JP3239898B2 - Thick film pattern forming method - Google Patents
Thick film pattern forming methodInfo
- Publication number
- JP3239898B2 JP3239898B2 JP05113890A JP5113890A JP3239898B2 JP 3239898 B2 JP3239898 B2 JP 3239898B2 JP 05113890 A JP05113890 A JP 05113890A JP 5113890 A JP5113890 A JP 5113890A JP 3239898 B2 JP3239898 B2 JP 3239898B2
- Authority
- JP
- Japan
- Prior art keywords
- intaglio
- substrate
- thick film
- pattern
- film pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、液晶表示装置、蛍光表示ディスプレイパネ
ル、プラズマディスプレイパネル、混成集積回路等の製
造工程における厚膜パターン形成方法に関するものであ
る。Description: BACKGROUND OF THE INVENTION The present invention relates to a method for forming a thick film pattern in a manufacturing process of a liquid crystal display device, a fluorescent display panel, a plasma display panel, a hybrid integrated circuit, and the like.
［従来の技術］ 従来、この種の厚膜パターン形成方法としては、ガラ
スやセラミック基板上に導体或いは絶縁体用のペースト
をスクリーン印刷によりパターン状に印刷を行った後に
このペーストを乾燥、焼成する工程を繰り返して厚膜パ
ターンを形成する方法が知られている。また、他の方法
として、基板上の非パターン部にフォトレジストからな
る焼却除去層を形成しておき、さらに基板上の全面にパ
ターン形成層を施してから基板全体を焼成することによ
り厚膜パターンを得ることも行われている（特開昭63−
116846号公報参照）。[Prior Art] Conventionally, as a method of forming a thick film pattern of this type, a paste for a conductor or an insulator is printed in a pattern on a glass or ceramic substrate by screen printing, and then the paste is dried and fired. A method of forming a thick film pattern by repeating the steps is known. As another method, a thick film pattern is formed by forming an incineration removal layer made of a photoresist on a non-pattern portion on a substrate, further applying a pattern forming layer on the entire surface of the substrate, and then firing the entire substrate. (Japanese Patent Laid-Open No. 63-63)
No. 116846).
［発明が解決しようとする課題］ 前記従来のスクリーン印刷による方法においては、上
述のように複数回のスクリーン印刷により重ね刷りをし
て所定の厚さにする方法が採られているが、この方法で
は例えば50〜100μｍの厚膜を得るために５〜10回の重
ね刷りを必要とし、その度ごとに乾燥工程が入ることと
なり、その結果として極めて生産性が悪く、また、歩留
りを低下させるという問題点があった。さらに、ペース
トの粘度、チクソトロピー等によりパターンの線幅精度
が損なわれるという問題点もあった。[Problem to be Solved by the Invention] In the above-mentioned conventional screen printing method, a method of performing overprinting by a plurality of screen printings to a predetermined thickness as described above is employed. For example, in order to obtain a thick film of 50 to 100 μm, overprinting of 5 to 10 times is required, and each time a drying step is entered, as a result, extremely low productivity and lowering the yield There was a problem. Further, there is a problem that the line width accuracy of the pattern is impaired due to the viscosity of the paste, thixotropy and the like.
また、基板上にフォトレジストからなる焼却除去層を
設けておき、パターン形成層を施した後に全面焼成を行
う方法では、現像にウェットプロセスが入ることから操
作が煩雑になると共に、高価なフォトレジストを焼却す
るためにコスト高になるという問題点を有していた。In addition, in a method in which an incineration removal layer made of a photoresist is provided on a substrate and the entire surface is baked after the pattern formation layer is applied, the operation becomes complicated because a wet process is involved in development, and an expensive photoresist is used. However, there is a problem that the cost is increased due to incineration.
本発明は、このような従来技術の問題点を解消するた
めに創案されたものであり、生産性を改善し歩留りを向
上させる厚膜パターン形成方法を提供することを目的と
している。The present invention has been made in order to solve such problems of the related art, and has as its object to provide a method of forming a thick film pattern that improves productivity and improves yield.
