JP3428483B2 - Pattern forming method, manufacturing method of plasma display rib substrate, manufacturing method of plasma display - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a composition of a solventless photosensitive baking paste and a solvent photosensitive baking paste for forming an inorganic structure by baking. More specifically, in the production of circuit boards for electronic devices, chip capacitors, display panels, etc., it is used for the formation of inorganic structures such as insulators, dielectrics, resistors, and conductors that utilize printing coating technology. .

[0002]

2. Description of the Related Art Conventionally, in order to obtain an inorganic structure such as an insulator, a dielectric, a resistor or a conductor, a paste prepared by mixing an inorganic powder and an organic component has been applied by a printing coating technique such as screen printing. A method is used in which a pattern is formed on a transfer target such as a substrate by using the pattern, and the pattern is baked. In addition to the method of directly patterning the structure by screen printing, the method of forming the structure includes a method of scraping off the paste layer patterned on the transfer target, and a method of embedding the paste in the concave mold formed on the transfer target. After patterning, remove the concave shape, press the patterned paste layer on the transfer target with an intaglio to pattern it into a predetermined shape, transfer the pre-patterned paste, for example, the paste embedded in the intaglio onto the transfer target There are ways.

The first of these conventional baking pastes is a solvent-type non-photosensitive baking paste. As the organic material of this paste, a binder resin and a solvent are main components. Moreover, an additive may be used as needed. As the binder resin, a polymer such as an acrylic resin or a cellulose resin is often used as a ceramic forming resin, and as the solvent, a carbitol-based solvent or a cellosolve-based solvent is often used. Both of these components, in a solvent-based non-photosensitive baking paste,
The resin is present in a state of being dissolved in a solvent, which imparts fluidity as a paste, evaporates the solvent by a heat drying step after printing coating, and a binder resin between inorganic powders and inorganic powders and a substrate. The spaces are bound to form a pattern.

As the second baking paste, there is a solvent type photosensitive paste obtained by adding photosensitivity to the above solvent type paste. The organic material of this paste contains a photosensitive monomer and a photopolymerization initiator as main components in addition to a high molecular weight binder resin and a solvent. As a method of forming a structure using this solvent-type photosensitive baking paste, the solvent is removed in a heat drying step or a pressure reducing step, and then a photosensitive monomer is polymerized and cured in a light irradiation step.

As the third baking paste, a solventless photosensitive baking paste using a high molecular weight binder resin, a photosensitive monomer, and a photopolymerization initiator as an organic material has been devised. This solventless photosensitive baking paste can form a pattern by polymerizing a photosensitive monomer in a light irradiation step instead of the heat drying step. As an example of such a solventless photosensitive baking paste, Japanese Patent Application Laid-Open No. 54-1
3591 Example 1. The solventless paste has a paste composition containing no solvent and does not require a heat drying step. Here, the solvent refers to an organic solvent for coating or printing, is a liquid that does not react with a solute, is volatile, and has a boiling point of 300 ° C. or less.

When the above-mentioned three kinds of firing pastes are compared in terms of productivity and equipment, solvent type non-photosensitive firing pastes,
In the case of the solvent-type photosensitive baking paste, the heat-drying process takes a long time in the whole process, and the heat-drying process often determines the production speed. Furthermore, the space required for a long heat-drying belt furnace is also required. On the other hand, with the solventless photosensitive baking paste, the fixing time of the paste can be significantly shortened by exposure to irradiation, and the equipment space up to the heat drying step is not required. For these reasons, in recent years, it has been desired to shift from a solvent-containing firing paste to a solvent-free, photosensitive firing paste.

However, depending on the method of forming the structure, the solvent-type photosensitive paste may be more advantageous than the solvent-free photosensitive baking paste. Specifically, when it is desired to improve the wettability with the transferred material or the intaglio, when a fine pattern is formed by screen printing, or when the intaglio in which the paste is embedded requires a low viscosity paste, etc. Is.

