for manufacturing a partition wall for a plasma display device.

According to the present invention, a method of manufacturing a partition wall for a plasma display device includes forming a primary partition pattern on an upper portion of a lower substrate, forming a mask on an upper portion of the primary partition pattern, and using a mask to eliminate unnecessary partition patterns. Removing the portion to form a secondary partition.

Accordingly, the method for manufacturing a partition wall for the plasma display device of the present invention forms a fine partition wall and reduces the consumption of the partition wall material.

Description

Method for manufacturing partition wall for plasma display device {Method of Fabricating Barrier Rib for Plasma Display Panel}             

1 is a perspective view showing the configuration of a conventional plasma display device.

Figure 2 is a view showing for explaining a barrier rib manufacturing method using the screen printing method.

Figure 3 is a view showing for explaining a partition wall manufacturing method using the sandblast method.

Figure 4 is a view showing for explaining a partition wall manufacturing method using the addition method.

5 is a view for explaining a method for manufacturing a partition wall for a plasma display device according to an embodiment of the present invention.

6 is a view for explaining a method for manufacturing a partition wall for a plasma display device according to another embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

2: address electrode 4: sustain electrode pair

6: phosphor 8,36: partition wall

10: protective layer 12, 18: dielectric layer

14: lower glass plate 16: upper glass plate

20: paste 22,34: mask

24: laminate 32: partition wall material
30: lower substrate

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a plasma display device, and more particularly, to a method for manufacturing a partition for a plasma display device for forming a fine partition.

Recently, Liquid Crystal Display (hereinafter referred to as "LCD"), Field Emission Display (hereinafter referred to as "FED") and Plasma Display Panel (hereinafter referred to as "PDP") Flat display devices such as PDP have been actively developed. Among them, PDP is able to realize large screen of 40 inches or more as well as ease of fabrication by simple structure, excellent brightness and luminous efficiency, memory function and wide viewing angle of 160 ° or more. Has the advantage.

Referring to FIG. 1, a conventional PDP includes a lower glass plate 14 on which an address electrode 2 is mounted, and a dielectric layer coated on the lower glass plate 14 with a predetermined thickness to form a wall charge. (18), a partition (8) formed on the dielectric layer (18) and dividing each discharge cell, a phosphor (6) excited by and emitted by light generated by plasma discharge, and an upper glass plate (16). The sustain electrode pair 4 formed on the upper portion of the upper surface of the upper glass plate 16 and the sustain electrode pair 4 and having a predetermined thickness to form wall charges, and the dielectric layer 12 The protective film 10 which protects the dielectric layer 12 from sputtering by the discharge apply | coated on the top is provided. When a predetermined driving voltage (for example, 200 V) is applied to the address electrode 2 and the sustain electrode pair 4, plasma discharge is caused by electrons emitted from the address electrode 2 inside the discharge cell. In detail, the electrons emitted from the electrode collide with the atoms of the He + Xe gas or the Ne + Xe gas enclosed in the discharge cell to ionize the atoms of the gas, and the emission of the secondary electrons occurs. Repeats collisions with atoms in the gas, ionizing atoms in turn. In other words, they enter the avalanche process, where electrons and ions double. The light generated in the avalanche process is excited to emit red (Red; " R "), green (hereinafter, " G "), and blue (" B ") phosphors. The light of R, G, and B emitted from the phosphor passes through the protective film 10, the dielectric layer 12, and the sustain electrode pair 4 to the upper glass plate 16 to display characters or graphics. Meanwhile, the partition wall 8 is formed in a stripe shape to divide each discharge cell, and reflect the light emitted from the phosphor 6 toward the upper glass plate 16.

Referring to FIG. 2, a barrier rib manufacturing method according to a screen print method is illustrated.