［課題を解決するための手段］ 上記目的を達成するために、本発明の厚膜パターン形
成方法は、目的パターンの雌型である凹版の凹部にパタ
ーン形成材料であるガラスペーストを充填し、次いで、
該ガラスペーストを挟むようにして凹版にガラス又はセ
ラミックからなる基板を密着させてガラスペーストを硬
化させた後、硬化したガラスペーストを基板の表面に残
すようにして凹版を基板より剥離することで高さ100μ
ｍ以上のラインパターンを転写し、続いて、表面にガラ
スペーストが転写された基板に対し焼成を行うようにし
たものである。[Means for Solving the Problems] In order to achieve the above object, a method for forming a thick film pattern according to the present invention comprises filling a glass paste, which is a pattern forming material, into a concave portion of an intaglio, which is a female mold of a target pattern, ,
After the glass paste is hardened by adhering a glass or ceramic substrate to the intaglio so as to sandwich the glass paste, the intaglio is peeled off from the substrate so that the hardened glass paste is left on the surface of the substrate, thereby obtaining a height of 100 μm.
In this case, a line pattern of m or more is transferred, and then the substrate on which the glass paste is transferred is fired.
そして、上記の方法では、凹版の凹部に充填されたパ
ターン形成材料が基板側に転写される段階でパターン形
成材料の凝集力及びパターン形成材料と基板との密着力
が強いことが必要である。このため、凹版の凹部に充填
する前記パターン形成材料として紫外線硬化性ガラスペ
ーストを用いるようし、さらに基板を凹版に密着させる
前に紫外線硬化性プライマーにより基板の表面を処理す
るか、或いは、基板を凹版に密着させる前に凹版の表面
に紫外線硬化性樹脂を塗布するようにした。In the above-mentioned method, it is necessary that the cohesive force of the pattern forming material and the adhesion between the pattern forming material and the substrate are strong at the stage when the pattern forming material filled in the concave portions of the intaglio is transferred to the substrate side. For this reason, an ultraviolet-curable glass paste is used as the pattern forming material to be filled in the concave portions of the intaglio, and the surface of the substrate is treated with an ultraviolet-curable primer before the substrate is brought into close contact with the intaglio, or An ultraviolet curable resin was applied to the surface of the intaglio before it was brought into close contact with the intaglio.
また、凹版の材料としては、熱可塑性樹脂或いは表面
張力の小さい物質を使用することが好ましい。Further, as the material of the intaglio, it is preferable to use a thermoplastic resin or a substance having a small surface tension.
［作用］ 上記構成の厚膜パターン形成方法によれば、硬化した
パターン形成材料が基板の表面に残るようにして凹版が
剥離されることにより、目的パターンのパターン形成材
料が基板の上に転写される。そして、このパターン形成
材料が転写された基板を焼成することにより所望の厚膜
パターンが形成される。[Operation] According to the thick film pattern forming method having the above configuration, the intaglio is peeled off so that the cured pattern forming material remains on the surface of the substrate, so that the pattern forming material of the target pattern is transferred onto the substrate. You. Then, a desired thick film pattern is formed by baking the substrate to which the pattern forming material has been transferred.
そして、前記パターン形成材料として紫外線硬化性ガ
ラスペーストを用い、基板を凹版に密着させる前に紫外
線硬化性プライマーにより基板の表面を処理するように
した場合にあっては、紫外線を照射することによりパタ
ーン形成材料が固まると共に、プライマーの作用により
パターン形成材料と基板との密着力が付与される。And, in the case where an ultraviolet-curing glass paste is used as the pattern forming material and the surface of the substrate is treated with an ultraviolet-curing primer before the substrate is brought into close contact with the intaglio, the pattern is irradiated by irradiating ultraviolet rays. As the forming material hardens, the adhesion of the pattern forming material to the substrate is imparted by the action of the primer.