[0008]

However, some problems have been pointed out in the conventional solventless photosensitive baking paste and solvent photosensitive baking paste. First, it has been pointed out that in the case of a paste using a photosensitive material, defects are likely to occur during firing. Specifically, when the organic material burns by firing, peeling or cracking of the pattern occurs. It is considered that the unreacted photosensitive material remaining during the exposure process is polymerized by the heat during baking, and is peeled off due to contraction at that time to cause cracks.

Further, in the case of a solventless photosensitive baking paste, since it is solventless, the material imparting fluidity to the paste must be an organic material instead of the solvent. The organic material is a photosensitive material and a high molecular weight binder resin, and unlike a solvent-type paste in which a solvent is heated and evaporated, an organic material necessary for imparting fluidity remains as a pattern. Therefore, it is considered that a large amount of organic material remains in the pattern as compared with the solvent type, which is a cause of peeling and cracking during firing.

Second, there is a problem regarding the fluidity of the paste. As described above, in the case of the solventless photosensitive baking paste, the viscosity and the fluidity necessary for printing and coating the paste must depend on the photosensitive material and the organic material of the binder resin. At this time, the binder resin of the conventional paste is a high molecular weight polymer, and a solid one having a molecular weight of 100,000 or more is used. Therefore, it is difficult to dissolve and disperse the binder resin in the paste, and the paste viscosity increases. As a result, the fluidity of the paste is low, and when patterning by screen printing or the like, the transfer width to the transfer target is limited to a pattern width of several hundred μm at most, and it is difficult to transfer a pattern width of 100 μm or less. Met. Further, even when a pattern of several hundreds of μm or the entire surface of the transferred material is coated, there is a problem that the leveling property of the pattern is lacking due to the low fluidity of the paste.
Workability problems such as clogging of the screen mesh with paste have also been pointed out.

Similarly, in the solvent-type photosensitive baking paste, the binder resin, which is a high-molecular weight polymer, leads to an increase in viscosity of the paste and hinders filling into a fine concave mold.

The present invention is to improve the above-mentioned problems, and an inorganic material such as an insulator, a dielectric, a resistor or a conductor which utilizes a printing coating technique such as screen printing or other structure forming method. An object of the present invention is to provide a solventless photosensitive baking paste and a solvent photosensitive baking paste which can form a fine smooth pattern with high smoothness in forming a structure and further improve workability.

[0013]

The first invention of the present invention is as follows:
Embed the paste consisting of the photosensitive baking paste composition in the intaglio plate.
Embed, cure the paste, and transfer to the transfer target
In the pattern forming method, the photosensitive firing paste group
The composition has (A) an inorganic powder component, (B) an acryloyl group or a methacryloyl group, and has a polymerization degree (n).
Is a photosensitive monomer component having an ethylene oxide structure or a propylene oxide structure of 4 to 100, and a photosensitive baking paste composition containing (C) a photopolymerization initiator as a paste main component is used .

The second aspect of the present invention is a photosensitive baking.
Embed the paste composed of the paste composition in the intaglio
Pattern shape that hardens the paste and transfers it to the transfer target
In the composition method, the photosensitive paste composition
Te, (A) an inorganic powder component and (B) having an acryloyl group or a methacryloyl group, and degree of polymerization (n) 4 to 1
00 photosensitive monomer component having an ethylene oxide structure and propylene oxide structure, (C) a photopolymerization initiator, the use of solvent-free photosensitive fired paste composition paste mainly composed of (D) a molecular weight of 1000 or less of polyethylene glycol Is a pattern forming method .

Further, a third aspect of the present invention is characterized in that the solvent had been added to the photosensitive fired paste composition
The pattern forming method according to claim 1 or 2 .

The fourth invention of the present invention is defined in claim 3.
The amount of the solvent added in the range of 0.01 to 30 parts by weight with respect to 100 parts by weight of the paste composition other than the solvent within a range in which the solvent removal step by heat drying or reduced pressure is unnecessary. The pattern forming method described in 1.

