JP3338402B2 - Thick film pattern forming method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method of forming a thick film pattern in a process of manufacturing a liquid crystal display device, a fluorescent display panel, a plasma display panel, a hybrid integrated circuit, and the like.

[0002]

2. Description of the Related Art Conventionally, as a method of forming a thick film pattern of this kind, a paste for a conductor or an insulator is printed in a pattern on a glass or ceramic substrate by screen printing, and then the paste is dried and fired. A method of forming a thick film pattern by repeating the steps is known. As another method, a thick film pattern is formed by forming an incineration removal layer made of a photoresist on a non-pattern portion on a substrate, further applying a pattern forming layer on the entire surface of the substrate, and then firing the entire substrate. (See JP-A-63-116846).

[0003]

In the above-mentioned conventional screen printing method, a method of performing overprinting by a plurality of times of screen printing to obtain a predetermined thickness as described above is adopted. Then, for example, 50-100μ
In order to obtain a thick film having a thickness of 5 m, overprinting is required 5 to 10 times, and each time a drying step is performed, there is a problem that the productivity is extremely low and the yield is reduced. Was. Further, there is a problem that the line width accuracy of the pattern is impaired due to the viscosity of the paste, thixotropy and the like.

Further, in a method in which an incineration removal layer made of a photoresist is provided on a substrate, and the entire surface is baked after the pattern formation layer is applied, the operation becomes complicated since a wet process is involved in development, and the cost is high. There is a problem that the cost is increased due to incineration of a complicated photoresist.

SUMMARY OF THE INVENTION The present invention has been made to solve such problems of the prior art, and has as its object to provide a method of forming a thick film pattern which improves productivity and improves yield.

[0006]

In order to achieve the above object, a method for forming a thick film pattern according to the present invention utilizes an intaglio transfer method. That is, an intaglio, which is the female mold of the target pattern, is formed of a curable resin, and the concave portions of the intaglio are hardened by ultraviolet light.
Filling with a pattern forming material including a volatile glass paste ,
UV curing the pattern forming material by irradiating, with had continued, is obtained by such firing the cured pattern forming material. In addition, the substrate is brought into close contact with the intaglio
Previously, the recess was used to leave the cured patterning material on the substrate.
The plate is separated from the substrate.

[0007]

In the method described above, the cohesive force of the pattern forming material and the adhesion between the pattern forming material and the substrate are reduced at the stage when the pattern forming material filled in the concave portions of the intaglio is transferred to the substrate side. It is necessary to be strong. Therefore, an ultraviolet-curable glass paste is used as a pattern forming material to be filled in the concave portions of the intaglio, and the surface of the substrate is treated with an ultraviolet-curable primer before the substrate is brought into close contact with the intaglio. Alternatively, a suspension in which a ceramic material powder is dispersed is used as a pattern forming material, and an ultraviolet curable resin is applied to the surface of the intaglio before the substrate is brought into close contact with the intaglio.

According to the method for forming a thick film pattern having the above structure, the intaglio is peeled off so that the cured pattern forming material remains on the surface of the substrate, so that the pattern forming material of the target pattern is transferred onto the substrate. You. Then, a desired thick film pattern is formed by baking the substrate to which the pattern forming material has been transferred.

In the case where an ultraviolet-curable glass paste is used as a pattern forming material, and the surface of the substrate is treated with an ultraviolet-curable primer before the substrate is brought into close contact with the intaglio, the ultraviolet light is irradiated. As a result, the pattern forming material is solidified, and the adhesion between the pattern forming material and the substrate is given by the action of the primer.

In the case where a suspension in which a ceramic material powder is dispersed is used as a pattern forming material and an ultraviolet curable resin is applied to the surface of the intaglio before the substrate is brought into close contact with the intaglio, As a result of the applied ultraviolet curable resin penetrating into the pattern forming material, the pattern forming material is hardened by irradiating ultraviolet rays, and the adhesive force between the pattern forming material and the substrate is given by the action of the ultraviolet curable resin.

[0011]

The present invention will be described more specifically with reference to the following examples.

<Embodiment 1> This will be described with reference to the process charts shown in FIGS. 1 (a) to 1 (e).