A screen (not shown) is positioned on the glass substrate 14. (First Step) A screen (not shown) is positioned in order to form a pattern on the glass substrate 14 on which the dielectric thick film 18 is formed. The paste 20 is applied to a glass substrate with a predetermined thickness and then dried for a predetermined time. (Second Step) After placing the paste 20 on the upper part of the screen, apply the paste 20 to the upper part of the glass substrate 14 by using a roller (not shown) or the like, and then dry it. . By this process, as shown in Fig. 2A, a paste 20 having a predetermined height is formed. The first and second steps are repeated to form the partition wall 8 having a predetermined thickness. (Third Step) By repeatedly performing the first and second steps, the height of the partition wall 8 is increased as shown in FIGS. 2B and 2C. Accordingly, as shown in FIG. 2 (d), a partition wall having a predetermined thickness (eg, 150 to 200 μm) is formed. The screen printing method as described above has the advantage of a simple process and low manufacturing cost, but requires a process of adjusting the position of the screen and the substrate 14 and repeating the printing and drying several times. Since the position of the screen and the substrate is displaced during the repetitive work and the shape of the partition is degraded, it is difficult to produce a partition having a fine width.

Referring to FIG. 3, a method of manufacturing a partition wall according to a sand blast method is illustrated.

The paste 20 and the laminate 24 are sequentially applied on the glass substrate 14 (step 11). As shown in FIG. 3A, a predetermined thickness (eg, an upper portion of the glass substrate 14) is applied. For example, the paste 20 is applied at 150-200 mu m). Subsequently, as shown in FIG. 3B, the laminate 24 is laminated on the paste 20. In this case, the laminate means that the organic or inorganic material is added to the photoresist or slurry in a predetermined ratio, and is manufactured in the form of a tape. The laminate has photosensitivity by the composition of the organic or inorganic material. The pattern is formed by photolithography. (Twelfth Step) As shown in Fig. 3C, the mask 22 is positioned on the laminate 24, and then a pattern is formed. Subsequently, unnecessary portions of the pattern by the photolithography method are etched as shown in FIG. An abrasive is sprayed on the pattern to remove the paste 20 in the portion where the pattern is not formed. (Thirteenth Step) As shown in Fig. 3E, the abrasive is sprayed to remove the unnecessary portion of the paste 20. The laminate 24 on top of the paste is removed. (Step 14) As shown in FIG. 3F, the laminate 24 on the paste 20 is removed to form the partition wall 8. The sand blasting method has an advantage of easily forming a partition wall on a large-area substrate. However, the abrasive flying at high speed tends to polish the side surfaces of the partition wall due to its weak directionality, thereby limiting the height of the partition wall.

Referring to FIG. 4, a barrier rib manufacturing method according to an additive method is illustrated.

The laminate 24 is laminated on the glass substrate 14. (Step 21) A laminate 24 having a predetermined thickness is laminated on the glass substrate 14 as shown in Fig. 4A. In this case, the laminate means that the organic or inorganic material is added to the photoresist or slurry at a predetermined ratio, and is manufactured in the form of a tape. The laminate has photosensitivity by the composition of the organic or inorganic material. The pattern is formed by photolithography. (Step 22) As shown in FIG. 4B, a pattern is formed on the laminate 24 using the mask 22. Subsequently, unnecessary portions of the pattern formed by the photolithography method are etched as shown in Fig. 4C. After the paste 20 is applied to the portion where the laminate 24 is removed, the laminate 24 adjacent to the paste 20 is removed. (Step 23) As shown in Fig. 4D, the paste 20 is applied to a portion where the laminate 24 is removed to a predetermined thickness. By repeating the twenty-first to twenty-third steps, the partition 8 having a predetermined thickness (for example, 150-200 mu m) is formed. (Step 24) By repeatedly performing steps 21 through 23, the partition wall 8 having a predetermined thickness is formed as shown in Fig. 4E. Additive method has the advantage of being able to form a partition of fine shape and suitable for the manufacture of a large area substrate.However, when the pattern of the partition is 100 μm or more, it takes a long time to manufacture and the partition paste and the photosensitive paste. There is a problem in that it is difficult to completely separate the residues. In addition, problems have arisen in that the formed pattern is torn down or cracks are generated in the barrier rib during firing.

As described above, the conventional barrier rib manufacturing method has a problem in that it is difficult to form the fine barrier ribs. Accordingly, there is a demand for a new method for manufacturing partition walls for forming a fine partition wall.