[0017]

[0018]

[0019]

[0020]

[0021]

[0022]

[0023]

[0024]

The fifth aspect of the present invention is a plasma de-emitter.
Of ribs in a display rib substrate manufacturing method
The pattern according to any one of claims 1 to 4 as a method.
Plasma display characterized by using a forming method
This is a method for manufacturing a Ray rib substrate. The sixth aspect of the present invention
Of the invention is a method for manufacturing a plasma display,
Claimed as a method for manufacturing a rib substrate of a plasma display
Item 5. A method for manufacturing a rib substrate for a plasma display according to item 5.
Of the plasma display characterized by using the method
It is a manufacturing method.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION The photosensitive monomer used in the present invention is a compound that advances a radical polymerization reaction by the action of a photopolymerization initiator, has an acryloyl group or a methacryloyl group in the molecule, and has a polymerization degree (n ) Is 4-100,
More preferably, it is a compound having an ethylene oxide structure or a propylene oxide structure of 10 to 30. By the action of light irradiation and the action of the photopolymerization initiator, the radical polymerization reaction causes the above-mentioned reactive groups to polymerize to form a polymer. Such an ethylene oxide structure or a propylene oxide structure is
When the radical polymerization reaction proceeds by light irradiation or thermal polymerization,
Since the shrinkage is relaxed and the thermal decomposability is also good, the combustion of the organic component by firing proceeds smoothly, and the inorganic structure can be formed without causing peeling or cracking by firing. As for the ethylene oxide structure or the propylene oxide structure, the higher the degree of polymerization, the more the above effect is exerted. However, a structure in which the degree of polymerization exceeds 100 and the molecular weight of the photosensitive monomer exceeds 5,000 becomes a wax-like solid, which causes deterioration of paste fluidity. When the degree of polymerization is 3 or less, the thermal decomposability during firing becomes poor, and cracks occur when contracting. Therefore, when the degree of polymerization is 4 to 100 (molecular weight of 5000 or less), more preferably 10 to 30, a structure having good workability can be obtained.

Specific examples of the bifunctional or higher-functional photosensitive monomer include polyethylene glycol di (meth) acrylate, ethylene oxide-added trimethylolpropane tri (meth) acrylate, ethylene oxide-added sorbitol hexa (meth) acrylate, and ethylene oxide-added bisphenol A diester. (Meth) acrylate and the like are mentioned, and all are compounds having an ethylene oxide structure.
Alternatively, it is a compound in which a portion of the above ethylene oxide structure is a propylene oxide structure. You may mix 2 or more types of these.

For the purpose of adjusting the viscosity and adjusting the photo-curing state, one or more of the following monofunctional photosensitive monomers may be added to the bifunctional or higher photosensitive monomer. Specific examples thereof include methoxy polyethylene glycol (meth) acrylate, phenol ethylene oxide-added (meth) acrylate, nonylphenol ethylene oxide-added (meth) acrylate and the like, all of which are compounds having an ethylene oxide structure. Alternatively, it is a compound in which a portion of the above ethylene oxide structure is a propylene oxide structure.

For the purpose of adjusting viscosity and improving fluidity, polyethylene glycol having a molecular weight of 1000 or less and a melting point of about 30 ° C. or less may be added. Unlike the high molecular weight polymer of the conventional paste, such polyethylene glycol is usually a liquid at room temperature, is non-volatile, and is a good compound for adjusting the viscosity of the paste and imparting thixotropy. In this case, the amount of non-photosensitive polyethylene glycol added needs to be within a range that does not interfere with the shape or cured state of the pattern formed by photocuring the paste.