また、基板を凹版に密着させる前に凹版の表面に紫外
線硬化性樹脂を塗布するようにした場合にあっては、塗
布した紫外線硬化性樹脂がパターン形成材料に浸透する
結果、紫外線を照射することによりパターン形成材料が
固まると共に、紫外線硬化性樹脂の作用によりパターン
形成材料と基板との密着力が付与される。In the case where the UV curable resin is applied to the surface of the intaglio before the substrate is brought into close contact with the intaglio, the applied UV curable resin penetrates the pattern forming material, so that the UV irradiation is performed. As a result, the pattern forming material is hardened, and the adhesive force between the pattern forming material and the substrate is given by the action of the ultraviolet curable resin.
そして、凹版の材料として熱可塑性樹脂を使用した場
合には、凹版を基板から剥離する前に熱処理を施すこと
により凹版が軟化して容易に剥離される。また、凹版の
材料として表面張力の小さい物質を使用した場合には、
硬化したパターン形成材料との接着力が減少されて剥離
が容易となる。When a thermoplastic resin is used as the material for the intaglio, the intaglio is softened and easily peeled off by performing a heat treatment before the intaglio is peeled from the substrate. If a material with a low surface tension is used as the material for the intaglio,
The adhesive force with the cured pattern forming material is reduced, and peeling is facilitated.
［実施例］ 上記の本発明について、以下に実施例を挙げてさらに
具体的に説明する。[Examples] The present invention will be described more specifically with reference to the following examples.
〈実施例１〉 第１図（ａ）〜（ｅ）に示す工程図により説明する。<Example 1> This will be described with reference to the process charts shown in FIGS.
まず、第１図（ａ）に示すように、目的パターンの雌
型である凹版１を作成する。本実施例では、切削加工を
施した銅板を元型として用い、熱可塑性樹脂であるダウ
コーニング（株）製シリコン含有ポリエチレン「マスタ
ーペレットSP300」を凹版材料として用いて、150℃/8〜
10kg・cm-2/5〜10minの条件でコンプレッション成型
し、線幅100μｍ、深さ150μｍ、ピッチ300μｍのライ
ンパターンを有する凹版１を得た。First, as shown in FIG. 1A, an intaglio 1 which is a female mold of a target pattern is prepared. In the present example, a cut copper plate was used as a master, and a thermoplastic resin, Dow Corning Co., Ltd. silicon-containing polyethylene "Master Pellet SP300" was used as an intaglio material at 150 ° C./8 to
Compression molding was performed under the conditions of 10 kg · cm −2 / 5 to 10 min to obtain an intaglio 1 having a line pattern having a line width of 100 μm, a depth of 150 μm, and a pitch of 300 μm.
続いて、第１図（ｂ）に示すように、得られた凹版１
に紫外線硬化性ガラスペースト２を充填した。具体的に
は、平板ゴムを凹版１に押し当てながらパターンを斜め
に横切るように移動させ、紫外線硬化性ガラスペースト
２を凹版１の凹部に押し込むと共に余分なペーストを掻
き取るようにした。また、紫外線硬化性ガラスペースト
２には市販の無溶剤型紫外線硬化性樹脂をバインダーと
して結着剤、充填剤、着色顔料を練肉しペースト化した
ものを用いた。Subsequently, as shown in FIG. 1 (b), the obtained intaglio 1
Was filled with an ultraviolet curable glass paste 2. Specifically, the flat rubber was pressed against the intaglio 1 and moved obliquely across the pattern, so that the ultraviolet curable glass paste 2 was pushed into the recesses of the intaglio 1 and the excess paste was scraped off. As the UV-curable glass paste 2, a paste obtained by kneading a binder, a filler, and a coloring pigment using a commercially available solventless UV-curable resin as a binder was used.