First, as shown in FIG. 1A, an intaglio 1 which is a female mold of a target pattern is prepared. In the present embodiment, a two-pack type RTV rubber KE-112 manufactured by Shin-Etsu Chemical Co., Ltd., which is a hardening resin, is used as a mold using a cut copper plate.
Is used as an intaglio material, the RTV rubber is cured on the original mold, and the line width is 100 μm, the depth is 150 μm, and the pitch is 300 μm.
Intaglio 1 having m line patterns was obtained.

Subsequently, as shown in FIG. 1B, the obtained intaglio 1 was filled with an ultraviolet-curable glass paste 2.
Specifically, the flat rubber was pressed against the intaglio 1 and moved obliquely across the pattern to push the ultraviolet-curable glass paste 2 into the recesses of the intaglio 1 and scrape off excess paste. As the UV-curable glass paste 2, a paste obtained by kneading a binder, a filler, and a coloring pigment using a commercially available solventless UV-curable resin as a binder was used.

Next, as shown in FIG. 1C, a glass substrate 3 treated with an ultraviolet-curable primer 4 is opposed to and in close contact with the intaglio 1 filled with the glass paste 2.
Ultraviolet rays were irradiated from the glass substrate 3 side under a pressure of 3 to 5 kg · cm ^-2 to cure the glass paste 2 and the primer 4. The primer 4 to be used can be widely considered in the range of commercially available ultraviolet-curable resins, but in this example, urethane acrylate M-1 manufactured by Toa Gosei Chemical Industry Co., Ltd.
100 was used. In addition, 1-hydroxycyclohexyl phenyl ketone (Irgacure-184, manufactured by Nippon Ciba Geigy Co., Ltd.) was used as a photoinitiator in a wide range of commercially available reagents. Then, a solution obtained by dissolving 3 wt% of the photoinitiator in the urethane acrylate and 50 wt% in methyl ethyl ketone was used as a primer solution, and this was applied to the glass substrate 3 with an applicator to a thickness of about 5 μm. Primer treatment was performed. Here, the selection of the ultraviolet curable resin or the photoinitiator does not limit the present invention,
The viscosity at room temperature is about 1000 to prevent the resin from diffusing into the glass paste 2 in the intaglio 1 at the time of close contact with the intaglio 1.
A resin having a high viscosity of 0 cps or more is preferable. Further, the thickness of the primer treatment is appropriately determined, but if the thickness is 10 μm or more, it becomes an obstacle in the subsequent firing step shown in FIG.
At a thickness of less than μm, a sufficient adhesion effect could not be obtained.
The curing conditions were as follows: a high-pressure mercury lamp of 40 w / cm was used as a light source, and ultraviolet rays were irradiated at 1000 mJ / cm ² .

Next, as shown in FIG. 1D, the intaglio 1 was peeled off, and a line pattern was formed on the glass substrate 3 with the glass paste 2 via the primer 4. If a heat treatment of about 80 ° C./5 min is performed before the peeling, the intaglio 1 is softened, so that the peeling becomes easy.

Finally, as shown in FIG.
Firing at 0 ° C, line width 100 μm, height 150 μm,
A thick film pattern 5 having a pitch of 300 μm was obtained.

<Embodiment 2> This will be described with reference to the process charts shown in FIGS. 2 (a) to 2 (f).

First, as shown in FIG. 2A, an intaglio 6 which is a male pattern of the target pattern is prepared. In the present embodiment, a cut copper plate is used as an original mold, and a two-pack type RTV rubber KE-112 manufactured by Shin-Etsu Chemical Co., Ltd. is used as an intaglio material, and the RTV rubber is cured on the original mold to form a wire. Width 100
An intaglio 6 having a line pattern of μm, a depth of 150 μm, and a pitch of 300 μm was obtained.

Next, as shown in FIG. 2B, the obtained intaglio 6 is coated with a ceramic material powder, that is, a suspension 7 in which a binder, a filler and a coloring pigment are dispersed. Utilizing the sedimentation of each of the powders in 7, the recesses of intaglio 6 were filled with the ceramic material powder. In this embodiment, as the suspension 7, GA-8 (binder) 5 manufactured by NEC Corporation
0 g, CBA-05S (filler) 10 manufactured by Showa Denko KK
g, TM-DR (filler) 10 manufactured by Daimei Chemical Co., Ltd.
g, 10 g of Black 9590 (color pigment) manufactured by Dainichi Seika Kogyo Co., Ltd., 0.4 g of TSL8802 manufactured by Toshiba Silicone Co., Ltd. as a surfactant and 40 g of isopropyl alcohol as a dispersion medium were added, and the diameter was about 1 mm. 1200 rpm / 2 hrs in the presence of 80 g of glass beads
A sand-milled condition was used.