[0030] As the photopolymerization initiator, diethoxy acetone phenone, 2-hydroxy-Shi-2-methyl-acetophenone such as isobutyl benzoin ether, benzoin ether, such as isopropyl benzoin ether, A benzyl ketal system such as benzyl dimethyl ketal and hydroxycyclohexyl phenyl ketone, a benzophenone system such as benzophenone, and a thioxanthone system such as 2-chlorothioxanthone are used.

The solvent is not particularly limited as long as it can dissolve or disperse the photosensitive monomer uniformly.
For example, hydrocarbons such as toluene, xylenetetralin, and mineral spirits, alcohols such as methanol, ethanol, isopropanol, and α-terpineol,
Acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, isophorone, and other ketone systems, methyl acetate, ethyl acetate, butyl acetate, ethyl acetate, and other ester systems, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol Ethylene glycol glycol ethers such as monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether Seteto, diethylene glycol ether such as diethylene glycol monobutyl ether acetate.

Examples of the inorganic powder used in the present invention include metals, non-metals, heat-resistant inorganic compounds and the like, and combinations thereof. Specifically, as the metal powder, gold (Au), palladium (Pd), silver (Ag), platinum (Pt), silver / palladium (Ag / Pd) that is stable in an atmosphere such as temperature and humidity and used for low-temperature firing is used. ), Chemically stable tungsten (W), nickel (Ni), molybdenum (M) for high temperature firing.
o), molybdenum / manganese (Mo-Mn), and the like. Further, carbon powder, graphite, or the like is also used as the nonmetal. Examples of the heat-resistant inorganic compound include tin oxide (SnO2), indium oxide (In2O3), ruthenium oxide (RuO2), alumina (Al2O3), borosilicate glass and lead borosilicate glass.

These inorganic components may be used alone or as a mixture as necessary. When the inorganic powder itself sinters during firing, it is possible to use it alone as an inorganic component, but when the melting temperature of the inorganic powder is high, or when the firing temperature cannot be raised to the melting temperature, a low melting point is used. Inorganic powder of is mixed and used. Usually, in such a case, it is possible to sinter between the inorganic powders by adding powder of low melting point glass such as lead borosilicate glass at a ratio of several wt%. The particle size or shape of the inorganic powder is spherical, fibrous, flake-like,
There are various types such as amorphous type, but it is necessary to select them according to the target paste.

Additives are added as needed. As an additive, a wetting agent, a dispersant, a plasticizer, a defoaming agent, a polymerization inhibitor, a thixotropy imparting agent and the like are used as necessary. Examples of dispersants include sorbitan fatty acid esters,
Examples of benzene sulfonic acid and the like include plasticizers such as diphenyl phthalate, dioctyl phthalate, dihexyl phthalate, dicyclohexyl phthalate, dimethyl isophthalate, and benzoic acid scroll.

[0035] As mixing kneading method, a roll mill, a bead mill, an automatic mortar is used.

Here, the patterning in the present invention means not only forming the paste into a desired structure shape, but also a preceding step necessary for forming the structure, for example, a step of applying the paste to a uniform film. Also refers to. Specifically, in the method of forming a structure described in the related art, the step of applying on the transferred material is called patterning,
The patterned paste is scraped off to form a desired structure. Further, in the method of forming a structure described in the related art, both the step of applying on the transferred material and the step of subsequently pressing with an intaglio to form the desired structure are called patterning. Therefore, when the structure is formed by the method of using the solvent-type photosensitive baking paste, the first order is <coating the paste on the transfer target (patterning)> → <solvent removal>.
→ <pressing with intaglio (patterning)> → <exposure hardening>, secondly, <applying paste on transfer target (patterning)> → <pressing with intaglio without removing solvent (patterning)> → <Solvent removal while pressing with intaglio plate> → <
There is a case of exposure curing>, both of which satisfy claim 9.

<Operation> According to the above-mentioned solventless photosensitive baking paste or solvent photosensitive baking paste, viscosity and fluidity adjustment suitable for printing coating or patterning can be achieved without peeling or cracking during baking. It is possible to obtain an easy paste.