次いで、ガラスペースト２が充填された凹版１に対
し、第１図（ｃ）に示すように、紫外線硬化性プライマ
ー４で処理したガラス基板３を対向、密着させ、３〜5k
g・cm-2の加圧下でガラス基板３側から紫外線を照射
し、ガラスペースト２及びプライマー４を硬化させた。
使用するプライマー４としては市販の紫外線硬化性樹脂
の範囲で広く考えられるが、本実施例では東亜合成化学
工業（株）製ウレタンアクリレート「Ｍ−1100」を用い
た。また、光開始剤としては市販の試薬の範囲で広く考
えられるが、本実施例では１−ヒドロキシシクロヘキシ
ルフェニルケトン（日本チバガイギー（株）製「イルガ
キュア−184」）を用いた。そして、前記ウレタンアク
リレートに前記光開始剤を3wt％溶解させた樹脂分をメ
チルエチルケトンに50wt％溶解させた溶液をプライマー
液とし、これをアプリケーターにてガラス基板３上に約
５μｍの厚みで塗布してプライマー処理を行った。ここ
で、前記の紫外線硬化性樹脂或いは光開始剤の選択は本
発明を限定するものではないが、凹版１との密着時に凹
版１内のガラスペースト２中に樹脂の拡散を防止するた
め室温における粘度が約10000cps以上の高粘度の樹脂が
好ましい。また、プライマー処理の厚みは適宜決定され
るが、10μｍ以上の厚さでは続く第１図（ｅ）に示す焼
成工程で障害となり、５μｍ以下の厚さでは十分な密着
効果が得られなかった。なお、硬化条件は40w/cmの高圧
水銀灯を光源とし、紫外線を1000mJ/cm2照射した。Next, as shown in FIG. 1 (c), the glass substrate 3 treated with the ultraviolet-curable primer 4 is opposed to and in close contact with the intaglio 1 filled with the glass paste 2, and 3 to 5 k
Ultraviolet rays were irradiated from the glass substrate 3 side under a pressure of g · cm −2 to cure the glass paste 2 and the primer 4.
As the primer 4 to be used, a wide range of commercially available ultraviolet curable resins can be considered, but in this example, urethane acrylate “M-1100” manufactured by Toa Gosei Chemical Industry Co., Ltd. was used. In addition, 1-hydroxycyclohexyl phenyl ketone ("Irgacure-184" manufactured by Ciba Geigy K.K.) was used in this example, although a photoinitiator is widely considered in the range of commercially available reagents. Then, a solution obtained by dissolving 3 wt% of the photoinitiator in the urethane acrylate and 50 wt% in methyl ethyl ketone was used as a primer solution, and this was applied to the glass substrate 3 with an applicator to a thickness of about 5 μm. Primer treatment was performed. Here, the selection of the ultraviolet curable resin or the photoinitiator does not limit the present invention, but at room temperature in order to prevent the resin from diffusing into the glass paste 2 in the intaglio 1 at the time of close contact with the intaglio 1. High viscosity resins having a viscosity of about 10,000 cps or more are preferred. The thickness of the primer treatment is determined as appropriate. However, a thickness of 10 μm or more hinders the subsequent firing step shown in FIG. 1E, and a sufficient adhesion effect cannot be obtained with a thickness of 5 μm or less. The curing conditions were as follows: a 40 w / cm high pressure mercury lamp was used as a light source, and ultraviolet rays were irradiated at 1000 mJ / cm 2 .
次に、第１図（ｄ）に示すように、凹版１を剥離し、
ガラス基板３上にプライマー４を介してガラスペースト
２でラインパターンを形成した。なお、剥離前に80℃/5
min程度の熱処理を施すと凹版１が軟化するため剥離が
容易になる。Next, as shown in FIG. 1 (d), the intaglio 1 is peeled off,
A line pattern was formed on the glass substrate 3 with the glass paste 2 via the primer 4. Before peeling, 80 ℃ / 5
When a heat treatment of about min is performed, the intaglio 1 is softened, so that peeling becomes easy.
最後に、第１図（ｅ）に示すように、約600℃で焼成
を行い、線幅100μｍ、高さ150μｍ、ピッチ300μｍの
厚膜パターン５を得た。Finally, as shown in FIG. 1E, baking was performed at about 600 ° C. to obtain a thick film pattern 5 having a line width of 100 μm, a height of 150 μm and a pitch of 300 μm.