Accordingly, an object of the present invention is to provide a method for manufacturing a partition wall for a plasma display device for forming a fine partition wall.

In order to achieve the above object, a method of manufacturing a partition wall for a plasma display device according to the present invention includes forming a primary partition pattern on an upper portion of a substrate, forming a mask on an upper portion of the primary partition pattern, and forming a secondary layer by a mask. Forming a partition.

Other objects and features of the present invention other than the above object will become apparent from the description of the embodiments with reference to the accompanying drawings.

A preferred embodiment of the present invention will be described with reference to FIGS. 5 to 6.

Referring to FIG. 5, a diagram for describing a method of manufacturing a partition wall for a plasma display device according to an exemplary embodiment of the present invention is illustrated.

The partition wall material 32 is partially coated on the lower substrate 30 to form a primary partition wall pattern. (First Step) The primary partition shown in FIG. 5B by partially applying the partition member 32 on the upper portion of the lower substrate 30 as shown in FIG. 5A using the screen printing method. Form a pattern. In this case, an address electrode (not shown) and a dielectric layer (not shown) are formed on the lower substrate 30. In this case, the partition wall material 32 uses a paste or the like.

A mask 34 is formed on the first barrier rib pattern. (Second Step) A mask 34 is formed on the upper part of the primary partition pattern shown in FIG. 5C using photolithography. At this time, it is preferable to use a dry film as the material of the mask 34.

An unnecessary portion of the primary partition pattern is removed to form a secondary partition. (Third Step) The secondary partition shown in FIG. The partitions will be formed. At this time, since the unnecessary part of the primary partition wall is removed only, the waste of the partition wall material is reduced.

As described above, the method of manufacturing the partition wall for the plasma display device of the present invention can not only form a fine partition wall but also reduce waste of the partition wall material.

Referring to FIG. 6, a diagram for describing a method of manufacturing a partition wall for a plasma display device according to another exemplary embodiment of the present invention is illustrated.

A photosensitive partition wall is partially coated on the lower substrate 30 to form a primary partition pattern. (Step 11) By partially applying the photosensitive partition wall material 32 'to have a predetermined width on the upper portion of the lower substrate 30 shown in FIG. The primary partition wall pattern as shown in b) is formed. In this case, an address electrode (not shown) and a dielectric layer (not shown) are formed on the lower substrate 30. In this case, a photosensitive paste or the like is used as the photosensitive partition wall material 32 '.

A photomask is positioned and exposed on the first barrier rib pattern. (Twelfth Step) As shown in FIG. 6C, the photomask 34 'is positioned on the primary partition pattern and exposed to form a pattern of the micro partition wall.

Unnecessary portions of the photosensitive partition material are removed to form secondary partitions. (Thirteenth Step) The photosensitive partition wall material of the unnecessary portion of the patterned photosensitive partition material 32 'on which the pattern is formed is removed by developing and fired, thereby forming a secondary partition, that is, a fine partition wall having a fine width. At this time, since only the unnecessary portion of the primary partition pattern is removed, the portion to be removed reduces waste of the partition wall material. As described above, the method of manufacturing the partition wall for the plasma display device of the present invention can not only form the fine partition wall but also reduce the waste of the photosensitive partition wall material.

As described above, the method for manufacturing a partition wall for the plasma display device of the present invention has the advantage of forming a fine partition wall and reducing the consumption of the partition wall material.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (6)

Forming a primary partition pattern by partially applying a partition material on an upper portion of the lower substrate; Forming a mask on the first barrier rib pattern; Forming a secondary partition by removing an unnecessary portion of the primary partition pattern using the mask. The method of claim 1, And the primary partition pattern is formed by a screen printing method. The method of claim 1, And the secondary partition wall is formed by any one of a sandblasting method, an etching method and a photosensitive paste method. The method of claim 1, And the mask material is a photosensitive dry film. delete The method of claim 1, A partition wall manufacturing method for a plasma display device, wherein the partition material is any one of a paste and a photosensitive paste.

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