[0038]

【Example】

Example 1 The following is an example of manufacturing a solventless photosensitive baking paste for forming a dielectric layer and a dielectric layer. The composition of the low-melting lead borosilicate glass powder 75 parts by weight of ethylene oxide adduct of trimethylolpropane triacrylate (n = 10) 10 parts by weight of benzophenone 3 parts by weight diphenyl phthalate 2 parts by weight The above, sufficiently mixed kneaded at a roll mill, a paste And

The dielectric layer paste thus obtained was applied on the entire surface of the glass substrate by screen printing and irradiated with ultraviolet rays at 1000 mJ / cm 2. Then 550 ° C
Firing was performed to form a dielectric layer on the glass substrate.

Example 2 The following is an example of manufacturing a solventless photosensitive baking paste for forming a conductive pattern and a conductive pattern.

[0042] The composition of the silver powder 75 parts by weight of glass frit 5 parts by weight of polyethylene glycol (# 600) diacrylate 10 parts by weight of benzophenone and 2 parts by weight diphenyl phthalate 2 parts by weight The above, sufficiently mixed kneaded at a roll mill, and paste did.

The conductive pattern paste thus obtained was applied onto a glass substrate by screen printing and irradiated with ultraviolet rays at 1000 mJ / cm 2. The conductive pattern width of the screen plate was 100 μm. Then 550
By firing at ℃, to form a conductive pattern on the glass substrate.

Example 3 The composition and production example of a solventless photosensitive baking paste for forming ribs of a plasma display will be described below. Composition Lead borosilicate glass frit 68 parts by weight Alumina 12 parts by weight Ethylene oxide added sorbitol hexaacrylate (n = 15) 8 parts by weight Polyethylene glycol # 400 8 parts by weight t-butyl anthraquinone 2 parts by weight Butylbenzyl phthalate 2 parts by weight , thoroughly mixed kneaded by a roll mill, was a paste. The paste viscosity was 10,000 PS.

The prepared paste was set in a screen printer to pattern the rib shape of the plasma display. After printing, the patterned substrate was exposed to 100 mJ / cm @ 2 with a UV exposure device to fix the paste on the substrate. At this time, the pattern shape was 100 μm wide and 20 μm high. After the exposure was completed, the substrate was set again in the screen printing machine and the paste was printed. After printing,
It exposed with the UV exposure apparatus like the 1st layer. This operation 1
This was repeated 0 times to form a rib having a height of 200 μm and a width of 100 μm. Finally, it was baked at 550 ° C. to obtain a rib substrate for a plasma display.

Example 4 The composition and production example of a solvent-type photosensitive baking paste for forming ribs of a plasma display will be described below. Composition Lead borosilicate glass frit 75 parts by weight Alumina 15 parts by weight Polypropylene glycol dimethacrylate (n = 10) 6 parts by weight Phenol ethylene oxide-added methacrylate (n = 10) 3 parts by weight Benzophenone 1 part by weight Ethylene glycol monobutyl ether 10 parts by weight Above the composition was thoroughly mixed kneaded at a roll mill to obtain a paste. The paste viscosity was 1000 PS.

On the glass substrate on which the electrodes to be transferred are formed, the rib shape of plasma display (width 30 μm,
A concave mold having a groove having a height of 200 μm) was formed from a photosensitive dry film. The prepared paste was embedded in the groove by screen printing, the solvent was removed by a heat drying process, the excess paste was removed from the top of the concave mold, and then U was added.
The paste was cured by irradiating 1000 mJ / cm @ 2 of UV light with a V exposure device. After the exposure, the concave mold was removed with a developing solution to form a rib-shaped pattern having a width of 30 μm and a height of 200 μm. Finally, it was baked at 580 ° C. to obtain a rib substrate for a plasma display.