〈実施例２〉 まず、第１図（ａ）に示すように、目的パターンの雌
型である凹版１を作成する。本実施例では、切削加工を
施した銅板を元型として用い、表面張力の小さい物質で
ある信越化学工業（株）製二液型RTVゴム「KE−112」を
凹版材料として用いて、元型上でRTVゴムを硬化させ、
線幅100μｍ、深さ150μｍ、ピッチ300μｍのラインパ
ターンを有する凹版１を得た。Embodiment 2 First, as shown in FIG. 1A, an intaglio 1 which is a female mold of a target pattern is prepared. In the present embodiment, a copper plate subjected to a cutting process is used as a master, and a two-component RTV rubber “KE-112” manufactured by Shin-Etsu Chemical Co., Ltd., which is a substance having a small surface tension, is used as an intaglio material. Cure the RTV rubber on
Intaglio 1 having a line pattern having a line width of 100 μm, a depth of 150 μm, and a pitch of 300 μm was obtained.
以下、実施例１と同様にして線幅100μｍ、高さ150μ
ｍ、ピッチ300μｍの厚膜パターン５を得た。Thereafter, the line width is 100 μm and the height is 150 μ in the same manner as in Example 1.
m, a thick film pattern 5 having a pitch of 300 μm was obtained.
［発明の効果］ 以上説明したように、本発明の厚膜パターン形成方法
は、一回の操作で高さ100μｍ以上のパターンが得られ
ることから、これまでのスクリーン印刷による積層等に
比べ、処理時間が短縮されるとともに位置合わせ等の操
作も一回でよいため、工程の簡略化を図ることができ、
しかもガラスペーストを用いて硬化させた厚膜パターン
を形成することができるという効果を奏する。[Effects of the Invention] As described above, the method of forming a thick film pattern of the present invention can obtain a pattern having a height of 100 µm or more in a single operation. Since the time is shortened and the operation such as alignment is performed only once, the process can be simplified,
In addition, there is an effect that a thick film pattern cured using a glass paste can be formed.
第１図（ａ）〜（ｅ）は本発明に係る厚膜パターン形成
方法の一実施例を示す工程図である。 １……凹版、２……紫外線硬化性ガラスペースト、３…
…ガラス基板、４……紫外線硬化性プライマー、５……
厚膜パターン1 (a) to 1 (e) are process diagrams showing one embodiment of a method for forming a thick film pattern according to the present invention. 1 ... intaglio, 2 ... ultraviolet curable glass paste, 3 ...
... Glass substrate, 4 ... UV curable primer, 5 ...
Thick film pattern
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭56−121666（ＪＰ，Ａ) 特開 昭64−58373（ＪＰ，Ａ) 特開 平１−297178（ＪＰ，Ａ) 特開 平１−319945（ＪＰ，Ａ) 特開 昭55−34211（ＪＰ，Ａ) 特開 昭57−87318（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) B05D 1/00 - 7/26 H01L 21/3065 H01L 21/3205 H05K 3/10 - 3/26 H05K 3/38 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-56-121666 (JP, A) JP-A-64-58373 (JP, A) JP-A-1-297178 (JP, A) JP-A-1- 319945 (JP, A) JP-A-55-34211 (JP, A) JP-A-57-87318 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) B05D 1/00-7 / 26 H01L 21/3065 H01L 21/3205 H05K 3/10-3/26 H05K 3/38
Claims (6)
ターン形成材料であるガラスペーストを充填し、次い
で、該ガラスペーストを挟むようにして凹版にガラス又
はセラミックからなる基板を密着させてガラスペースト
を硬化させた後、硬化したガラスペーストを基板の表面
に残すようにして凹版を基板より剥離することで高さ10
0μｍ以上のラインパターンを転写し、続いて、表面に
ガラスペーストが転写された基板に対し焼成を行うこと
を特徴とする厚膜パターン形成方法。1. A concave portion of an intaglio plate, which is a female mold of a target pattern, is filled with a glass paste as a pattern forming material, and then a glass or ceramic substrate is brought into close contact with the intaglio plate so as to sandwich the glass paste. After curing, the intaglio is peeled from the substrate so that the cured glass paste remains on the surface of the substrate, and the height is 10
A method for forming a thick film pattern, comprising transferring a line pattern of 0 μm or more, and subsequently baking the substrate on which the glass paste has been transferred.