Thereafter, the film of the suspension 7 is dried at room temperature, and as shown in FIG.
The pattern was moved obliquely across the pattern while being pressed against the surface of the suspension, and an excess portion of the dried suspension 7 was scraped off.

With respect to the concave plate 6 obtained as described above, FIG.
As shown in FIG. 2, an ultraviolet-curing resin 9 is bar-coated with a bar 10 to impart cohesive force to the ceramic material-filled portion 11 and, at the same time, to a glass substrate 1 shown in FIG.
2 to provide adhesion. UV curable resin 9
Is composed of an ultraviolet-curable monomer, oligomer, and photoinitiator, and can be selected from a wide variety of commercially available reagents. In this example, 2-hydroxyethyl methacrylate (2HEMA manufactured by Nippon Shokubai Chemical Industry Co., Ltd.) was used. 1-
Hydroxysynchrohexyl phenyl ketone (Irgacure-184, manufactured by Nippon Ciba Geigy Co., Ltd.) was dissolved in an amount of 5 wt% to obtain an ultraviolet curable resin 9. Here, the selection of the ultraviolet curable resin 9 is not limited to the present invention, and may be any as long as the following conditions are satisfied.

(1) Permeation into the ceramic material filling portion 11 is easy. (2) High cohesion after curing. (3) Good adhesion to glass. (4) Complete gasification in the firing step.

In addition, as the bar 10 at the time of bar coating, a regular third bar was used.

Subsequently, as shown in FIG.
To the glass substrate 12 under pressure of 3 to 5 kg · cm ⁻² to irradiate ultraviolet rays from the glass substrate 12 side, and the ultraviolet curable resin 9 permeating the ceramic material filling portion 11
Was cured. The curing conditions were as follows: a high-pressure mercury lamp of 40 w / cm was used as a light source, and ultraviolet rays were irradiated at 1000 mJ / cm ² .

Finally, as shown in FIG.
And fired at about 600 ° C. to obtain a line width of 100 μm.
m, a height of 150 μm and a pitch of 300 μm were obtained.

[0027]

As described above, the method for forming a thick film pattern according to the present invention can obtain a pattern having a height of 100 μm or more in one operation. Since the time is shortened and the operation such as the positioning is performed only once, the process can be simplified. In addition, since the female mold of the target pattern is formed of a curable resin, the female mold can be easily formed, so that an effect of shortening the preparation process can be obtained.

[Brief description of the drawings]

FIG. 1 is a process diagram showing one embodiment of a method for forming a thick film pattern according to the present invention.

FIG. 2 is a process chart showing another embodiment of the method of forming a thick film pattern according to the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... intaglio, 2 ... ultraviolet curable glass paste, 3 ... glass substrate, 4 ... ultraviolet curable primer, 5 ... thick film pattern, 6 ... intaglio, 7 ... suspension, 8 ... flat rubber, 9 ... ultraviolet curable Resin, 10 ... Bar, 11 ... Ceramic material filling part, 12 ... Glass substrate, 13 ... Thick film pattern

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B05D 1/00-7/26

Claims (4)

(57) [Claims] An intaglio plate, which is a female mold of a target pattern, is formed of a curable resin, and a concave portion of the intaglio plate is provided with an ultraviolet-curable glass pen.
Filled with pattern forming material including paste and irradiated with ultraviolet rays
Curing the pattern forming material by, and have continued,
A method for forming a thick film pattern, comprising firing a cured pattern forming material. 2. A substrate is brought into close contact with an intaglio plate and cured before firing.
Remove the intaglio plate from the substrate so that the patterned
2. The method for forming a thick film pattern according to claim 1, wherein the film is peeled off . 3. The method according to claim 2, wherein the surface of the substrate is treated with an ultraviolet-curable primer before the substrate is brought into close contact with the intaglio. 4. The method according to claim 1, wherein a suspension in which a ceramic material powder is dispersed is used as a pattern forming material, and an ultraviolet curable resin is applied to the surface of the intaglio before the substrate is brought into close contact with the intaglio. Thick film pattern forming method.