Example 5 The composition and production example of a solvent-type photosensitive baking paste for forming ribs of a plasma display will be described below. Composition Lead borosilicate glass frit 73 parts by weight Alumina 15 parts by weight Ethylene oxide-added trimethylolpropane triacrylate (n = 20) 8 parts by weight t-butylanthraquinone 1 part by weight Polyethylene glycol # 400 3 parts by weight Ethylene glycol monobutyl ether 5 parts by weight Above the composition of, and thoroughly mixed kneaded at a roll mill to obtain a paste. The paste viscosity was 3000 PS.

The prepared paste was coated on a glass substrate on which an electrode, which was a transfer target, was formed so as to have a uniform film thickness. Then, a transparent intaglio (made of polyester resin) having a reverse pattern of the rib shape (width 50 μm, height 200 μm) of the plasma display was removed by a flat press using a paste on a glass substrate without removing the solvent in the heat drying step. Pressure was applied at. After that, from both sides of the glass substrate taken out from the flat press machine, 1000 mJ / cm with a UV exposure device.
The paste was cured by irradiating with 2 UV light. After the exposure was completed, the intaglio was removed to form a rib-shaped pattern having a width of 50 μm and a height of 200 μm. Finally, it was baked at 580 ° C. to obtain a rib substrate for a plasma display.

Example 6 The composition and production example of a solvent-type photosensitive baking paste for forming high-definition ribs of a plasma display will be described below. Composition Lead borosilicate glass frit 68 parts by weight Alumina 15 parts by weight Propylene oxide-added trimethylolpropane trimethacrylate (n = 15) 16 parts by weight t-Butylanthraquinone 1 part by weight Diethylene glycol monobutyl ether acetate 10 parts by weight The above composition was applied to a roll mill. Te thoroughly mixed kneaded to obtain a paste. The paste viscosity was 200 PS.

The prepared paste was embedded in an intaglio plate (made of silicone resin) having an inverse pattern of a rib shape (width 30 μm, height 200 μm) of a plasma display with a doctor, and the solvent was removed in a heat drying step, followed by UV exposure. The device was irradiated with 1000 mJ / cm @ 2 of UV light to cure the paste. After the exposure, the liquid UV adhesive (main component: urethane acrylate) is coated on the paste filled in the intaglio plate in a cured state, and no bubbles are mixed in on the glass substrate on which the electrode that is the transfer target is formed. In this way, pressure was applied with a flat press machine, and UV light was irradiated from the back surface of the glass substrate removed from the flat press machine with a UV exposure device to cure the adhesive.
After that, the intaglio was removed to form a rib-shaped pattern having a width of 30 μm and a height of 200 μm. Finally, it was baked at 580 ° C. to obtain a rib substrate for a plasma display.

Example 7 The composition and production example of a solvent-type photosensitive baking paste for forming ribs of a plasma display will be described below. Composition Lead borosilicate glass frit 68 parts by weight Alumina 15 parts by weight Ethylene oxide-added trimethylolpropane triacrylate (n = 15) 16 parts by weight t-Butylanthraquinone 1 part by weight Diethylene glycol monobutyl ether acetate 3 parts by weight The above composition was rolled. thoroughly mixed kneaded to obtain a paste. The paste viscosity was 2000 PS.

The prepared paste was embedded in an intaglio (made of polyester resin) having a reverse pattern of a rib shape (width 50 μm, height 200 μm) of a plasma display with a doctor, and UV was removed without removing the solvent in a heat drying step.
The paste was cured by irradiating 1000 mJ / cm @ 2 of UV light with an exposure device. After completion of the exposure, under the same conditions as in Example 6, the cured paste embedded in the intaglio was transferred with an adhesive onto the glass substrate on which the electrodes to be transferred were formed,
The intaglio was removed to form a rib-shaped pattern having a width of 50 μm and a height of 200 μm. Finally, it was baked at 580 ° C. to obtain a rib substrate for a plasma display.