スペーストを用いたことを特徴とする請求項１記載の厚
膜パターン形成方法。2. The method according to claim 1, wherein an ultraviolet-curable glass paste is used as the pattern forming material.
プライマーにより基板の表面を処理することを特徴とす
る請求項２記載の厚膜パターン形成方法。3. The method of forming a thick film pattern according to claim 2, wherein the surface of the substrate is treated with an ultraviolet curable primer before the substrate is brought into close contact with the intaglio.
紫外線硬化性樹脂を塗布することを特徴とする請求項１
記載の厚膜パターン形成方法。4. An ultraviolet curable resin is applied to the surface of the intaglio before the substrate is brought into close contact with the intaglio.
The method for forming a thick film pattern according to the above.
とを特徴とする請求項1,2,3又は４記載の厚膜パターン
形成方法。5. The method of forming a thick film pattern according to claim 1, wherein a thermoplastic resin is used as a material for the intaglio.
用いることを特徴とする請求項1,2,3又は４記載の厚膜
パターン形成方法。6. The method according to claim 1, wherein a material having a low surface tension is used as a material for the intaglio.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05113890A JP3239898B2 (en) | 1990-03-02 | 1990-03-02 | Thick film pattern forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05113890A JP3239898B2 (en) | 1990-03-02 | 1990-03-02 | Thick film pattern forming method |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17651999A Division JP3338403B2 (en) | 1999-06-23 | 1999-06-23 | Method of forming thick film pattern of plasma display panel |
| JP17651899A Division JP3338402B2 (en) | 1999-06-23 | 1999-06-23 | Thick film pattern forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03254857A JPH03254857A (en) | 1991-11-13 |
| JP3239898B2 true JP3239898B2 (en) | 2001-12-17 |
Family
ID=12878461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05113890A Expired - Fee Related JP3239898B2 (en) | 1990-03-02 | 1990-03-02 | Thick film pattern forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3239898B2 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5609704A (en) * | 1993-09-21 | 1997-03-11 | Matsushita Electric Industrial Co., Ltd. | Method for fabricating an electronic part by intaglio printing |
| US6023130A (en) * | 1995-09-06 | 2000-02-08 | Kyocera Corporation | Plasma display substrate and a production method thereof |
| EP0802170A3 (en) * | 1996-04-16 | 1997-11-05 | Corning Incorporated | Method and apparatus for forming glass rib structures |
| JPH10188793A (en) * | 1996-10-21 | 1998-07-21 | Hitachi Ltd | Gas discharge display panel, manufacture of the gas discharge display panel, and display device using the gas discharge display panel |
| DE19713311C2 (en) * | 1997-03-29 | 1999-03-11 | Schott Glas | Method and device for producing large-area precision structures on flat glass |
| KR19990012634A (en) * | 1997-07-30 | 1999-02-25 | 엄길용 | Manufacturing Method of Plasma Display Device |
| WO2005090043A1 (en) * | 2004-03-22 | 2005-09-29 | Pioneer Corporation | Method and device for forming recessed and projected pattern |
| JP2006082039A (en) * | 2004-09-17 | 2006-03-30 | Noritake Co Ltd | Oxygen separation membrane element, its manufacturing method, oxygen manufacturing method, and reactor |
| JP4934996B2 (en) * | 2005-06-08 | 2012-05-23 | ソニー株式会社 | Method for manufacturing flat display device |
| CN102105280B (en) * | 2008-09-12 | 2013-04-10 | 日本碍子株式会社 | Manufacturing method for three-dimensional molded parts |
| GB201613051D0 (en) * | 2016-07-28 | 2016-09-14 | Landa Labs (2012) Ltd | Applying an electrical conductor to a substrate |
-
1990
- 1990-03-02 JP JP05113890A patent/JP3239898B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03254857A (en) | 1991-11-13 |
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| LAPS | Cancellation because of no payment of annual fees |