<Comparative Example 1> As a comparative example, a composition and a production example of a solventless photosensitive baking paste for forming ribs of a plasma display when a polymer is added will be described. Composition Lead borosilicate glass frit 68 parts by weight Alumina 12 parts by weight Ethyl cellulose 4 parts by weight Epoxy acrylate 6 parts by weight Butyl methacrylate 6 parts by weight t-Butyl anthraquinone 2 parts by weight Butylbenzyl phthalate 2 parts by weight The above composition is sufficiently rolled. confuse kneaded to obtain a paste. The paste viscosity was 1,000,000 PS.

The prepared insulating paste for firing was set on a plate of a screen printing machine, and an attempt was made to print a rib pattern having a width of 100 μm. However, the paste was clogged between the meshes of the screen plate and the paste was transferred onto the substrate. I couldn't. Also, when an attempt was made to print a rib pattern having a width of 300 μm, it was possible to transfer the paste onto the substrate to form a pattern, but a mesh mark of the screen plate remained on the pattern surface, resulting in lack of smoothness. there were.

Further, with this paste, an attempt was made to embed in the concave mold formed on the glass substrate in Example 4, press with the intaglio plate used in Example 5, and embed in the intaglio plate used in Examples 6 and 7. As a result, air bubbles were partially generated, and sufficient filling and pressing could not be performed. When the rib substrate formed under these conditions was fired at 580 ° C, most of the ribs were cracked.

[0057]

EFFECTS OF THE INVENTION According to the present invention, a printing coating technique such as screen printing, embedding in a concave mold formed on a transferred material,
When forming inorganic structures such as insulators, dielectrics, resistors, conductors, etc. using technologies such as pressing with intaglio and transferring from intaglio, it is possible to form highly precise structures with high smoothness. Thus, a solventless photosensitive baking paste or a solvent photosensitive baking paste having good workability can be obtained.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ identification code FI H01J 9/227 H01J 9/227 E 11/02 11/02 B (58) Fields investigated (Int.Cl. ⁷ , DB name) G03F 7/00-7/42

Claims (6)

(57) [Claims] 1. A pace comprising a photosensitive baking paste composition.
Embedded in the intaglio, cure the paste, and transfer
In the pattern forming method of transferring to a body, the photosensitive baking paste composition has (A) an inorganic powder component, (B) an acryloyl group or a methacryloyl group, and has a polymerization degree (n) of 4 to 100.
Photosensitive monomer component having an ethylene oxide structure and propylene oxide structure, the photosensitive fired paste composition paste mainly composed of (C) a photopolymerization initiator using the
A method for forming a pattern, comprising: 2. A pace comprising a photosensitive baking paste composition.
Embedded in the intaglio, cure the paste, and transfer
In the pattern forming method of transferring to a body, the photosensitive baking paste composition has (A) an inorganic powder component, (B) an acryloyl group or a methacryloyl group, and has a polymerization degree (n) of 4 to 100.
A photosensitive monomer component having an ethylene oxide structure or a propylene oxide structure, (C) a photopolymerization initiator,
(D) A pattern forming method , which comprises using a solventless photosensitive baking composition containing polyethylene glycol having a molecular weight of 1000 or less as a paste main component . 3. The path as claimed in claim 1 or 2, characterized in that the solvent had been added to the photosensitive fired paste composition
Turn formation method. 4. The amount of the solvent added in claim 3 is 0.01 to 30 parts by weight with respect to 100 parts by weight of the paste composition other than the solvent, as long as the solvent removal step by heat drying or reduced pressure is unnecessary. The pattern according to claim 3, wherein
Forming method. 5. A method of manufacturing a rib substrate for a plasma display.
In law,請 Motomeko 1-4 Neu As a method for producing rib
Characterized by using the pattern forming method described in the offset
A method for manufacturing a rib substrate of a plasma display. 6. A plasma display manufacturing method.
As a method for manufacturing rib substrates for plasma displays
A rib substrate for a plasma display according to claim 5,
Plasma display characterized by using a manufacturing method
B manufacturing method.